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| To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Renesas Technology Corp. Hitachi Single-Chip Microcomputer H8/3062 Series H8/3062 H8/3061 H8/3060 H8/3064B H8/3062B H8/3061B H8/3060B HD6433062 HD6433061 HD6433060 HD6433064B HD6433062B HD6433061B HD6433060B H8/3062B Series H8/3062F-ZTATTM HD64F3062, HD64F3062R, HD64F3062B H8/3064F-ZTATTM HD64F3064B Hardware Manual ADE-602-136D Rev. 5.0 3/18/02 Hitachi, Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Preface The H8/3062 Series is a high-performance single-chip microcomputer that integrates peripheral functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal architecture as its core. The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI), a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTATTM*) and mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to changing application specifications and the demands of the transition from initial to full-fledged volume production. Note: * F-ZTAT is a trademark of Hitachi, Ltd. Intended Readership: This manual is intended for users undertaking the design of an application system using the H8/3062 Series. Readers using this manual require a basic knowledge of electrical circuits, logic circuits, and microcomputers. Purpose: The purpose of this manual is to give users an understanding of the hardware functions and electrical characteristics of the H8/3062 Series. Details of execution instructions can be found in the H8/300H Series Programming Manual, which should be read in conjunction with the present manual. Using this Manual: * For an overall understanding of the H8/3062 Series's functions Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system control functions, peripheral functions, and electrical characteristics. * For a detailed understanding of CPU functions Refer to the separate publication H8/300H Series Programming Manual. Note on bit notation: Bits are shown in high-to-low order from left to right. Related Material: The latest information is available at our Web Site. Please make sure that you have the most up-to-date information available. (http://www.hitachisemiconductor.com/) User's Manuals on the H8/3062: Manual Title H8/3062 Hardware Manual H8/300H Series Programming Manual ADE No. This manual ADE-602-053 Users manuals for development tools: Manual Title C/C++ Compiler, Assembler, Optimizing Linkage Editor User's Manual H8S, H8/300 Series Simulator/Debugger User's Manual Hitachi Embedded Workshop User's Manual H8S, H8/300 Series Hitachi Embedded Workshop, Hitachi Debugging Interface User's Manual ADE No. ADE-702-247 ADE-702-037 ADE-702-201 ADE-702-231 Application Note: Manual Title H8/300H for CPU Application Note H8/300H On-Chip Supporting Modules Application Note H8/300H Technical Q&A ADE No. ADE-502-033 ADE-502-035 ADE-502-038 Comparison of H8/3062 Series Product Specifications There are 11 members of the H8/3062 Series: the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062F-ZTAT B-mask version, and H8/3064F-ZTAT B-mask version (all with on-chip flash memory), and the H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask ROM version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. The specifications of these products are compared below. H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version Mask ROM version H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM H8/3064F-ZTAT H8/3062F-ZTAT B-Mask Version, B-Mask Version B-Mask Version H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version On-chip largecapacity singlepower-supply flash memory Internal stepdown circuit Product code HD64F3062 HD64F3062R HD6433062 HD6433061 HD6433060 HD64F3064B HD64F3062B HD6433064B HD6433062B HD6433061B HD6433060B H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version have V CL pin, and require connection of external capacitor See figures 1.4 and 1.5, Pin Arrangement, in section 1 RAM size 4 kbytes H8/3062: 4 kbytes H8/3061: 4 kbytes H8/3060: 2 kbytes 8 kbytes 4 kbytes H8/3064B: 8 kbytes H8/3062B: 4 kbytes H8/3061B: 4 kbytes H8/3060B: 2 kbytes H8/3062F-ZTAT Mask ROM version high-speed operation version H8/3062F-ZTAT H8/3062F-ZTAT R-Mask Version Product specifications On-chip singlepower-supply flash memory H8/3062F-ZTAT version with address output functions added Pin arrange- See figures 1.2 and 1.3, Pin Arrangement, in section 1 H8/3064F-ZTAT ment B-mask version has VCL pin, and requires connection of external capacitor See figures 1.4 and 1.5, Pin Arrangement, in section 1 H8/3062F-ZTAT B-mask version has VCL pin, and requires connection of external capacitor See figures 1.4 and 1.5, Pin Arrangement, in section 1 H8/3062F-ZTAT H8/3062F-ZTAT R-Mask Version H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version H8/3062: 128 kbytes H8/3061: 96 kbytes H8/3060: 64 kbytes H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM H8/3064F-ZTAT H8/3062F-ZTAT B-Mask Version, B-Mask Version B-Mask Version H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version 256 kbytes 128 kbytes H8/3064B: 256 kbytes H8/3062B: 128 kbytes H8/3061B: 96 kbytes H8/3060B: 64 kbytes ROM size 128 kbytes Address output functions Flash memory Compatible with previous H8/300H Series Address update mode 1 or 2 selectable See 6.3.5, Address Output Method, in section 6 -- See 18.1.1, Differences between H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version, in section 18 -- -- See 19.1.1, Differences between H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version, in section 19 -- Mask ROM B-mask version of H8/3064: see section 18. Mask ROM B-mask versions of H8/3062, H8/3061, and H8/3060: see section 19. See section 17, ROM Mask ROM -- -- See section 17, ROM Electrical characteristics (operating frequency) See table 22.1, Comparison of H8/3062 Series Electrical Characteristics, in section 22 1 to 20 MHz 2 to 25 MHz H8/3062F-ZTAT H8/3062F-ZTAT R-Mask Version H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM H8/3064F-ZTAT H8/3062F-ZTAT B-Mask Version, B-Mask Version B-Mask Version H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version Registers See table B.1, Comparison of H8/3062 Series Internal I/O Register Specifications, in appendix B See appendix See appendix See appendix See appendix See appendix Mask ROM B-mask B.1, Address List B.1, Address List B.1, Address List B.2, Address List B.3, Address List version of H8/3064: see appendix B.2, Address List. Mask ROM B-mask versions of H8/3062, H8/3061, and H8/3060: see appendix B.3, Address List. Usage notes See 1.4, H8/3062F-ZTAT R-Mask Version Usage Note, in section 1 See 1.5, H8/3064F-ZTAT B-Mask Version, and H8/3062F-ZTAT B-Mask Version Usage Note, in section 1 List of Items Revised or Added for This Version Section All Page -- Item All Description (See Manual for Details) The H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM Bmask version are added to the product line-up. 1. Overview 18 1.3.3 Pin Assignments in Table 1.4 Pin Assignments in Each Mode Each Mode (FP-100B or TFP-100B, FP-100A) * (VCL)* 4 is added to modes 2 to 7 in the first row. 25 1.5.2 Product Type Names and Markings Table 1.7 Differences in H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064FZTAT, and H8/3064F-ZTAT B-Mask Version Markings * The marking examples of H8/3062F-ZTAT B-mask version and H8/3064FZTAT B-mask version are amended. Title is amended. Note (2) is added. 27 1.5.4 Notes on Changeover to Mask ROM Version or Mask ROM B-Mask Version 6.3.1 Area Division * * * 6. Bus Controller 139 Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3060 Mask ROM Version, H8/3060 Mask ROM B-Mask Version) (2) is added. The Memory Map in 16Mbyte Mode (H8/3064FZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version) is moved from figure 6.3 (2) to figure 6.3 (3). * Section Page Item 12.3.2 Operation in Asynchronous Mode Description (See Manual for Details) Figure 12.4 Sample Flowchart for SCI Initialization * Note is added. 12. Serial Communication 394 Interface 14. A/D Converter 447 14.1.1 Features 17.2.4 Register Configuration The high-speed conversion time is amended. Note 3 is deleted. 482 17. ROM [H8/3062FZTAT, H8/3062F-ZTAT R-Mask Version, On-Chip Mask ROM Models] 18. H8/3064 Internal Voltage Step-Down Version ROM [H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version] 523 to 574 All The title of the section is changed from Flash Memory [H8/3064F-ZTAT B-Mask Version]. 572 18.12 Mask ROM (H8/3064 Mask ROM B-Mask Version) Overview 18.13 Notes on Ordering Mask ROM Version Chips 18.14 Notes on Converting the F-ZTAT Application Software to the Mask ROM Versions Newly added. 573 574 19. H8/3062 Internal Voltage Step-Down Version ROM [H8/3062F-ZTAT B-Mask Version, Mask ROM B-Mask Versions of H8/3062, H8/3061, and H8/3060] 575 to 626 All * The title of the section is changed from Flash Memory. Descriptions on the mask ROM B-mask versions of H8/3062, H8/3061, and H8/3060 are added. * 594 19.5.1 Boot Mode The start address of the programming control program is amended to H'FFF520. Section 19. H8/3062 Internal Voltage Step-Down Version ROM [H8/3062F-ZTAT B-Mask Version, Mask ROM B-Mask Versions of H8/3062, H8/3061, and H8/3060] Page 624 Item 19.12 Mask ROM (H8/3062 Mask ROM BMask Version, H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version) Overview 19.13 Notes on Ordering Mask ROM Version Chips 19.14 Notes on Converting the F-ZTAT Application Software to the Mask ROM Versions 20.2.1 Connecting a Crystal Resonator Description (See Manual for Details) Newly added. 625 626 * * Moved from 19.12. Table is amended. 20. Clock Pulse Generator 628 Table 20.1 (1) Damping Resistance Value * Note is amended. 634 20.5.3 Usage Notes Table 20.7 Comparison of H8/3062 Series Operating Frequency Ranges is amended. 21. Power-Down State 644 21.4.3 Selection of Table 21.3 Clock Frequency Waiting Time for Exit from and Waiting Time for Clock to Software Standby Mode Settle * The value 13.1 is specified for the recommended setting for DIV = 1, DIV0 = 1, and 32468 states 22. Electrical Characteristics 695 22.3 Electrical Characteristics of H8/3064F-ZTAT B-Mask Version 22.3.1 Absolute Maximum Ratings Table 22.21 Absolute Maximum Ratings The operating temperature rating is amended 696, 699 22.3.2 DC Characteristics Table22.22 DC Characteristics, and Table 22.23 Permissible Output Currents * A new condition is added. Section 22. Electrical Characteristics Page 701, 702, 703, 705 Item 22.3.3 AC Characteristics Description (See Manual for Details) Table 22.24 Clock Timing, Table 22.25 Control Signal Timing, Table 22.26 Bus Timing, and Table 22.27 Timing of On-Chip Supporting Modules * A new condition is added. 707 22.3.4 A/D Conversion Characteristics Table 22.28 A/D Conversion Characteristics * A new condition is added. 708 22.3.5 D/A Conversion Characteristics Table 22.29 D/A conversion Characteristics * A new condition is added. 709 22.3.6 Flash Memory Characteristics Table 22.30 Flash Memory Characteristics * A new condition is added. 711 to 723 22.4 Electrical Characteristics of H8/3064 Mask ROM BMask Version 724 to 739 22.5 Electrical Characteristics of H8/3062F-ZTAT B-Mask Version 724 22.5.1 Absolute Maximum Ratings Newly added The section is moved from 22.4. Table 22.40 Absolute Maximum Ratings The operating temperature rating is amended 725 22.5.2 DC Characteristics Table22.41 DC Characteristics, and Table 22.42 Permissible Output Currents * A new condition is added. 730, 731, 732, 734 22.5.3 AC Characteristics Table 22.43 Clock Timing, Table 22.44 Control Signal Timing, Table 22.45 Bus Timing, and Table 22.46 Timing of On-Chip Supporting Modules * A new condition is added. Section 22. Electrical Characteristics Page 736 Item 22.5.4 A/D Conversion Characteristics Description (See Manual for Details) Table 22.47 A/D Conversion Characteristics * A new condition is added. 737 22.5.5 D/A Conversion Characteristics Table 22.48 D/A conversion Characteristics * A new condition is added. 738 22.5.6 Flash Memory Characteristics Table 22.49 Flash Memory Characteristics * A new condition is added. Newly added 740 to 752 22.6 Electrical Characteristics of H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version 753 to 761 22.7 Operational Timing The section is moved from 22.5. Appendix 906 C.7 Port 7 Block Diagram * Figure C.7(a) Port 7 Block Diagram (Pins P70 to P7 5) is amended. Figure C.7(b) Port 7 Block Diagram (Pins P76 to P7 7) is amended. * Contents Section 1 1.1 1.2 1.3 Overview............................................................................................................ 1.4 1.5 1.6 1.7 Overview ............................................................................................................................ Block Diagram.................................................................................................................... Pin Description ................................................................................................................... 1.3.1 Pin Arrangement ................................................................................................... 1.3.2 Pin Functions......................................................................................................... 1.3.3 Pin Assignments in Each Mode ............................................................................ Notes on H8/3062F-ZTAT R-Mask Version ..................................................................... 1.4.1 Pin Arrangement ................................................................................................... 1.4.2 Product Type Names and Markings...................................................................... 1.4.3 Differences between H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version.. Notes on H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version ........ 1.5.1 Pin Arrangement .................................................................................................. 1.5.2 Product Type Names and Markings...................................................................... 1.5.3 VCL Pin .................................................................................................................. 1.5.4 Notes on Changeover to On-Chip Mask ROM Versions and On-Chip Mask ROM B-Mask Versions................................................................ Setting Oscillation Settling Wait Time .............................................................................. Caution on Crystal Resonator Connection ......................................................................... 1 1 7 8 8 13 18 22 22 23 23 24 25 25 26 27 28 28 Section 2 2.1 CPU...................................................................................................................... 29 29 29 30 31 31 32 32 33 34 35 36 36 37 39 39 40 i 2.2 2.3 2.4 2.5 2.6 Overview ............................................................................................................................ 2.1.1 Features ................................................................................................................. 2.1.2 Differences from H8/300 CPU.............................................................................. CPU Operating Modes ....................................................................................................... Address Space .................................................................................................................... Register Configuration ....................................................................................................... 2.4.1 Overview ............................................................................................................... 2.4.2 General Registers .................................................................................................. 2.4.3 Control Registers................................................................................................... 2.4.4 Initial CPU Register Values ...................................................................................... Data Formats ...................................................................................................................... 2.5.1 General Register Data Formats ............................................................................. 2.5.2 Memory Data Formats .......................................................................................... Instruction Set..................................................................................................................... 2.6.1 Instruction Set Overview ...................................................................................... 2.6.2 Instructions and Addressing Modes ...................................................................... 2.7 2.8 2.9 2.6.3 Tables of Instructions Classified by Function....................................................... 2.6.4 Basic Instruction Formats...................................................................................... 2.6.5 Notes on Use of Bit Manipulation Instructions .................................................... Addressing Modes and Effective Address Calculation...................................................... 2.7.1 Addressing Modes................................................................................................. 2.7.2 Effective Address Calculation............................................................................... Processing States ................................................................................................................ 2.8.1 Overview ............................................................................................................... 2.8.2 Program Execution State ....................................................................................... 2.8.3 Exception-Handling State ..................................................................................... 2.8.4 Exception Handling Operation.............................................................................. 2.8.5 Bus-Released State................................................................................................ 2.8.6 Reset State ............................................................................................................. 2.8.7 Power-Down State ................................................................................................ Basic Operational Timing .................................................................................................. 2.9.1 Overview ............................................................................................................... 2.9.2 On-Chip Memory Access Timing ......................................................................... 2.9.3 On-Chip Supporting Module Access Timing........................................................ 2.9.4 Access to External Address Space ........................................................................ 41 50 51 53 53 55 59 59 59 60 61 62 62 63 63 63 63 64 65 67 67 67 68 68 69 72 72 72 72 72 72 73 73 73 74 74 75 85 85 85 85 Section 3 3.1 3.2 3.3 3.4 3.5 3.6 MCU Operating Modes ................................................................................. Overview ............................................................................................................................ 3.1.1 Operating Mode Selection .................................................................................... 3.1.2 Register Configuration .......................................................................................... Mode Control Register (MDCR)........................................................................................ System Control Register (SYSCR) .................................................................................... Operating Mode Descriptions............................................................................................. 3.4.1 Mode 1 .................................................................................................................. 3.4.2 Mode 2 .................................................................................................................. 3.4.3 Mode 3 .................................................................................................................. 3.4.4 Mode 4 .................................................................................................................. 3.4.5 Mode 5 .................................................................................................................. 3.4.6 Mode 6 .................................................................................................................. 3.4.7 Mode 7 .................................................................................................................. Pin Functions in Each Operating Mode.............................................................................. Memory Map in Each Operating Mode.............................................................................. 3.6.1 Comparison of H8/3062 Series Memory Maps .................................................... 3.6.2 Reserved Areas...................................................................................................... Exception Handling ........................................................................................ Overview ............................................................................................................................ 4.1.1 Exception Handling Types and Priority................................................................ 4.1.2 Exception Handling Operation.............................................................................. Section 4 4.1 ii 4.2 4.3 4.4 4.5 4.6 4.1.3 Exception Vector Table ........................................................................................ Reset ................................................................................................................................... 4.2.1 Overview ............................................................................................................... 4.2.2 Reset Sequence...................................................................................................... 4.2.3 Interrupts after Reset ............................................................................................. Interrupts ............................................................................................................................ Trap Instruction .................................................................................................................. Stack Status after Exception Handling ............................................................................... Notes on Stack Usage......................................................................................................... 86 88 88 88 91 92 92 93 94 Section 5 5.1 Interrupt Controller ......................................................................................... 97 5.2 5.3 5.4 5.5 Overview ............................................................................................................................ 97 5.1.1 Features ................................................................................................................. 97 5.1.2 Block Diagram ...................................................................................................... 98 5.1.3 Pin Configuration .................................................................................................. 99 5.1.4 Register Configuration .......................................................................................... 99 Register Descriptions.......................................................................................................... 99 5.2.1 System Control Register (SYSCR) ....................................................................... 99 5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB).............................................. 100 5.2.3 IRQ Status Register (ISR) ..................................................................................... 105 5.2.4 IRQ Enable Register (IER) ................................................................................... 106 5.2.5 IRQ Sense Control Register (ISCR)...................................................................... 107 Interrupt Sources ................................................................................................................ 108 5.3.1 External Interrupts................................................................................................. 108 5.3.2 Internal Interrupts.................................................................................................. 109 5.3.3 Interrupt Exception Handling Vector Table.......................................................... 109 Interrupt Operation ............................................................................................................. 113 5.4.1 Interrupt Handling Process.................................................................................... 113 5.4.2 Interrupt Exception Handling Sequence ............................................................... 118 5.4.3 Interrupt Response Time ....................................................................................... 119 Usage Notes........................................................................................................................ 120 5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction....................... 120 5.5.2 Instructions that Inhibit Interrupts......................................................................... 121 5.5.3 Interrupts during EEPMOV Instruction Execution ............................................... 121 Section 6 6.1 6.2 Bus Controller .................................................................................................. 123 Overview ............................................................................................................................ 123 6.1.1 Features ................................................................................................................. 123 6.1.2 Block Diagram ...................................................................................................... 124 6.1.3 Pin Configuration .................................................................................................. 125 6.1.4 Register Configuration .......................................................................................... 126 Register Descriptions.......................................................................................................... 126 6.2.1 Bus Width Control Register (ABWCR)................................................................ 126 iii 6.3 6.4 6.5 6.6 6.7 6.2.2 Access State Control Register (ASTCR) .............................................................. 127 6.2.3 Wait Control Registers H and L (WCRH, WCRL) .............................................. 128 6.2.4 Bus Release Control Register (BRCR) ................................................................. 132 6.2.5 Bus Control Register (BCR) ................................................................................. 133 6.2.6 Chip Select Control Register (CSCR)................................................................... 135 6.2.7 Address Control Register (ADRCR)..................................................................... 136 Operation ............................................................................................................................ 137 6.3.1 Area Division ........................................................................................................ 137 6.3.2 Bus Specifications ................................................................................................. 141 6.3.3 Memory Interfaces ................................................................................................ 142 6.3.4 Chip Select Signals................................................................................................ 142 6.3.5 Address Output Method ........................................................................................ 143 Basic Bus Interface............................................................................................................. 145 6.4.1 Overview ............................................................................................................... 145 6.4.2 Data Size and Data Alignment.............................................................................. 145 6.4.3 Valid Strobes ......................................................................................................... 146 6.4.4 Memory Areas....................................................................................................... 147 6.4.5 Basic Bus Control Signal Timing.......................................................................... 148 6.4.6 Wait Control.......................................................................................................... 155 Idle Cycle............................................................................................................................ 157 6.5.1 Operation ............................................................................................................... 157 6.5.2 Pin States in Idle Cycle ......................................................................................... 159 Bus Arbiter ......................................................................................................................... 159 6.6.1 Operation ............................................................................................................... 160 Register and Pin Input Timing ........................................................................................... 162 6.7.1 Register Write Timing .......................................................................................... 162 6.7.2 BREQ Pin Input Timing ....................................................................................... 163 Section 7 7.1 7.2 7.3 7.4 7.5 7.6 iv I/O Ports ............................................................................................................. 165 Overview ............................................................................................................................ 165 Port 1 .................................................................................................................................. 169 7.2.1 Overview ............................................................................................................... 169 7.2.2 Register Descriptions ............................................................................................ 169 Port 2 .................................................................................................................................. 172 7.3.1 Overview ............................................................................................................... 172 7.3.2 Register Descriptions ............................................................................................ 173 Port 3 .................................................................................................................................. 176 7.4.1 Overview ............................................................................................................... 176 7.4.2 Register Descriptions ............................................................................................ 176 Port 4 .................................................................................................................................. 178 7.5.1 Overview ............................................................................................................... 178 7.5.2 Register Descriptions ............................................................................................ 179 Port 5 .................................................................................................................................. 181 7.6.1 Overview ............................................................................................................... 181 7.6.2 Register Descriptions ............................................................................................ 182 7.7 Port 6 .................................................................................................................................. 184 7.7.1 Overview ............................................................................................................... 184 7.7.2 Register Descriptions ............................................................................................ 185 7.8 Port 7 .................................................................................................................................. 188 7.8.1 Overview ............................................................................................................... 188 7.8.2 Register Description.............................................................................................. 189 7.9 Port 8 .................................................................................................................................. 190 7.9.1 Overview ............................................................................................................... 190 7.9.2 Register Descriptions ............................................................................................ 191 7.10 Port 9 .................................................................................................................................. 195 7.10.1 Overview ............................................................................................................... 195 7.10.2 Register Descriptions ............................................................................................ 196 7.11 Port A.................................................................................................................................. 200 7.11.1 Overview ............................................................................................................... 200 7.11.2 Register Descriptions ............................................................................................ 202 7.12 Port B.................................................................................................................................. 212 7.12.1 Overview ............................................................................................................... 212 7.12.2 Register Descriptions ............................................................................................ 214 Section 8 8.1 8.2 8.3 8.4 16-Bit Timer...................................................................................................... 221 Overview ............................................................................................................................ 221 8.1.1 Features ................................................................................................................. 221 8.1.2 Block Diagrams..................................................................................................... 223 8.1.3 Pin Configuration .................................................................................................. 226 8.1.4 Register Configuration .......................................................................................... 227 Register Descriptions.......................................................................................................... 228 8.2.1 Timer Start Register (TSTR)................................................................................. 228 8.2.2 Timer Synchro Register (TSNC) .......................................................................... 229 8.2.3 Timer Mode Register (TMDR) ............................................................................. 230 8.2.4 Timer Interrupt Status Register A (TISRA).......................................................... 233 8.2.5 Timer Interrupt Status Register B (TISRB) .......................................................... 235 8.2.6 Timer Interrupt Status Register C (TISRC) .......................................................... 238 8.2.7 Timer Counters (16TCNT).................................................................................... 240 8.2.8 General Registers (GRA, GRB)............................................................................ 241 8.2.9 Timer Control Registers (16TCR) ........................................................................ 242 8.2.10 Timer I/O Control Register (TIOR) ...................................................................... 244 8.2.11 Timer Output Level Setting Register C (TOLR) .................................................. 246 CPU Interface ..................................................................................................................... 248 8.3.1 16-Bit Accessible Registers .................................................................................. 248 8.3.2 8-Bit Accessible Registers .................................................................................... 250 Operation ............................................................................................................................ 251 v 8.5 8.6 8.4.1 Overview ............................................................................................................... 251 8.4.2 Basic Functions ..................................................................................................... 251 8.4.3 Synchronization .................................................................................................... 259 8.4.4 PWM Mode ........................................................................................................... 261 8.4.5 Phase Counting Mode ........................................................................................... 265 8.4.6 16-Bit Timer Output Timing ................................................................................. 267 Interrupts ............................................................................................................................ 268 8.5.1 Setting of Status Flags........................................................................................... 268 8.5.2 Timing of Clearing of Status Flags ....................................................................... 270 8.5.3 Interrupt Sources ................................................................................................... 271 Usage Notes........................................................................................................................ 272 Section 9 9.1 9.2 9.3 9.4 9.5 9.6 9.7 8-Bit Timers ...................................................................................................... 285 Overview ............................................................................................................................ 285 9.1.1 Features ................................................................................................................. 285 9.1.2 Block Diagram ...................................................................................................... 287 9.1.3 Pin Configuration .................................................................................................. 288 9.1.4 Register Configuration .......................................................................................... 289 Register Descriptions.......................................................................................................... 290 9.2.1 Timer Counters (8TCNT)...................................................................................... 290 9.2.2 Time Constant Registers A (TCORA) .................................................................. 291 9.2.3 Time Constant Registers B (TCORB) .................................................................. 292 9.2.4 Timer Control Register (8TCR) ............................................................................ 293 9.2.5 Timer Control/Status Registers (8TCSR) ............................................................. 296 CPU Interface ..................................................................................................................... 301 9.3.1 8-Bit Registers....................................................................................................... 301 Operation ............................................................................................................................ 303 9.4.1 8TCNT Count Timing........................................................................................... 303 9.4.2 Compare Match Timing ........................................................................................ 304 9.4.3 Input Capture Signal Timing................................................................................. 305 9.4.4 Timing of Status Flag Setting................................................................................ 306 9.4.5 Operation with Cascaded Connection ................................................................... 307 9.4.6 Input Capture Setting ............................................................................................ 310 Interrupt .............................................................................................................................. 311 9.5.1 Interrupt Sources ................................................................................................... 311 9.5.2 A/D Converter Activation ..................................................................................... 312 8-Bit Timer Application Example...................................................................................... 312 Usage Notes........................................................................................................................ 313 9.7.1 Contention between 8TCNT Write and Clear....................................................... 313 9.7.2 Contention between 8TCNT Write and Increment ............................................... 314 9.7.3 Contention between TCOR Write and Compare Match ....................................... 315 9.7.4 Contention between TCOR Read and Input Capture............................................ 316 9.7.5 Contention between Counter Clearing by Input Capture and Counter Increment 317 vi 9.7.6 9.7.7 9.7.8 9.7.9 Contention between TCOR Write and Input Capture ........................................... 318 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode (Cascaded Connection) ......................................................................................... 319 Contention between Compare Matches A and B .................................................. 320 8TCNT Operation and Internal Clock Source Switchover ................................... 320 Section 10 Programmable Timing Pattern Controller (TPC) .................................. 323 10.1 Overview ............................................................................................................................ 323 10.1.1 Features ................................................................................................................. 323 10.1.2 Block Diagram ...................................................................................................... 324 10.1.3 Pin Configuration .................................................................................................. 325 10.1.4 Register Configuration .......................................................................................... 326 10.2 Register Descriptions.......................................................................................................... 327 10.2.1 Port A Data Direction Register (PADDR) ............................................................ 327 10.2.2 Port A Data Register (PADR) ............................................................................... 327 10.2.3 Port B Data Direction Register (PBDDR) ............................................................ 328 10.2.4 Port B Data Register (PBDR)................................................................................ 328 10.2.5 Next Data Register A (NDRA) ............................................................................. 329 10.2.6 Next Data Register B (NDRB).............................................................................. 331 10.2.7 Next Data Enable Register A (NDERA)............................................................... 333 10.2.8 Next Data Enable Register B (NDERB) ............................................................... 334 10.2.9 TPC Output Control Register (TPCR) .................................................................. 335 10.2.10 TPC Output Mode Register (TPMR) .................................................................... 337 10.3 Operation ............................................................................................................................ 339 10.3.1 Overview ............................................................................................................... 339 10.3.2 Output Timing ....................................................................................................... 340 10.3.3 Normal TPC Output .............................................................................................. 341 10.3.4 Non-Overlapping TPC Output .............................................................................. 343 10.3.5 TPC Output Triggering by Input Capture ............................................................. 345 10.4 Usage Notes........................................................................................................................ 346 10.4.1 Operation of TPC Output Pins .............................................................................. 346 10.4.2 Note on Non-Overlapping Output......................................................................... 346 Section 11 Watchdog Timer .............................................................................................. 349 11.1 Overview ............................................................................................................................ 349 11.1.1 Features ................................................................................................................. 349 11.1.2 Block Diagram ...................................................................................................... 350 11.1.3 Pin Configuration .................................................................................................. 350 11.1.4 Register Configuration .......................................................................................... 351 11.2 Register Descriptions.......................................................................................................... 351 11.2.1 Timer Counter (TCNT) ......................................................................................... 351 11.2.2 Timer Control/Status Register (TCSR) ................................................................. 352 11.2.3 Reset Control/Status Register (RSTCSR) ............................................................. 354 vii 11.2.4 Notes on Register Rewriting ................................................................................. 355 11.3 Operation ............................................................................................................................ 357 11.3.1 Watchdog Timer Operation .................................................................................. 357 11.3.2 Interval Timer Operation ...................................................................................... 358 11.3.3 Timing of Setting of Overflow Flag (OVF).......................................................... 358 11.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) ................................... 359 11.4 Interrupts ............................................................................................................................ 360 11.5 Usage Notes........................................................................................................................ 360 Section 12 Serial Communication Interface ................................................................. 361 12.1 Overview ............................................................................................................................ 361 12.1.1 Features ................................................................................................................. 361 12.1.2 Block Diagram ...................................................................................................... 363 12.1.3 Pin Configuration .................................................................................................. 364 12.1.4 Register Configuration .......................................................................................... 365 12.2 Register Descriptions.......................................................................................................... 366 12.2.1 Receive Shift Register (RSR)................................................................................ 366 12.2.2 Receive Data Register (RDR) ............................................................................... 366 12.2.3 Transmit Shift Register (TSR) .............................................................................. 367 12.2.4 Transmit Data Register (TDR).............................................................................. 367 12.2.5 Serial Mode Register (SMR)................................................................................. 368 12.2.6 Serial Control Register (SCR)............................................................................... 371 12.2.7 Serial Status Register (SSR).................................................................................. 375 12.2.8 Bit Rate Register (BRR)........................................................................................ 380 12.3 Operation ............................................................................................................................ 388 12.3.1 Overview ............................................................................................................... 388 12.3.2 Operation in Asynchronous Mode ........................................................................ 391 12.3.3 Multiprocessor Communication............................................................................ 400 12.3.4 Synchronous Operation ......................................................................................... 407 12.4 SCI Interrupts ..................................................................................................................... 415 12.5 Usage Notes........................................................................................................................ 416 12.5.1 Notes on Use of SCI.............................................................................................. 416 Section 13 Smart Card Interface ...................................................................................... 421 13.1 Overview ............................................................................................................................ 421 13.1.1 Features ................................................................................................................. 421 13.1.2 Block Diagram ...................................................................................................... 422 13.1.3 Pin Configuration .................................................................................................. 422 13.1.4 Register Configuration .......................................................................................... 423 13.2 Register Descriptions.......................................................................................................... 424 13.2.1 Smart Card Mode Register (SCMR) ..................................................................... 424 13.2.2 Serial Status Register (SSR).................................................................................. 426 13.2.3 Serial Mode Register (SMR)................................................................................. 427 viii 13.2.4 Serial Control Register (SCR)............................................................................... 428 13.3 Operation ............................................................................................................................ 429 13.3.1 Overview ............................................................................................................... 429 13.3.2 Pin Connections .................................................................................................... 429 13.3.3 Data Format........................................................................................................... 430 13.3.4 Register Settings.................................................................................................... 432 13.3.5 Clock ..................................................................................................................... 434 13.3.6 Transmitting and Receiving Data.......................................................................... 436 13.4 Usage Notes........................................................................................................................ 443 Section 14 A/D Converter .................................................................................................. 447 14.1 Overview ............................................................................................................................ 447 14.1.1 Features ................................................................................................................. 447 14.1.2 Block Diagram ...................................................................................................... 448 14.1.3 Pin Configuration .................................................................................................. 449 14.1.4 Register Configuration .......................................................................................... 450 14.2 Register Descriptions.......................................................................................................... 450 14.2.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 450 14.2.2 A/D Control/Status Register (ADCSR) ................................................................ 451 14.2.3 A/D Control Register (ADCR).............................................................................. 453 14.3 CPU Interface ..................................................................................................................... 454 14.4 Operation ............................................................................................................................ 456 14.4.1 Single Mode (SCAN = 0)...................................................................................... 456 14.4.2 Scan Mode (SCAN = 1) ........................................................................................ 458 14.4.3 Input Sampling and A/D Conversion Time .......................................................... 460 14.4.4 External Trigger Input Timing .............................................................................. 461 14.5 Interrupts ............................................................................................................................ 462 14.6 Usage Notes........................................................................................................................ 462 Section 15 D/A Converter .................................................................................................. 467 15.1 Overview ............................................................................................................................ 467 15.1.1 Features ................................................................................................................. 467 15.1.2 Block Diagram ...................................................................................................... 468 15.1.3 Pin Configuration .................................................................................................. 469 15.1.4 Register Configuration .......................................................................................... 469 15.2 Register Descriptions.......................................................................................................... 470 15.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1) .................................................. 470 15.2.2 D/A Control Register (DACR).............................................................................. 470 15.2.3 D/A Standby Control Register (DASTCR)........................................................... 472 15.3 Operation ............................................................................................................................ 472 15.4 D/A Output Control............................................................................................................ 474 ix Section 16 RAM.................................................................................................................... 475 16.1 Overview ............................................................................................................................ 475 16.1.1 Block Diagram ...................................................................................................... 476 16.1.2 Register Configuration .......................................................................................... 476 16.2 System Control Register (SYSCR) .................................................................................... 477 16.3 Operation ............................................................................................................................ 478 Section 17 ROM [H8/3062F-ZTAT, H8/3062F-ZTAT ROM Version, On-Chip Mask ROM Models]..................................................................... 479 17.1 Overview ............................................................................................................................ 479 17.2 Overview of Flash Memory (H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version)....... 480 17.2.1 Features ................................................................................................................. 480 17.2.2 Block Diagram ...................................................................................................... 481 17.2.3 Pin Configuration .................................................................................................. 482 17.2.4 Register Configuration .......................................................................................... 482 17.3 Flash Memory Register Descriptions ................................................................................. 483 17.3.1 Flash Memory Control Register (FLMCR) .......................................................... 483 17.3.2 Erase Block Register (EBR).................................................................................. 486 17.3.3 RAM Control Register (RAMCR) ........................................................................ 487 17.3.4 Flash Memory Status Register (FLMSR).............................................................. 489 17.4 On-Board Programming Mode........................................................................................... 490 17.4.1 Boot Mode............................................................................................................. 493 17.4.2 User Program Mode .............................................................................................. 498 17.5 Flash Memory Programming/Erasing ................................................................................ 500 17.5.1 Program Mode....................................................................................................... 501 17.5.2 Program-Verify Mode ........................................................................................... 502 17.5.3 Erase Mode............................................................................................................ 504 17.5.4 Erase-Verify Mode................................................................................................ 504 17.6 Flash Memory Protection ................................................................................................... 506 17.6.1 Hardware Protection.............................................................................................. 506 17.6.2 Software Protection ............................................................................................... 508 17.6.3 Error Protection ..................................................................................................... 508 17.6.4 NMI Input Disabling Conditions............................................................................. 510 17.7 Flash Memory Emulation in RAM..................................................................................... 511 17.8 Flash Memory PROM Mode.............................................................................................. 513 17.8.1 Socket Adapters and Memory Map ...................................................................... 513 17.8.2 Notes on Use of PROM Mode .............................................................................. 514 17.9 Flash Memory Programming and Erasing Precautions...................................................... 515 17.10 Mask ROM (H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version) Overview .......................................................................... 520 17.10.1 Block Diagram ...................................................................................................... 520 17.11 Notes on Ordering Mask ROM Version Chips .................................................................. 521 17.12 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Versions 522 x Section 18 H8/3064 Internal Voltage Step-Down Version ROM [H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version] ................................................... 523 18.1 Overview ............................................................................................................................ 523 18.1.1 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version........ 524 18.2 Features .............................................................................................................................. 525 18.2.1 Block Diagram ...................................................................................................... 526 18.2.2 Pin Configuration .................................................................................................. 527 18.2.3 Register Configuration .......................................................................................... 527 18.3 Register Descriptions.......................................................................................................... 528 18.3.1 Flash Memory Control Register 1 (FLMCR1)...................................................... 528 18.3.2 Flash Memory Control Register 2 (FLMCR2)...................................................... 531 18.3.3 Erase Block Register 1 (EBR1) ............................................................................ 532 18.3.4 Erase Block Register 2 (EBR2) ............................................................................ 532 18.3.5 RAM Control Register (RAMCR) ........................................................................ 533 18.4 Overview of Operation ....................................................................................................... 535 18.4.1 Mode Transitions .................................................................................................. 535 18.4.2 On-Board Programming Modes............................................................................ 537 18.4.3 Flash Memory Emulation in RAM........................................................................ 539 18.4.4 Block Configuration.............................................................................................. 540 18.5 On-Board Programming Mode........................................................................................... 541 18.5.1 Boot Mode............................................................................................................. 542 18.5.2 User Program Mode .............................................................................................. 547 18.6 Flash Memory Programming/Erasing ................................................................................ 549 18.6.1 Program Mode....................................................................................................... 551 18.6.2 Program-Verify Mode ........................................................................................... 552 18.6.3 Erase Mode............................................................................................................ 556 18.6.4 Erase-Verify Mode................................................................................................ 556 18.7 Flash Memory Protection ................................................................................................... 558 18.7.1 Hardware Protection.............................................................................................. 558 18.7.2 Software Protection ............................................................................................... 559 18.7.3 Error Protection ..................................................................................................... 559 18.8 Flash Memory Emulation in RAM..................................................................................... 562 18.9 NMI Input Disabling Conditions........................................................................................ 564 18.10 Flash Memory PROM Mode.............................................................................................. 565 18.10.1 Socket Adapters and Memory Map ...................................................................... 565 18.10.2 Notes on Use of PROM Mode .............................................................................. 566 18.11 Flash Memory Programming and Erasing Precautions...................................................... 566 18.12 Mask ROM (H8/3064 Mask ROM B-Mask Version) Overview ....................................... 572 18.12.1 Block Diagram ...................................................................................................... 572 18.13 Notes on Ordering Mask ROM Version Chips .................................................................. 573 18.14 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Version .. 574 xi Section 19 H8/3062 Internal Voltage Step-Down Version ROM [H8/3062F-ZTAT B-Mask Version, Mask ROM B-Mask Versions of H8/3062, H8/3061, and H8/3060]......................................................... 575 19.1 Overview ............................................................................................................................ 575 19.1.1 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version.......... 576 19.2 Features .............................................................................................................................. 577 19.2.1 Block Diagram ...................................................................................................... 578 19.2.2 Pin Configuration .................................................................................................. 579 19.2.3 Register Configuration .......................................................................................... 579 19.3 Register Descriptions.......................................................................................................... 580 19.3.1 Flash Memory Control Register 1 (FLMCR1)...................................................... 580 19.3.2 Flash Memory Control Register 2 (FLMCR2)...................................................... 583 19.3.3 Erase Block Register (EBR).................................................................................. 584 19.3.4 RAM Control Register (RAMCR) ........................................................................ 585 19.4 Overview of Operation ....................................................................................................... 587 19.4.1 Mode Transitions .................................................................................................. 587 19.4.2 On-Board Programming Modes............................................................................ 589 19.4.3 Flash Memory Emulation in RAM........................................................................ 591 19.4.4 Block Configuration.............................................................................................. 592 19.5 On-Board Programming Mode........................................................................................... 593 19.5.1 Boot Mode............................................................................................................. 594 19.5.2 User Program Mode .............................................................................................. 599 19.6 Flash Memory Programming/Erasing ................................................................................ 601 19.6.1 Program Mode....................................................................................................... 603 19.6.2 Program-Verify Mode ........................................................................................... 604 19.6.3 Erase Mode............................................................................................................ 608 19.6.4 Erase-Verify Mode................................................................................................ 608 19.7 Flash Memory Protection ................................................................................................... 610 19.7.1 Hardware Protection.............................................................................................. 610 19.7.2 Software Protection ............................................................................................... 611 19.7.3 Error Protection ..................................................................................................... 611 19.8 Flash Memory Emulation in RAM..................................................................................... 614 19.9 NMI Input Disabling Conditions........................................................................................ 615 19.10 Flash Memory PROM Mode.............................................................................................. 616 19.10.1 Socket Adapters and Memory Map ...................................................................... 616 19.10.2 Notes on Use of PROM Mode .............................................................................. 617 19.11 Flash Memory Programming and Erasing Precautions...................................................... 618 19.12 Mask ROM (H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version) Overview.............................................. 624 19.12.1 Block Diagram ...................................................................................................... 624 19.13 Notes on Ordering Mask ROM Version Chips .................................................................. 625 19.14 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Versions 626 xii Section 20 Clock Pulse Generator ................................................................................... 627 20.1 Overview ............................................................................................................................ 627 20.1.1 Block Diagram ...................................................................................................... 627 20.2 Oscillator Circuit ................................................................................................................ 628 20.2.1 Connecting a Crystal Resonator............................................................................ 628 20.2.2 External Clock Input ............................................................................................. 630 20.3 Duty Adjustment Circuit .................................................................................................... 632 20.4 Prescalers............................................................................................................................ 632 20.5 Frequency Divider.............................................................................................................. 632 20.5.1 Register Configuration .......................................................................................... 633 20.5.2 Division Control Register (DIVCR) ..................................................................... 633 20.5.3 Usage Notes .......................................................................................................... 634 Section 21 Power-Down State .......................................................................................... 635 21.1 Overview ............................................................................................................................ 635 21.2 Register Configuration ....................................................................................................... 637 21.2.1 System Control Register (SYSCR) ....................................................................... 637 21.2.2 Module Standby Control Register H (MSTCRH)................................................. 639 21.2.3 Module Standby Control Register L (MSTCRL).................................................. 640 21.3 Sleep Mode......................................................................................................................... 642 21.3.1 Transition to Sleep Mode ...................................................................................... 642 21.3.2 Exit from Sleep Mode ........................................................................................... 642 21.4 Software Standby Mode ..................................................................................................... 642 21.4.1 Transition to Software Standby Mode .................................................................. 642 21.4.2 Exit from Software Standby Mode........................................................................ 643 21.4.3 Selection of Waiting Time for Exit from Software Standby Mode ...................... 643 21.4.4 Sample Application of Software Standby Mode................................................... 645 21.4.5 Usage Note ............................................................................................................ 645 21.4.6 Cautions on Clearing the software Standby Mode of F-ZTAT Version ............... 646 21.5 Hardware Standby Mode.................................................................................................... 647 21.5.1 Transition to Hardware Standby Mode ................................................................. 647 21.5.2 Exit from Hardware Standby Mode ...................................................................... 647 21.5.3 Timing for Hardware Standby Mode .................................................................... 647 21.6 Module Standby Function .................................................................................................. 648 21.6.1 Module Standby Timing........................................................................................ 648 21.6.2 Read/Write in Module Standby............................................................................. 648 21.6.3 Usage Notes .......................................................................................................... 648 21.7 System Clock Output Disabling Function.......................................................................... 649 Section 22 Electrical Characteristics............................................................................... 651 22.1 Electrical Characteristics of H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, and H8/3060 Mask ROM Version...................................................................................... 652 22.1.1 Absolute Maximum Ratings.................................................................................. 652 xiii 22.2 22.3 22.4 22.5 22.6 22.7 22.1.2 DC Characteristics ................................................................................................ 653 22.1.3 AC Characteristics ................................................................................................ 664 22.1.4 A/D Conversion Characteristics............................................................................ 670 22.1.5 D/A Conversion Characteristics............................................................................ 672 Electrical Characteristics of H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version.... 673 22.2.1 Absolute Maximum Ratings.................................................................................. 673 22.2.2 DC Characteristics ................................................................................................ 674 22.2.3 AC Characteristics ................................................................................................ 682 22.2.4 A/D Conversion Characteristics............................................................................ 688 22.2.5 D/A Conversion Characteristics............................................................................ 690 22.2.6 Flash Memory Characteristics .............................................................................. 691 Electrical Characteristics of H8/3064F-ZTAT B-Mask Version ....................................... 695 22.3.1 Absolute Maximum Ratings.................................................................................. 695 22.3.2 DC Characteristics ................................................................................................ 696 22.3.3 AC Characteristics ................................................................................................ 701 22.3.4 A/D Conversion Characteristics............................................................................ 707 22.3.5 D/A Conversion Characteristics............................................................................ 708 22.3.6 Flash Memory Characteristics .............................................................................. 709 Electrical Characteristics of H8/3064 Mask ROM B-Mask Version ................................. 711 22.4.1 Absolute Maximum Ratings.................................................................................. 711 22.4.2 DC Characteristics ................................................................................................ 712 22.4.3 AC Characteristics ................................................................................................ 716 22.4.4 A/D Conversion Characteristics............................................................................ 722 22.4.5 D/A Conversion Characteristics............................................................................ 723 Electrical Characteristics of H8/3062F-ZTAT B-Mask Version ....................................... 724 22.5.1 Absolute Maximum Ratings.................................................................................. 724 22.5.2 DC Characteristics ................................................................................................ 725 22.5.3 AC Characteristics ................................................................................................ 730 22.5.4 A/D Conversion Characteristics............................................................................ 736 22.5.5 D/A Conversion Characteristics............................................................................ 737 22.5.6 Flash Memory Characteristics .............................................................................. 738 Electrical Characteristics of H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version......... 740 22.6.1 Absolute Maximum Ratings.................................................................................. 740 22.6.2 DC Characteristics ................................................................................................ 741 22.6.3 AC Characteristics ................................................................................................ 745 22.6.4 A/D Conversion Characteristics............................................................................ 751 22.6.5 D/A Conversion Characteristics............................................................................ 752 Operational Timing ............................................................................................................ 753 22.7.1 Clock Timing ........................................................................................................ 753 22.7.2 Control Signal Timing .......................................................................................... 754 22.7.3 Bus Timing............................................................................................................ 756 22.7.4 TPC and I/O Port Timing...................................................................................... 760 xiv 22.7.5 Timer Input/Output Timing .................................................................................. 760 22.7.6 SCI Input/Output Timing ...................................................................................... 761 Appendix A Instruction Set............................................................................................... 763 A.1 A.2 A.3 Instruction List.................................................................................................................... 763 Operation Code Maps......................................................................................................... 778 Number of States Required for Execution.......................................................................... 781 Appendix B Internal I/O Registers ................................................................................. 790 B.1 Address List (H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version) ......................................... 791 Address List (H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version) .................. 801 Address List (H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version)....... 811 Functions ............................................................................................................................ 821 B.2 B.3 B.4 Appendix C I/O Port Block Diagrams........................................................................... 896 C.1 C.2 C.3 C.4 C.5 C.6 C.7 C.8 C.9 C.10 C.11 Port 1 Block Diagram......................................................................................................... 896 Port 2 Block Diagram......................................................................................................... 897 Port 3 Block Diagram......................................................................................................... 898 Port 4 Block Diagram......................................................................................................... 899 Port 5 Block Diagram......................................................................................................... 900 Port 6 Block Diagrams ....................................................................................................... 901 Port 7 Block Diagrams ....................................................................................................... 906 Port 8 Block Diagrams ....................................................................................................... 907 Port 9 Block Diagrams ....................................................................................................... 911 Port A Block Diagrams ...................................................................................................... 917 Port B Block Diagrams ...................................................................................................... 920 Appendix D Pin States........................................................................................................ 926 D.1 D.2 Port States in Each Mode ................................................................................................... 926 Pin States at Reset .............................................................................................................. 930 Appendix E Appendix F Timing of Transition to and Recovery from Hardware Standby Mode............................................................................................... 933 Product Code Lineup.................................................................................. 934 Appendix G Package Dimensions................................................................................... 936 xv Appendix H Comparison of H8/300H Series Product Specifications.................. 939 H.1 H.2 Differences between H8/3067 and H8/3062 Series, H8/3048 Series, H8/3007 and H8/3006, and H8/3002.................................................................................. 939 Comparison of Pin Functions of 100-Pin Package Products (FP-100B, TFP-100B)......... 942 xvi Figures Figure 1.1 Figure 1.2 Block Diagram .................................................................................................... Pin Arrangement of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, and H8/3060 Mask ROM Version (FP-100B or TFP-100B Package, Top View) .... Pin Arrangement of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, and H8/3060 Mask ROM Version (FP-100A Package, Top View) .......................... Pin Arrangement of H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version (FP-100B or TFP-100B Package, Top View) ........................................................................................................... Pin Arrangement of H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version (FP-100A Package, Top View)...... H8/3062F-ZTAT B-Mask Version, H8/3064F-ZTAT B-Mask Version, and On-Chip Mask ROM B-Mask Versions.............................................................. Example of Board Pattern Providing for External Capacitor.............................. CPU Operating Modes ........................................................................................ Memory Map....................................................................................................... CPU Registers ..................................................................................................... Usage of General Registers ................................................................................. Stack.................................................................................................................... General Register Data Formats ........................................................................... General Register Data Formats ........................................................................... Memory Data Formats ........................................................................................ Instruction Formats ............................................................................................. Memory-Indirect Branch Address Specification ................................................ Processing States ................................................................................................. Classification of Exception Sources.................................................................... State Transitions.................................................................................................. Stack Structure after Exception Handling ........................................................... On-Chip Memory Access Cycle ......................................................................... Pin States during On-Chip Memory Access (Address Update Mode 1)............. Access Cycle for On-Chip Supporting Modules................................................. Pin States during Access to On-Chip Supporting Modules ................................ Memory Map of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM Version, and H8/3062 Mask ROM B-Mask Version in Each Operating Mode ....................... 7 9 Figure 1.3 10 Figure 1.4 11 Figure 1.5 12 26 27 31 31 32 33 34 36 37 38 51 55 59 60 61 62 64 64 65 65 Figure 1.6 Figure 1.7 Figure 2.1 Figure 2.2 Figure 2.3 Figure 2.4 Figure 2.5 Figure 2.6 Figure 2.7 Figure 2.8 Figure 2.9 Figure 2.10 Figure 2.11 Figure 2.12 Figure 2.13 Figure 2.14 Figure 2.15 Figure 2.16 Figure 2.17 Figure 2.18 Figure 3.1 76 xvii Figure 3.2 Figure 3.3 Figure 3.4 Figure 4.1 Figure 4.2 Figure 4.3 Figure 4.4 Figure 4.5 Figure 4.6 Figure 4.7 Figure 5.1 Figure 5.2 Figure 5.3 Figure 5.4 Figure 5.5 Figure 5.6 Figure 5.7 Figure 5.8 Figure 6.1 Figure 6.2 Figure 6.3 Figure 6.3 Figure 6.3 Figure 6.4 Figure 6.5 Figure 6.6 Figure 6.7 Figure 6.8 Figure 6.9 Figure 6.10 Figure 6.11 Figure 6.12 Memory Map of H8/3061 Mask ROM Version and H8/3061 Mask ROM B-Mask Version in Each Operating Mode.......................................................... 78 Memory Map of H8/3060 Mask ROM Version and H8/3060 Mask ROM B-Mask Version in Each Operating Mode.......................................................... 80 H8/3064F-ZTAT B-Mask Version and H8/3064 Mask ROM B-Mask Version Memory Map in Each Operating Mode .............................................................. 82 Exception Sources ............................................................................................... 86 Reset Sequence (Modes 1 and 3) ........................................................................ 89 Reset Sequence (Modes 2 and 4) ........................................................................ 90 Reset Sequence (Mode 6).................................................................................... 91 Interrupt Sources and Number of Interrupts ....................................................... 92 Stack after Completion of Exception Handling .................................................. 93 Operation when SP Value is Odd........................................................................ 95 Interrupt Controller Block Diagram.................................................................... 98 Block Diagram of Interrupts IRQ0 to IRQ5 ......................................................... 108 Timing of Setting of IRQnF................................................................................ 109 Process Up to Interrupt Acceptance when UE = 1.............................................. 114 Interrupt Masking State Transitions (Example).................................................. 116 Process Up to Interrupt Acceptance when UE = 0.............................................. 117 Interrupt Exception Handling Sequence ............................................................. 118 Contention between Interrupt and Interrupt-Disabling Instruction..................... 120 Block Diagram of Bus Controller ....................................................................... 124 Access Area Map for Each Operating Mode ...................................................... 137 Memory Map in 16-Mbyte Mode (H8/3062F-ZTAT, H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version) (1)........ 138 Memory Map in 16-Mbyte Mode (H8/3060 Mask ROM Version, H8/3060 Mask ROM B-Mask Version) (2) ........................................................ 139 Memory Map in 16-Mbyte Mode (H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version) (3) ........................................................ 140 CSn Signal Output Timing (n = 0 to 7) .............................................................. 142 Sample Address Output in Each Address Update Mode (Basic Bus Interface, 3-State Space)...................................................................................................... 143 Example of Consecutive External Space Accesses in Address Update Mode 2. 144 Access Sizes and Data Alignment Control (8-Bit Access Area) ........................ 145 Access Sizes and Data Alignment Control (16-Bit Access Area) ...................... 146 Bus Control Signal Timing for 8-Bit, Three-State-Access Area ........................ 148 Bus Control Signal Timing for 8-Bit, Two-State-Access Area .......................... 149 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1) (Byte Access to Even Address) ........................................................................... 150 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2) (Byte Access to Odd Address) ............................................................................ 151 xviii Figure 6.13 Figure 6.14 Figure 6.15 Figure 6.16 Figure 6.17 Figure 6.18 Figure 6.19 Figure 6.20 Figure 6.21 Figure 6.22 Figure 6.23 Figure 6.24 Figure 7.1 Figure 7.2 Figure 7.3 Figure 7.4 Figure 7.5 Figure 7.6 Figure 7.7 Figure 7.8 Figure 7.9 Figure 7.10 Figure 7.11 Figure 8.1 Figure 8.2 Figure 8.3 Figure 8.4 Figure 8.5 Figure 8.6 Figure 8.7 Figure 8.8 Figure 8.9 Figure 8.10 Figure 8.11 Figure 8.12 Figure 8.13 Figure 8.14 Figure 8.15 Figure 8.16 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3) (Word Access)..................................................................................................... 152 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1) (Byte Access to Even Address) ........................................................................... 153 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2) (Byte Access to Odd Address) ............................................................................ 154 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3) (Word Access)..................................................................................................... 155 Example of Wait State Insertion Timing ............................................................ 156 Example of Idle Cycle Operation (ICIS1 = 1) .................................................... 157 Example of Idle Cycle Operation (ICIS0 = 1) .................................................... 158 Example of Idle Cycle Operation........................................................................ 158 Example of External Bus Master Operation ....................................................... 161 ASTCR Write Timing ......................................................................................... 162 DDR Write Timing.............................................................................................. 162 BRCR Write Timing ........................................................................................... 163 Port 1 Pin Configuration ..................................................................................... 169 Port 2 Pin Configuration ..................................................................................... 172 Port 3 Pin Configuration ..................................................................................... 176 Port 4 Pin Configuration ..................................................................................... 178 Port 5 Pin Configuration ..................................................................................... 181 Port 6 Pin Configuration ..................................................................................... 185 Port 7 Pin Configuration ..................................................................................... 188 Port 8 Pin Configuration ..................................................................................... 190 Port 9 Pin Configuration ..................................................................................... 195 Port A Pin Configuration .................................................................................... 201 Port B Pin Configuration..................................................................................... 213 16-bit timer Block Diagram (Overall)................................................................. 223 Block Diagram of Channels 0 and 1 ................................................................... 224 Block Diagram of Channel 2 .............................................................................. 225 16TCNT Access Operation [CPU 16TCNT (Word)] .................................... 248 Access to Timer Counter (CPU Reads 16TCNT, Word).................................... 248 Access to Timer Counter H (CPU Writes to 16TCNTH, Upper Byte)............... 249 Access to Timer Counter L (CPU Writes to 16TCNTL, Lower Byte) ............... 249 Access to Timer Counter H (CPU Reads 16TCNTH, Upper Byte).................... 249 Access to Timer Counter L (CPU Reads 16TCNTL, Lower Byte) .................... 250 16TCR Access (CPU Writes to 16TCR)............................................................. 250 16TCR Access (CPU Reads 16TCR).................................................................. 250 Counter Setup Procedure (Example)................................................................... 252 Free-Running Counter Operation........................................................................ 253 Periodic Counter Operation ................................................................................ 253 Count Timing for Internal Clock Sources ........................................................... 254 Count Timing for External Clock Sources (when Both Edges are Detected) ..... 254 xix Figure 8.17 Figure 8.18 Figure 8.19 Figure 8.20 Figure 8.21 Figure 8.22 Figure 8.23 Figure 8.24 Figure 8.25 Figure 8.26 Figure 8.27 Figure 8.28 Figure 8.29 Figure 8.30 Figure 8.31 Figure 8.32 Figure 8.33 Figure 8.34 Figure 8.35 Figure 8.36 Figure 8.37 Figure 8.38 Figure 8.39 Figure 8.40 Figure 8.41 Figure 8.42 Figure 8.43 Figure 8.44 Figure 9.1 Figure 9.2 Figure 9.3 Figure 9.4 Figure 9.5 Figure 9.6 Figure 9.7 Figure 9.8 Figure 9.9 Figure 9.10 Figure 9.11 Figure 9.12 Figure 9.13 Figure 9.14 xx Setup Procedure for Waveform Output by Compare Match (Example) ............. 255 0 and 1 Output (TOA = 1, TOB = 0) .................................................................. 256 Toggle Output (TOA = 1, TOB = 0) ................................................................... 256 Output Compare Output Timing ......................................................................... 257 Setup Procedure for Input Capture (Example).................................................... 258 Input Capture (Example) ..................................................................................... 258 Input Capture Signal Timing............................................................................... 259 Setup Procedure for Synchronization (Example)................................................ 260 Synchronization (Example)................................................................................. 261 Setup Procedure for PWM Mode (Example) ...................................................... 262 PWM Mode (Example 1) .................................................................................... 263 PWM Mode (Example 2) .................................................................................... 264 Setup Procedure for Phase Counting Mode (Example) ...................................... 265 Operation in Phase Counting Mode (Example) .................................................. 266 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode ............. 266 Timing for Setting 16-Bit Timer Output Level by Writing to TOLR ................. 267 Timing of Setting of IMFA and IMFB by Compare Match................................ 268 Timing of Setting of IMFA and IMFB by Input Capture ................................... 269 Timing of Setting of OVF ................................................................................... 270 Timing of Clearing of Status Flags ..................................................................... 270 Contention between 16TCNT Write and Clear................................................... 272 Contention between 16TCNT Word Write and Increment ................................. 273 Contention between 16TCNT Byte Write and Increment................................... 274 Contention between General Register Write and Compare Match ..................... 275 Contention between 16TCNT Write and Overflow ............................................ 276 Contention between General Register Read and Input Capture.......................... 277 Contention between Counter Clearing by Input Capture and Counter Increment ............................................................................................................ 278 Contention between General Register Write and Input Capture......................... 279 Block Diagram of 8-Bit Timer Unit (Two Channels: Group 0).......................... 287 8TCNT Access Operation (CPU Writes to 8TCNT, Word) ............................... 301 8TCNT Access Operation (CPU Reads 8TCNT, Word) .................................... 301 8TCNT0 Access Operation (CPU Writes to 8TCNT0, Upper Byte).................. 301 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte).................. 302 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte) ....................... 302 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte) ...................... 302 Count Timing for Internal Clock Input ............................................................... 303 Count Timing for External Clock Input (Both-Edge Detection) ........................ 304 Timing of Timer Output...................................................................................... 304 Timing of Clear by Compare Match ................................................................... 305 Timing of Clear by Input Capture ....................................................................... 305 Timing of Input Capture Input Signal ................................................................. 306 CMF Flag Setting Timing when Compare Match Occurs .................................. 306 Figure 9.15 Figure 9.16 Figure 9.17 Figure 9.18 Figure 9.19 Figure 9.20 Figure 9.21 Figure 9.22 Figure 9.23 Figure 9.24 Figure 10.1 Figure 10.2 Figure 10.3 Figure 10.4 Figure 10.5 Figure 10.6 Figure 10.7 Figure 10.8 Figure 10.9 Figure 10.10 Figure 11.1 Figure 11.2 Figure 11.3 Figure 11.4 Figure 11.5 Figure 11.6 Figure 11.7 Figure 11.8 Figure 12.1 Figure 12.2 Figure 12.3 Figure 12.4 Figure 12.5 Figure 12.6 Figure 12.7 Figure 12.8 Figure 12.9 CMFB Flag Setting Timing when Input Capture Occurs ................................... 307 Timing of OVF Setting ....................................................................................... 307 Example of Pulse Output .................................................................................... 312 Contention between 8TCNT Write and Clear..................................................... 313 Contention between 8TCNT Write and Increment ............................................. 314 Contention between TCOR Write and Compare Match ..................................... 315 Contention between TCOR Read and Input Capture.......................................... 316 Contention between Counter Clearing by Input Capture and Counter Increment ............................................................................................................ 317 Contention between TCOR Write and Input Capture ......................................... 318 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode 319 TPC Block Diagram............................................................................................ 324 TPC Output Operation ........................................................................................ 339 Timing of Transfer of Next Data Register Contents and Output (Example) ...... 340 Setup Procedure for Normal TPC Output (Example) ......................................... 341 Normal TPC Output Example (Five-Phase Pulse Output).................................. 342 Setup Procedure for Non-Overlapping TPC Output (Example) ......................... 343 Non-Overlapping TPC Output Example (Four-Phase Complementary Non-Overlapping Pulse Output).......................................................................... 344 TPC Output Triggering by Input Capture (Example) ......................................... 345 Non-Overlapping TPC Output ............................................................................ 346 Non-Overlapping Operation and NDR Write Timing ........................................ 347 WDT Block Diagram .......................................................................................... 350 Format of Data Written to TCNT and TCSR...................................................... 355 Format of Data Written to RSTCSR ................................................................... 356 Operation in Watchdog Timer Mode .................................................................. 357 Interval Timer Operation .................................................................................... 358 Timing of Setting of OVF ................................................................................... 358 Timing of Setting of WRST Bit and Internal Reset............................................ 359 Contention between TCNT Write and Count up ................................................ 360 SCI Block Diagram ............................................................................................. 363 Data Format in Asynchronous Communication (Example: 8-Bit Data with Parity and 2 Stop Bits)............................................. 391 Phase Relationship between Output Clock and Serial Data (Asynchronous Mode) .................................................................................................................. 393 Sample Flowchart for SCI Initialization ............................................................. 394 Sample Flowchart for Transmitting Serial Data ................................................. 395 Example of SCI Transmit Operation in Asynchronous Mode (8-Bit Data with Parity and One Stop Bit) .......................................................... 396 Sample Flowchart for Receiving Serial Data...................................................... 397 Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit) 400 Example of Communication among Processors using Multiprocessor Format (Sending Data H'AA to Receiving Processor A) ................................................ 401 xxi Figure 12.10 Figure 12.11 Figure 12.12 Figure 12.13 Figure 12.14 Figure 12.15 Figure 12.16 Figure 12.17 Figure 12.18 Figure 12.19 Figure 12.20 Figure 12.21 Figure 12.22 Figure 12.23 Figure 12.24 Figure 13.1 Figure 13.2 Figure 13.3 Figure 13.4 Figure 13.5 Figure 13.6 Figure 13.7 Figure 13.8 Figure 13.9 Figure 13.10 Figure 13.11 Figure 13.12 Figure 13.13 Figure 14.1 Figure 14.2 Figure 14.3 Figure 14.4 Figure 14.5 Figure 14.6 Figure 14.7 Figure 14.8 Figure 14.9 Figure 14.10 Figure 14.11 xxii Sample Flowchart for Transmitting Multiprocessor Serial Data ........................ 402 Example of SCI Transmit Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) ...................................................................................................... 403 Sample Flowchart for Receiving Multiprocessor Serial Data............................. 404 Example of SCI Receive Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) ...................................................................................................... 406 Data Format in Synchronous Communication.................................................... 407 Sample Flowchart for SCI Initialization ............................................................. 408 Sample Flowchart for Serial Transmitting.......................................................... 409 Example of SCI Transmit Operation .................................................................. 410 Sample Flowchart for Serial Receiving .............................................................. 411 Example of SCI Receive Operation .................................................................... 413 Sample Flowchart for Simultaneous Serial Transmitting and Receiving ........... 414 Receive Data Sampling Timing in Asynchronous Mode.................................... 417 Example of Synchronous Transmission.............................................................. 418 Operation when Switching from SCK Pin Function to Port Pin Function.......... 419 Operation when Switching from SCK Pin Function to Port Pin Function (Example of Preventing Low-Level Output) ...................................................... 420 Block Diagram of Smart Card Interface ............................................................. 422 Smart Card Interface Connection Diagram ......................................................... 430 Smart Card Interface Data Format ...................................................................... 431 Timing of TEND Flag Setting ............................................................................ 437 Sample Transmission Processing Flowchart....................................................... 438 Relation Between Transmit Operation and Internal Registers............................ 439 Timing of TEND Flag Setting ............................................................................ 439 Sample Reception Processing Flowchart ............................................................ 440 Timing for Fixing Cock Output .......................................................................... 441 Procedure for Stopping and Restarting the Clock ............................................... 442 Receive Data Sampling Timing in Smart Card Interface Mode ......................... 443 Retransmission in SCI Receive Mode ................................................................ 445 Retransmission in SCI Transmit Mode ............................................................... 445 A/D Converter Block Diagram ........................................................................... 448 A/D Data Register Access Operation (Reading H'AA40) .................................. 455 Example of A/D Converter Operation (Single Mode, Channel 1 Selected) ....... 457 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected).............................................................................................................. 459 A/D Conversion Timing...................................................................................... 460 External Trigger Input Timing ............................................................................ 461 Example of Analog Input Protection Circuit ...................................................... 463 Analog Input Pin Equivalent Circuit ................................................................... 463 A/D Converter Accuracy Definitions (1)............................................................ 464 A/D Converter Accuracy Definitions (2)............................................................ 465 Analog Input Circuit (Example).......................................................................... 466 Figure 15.1 Figure 15.2 Figure 16.1 Figure 17.1 Figure 17.2 Figure 17.3 Figure 17.4 Figure 17.5 Figure 17.6 Figure 17.7 Figure 17.8 Figure 17.9 Figure 17.10 Figure 17.11 Figure 17.12 Figure 17.13 Figure 17.14 Figure 17.15 Figure 17.16 Figure 17.17 Figure 17.18 Figure 17.19 Figure 17.20 Figure 18.1 Figure 18.2 Figure 18.3 Figure 18.4 Figure 18.5 Figure 18.6 Figure 18.7 Figure 18.8 Figure 18.9 Figure 18.10 Figure 18.11 Figure 18.12 Figure 18.13 Figure 18.14 Figure 18.15 Figure 18.16 Figure 18.17 D/A Converter Block Diagram ........................................................................... 468 Example of D/A Converter Operation ................................................................ 473 RAM Block Diagram .......................................................................................... 476 Block Diagram of Flash Memory........................................................................ 481 Example of ROM Area/RAM Area Overlap ...................................................... 488 Boot Mode........................................................................................................... 491 User Program Mode (Example) .......................................................................... 492 System Configuration When Using Boot Mode ................................................. 493 Boot Mode Execution Procedure ........................................................................ 494 Measurement of Low Period of Host's Transmit Data ....................................... 495 RAM Areas in Boot Mode .................................................................................. 496 User Program Mode Execution Procedure (Example)........................................ 499 FLMCR Bit Settings and State Transitions......................................................... 501 Program/Program-Verify Flowchart (32-byte Programming) ............................ 503 Erase/Erase-Verify Flowchart (Single-Block Erasing) ....................................... 505 Flash Memory State Transitions (Modes 5 and 7 (On-Chip ROM Enabled), High Level Applied to FWE Pin)........................................................................ 509 Example of RAM Overlap Operation ................................................................. 511 Memory Map in PROM Mode............................................................................ 514 Power-On/Off Timing (Boot Mode) ................................................................... 517 Power-On/Off Timing (User Program Mode)..................................................... 518 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) ................................................................................................... 519 ROM Block Diagram (H8/3062 Mask ROM Version)....................................... 520 Mask ROM Addresses and Data ......................................................................... 521 Block Diagram of Flash Memory........................................................................ 526 Flash Memory Related State Transitions ............................................................ 536 Reading Overlap RAM Data in User Mode/User Program Mode ...................... 539 Writing Overlap RAM Data in User Program Mode .......................................... 540 System Configuration When Using Boot Mode ................................................. 542 Boot Mode Execution Procedure ........................................................................ 543 RAM Areas in Boot Mode .................................................................................. 545 Example of User Program Mode Execution Procedure ...................................... 548 FLMCR1 Bit Settings and State Transitions....................................................... 550 Program/Program-Verify Flowchart (128-Byte Programming).......................... 555 Erase/Erase-Verify Flowchart (Single-Block Erasing) ....................................... 557 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled)).......................................................... 561 Flowchart of Flash Memory Emulation in RAM................................................ 562 Example of RAM Overlap Operation ................................................................. 563 Memory Map in PROM Mode............................................................................ 565 Power-On/Off Timing (Boot Mode) ................................................................... 569 Power-On/Off Timing (User Program Mode)..................................................... 570 xxiii Figure 18.18 Figure 18.19 Figure 18.20 Figure 19.1 Figure 19.2 Figure 19.3 Figure 19.4 Figure 19.5 Figure 19.6 Figure 19.7 Figure 19.8 Figure 19.9 Figure 19.10 Figure 19.11 Figure 19.12 Figure 19.13 Figure 19.14 Figure 19.15 Figure 19.16 Figure 19.17 Figure 19.18 Figure 19.19 Figure 19.20 Figure 20.1 Figure 20.2 Figure 20.3 Figure 20.4 Figure 20.5 Figure 20.6 Figure 20.7 Figure 21.1 Figure 21.2 Figure 21.3 Figure 22.1 Figure 22.2 Figure 22.3 Figure 22.4 Figure 22.5 Figure 22.6 Figure 22.7 xxiv Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) ................................................................................................... 571 ROM Block Diagram (H8/3064 Mask ROM B-Mask Version) ......................... 572 Mask ROM Addresses and Data ......................................................................... 573 Block Diagram of Flash Memory........................................................................ 578 Example of ROM Area/RAM Area Overlap ...................................................... 586 Flash Memory Related State Transitions ............................................................ 588 Reading Overlap RAM Data in User Mode/User Program Mode ...................... 591 Writing Overlap RAM Data in User Program Mode .......................................... 592 System Configuration When Using Boot Mode ................................................. 594 Boot Mode Execution Procedure ........................................................................ 595 RAM Areas in Boot Mode .................................................................................. 597 Example of User Program Mode Execution Procedure ...................................... 600 FLMCR1 Bit Settings and State Transitions....................................................... 602 Program/Program-Verify Flowchart (128-Byte Programming).......................... 607 Erase/Erase-Verify Flowchart (Single-Block Erasing) ....................................... 609 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled)).......................................................... 613 Example of RAM Overlap Operation ................................................................. 614 Memory Map in PROM Mode............................................................................ 617 Power-On/Off Timing (Boot Mode) ................................................................... 621 Power-On/Off Timing (User Program Mode)..................................................... 622 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) ................................................................................................... 623 ROM Block Diagram (H8/3062 Mask ROM B-Mask Version) ......................... 624 Mask ROM Addresses and Data ......................................................................... 625 Block Diagram of Clock Pulse Generator........................................................... 627 Connection of Crystal Resonator (Example) ...................................................... 628 Crystal Resonator Equivalent Circuit.................................................................. 629 Oscillator Circuit Block Board Design Precautions............................................ 629 External Clock Input (Examples)........................................................................ 630 External Clock Input Timing .............................................................................. 632 External Clock Output Settling Delay Timing.................................................... 632 NMI Timing for Software Standby Mode (Example) ......................................... 645 Hardware Standby Mode Timing........................................................................ 647 Starting and Stopping of System Clock Output .................................................. 649 Darlington Pair Drive Circuit (Example)............................................................ 662 Sample LED Circuit............................................................................................ 663 Output Load Circuit ............................................................................................ 669 Darlington Pair Drive Circuit (Example)............................................................ 680 Sample LED Circuit............................................................................................ 681 Output Load Circuit ............................................................................................ 687 Darlington Pair Drive Circuit (Example)............................................................ 699 Figure 22.8 Figure 22.9 Figure 22.10 Figure 22.11 Figure 22.12 Figure 22.13 Figure 22.14 Figure 22.15 Figure 22.16 Figure 22.17 Figure 22.18 Figure 22.19 Figure 22.20 Figure 22.21 Figure 22.22 Figure 22.23 Figure 22.24 Figure 22.25 Figure 22.26 Figure 22.27 Figure 22.28 Figure 22.29 Figure 22.30 Figure 22.31 Figure C.1 Figure C.2 Figure C.3 Figure C.4 Figure C.5 Figure C.6 (a) Figure C.6 (b) Figure C.6 (c) Figure C.6 (d) Figure C.6 (e) Figure C.7 (a) Figure C.7 (b) Figure C.8 (a) Figure C.8 (b) Figure C.8 (c) Figure C.8 (d) Figure C.9 (a) Figure C.9 (b) Figure C.9 (c) Sample LED Circuit............................................................................................ 700 Output Load Circuit ............................................................................................ 706 Darlington Pair Drive Circuit (Example)............................................................ 715 Sample LED Circuit............................................................................................ 715 Output Load Circuit ............................................................................................ 721 Darlington Pair Drive Circuit (Example)............................................................ 728 Sample LED Circuit............................................................................................ 729 Output Load Circuit ............................................................................................ 735 Darlington Pair Drive Circuit (Example)............................................................ 744 Sample LED Circuit............................................................................................ 744 Output Load Circuit ............................................................................................ 750 Oscillator Settling Timing................................................................................... 753 Reset Input Timing.............................................................................................. 754 Reset Output Timing ........................................................................................... 754 Interrupt Input Timing ........................................................................................ 755 Basic Bus Cycle: Two-State Access ................................................................... 757 Basic Bus Cycle: Three-State Access ................................................................. 758 Basic Bus Cycle: Three-State Access with One Wait State................................ 759 Bus-Release Mode Timing.................................................................................. 759 TPC and I/O Port Input/Output Timing .............................................................. 760 Timer Input/Output Timing ................................................................................ 760 Timer External Clock Input Timing.................................................................... 761 SCI Input Clock Timing...................................................................................... 761 SCI Input/Output Timing in Synchronous Mode................................................ 761 Port 1 Block Diagram.......................................................................................... 896 Port 2 Block Diagram.......................................................................................... 897 Port 3 Block Diagram.......................................................................................... 898 Port 4 Block Diagram.......................................................................................... 899 Port 5 Block Diagram.......................................................................................... 900 Port 6 Block Diagram (Pin P60) .......................................................................... 901 Port 6 Block Diagram (Pin P61) .......................................................................... 902 Port 6 Block Diagram (Pin P62) .......................................................................... 903 Port 6 Block Diagram (Pins P63 to P66) .............................................................. 904 Port 6 Block Diagram (Pin P67) .......................................................................... 905 Port 7 Block Diagram (Pins P70 to P75) .............................................................. 906 Port 7 Block Diagram (Pins P76 and P77)............................................................ 906 Port 8 Block Diagram (Pin P80) .......................................................................... 907 Port 8 Block Diagram (Pins P81 and P82)............................................................ 908 Port 8 Block Diagram (Pin P83) .......................................................................... 909 Port 8 Block Diagram (Pin P84) .......................................................................... 910 Port 9 Block Diagram (Pin P90) .......................................................................... 911 Port 9 Block Diagram (Pin P91) .......................................................................... 912 Port 9 Block Diagram (Pin P92) .......................................................................... 913 xxv Figure C.9 (d) Figure C.9 (e) Figure C.9 (f) Figure C.10 (a) Figure C.10 (b) Figure C.10 (c) Figure C.11 (a) Figure C.11 (b) Figure C.11 (c) Figure C.11 (d) Figure C.11 (e) Figure C.11 (f) Figure D.1 Figure D.2 Figure D.3 Figure D.4 Figure G.1 Figure G.2 Figure G.3 Port 9 Block Diagram (Pin P93) .......................................................................... 914 Port 9 Block Diagram (Pin P94) .......................................................................... 915 Port 9 Block Diagram (Pin P95) .......................................................................... 916 Port A Block Diagram (Pins PA 0 and PA1)......................................................... 917 Port A Block Diagram (Pins PA 2 and PA3)......................................................... 918 Port A Block Diagram (Pins PA 4 to PA 7) ........................................................... 919 Port B Block Diagram (Pins PB0 and PB2).......................................................... 920 Port B Block Diagram (Pins PB1 and PB3).......................................................... 921 Port B Block Diagram (Pin PB 4)......................................................................... 922 Port B Block Diagram (Pin PB5)......................................................................... 923 Port B Block Diagram (Pin PB 6)......................................................................... 924 Port B Block Diagram (Pin PB 7)......................................................................... 925 Reset during Memory Access (Modes 1 and 2) .................................................. 930 Reset during Memory Access (Modes 3 and 4) .................................................. 931 Reset during Memory Access (Mode 5) ............................................................. 932 Reset during Operation (Modes 6 and 7) ............................................................ 932 Package Dimensions (FP-100B) ......................................................................... 936 Package Dimensions (TFP-100B)....................................................................... 937 Package Dimensions (FP-100A) ......................................................................... 938 xxvi Tables Table 1.1 Table 1.2 Table 1.3 Table 1.4 Table 1.5 Table 1.6 Table 1.7 Table 2.1 Table 2.2 Table 2.3 Table 2.4 Table 2.5 Table 2.6 Table 2.7 Table 2.8 Table 2.9 Table 2.10 Table 2.11 Table 2.12 Table 2.13 Table 2.14 Table 3.1 Table 3.2 Table 3.3 Table 3.4 Table 4.1 Table 4.2 Table 5.1 Table 5.2 Table 5.3 Table 5.4 Table 5.5 Table 6.1 Table 6.2 Table 6.3 Table 6.4 Table 6.5 Table 7.1 Features ................................................................................................................. 2 Comparison of H8/3062 Series Pin Arrangements ............................................... 8 Pin Functions......................................................................................................... 13 Pin Assignments in Each Mode (FP-100B or TFP-100B, FP-100A) ................... 18 Differences in H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Markings................................................................................................................ 23 Differences between H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, and On-Chip Mask ROM Versions....................................................................... 24 Differences in H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version, and H8/3064F-ZTAT B-Mask Version Markings.................................. 25 Instruction Classification ...................................................................................... 39 Instructions and Addressing Modes ...................................................................... 40 Data Transfer Instructions ..................................................................................... 42 Arithmetic Operation Instructions ........................................................................ 43 Logic Operation Instructions ................................................................................ 45 Shift Instructions ................................................................................................... 45 Bit Manipulation Instructions................................................................................ 46 Branching Instructions .......................................................................................... 48 System Control Instructions.................................................................................. 49 Block Transfer Instruction .................................................................................... 50 Addressing Modes................................................................................................. 53 Absolute Address Access Ranges ......................................................................... 54 Effective Address Calculation............................................................................... 56 Exception Handling Types and Priority................................................................ 60 Operating Mode Selection .................................................................................... 67 Registers................................................................................................................ 68 Pin Functions in Each Mode ................................................................................. 73 Address Maps in Mode 5 ...................................................................................... 74 Exception Types and Priority................................................................................ 85 Exception Vector Table ........................................................................................ 87 Interrupt Pins ......................................................................................................... 99 Interrupt Controller Registers................................................................................ 99 Interrupt Sources, Vector Addresses, and Priority................................................ 110 UE, I, and UI Bit Settings and Interrupt Handling................................................ 113 Interrupt Response Time ....................................................................................... 119 Bus Controller Pins ............................................................................................... 125 Bus Controller Registers ....................................................................................... 126 Bus Specifications for Each Area (Basic Bus Interface) ...................................... 141 Data Buses Used and Valid Strobes...................................................................... 146 Pin States in Idle Cycle ......................................................................................... 159 Port Functions ....................................................................................................... 165 xxvii Table 7.2 Table 7.3 Table 7.4 Table 7.5 Table 7.6 Table 7.7 Table 7.8 Table 7.9 Table 7.10 Table 7.11 Table 7.12 Table 7.13 Table 7.14 Table 7.15 Table 7.16 Table 7.17 Table 7.18 Table 7.19 Table 7.20 Table 7.21 Table 7.22 Table 7.23 Table 7.24 Table 8.1 Table 8.2 Table 8.3 Table 8.4 Table 8.5 Table 8.6 Table 8.7 (a) Table 8.7 (b) Table 8.7 (c) Table 9.1 Table 9.2 Table 9.3 Table 9.4 Table 9.5 Table 9.6 Table 9.7 Table 9.8 Table 10.1 Table 10.2 Table 10.3 xxviii Port 1 Registers ..................................................................................................... 169 Port 2 Registers ..................................................................................................... 173 Input Pull-Up Transistor States (Port 2)................................................................ 175 Port 3 Registers ..................................................................................................... 176 Port 4 Registers ..................................................................................................... 179 Input Pull-Up Transistor States (Port 4)................................................................ 181 Port 5 Registers ..................................................................................................... 182 Input Pull-Up Transistor States (Port 5)................................................................ 184 Port 6 Registers ..................................................................................................... 185 Port 6 Pin Functions in Modes 1 to 5.................................................................... 187 Port 7 Data Register .............................................................................................. 189 Port 8 Registers ..................................................................................................... 191 Port 8 Pin Functions in Modes 1 to 5.................................................................... 193 Port 8 Pin Functions in Modes 6 and 7 ................................................................. 194 Port 9 Registers ..................................................................................................... 196 Port 9 Pin Functions .............................................................................................. 198 Port A Registers .................................................................................................... 202 Port A Pin Functions (Modes 1, 2, 6, and 7)......................................................... 204 Port A Pin Functions (Modes 3 to 5) .................................................................... 206 Port A Pin Functions (Modes 1 to 7) .................................................................... 209 Port B Registers .................................................................................................... 214 Port B Pin Functions (Modes 1 to 5)..................................................................... 216 Port B Pin Functions (Modes 6 and 7) .................................................................. 218 16-bit timer Functions ........................................................................................... 222 16-bit timer Pins.................................................................................................... 226 16-bit timer Registers............................................................................................ 227 PWM Output Pins and Registers .......................................................................... 261 Up/Down Counting Conditions............................................................................. 266 16-bit timer Interrupt Sources ............................................................................... 271 16-bit timer Operating Modes (Channel 0) ........................................................... 281 16-bit timer Operating Modes (Channel 1) ........................................................... 282 16-bit timer Operating Modes (Channel 2) ........................................................... 283 8-Bit Timer Pins.................................................................................................... 288 8-Bit Timer Registers............................................................................................ 289 Operation of Channels 0 and 1 when Bit ICE is Set to 1 in 8TCSR1 Register .... 299 Operation of Channels 2 and 3 when Bit ICE is Set to 1 in 8TCSR3 Register .... 299 Types of 8-Bit Timer Interrupt Sources and Priority Order.................................. 311 8-Bit Timer Interrupt Sources ............................................................................... 311 Timer Output Priority Order ................................................................................. 320 Internal Clock Switchover and 8TCNT Operation ............................................... 321 TPC Pins................................................................................................................ 325 TPC Registers........................................................................................................ 326 TPC Operating Conditions.................................................................................... 339 Table 11.1 Table 11.2 Table 11.3 Table 12.1 Table 12.2 Table 12.3 Table 12.4 Table 12.5 Table 12.6 Table 12.7 Table 12.8 Table 12.9 Table 12.10 Table 12.11 Table 12.12 Table 12.13 Table 13.1 Table 13.2 Table 13.3 Table 13.4 Table 13.5 Table 13.6 Table 13.7 Table 13.8 Table 14.1 Table 14.2 Table 14.3 Table 14.4 Table 14.5 Table 15.1 Table 15.2 Table 16.1 Table 16.2 Table 17.1 Table 17.2 Table 17.3 Table 17.4 Table 17.5 Table 17.6 Table 17.7 Table 17.8 Table 17.9 WDT Pin ............................................................................................................... 350 WDT Registers...................................................................................................... 351 Read Addresses of TCNT, TCSR, and RSTCSR.................................................. 356 SCI Pins................................................................................................................. 364 SCI Registers......................................................................................................... 365 Examples of Bit Rates and BRR Settings in Asynchronous Mode....................... 381 Examples of Bit Rates and BRR Settings in Synchronous Mode ......................... 384 Maximum Bit Rates for Various Frequencies (Asynchronous Mode).................. 386 Maximum Bit Rates with External Clock Input (Asynchronous Mode)............... 387 Maximum Bit Rates with External Clock Input (Synchronous Mode) ................. 388 SMR Settings and Serial Communication Formats .............................................. 390 SMR and SCR Settings and SCI Clock Source Selection .................................... 390 Serial Communication Formats (Asynchronous Mode)........................................ 392 Receive Error Conditions...................................................................................... 399 SCI Interrupt Sources............................................................................................ 415 SSR Status Flags and Transfer of Receive Data ................................................... 416 Smart Card Interface Pins ..................................................................................... 422 Smart Card Interface Registers ............................................................................. 423 Smart Card Interface Register Settings ................................................................. 432 n-Values of CKS1 and CKS0 Settings.................................................................. 434 Bit Rates (bits/s) for Various BRR Settings (When n = 0) ................................... 434 BRR Settings for Typical Bit Rates (bits/s) (When n = 0).................................... 435 Maximum Bit Rates for Various Frequencies (Smart Card Interface Mode) ....... 435 Smart Card Interface Mode Operating States and Interrupt Sources.................... 441 A/D Converter Pins ............................................................................................... 449 A/D Converter Registers ....................................................................................... 450 Analog Input Channels and A/D Data Registers (ADDRA to ADDRD) ............. 451 A/D Conversion Time (Single Mode) ................................................................... 461 Analog Input Pin Ratings ...................................................................................... 463 D/A Converter Pins ............................................................................................... 469 D/A Converter Registers ....................................................................................... 469 H8/3062 Series On-Chip RAM Specifications ..................................................... 475 System Control Register........................................................................................ 476 Operating Modes and ROM .................................................................................. 479 Flash Memory Pins................................................................................................ 482 Flash Memory Registers........................................................................................ 482 Flash Memory Erase Blocks ................................................................................. 487 RAM Area Setting ................................................................................................ 488 On-Board Programming Mode Settings................................................................ 490 System Clock Frequencies for which Automatic Adjustment of MCU Bit Rate is Possible.............................................................................................................. 495 Hardware Protection.............................................................................................. 506 Software Protection ............................................................................................... 508 xxix Table 17.10 H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Socket Adapter Product Codes ....................................................................................................... 513 Table 18.1 Operating Modes and ROM .................................................................................. 523 Table 18.2 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version........ 524 Table 18.3 Flash Memory Pins................................................................................................ 527 Table 18.4 Flash Memory Registers........................................................................................ 527 Table 18.5 Flash Memory Erase Blocks ................................................................................. 533 Table 18.6 Flash Memory Area Divisions .............................................................................. 534 Table 18.7 On-Board Programming Mode Settings................................................................ 541 Table 18.8 System Clock Frequencies for which Automatic Adjustment of H8/3064F-ZTAT B-mask version Bit Rate is Possible ........................................ 544 Table 18.9 Hardware Protection.............................................................................................. 558 Table 18.10 Software Protection ............................................................................................... 559 Table 18.11 H8/3064F-ZTAT B-Mask Version Socket Adapter Product Codes ..................... 565 Table 19.1 Operating Modes and ROM .................................................................................. 575 Table 19.2 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version........ 576 Table 19.3 Flash Memory Pins................................................................................................ 579 Table 19.4 Flash Memory Registers........................................................................................ 579 Table 19.5 Flash Memory Erase Blocks ................................................................................. 585 Table 19.6 RAM Area Setting ................................................................................................ 586 Table 19.7 On-Board Programming Mode Settings................................................................ 593 Table 19.8 System Clock Frequencies for which Automatic Adjustment of H8/3062F-ZTAT B-Mask Version Bit Rate is Possible ....................................... 596 Table 19.9 Hardware Protection.............................................................................................. 610 Table 19.10 Software Protection ............................................................................................... 611 Table 19.11 H8/3062F-ZTAT B-Mask Version Socket Adapter Product Codes ..................... 616 Table 20.1 (1) Damping Resistance Value ................................................................................... 628 Table 20.1 (2) External Capacitance Values ................................................................................. 628 Table 20.2 Crystal Resonator Parameters ............................................................................... 629 Table 20.3 (1) Clock Timing for On-Chip Flash Memory Versions ............................................ 631 Table 20.3 (2) Clock Timing for On-Chip Mask ROM Versions ................................................ 631 Table 20.4 Frequency Division Register ................................................................................. 633 Table 20.5 Comparison of H8/3062 Series Operating Frequency Ranges.............................. 634 Table 21.1 Power-Down State and Module Standby Function ............................................... 636 Table 21.2 Control Register .................................................................................................... 637 Table 21.3 Clock Frequency and Waiting Time for Clock to Settle ....................................... 644 Table 21.4 Pin State in Various Operating States ................................................................ 649 Table 22.1 Electrical Characteristics of H8/3062 Series Products.......................................... 651 Table 22.2 Absolute Maximum Ratings.................................................................................. 652 Table 22.3 DC Characteristics (1) ........................................................................................... 653 Table 22.3 DC Characteristics (2) ........................................................................................... 656 Table 22.3 DC Characteristics (3) ........................................................................................... 659 Table 22.4 Permissible Output Currents ................................................................................. 662 xxx Table 22.5 Table 22.6 Table 22.7 Table 22.8 Table 22.9 Table 22.10 Table 22.11 Table 22.12 Table 22.12 Table 22.13 Table 22.14 Table 22.15 Table 22.16 Table 22.17 Table 22.18 Table 22.19 Table 22.20 Table 22.20 Table 22.21 Table 22.22 Table 22.23 Table 22.24 Table 22.25 Table 22.26 Table 22.27 Table 22.28 Table 22.29 Table 22.30 Table 22.31 Table 22.32 Table 22.33 Table 22.34 Table 22.35 Table 22.36 Table 22.37 Table 22.38 Table 22.39 Table 22.40 Table 22.41 Table 22.42 Table 22.43 Table 22.44 Table 22.45 Clock Timing ........................................................................................................ 664 Control Signal Timing .......................................................................................... 665 Bus Timing............................................................................................................ 666 Timing of On-Chip Supporting Modules.............................................................. 668 A/D Conversion Characteristics............................................................................ 670 D/A Conversion Characteristics............................................................................ 672 Absolute Maximum Ratings.................................................................................. 673 DC Characteristics (1)........................................................................................... 674 DC Characteristics (2) ........................................................................................... 677 Permissible Output Currents ................................................................................. 680 Clock Timing ........................................................................................................ 682 Control Signal Timing .......................................................................................... 683 Bus Timing............................................................................................................ 684 Timing of On-Chip Supporting Modules.............................................................. 686 A/D Conversion Characteristics............................................................................ 688 D/A Conversion Characteristics............................................................................ 690 Flash Memory Characteristics (1) ......................................................................... 691 Flash Memory Characteristics (2) ......................................................................... 693 Absolute Maximum Ratings.................................................................................. 695 DC Characteristics................................................................................................. 696 Permissible Output Currents ................................................................................. 699 Clock Timing ........................................................................................................ 701 Control Signal Timing .......................................................................................... 702 Bus Timing............................................................................................................ 703 Timing of On-Chip Supporting Modules.............................................................. 705 A/D Conversion Characteristics............................................................................ 707 D/A Conversion Characteristics............................................................................ 708 Flash Memory Characteristics .............................................................................. 709 Absolute Maximum Ratings.................................................................................. 711 DC Characteristics ................................................................................................ 712 Permissible Output Currents ................................................................................. 714 Clock Timing ........................................................................................................ 716 Control Signal Timing .......................................................................................... 717 Bus Timing............................................................................................................ 718 Timing of On-Chip Supporting Modules.............................................................. 720 A/D Conversion Characteristics............................................................................ 722 D/A Conversion Characteristics............................................................................ 723 Absolute Maximum Ratings.................................................................................. 724 DC Characteristics ................................................................................................ 725 Permissible Output Currents ................................................................................. 728 Clock Timing ........................................................................................................ 730 Control Signal Timing .......................................................................................... 731 Bus Timing............................................................................................................ 732 xxxi Table 22.46 Table 22.47 Table 22.48 Table 22.49 Table 22.50 Table 22.51 Table 22.52 Table 22.53 Table 22.54 Table 22.55 Table 22.56 Table 22.57 Table 22.58 Table A.1 Table A.2 Table A.2 Table A.2 Table A.3 Table A.4 Table B.1 Table D.1 Table F.1 Table H.1 Timing of On-Chip Supporting Modules.............................................................. 734 A/D Conversion Characteristics............................................................................ 736 D/A Conversion Characteristics............................................................................ 737 Flash Memory Characteristics .............................................................................. 738 Absolute Maximum Ratings.................................................................................. 740 DC Characteristics ................................................................................................ 741 Permissible Output Currents ................................................................................. 743 Clock Timing ........................................................................................................ 745 Control Signal Timing .......................................................................................... 746 Bus Timing............................................................................................................ 747 Timing of On-Chip Supporting Modules.............................................................. 749 A/D Conversion Characteristics............................................................................ 751 D/A Conversion Characteristics............................................................................ 752 Instruction Set ....................................................................................................... 765 Operation Code Map (1) ....................................................................................... 778 Operation Code Map (2) ....................................................................................... 779 Operation Code Map (3) ....................................................................................... 780 Number of States per Cycle .................................................................................. 782 Number of Cycles per Instruction ......................................................................... 783 Comparison of H8/3062 Series Internal I/O Register Specifications ................... 790 Port States.............................................................................................................. 926 H8/3062 Series ...................................................................................................... 934 Pin Arrangement of Each Product (FP-100B, TFP-100B).................................... 942 xxxii Section 1 Overview 1.1 Overview The H8/3062 Series is a series of microcontrollers (MCUs) that integrate system supporting functions together with an H8/300H CPU core having an original Hitachi architecture. The H8/300H CPU has a 32-bit internal architecture with sixteen 16-bit general registers, and a concise, optimized instruction set designed for speed. It can address a 16-Mbyte linear address space. Its instruction set is upward-compatible at the object-code level with the H8/300 CPU, enabling easy porting of software from the H8/300 Series. The on-chip system supporting functions include ROM, RAM, a 16-bit timer, an 8-bit timer, a programmable timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI), an A/D converter, a D/A converter, I/O ports, and other facilities. The 11 members of the H8/3062 Series are the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062 (mask ROM version), H8/3061 (mask ROM version), H8/3060 (mask ROM version), H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. Seven MCU operating modes offer a choice of bus width and address space size. The modes (modes 1 to 7) include two single-chip modes and five expanded modes. In addition to its mask ROM versions, the H8/3062 Series has F-ZTATTM* versions with on-chip flash memory that allows programs to be freely rewritten by the user. This version enables users to respond quickly and flexibly to changing application specifications, growing production volumes, and other conditions. Table 1.1 summarizes the features of the H8/3062 Series. Note: * F-ZTAT TM (Flexible ZTAT) is a trademark of Hitachi, Ltd. 1 Table 1.1 Feature CPU Features Description Upward-compatible with the H8/300 CPU at the object-code level General-register machine * Sixteen 16-bit general registers (also usable as sixteen 8-bit registers plus eight 16-bit registers, or as eight 32-bit registers) High-speed operation Maximum clock rate H8/3062F-ZTAT H8/3062F-ZTAT R-Mask version H8/3062 (mask ROM version) H8/3061 (mask ROM version) H8/3060 (mask ROM version) H8/3064F-ZTAT B-mask version H8/3062F-ZTAT B-mask version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version 25 MHz 80 ns 560 ns 20 MHz Add/ subtract 100 ns Multiply/ divide 700 ns 16-Mbyte address space Instruction features * * * * * 8/16/32-bit data transfer, arithmetic, and logic instructions Signed and unsigned multiply instructions (8 bits x 8 bits, 16 bits x 16 bits) Signed and unsigned divide instructions (16 bits / 8 bits, 32 bits / 16 bits) Bit accumulator function Bit manipulation instructions with register-indirect specification of bit positions 2 Feature Memory Description ROM H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3062 (mask ROM version) H8/3062 mask ROM B-mask version H8/3061 (mask ROM version) H8/3061 mask ROM B-mask version H8/3060 (mask ROM version) H8/3060 mask ROM B-mask version H8/3064F-ZTAT B-mask version H8/3064 mask ROM B-mask version * * * 256 kbytes 8 kbytes 64 kbytes 2 kbytes 96 kbytes 4 kbytes 128 kbytes RAM 4 kbytes Interrupt controller Seven external interrupt pins: NMI, IRQ0 to IRQ5 27 internal interrupts Three selectable interrupt priority levels Address space can be partitioned into eight areas, with independent bus specifications in each area Chip select output available for areas 0 to 7 8-bit access or 16-bit access selectable for each area Two-state or three-state access selectable for each area Selection of two wait modes Number of program wait states selectable for each area Bus arbitration function Two address update modes (not available in the H8/3062F-ZTAT) Three 16-bit timer channels, capable of processing up to six pulse outputs or six pulse inputs 16-bit timer counter (channels 0 to 2) Two multiplexed output compare/input capture pins (channels 0 to 2) Operation can be synchronized (channels 0 to 2) PWM mode available (channels 0 to 2) Phase counting mode available (channel 2) Bus controller * * * * * * * * 16-bit timer, 3 channels * * * * * * 3 Feature 8-bit timer, 4 channels Description * * * 8-bit up-counter (external event count capability) Two time constant registers Two channels can be connected Maximum 16-bit pulse output, using 16-bit timer as time base Up to four 4-bit pulse output groups (or one 16-bit group, or two 8-bit groups) Non-overlap mode available Internal reset signal can be generated by overflow Reset signal can be output externally (not available in on-chip flash memory versions) Usable as an interval timer Selection of asynchronous or synchronous mode Full duplex: can transmit and receive simultaneously On-chip baud-rate generator Smart card interface extended functions added Resolution: 10 bits Eight channels, with selection of single or scan mode Variable analog conversion voltage range Sample-and-hold function A/D conversion can be started by an external trigger or 8-bit timer comparematch Resolution: 8 bits Two channels D/A outputs can be sustained in software standby mode 70 input/output pins 9 input-only pins Programmable timing pattern controller (TPC) Watchdog timer (WDT), 1 channel * * * * * * Serial communication interface (SCI), 2 channels * * * * A/D converter * * * * * D/A converter * * * I/O ports * * 4 Feature Description Address Space 1 Mbyte 1 Mbyte 16 Mbytes 16 Mbytes 16 Mbytes 64 kbytes 1 Mbyte Address Pins A19 to A 0 A19 to A 0 A23 to A 0 A23 to A 0 A23 to A 0 -- -- Initial Bus Width 8 bits 16 bits 8 bits 16 bits 8 bits -- -- Max. Bus Width 16 bits 16 bits 16 bits 16 bits 16 bits -- -- Operating modes Seven MCU operating modes Mode Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 * * * * * * * Other features * On-chip ROM is disabled in modes 1 to 4 In the versions with on-chip flash memory, an on-board programming mode is supported that allows flash memory to be programmed in modes 5 and 7. Sleep mode Software standby mode Hardware standby mode Module standby function Programmable system clock frequency division On-chip clock pulse generator Power-down state 5 Feature Product lineup Description Product Type H8/3062F-ZTAT Model HD64F3062F HD64F3062TE HD64F3062FP HD64F3062RF HD64F3062RTE HD64F3062RFP HD64F3062RVF HD64F3062RVTE HD64F3062RVFP HD6433062F HD6433062TE HD6433062FP HD6433062VF HD6433062VTE HD6433062VFP HD6433061F HD6433061TE HD6433061FP HD6433061VF HD6433061VTE HD6433061VFP HD6433060F HD6433060TE HD6433060FP HD6433060VF HD6433060VTE HD6433060VFP HD64F3064BF HD64F3064BTE HD64F3064BFP HD6433064BF HD6433064BTE HD6433064BFP HD64F3062BF HD64F3062BTE HD64F3062BFP HD6433062BF HD6433062BTE HD6433062BFP HD6433061BF HD6433061BTE HD6433061BFP HD6433060BF HD6433060BTE HD6433060BFP Package (Hitachi Package Code) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 5 V operation H8/3062F-ZTAT R-mask version 5 V operation 3 V operation H8/3062 mask ROM version 5 V operation 3 V operation H8/3061 mask ROM version 5 V operation 3 V operation H8/3060 mask ROM version 5 V operation 3 V operation H8/3064F-ZTAT B-mask version H8/3064 mask ROM B-mask version H8/3062F-ZTAT B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version 5 V operation 5 V operation 5 V operation 5 V operation 5 V operation 5 V operation 6 1.2 Block Diagram Figure 1.1 shows an internal block diagram. P37 /D15 P36 /D14 P35 /D13 P34 /D12 P33 /D11 P32 /D10 P47 /D7 P46 /D6 P45 /D5 P44 /D4 P43 /D3 P42 /D2 P41 /D1 Port 3 Address bus Port 4 P53 /A 19 Port 5 Port 2 Port 1 Port 9 Port 7 MD 2 MD 1 MD 0 EXTAL XTAL STBY RES RESO/FWE *1 Data bus (upper) Data bus (lower) P40 /D0 P31 /D9 P30 /D8 VCL*2 VCC VCC VSS VSS VSS VSS VSS VSS P52 /A 18 P51 /A 17 P50 /A 16 Clock pulse generator P27 /A 15 H8/300H CPU P26 /A 14 P25 /A 13 P24 /A 12 P23 /A 11 P22 /A 10 P21 /A 9 P20 /A 8 P17 /A 7 P16 /A 6 P15 /A 5 P14 /A 4 P13 /A 3 P12 /A 2 RAM P11 /A 1 Watchdog timer (WDT) P10 /A 0 NMI /P67 LWR/P66 HWR/P65 RD/P64 AS/P63 BACK/P62 BREQ/P61 WAIT/P60 Interrupt controller Port 6 ROM (mask ROM or flash memory) CS0/P84 CS2/IRQ2/P82 CS3/IRQ1/P81 IRQ0/P80 Port 8 ADTRG/CS1/IRQ3/P83 16-bit timer unit Serial communication interface (SCI) x 2 channels P95 /SCK 1 /IRQ 5 Programmable timing pattern controller (TPC) A/D converter D/A converter P94 /SCK 0 /IRQ 4 P93 /RxD1 P92 /RxD0 P91 /TxD 1 P90 /TxD 0 8-bit timer unit Port B Port A VREF AVCC AVSS DA1/AN7/P77 DA0/AN6/P76 Bus controller AN5/P75 AN4/P74 AN3/P73 AN2/P72 AN1/P71 TP15/PB7 CS5/TMO2/TP10/PB2 CS7/TMO0/TP8/PB0 A20/TIOCB2/TP7/PA7 A21/TIOCA2/TP6/PA6 A22/TIOCB1/TP5/PA5 A23/TIOCA1/TP4/PA4 CS6/TMIO1/TP9/PB1 TCLKB/TP1/PA1 TCLKD/TIOCB0/TP3/PA3 Notes: *1 Functions as RESO in the on-chip mask ROM versions, and as FWE in the on-chip flash memory versions. *2 The H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version have a VCL pin, and require the connection of an external capacitor. Figure 1.1 Block Diagram 7 TCLKC/TIOCA0/TP2/PA2 CS4/TMIO3/TP11/PB3 TCLKA/TP0/PA0 TP14/PB6 TP13/PB5 TP12/PB4 AN0/P70 1.3 1.3.1 Pin Description Pin Arrangement The pin arrangement of the H8/3062 Series is shown in figures 1.2 to 1.5. Differences in the H8/3062 Series pin arrangements are shown in table 1.2. The H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version have a V CL pin. See section 1.5, Notes on H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. Except for the differences shown in table 1.2, the pin arrangements are the same. Table 1.2 Package FP-100B (TFP-100B) FP-100A Comparison of H8/3062 Series Pin Arrangements Pin Number 1 10 3 12 H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version V CC FWE V CC FWE H8/3062 Mask ROM Version V CC RESO V CC RESO H8/3061 Mask ROM Version V CC RESO V CC RESO H8/3060 H8/3064 H8/3062 Mask ROM F-ZTAT F-ZTAT Version B-Mask Version B-Mask Version V CC RESO V CC RESO V CL FWE V CL FWE V CC FWE V CL FWE Package Pin Number 1 10 3 12 H8/3064 Mask ROM B-Mask Version V CL RESO V CL RESO H8/3062 Mask ROM B-Mask Version V CL RESO V CL RESO H8/3061 Mask ROM B-Mask Version V CL RESO V CL RESO H8/3060 Mask ROM B-Mask Version V CL RESO V CL RESO FP-100B (TFP-100B) FP-100A 8 P61 /BREQ P62 /BACK P65 /HWR P66 /LWR P60 /WAIT P53 /A 19 P52 /A 18 P51 /A 17 P50 /A 16 53 P27 /A 15 52 P64 /RD P63 /AS EXTAL STBY P67/ XTAL RES MD2 MD1 MD0 VCC NMI VSS 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 AV CC VREF P70 /AN0 P71 /AN1 P72 /AN2 P73 /AN3 P74 /AN4 P75 /AN5 P76 /AN6 /DA 0 P77 /AN7 /DA 1 AV SS IRQ0 /P80 CS 3 /IRQ1/P81 CS2/IRQ2/P82 ADTRG/CS1/IRQ3/P83 CS0/P84 VSS TCLKA/TP0/PA0 TCLKB/TP1/PA1 TCLKC/TIOCA0/TP2/PA2 TCLKD/TIOCB0/TP3/PA3 A23/TIOCA1/TP4/PA4 A22/TIOCB1/TP5/PA5 A21/TIOCA2/TP6/PA6 A20/TIOCB2/TP7/PA7 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P26 /A 14 VSS 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 10 12 13 14 15 16 17 18 19 20 21 22 23 24 11 100 1 2 3 4 5 6 7 8 9 Top view (FP-100B, TFP-100B) A13 /P25 A12 /P24 A11 /P23 A10 /P22 A9 /P21 A8 /P20 VSS A7 /P17 A6 /P16 A5 /P15 A4 /P14 A3 /P13 A2 /P12 A1 /P11 A0 /P10 VCC D15/P37 D14/P36 D13/P35 D12/P34 D11/P33 D10/P32 D9 /P31 D8 /P30 D7 /P47 TP15/PB7 RESO / FWE* TxD0 /P90 TxD1 /P91 RxD0 /P92 RxD1 /P93 IRQ4 /SCK0 /P94 IRQ5 /SCK1 /P95 D0 /P40 D1 /P41 D2 /P42 CS7/TMO0/TP8/PB0 CS6 /TMIO 1/TP9/PB1 CS5 /TMO2/TP10/PB2 CS4 /TMIO 3/TP11/PB3 TP12/PB4 TP13/PB5 TP14/PB6 D3 /P43 VSS D4 /P44 D5 /P45 Note: * Functions as RESO in the on-chip mask ROM versions, and as FWE in the on-chip flash memory versions. Figure 1.2 Pin Arrangement of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, and H8/3060 Mask ROM Version (FP-100B or TFP-100B Package, Top View) D6 /P46 VCC VSS 25 9 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS P80/IRQ0 P81/IRQ1/CS3 P82/IRQ2/CS2 P83/IRQ3/CS1/ADTRG P84/CS0 VSS PA0/TP0/TCLKA PA1/TP1/TCLKB PA2/TP2/TIOCA0/TCLKC PA3/TP3/TIOCB0/TCLKD PA4/TP4/TIOCA1/A23 PA5/TP5/TIOCB1/A22 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 P70/AN0 VREF AVCC MD2 MD1 MD0 P66/LWR P65/HWR P64/RD P63/AS VCC XTAL EXTAL VSS NMI RES STBY P67/ P62/BACK P61/BREQ P60/WAIT VSS P53/A19 P52/A18 P51/A17 P50/A16 P27/A15 P26/A14 P25/A13 P24/A12 Top view (FP-100A) A11 /P23 A10 /P22 A 9 /P2 1 A 8 /P2 0 V SS A7 /P17 A6 /P16 A5 /P15 A4 /P14 A3 /P13 A2 /P12 A1 /P11 A0 /P10 V CC D15 /P3 7 D14 /P3 6 D13 /P3 5 D12 /P3 4 D11 /P3 3 D10 /P32 Note: * Functions as RESO in the on-chip mask ROM versions, and as FWE in the on-chip flash memory versions. Figure 1.3 Pin Arrangement of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, and H8/3060 Mask ROM Version (FP-100A Package, Top View) 10 A21/TIOCA2 /TP6 /PA6 A20/TIOCB2 /TP7 /PA7 V CC CS7 /TMO0 /TP8 /PB0 CS6 /TMIO1 /TP9 /PB1 CS 5 /TMO 2 /TP10 /PB2 CS 4 /TMIO 3 /TP11/PB3 TP12 /PB4 TP13 /PB5 TP14 /PB6 TP15 /PB 7 RESO/FWE* VSS TxD0 /P90 TxD1 /P91 RxD0 /P9 2 RxD1 /P9 3 IRQ4 /SCK0 /P94 IRQ5 /SCK1 /P95 D0 /P4 0 D1 /P41 D2 /P42 D3 /P43 V SS D4 /P44 D5 /P4 5 D6 /P4 6 D7 /P4 7 D8 /P3 0 D9 /P3 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 P61 /BREQ P62 /BACK P65 /HWR P66 /LWR P60 /WAIT P53 /A 19 P52 /A 18 P51 /A 17 P50 /A 16 53 P27 /A 15 52 P64 /RD P63 /AS EXTAL STBY P67/ XTAL RES MD2 MD1 MD0 VCC NMI VSS 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 AV CC VREF P70 /AN0 P71 /AN1 P72 /AN2 P73 /AN3 P74 /AN4 P75 /AN5 P76 /AN6 /DA 0 P77 /AN7 /DA 1 AV SS IRQ0 /P80 CS 3 /IRQ1/P81 CS2/IRQ2/P82 ADTRG/CS1/IRQ3/P83 CS0/P84 VSS TCLKA/TP0/PA0 TCLKB/TP1/PA1 TCLKC/TIOCA0/TP2/PA2 TCLKD/TIOCB0/TP3/PA3 A23/TIOCA1/TP4/PA4 A22/TIOCB1/TP5/PA5 A21/TIOCA2/TP6/PA6 A20/TIOCB2/TP7/PA7 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 P26 /A 14 VSS 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 10 12 13 14 15 16 17 18 19 20 21 22 23 24 11 100 1 2 3 4 5 6 7 8 9 Top view (FP-100B, TFP-100B) P25/A13 P24/A12 P23/A11 P22/A10 P21/A9 P20/A8 VSS P17/A7 P16/A6 P15/A5 P14/A4 P13/A3 P12/A2 P11/A1 P10/A0 VCC D15/P37 D14/P36 D13/P35 D12/P34 D11/P33 D10/P32 D9/P31 D8/P30 D7/P47 VCL* TxD0 /P90 TxD1 /P91 RxD0 /P92 RxD1 /P93 IRQ4 /SCK0 /P94 IRQ5 /SCK1 /P95 D0 /P40 D1 /P41 D2 /P42 CS7/TMO0/TP8/PB0 CS6 /TMIO 1/TP9/PB1 CS5 /TMO2/TP10/PB2 CS4 /TMIO 3/TP11/PB3 TP12/PB4 TP13/PB5 TP14/PB6 TP15/PB7 D3 /P43 VSS D4 /P44 D5 /P45 D6 /P46 1 0.1 F Note: * An external capacitor must be connected to the VCL pin. Figure 1.4 Pin Arrangement of H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version (FP-100B or TFP-100B Package, Top View) FWE VSS 25 11 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVSS P80/IRQ0 P81/IRQ1/CS3 P82/IRQ2/CS2 P83/IRQ3/CS1/ADTRG P84/CS0 VSS PA0/TP0/TCLKA PA1/TP1/TCLKB PA2/TP2/TIOCA0/TCLKC PA3/TP3/TIOCB0/TCLKD PA4/TP4/TIOCA1/A23 PA5/TP5/TIOCB1/A22 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 P70/AN0 VREF AVCC MD2 MD1 MD0 P66/LWR P65/HWR P64/RD P63/AS VCC XTAL EXTAL VSS NMI RES STBY P67/ P62/BACK P61/BREQ P60/WAIT VSS P53/A19 P52/A18 P51/A17 P50/A16 P27/A15 P26/A14 P25/A13 P24/A12 Top view (FP-100A) P23/A11 P22/A10 P21/A9 P20/A8 VSS P17/A7 P16/A6 P15/A5 P14/A4 P13/A3 P12/A2 P11/A1 P10/A0 V CC D15 /P3 7 D14 /P3 6 D13 /P3 5 D12 /P3 4 D11 /P3 3 D10 /P32 A21/TIOCA2 /TP6 /PA6 A20/TIOCB2 /TP7 /PA7 VCL* CS7 /TMO0 /TP8 /PB0 CS 6 /TMIO1 /TP9 /PB1 CS 5 /TMO 2 /TP10 /PB2 CS 4 /TMIO 3 /TP11/PB3 TP12 /PB4 TP13 /PB5 TP14 /PB6 TP15 /PB 7 FWE VSS TxD0 /P90 TxD1 /P91 RxD0 /P9 2 RxD1 /P9 3 IRQ4 /SCK0 /P94 IRQ5 /SCK1 /P95 D0 /P4 0 D1 /P41 D2 /P42 D3 /P43 V SS D4 /P44 D5 /P4 5 D6 /P4 6 D7 /P4 7 D8 /P3 0 D9 /P3 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 3 0.1 F Note: * An external capacitor must be connected to the VCL pin. Figure 1.5 Pin Arrangement of H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version (FP-100A Package, Top View) 12 1.3.2 Pin Functions Table 1.3 summarizes the pin functions. The H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version have a VCL pin, and require the connection of an external capacitor. Table 1.3 Pin Functions Pin No. Type Power Symbol VCC FP-100B TFP-100B FP-100A I/O 1* , 35, 68 11, 22, 44, 57, 65, 92 1* 2 1 Name and Function Power: For connection to the power supply. Connect all V CC pins to the system power supply. Ground: For connection to ground (0 V). Connect all V SS pins to the 0-V system power supply. 3* , 37, 70 13, 24, 46, 59, 67, 94 3* 2 1 Input VSS Input Internal VCL step-down pin Clock XTAL Output Connect an external capacitor between this pin and GND (0 V). Do not connect to VCC. VCL 0.1 F 67 69 Input For connection to a crystal resonator. For examples of crystal resonator and external clock input, see section 20, Clock Pulse Generator. For connection to a crystal resonator or input of an external clock signal. For examples of crystal resonator and external clock input, see section 20, Clock Pulse Generator. EXTAL 66 68 Input 61 63 Output System clock: Supplies the system clock to external devices. 13 Pin No. Type Symbol FP-100B TFP-100B FP-100A I/O 75 to 73 77 to 75 Input Name and Function Mode 2 to mode 0: For setting the operating mode, as follows. Inputs at these pins must not be changed during operation. MD2 0 0 0 0 1 1 1 1 System control RES 63 65 Input MD1 0 0 1 1 0 0 1 1 MD0 0 1 0 1 0 1 0 1 Operating Mode Setting prohibited Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Operating MD2 to mode MD0 control Reset input: When driven low, this pin resets the chip. This pin must be driven low at powerup. RESO 10 12 Output Reset output (On-chip mask ROM versions): Outputs the reset signal generated by the watchdog timer to external devices. Input Write enable signal (On-chip flash memory versions): Flash memory programming control signal Standby: When driven low, this pin forces a transition to hardware standby mode. Bus request: Used by an external bus master to request the bus right. FWE 10 12 STBY BREQ BACK 62 59 60 64 61 62 Input Input Output Bus request acknowledge: Indicates that the bus has been granted to an external bus master. Input Nonmaskable interrupt: Requests a nonmaskable interrupt. Interrupt request 5 to 0: Maskable interrupt request pins Interrupts NMI IRQ5 to IRQ0 Address bus A23 to A 0 64 17, 16, 90 to 87 66 19, 18, Input 92 to 89 97 to 100, 99, 100, Output Address bus: Output address signals. 56 to 45, 1, 2, 43 to 36 58 to 47, 45 to 38 14 Pin No. Type Data bus Bus control Symbol D15 to D0 CS 7 to CS 0 AS RD HWR FP-100B TFP-100B FP-100A I/O 34 to 23, 21 to 18 2 to 5, 88 to 91 69 70 71 Name and Function 36 to 25, Input/ Data bus: Bidirectional data bus 23 to 20 output 4 to 7, Output Chip select: Select signals for areas 7 to 0. 90 to 93 71 72 73 Output Address strobe: Goes low to indicate valid address output on the address bus. Output Read: Goes low to indicate reading from the external address space. Output High write: Goes low to indicate writing to the external address space; indicates valid data on the upper data bus (D 15 to D8). Output Low write: Goes low to indicate writing to the external address space; indicates valid data on the lower data bus (D7 to D0). Input Wait: Requests insertion of wait states in bus cycles during access to the external address space. Clock input D to A: External clock inputs LWR 72 74 WAIT 58 60 16-bit timer TCLKD to 96 to 93 TCLKA 98 to95 Input TIOCA2 to 99, 97, 95 1, 99, 97 Input/ Input capture/output compare A2 to A0: TIOCA0 output GRA2 to GRA0 output compare or input capture, or PWM output TIOCB2 to 100, 98, TIOCB0 96 8-bit timer TMO0, TMO2 TMIO1, TMIO3 2, 4 3, 5 2, 100, 98 4, 6 5, 7 Input/ Input capture/output compare B2 to B0: output GRB2 to GRB0 output compare or input capture Output Compare match output: Compare match output pins Input/ Input capture input/compare match output: output Input capture input or compare match output pins Counter external clock input: These pins input an external clock to the counters. TCLKD to 96 to 93 TCLKA Programmable timing pattern controller (TPC) TP 15 to TP 0 98 to 95 Input 9 to 2, 11 to 4, 100 to 93 2, 1, 100 to 95 Output TPC output 15 to 0: Pulse output 15 Pin No. Type Serial communication interface (SCI) Symbol TxD1, TxD0 RxD1, RxD0 SCK 1, SCK 0 A/D converter AN 7 to AN 0 ADTRG FP-100B TFP-100B FP-100A I/O 13, 12 15, 14 17, 16 85 to 78 90 15, 14 17, 16 19, 18 Name and Function Output Transmit data (channels 0, 1): SCI data output Input Receive data (channels 0, 1): SCI data input Input/ Serial clock (channels 0, 1): SCI clock output input/output Analog 7 to 0: Analog input pins A/D conversion external trigger input: External trigger input for starting A/D conversion 87 to 80 Input 92 Input D/A converter Analog power supply DA 1, DA 0 85, 84 AVCC 76 87, 86 78 Output Analog output: Analog output from the D/A converter Input Power supply pin for the A/D and D/A converters. Connect to the system power supply when not using the A/D and D/A converters. Ground pin for the A/D and D/A converters. Connect to system ground (0 V). Reference voltage input pin for the A/D and D/A converters. Connect to the system power supply when not using the A/D and D/A converters. AVSS VREF 86 77 88 79 Input Input I/O ports P17 to P1 0 43 to 36 45 to 38 Input/ Port 1: Eight input/output pins. The direction output of each pin can be selected in the port 1 data direction register (P1DDR). 54 to 47 Input/ Port 2: Eight input/output pins. The direction output of each pin can be selected in the port 2 data direction register (P2DDR). 36 to 29 Input/ Port 3: Eight input/output pins. The direction output of each pin can be selected in the port 3 data direction register (P3DDR). 28 to 25, Input/ Port 4: Eight input/output pins. The direction 23 to 20 output of each pin can be selected in the port 4 data direction register (P4DDR). 58 to 55 Input/ Port 5: Four input/output pins. The direction of output each pin can be selected in the port 5 data direction register (P5DDR). P27 to P2 0 52 to 45 P37 to P3 0 34 to 27 P47 to P4 0 26 to 23, 21 to 18 P53 to P5 0 56 to 53 16 Pin No. Type I/O ports Symbol FP-100B TFP-100B FP-100A I/O Name and Function P67 to P6 0 61, 72 to 69, 60 to 58 P77 to P7 0 85 to 78 P84 to P8 0 91 to 87 63, Input/ Port 6: Eight input/output pins. The direction 74 to 71, output of each pin can be selected in the port 6 data 62 to 60 direction register (P6DDR). 87 to 80 Input Port 7: Eight input pins 93 to 89 Input/ Port 8: Five input/output pins. The direction of output each pin can be selected in the port 8 data direction register (P8DDR). 19 to 14 Input/ Port 9: Six input/output pins. The direction of output each pin can be selected in the port 9 data direction register (P9DDR). Input/ Port A: Eight input/output pins. The direction output of each pin can be selected in the port A data direction register (PADDR). Input/ Port B: Eight input/output pins. The direction output of each pin can be selected in the port B data direction register (PBDDR). P95 to P9 0 17 to 12 PA7 to PA0 PB7 to PB0 100 to 93 2, 1, 100 to 95 9 to 2 11 to 4 Notes: *1 In the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, and H8/3060 mask ROM version *2 In the H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. 17 1.3.3 Pin Assignments in Each Mode Table 1.4 lists the pin assignments in each mode. Table 1.4 Pin No. FP-100B TFP-100B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 FP-100A 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Mode 1 vCC (v CL)* 4 Pin Assignments in Each Mode (FP-100B or TFP-100B, FP-100A) Pin Name Mode 2 vCC (v CL)* 4 Mode 3 vCC (v CL)* 4 Mode 4 vCC (v CL)* 4 Mode 5 vCC (v CL)* 4 Mode 6 vCC (v CL)* 4 Mode 7 vCC (v CL)*4 PB 0/TP8/ TMO0 PB 1/TP9/ TMIO1 PB 2/TP10/ TMO2 PB 3/TP11/ TMIO3 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 PB 0/TP8/ PB 0/TP8/ TMO0/CS7 TMO0/CS7 PB 0/TP8/ PB 0/TP8/ TMO0/CS7 TMO0/CS7 PB 0/TP8/ PB 0/TP8/ TMO0/CS7 TMO0 PB 1/TP9/ PB 1/TP9/ PB 1/TP9/ PB 1/TP9/ PB 1/TP9/ PB 1/TP9/ TMIO1/CS6 TMIO1/CS6 TMIO1/CS6 TMIO1/CS6 TMIO1/CS6 TMIO1 PB 2/TP10/ PB 2/TP10/ TMO2/CS5 TMO2/CS5 PB 2/TP10/ PB 2/TP10/ TMO2/CS5 TMO2/CS5 PB 2/TP10/ PB 2/TP10/ TMO2/CS5 TMO2 PB 3/TP11/ PB 3/TP11/ PB 3/TP11/ PB 3/TP11/ PB 3/TP11/ PB 3/TP11/ TMIO3/CS4 TMIO3/CS4 TMIO3/CS4 TMIO3/CS4 TMIO3/CS4 TMIO3 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/ FWE*3 VSS P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ P94 /SCK0/ IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 IRQ4 P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ P95 /SCK1/ IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 IRQ5 P40/D0*1 P41/D1* P42/D2* 1 1 P40/D0*2 P41/D1* P42/D2* 2 2 P40/D0*1 P41/D1* P42/D2* 1 1 P40/D0*2 P41/D1* P42/D2* 2 2 P40/D0*1 P41/D1* P42/D2* 1 1 P40 P41 P42 P43 VSS P40 P41 P42 P43 VSS P44 P45 P43/D3*1 VSS P44/D4* P45/D5* 1 1 P43/D3*2 VSS P44/D4* P45/D5* 2 2 P43/D3*1 VSS P44/D4* P45/D5* 1 1 P43/D3*2 VSS P44/D4* P45/D5* 2 2 P43/D3*1 VSS P44/D4* P45/D5* 1 1 P44 P45 18 Pin No. FP-100B TFP-100B 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 FP-100A 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 Mode 1 P46/D6*1 P47/D7* D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 VSS P60/WAIT 1 Pin Name Mode 2 P46/D6*2 P47/D7* D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 VSS P60/WAIT 2 Mode 3 P46/D6*1 P47/D7* D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 VSS P60/WAIT 1 Mode 4 P46/D6*2 P47/D7* D8 D9 D10 D11 D12 D13 D14 D15 VCC A0 A1 A2 A3 A4 A5 A6 A7 VSS A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 VSS P60/WAIT 2 Mode 5 P46/D6*1 P47/D7* D8 D9 D10 D11 D12 D13 D14 D15 VCC P10/A 0 P11/A 1 P12/A 2 P13/A 3 P14/A 4 P15/A 5 P16/A 6 P17/A 7 VSS P20/A 8 P21/A 9 P22/A 10 P23/A 11 P24/A 12 P25/A 13 P26/A 14 P27/A 15 P50/A 16 P51/A 17 P52/A 18 P53/A 19 VSS P60/WAIT 1 Mode 6 P46 P47 P30 P31 P32 P33 P34 P35 P36 P37 VCC P10 P11 P12 P13 P14 P15 P16 P17 VSS P20 P21 P22 P23 P24 P25 P26 P27 P50 P51 P52 P53 VSS P60 Mode 7 P46 P47 P30 P31 P32 P33 P34 P35 P36 P37 VCC P10 P11 P12 P13 P14 P15 P16 P17 VSS P20 P21 P22 P23 P24 P25 P26 P27 P50 P51 P52 P53 VSS P60 19 Pin No. FP-100B TFP-100B 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 FP-100A 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 Mode 1 Mode 2 Mode 3 Pin Name Mode 4 Mode 5 Mode 6 Mode 7 P61 P62 P67/ STBY RES NMI VSS EXTAL XTAL VCC P63 P64 P65 P66 MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P61/BREQ P61/BREQ P61/BREQ P61/BREQ P61/BREQ P61 P62/BACK P62/BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P62/BACK P62/BACK STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P62/BACK P62 P67/ STBY RES NMI VSS EXTAL XTAL VCC AS RD HWR LWR MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P67/ STBY RES NMI VSS EXTAL XTAL VCC P63 P64 P65 P66 MD0 MD1 MD2 AV CC VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0P76/AN6/DA0P76/AN6/DA0P76/AN6/DA0P76/AN6/DA0P76/AN6/DA0P76/AN6/DA0 P77/AN7/DA1P77/AN7/DA1P77/AN7/DA1P77/AN7/DA1P77/AN7/DA1P77/AN7/DA1P77/AN7/DA1 AV SS P80/IRQ0 P81/IRQ1/ CS3 P82/IRQ2/ CS2 AV SS P80/IRQ0 P81/IRQ1/ CS3 P82/IRQ2/ CS2 AV SS P80/IRQ0 P81/IRQ1/ CS3 P82/IRQ2/ CS2 AV SS P80/IRQ0 P81/IRQ1/ CS3 P82/IRQ2/ CS2 AV SS P80/IRQ0 P81/IRQ1/ CS3 P82/IRQ2/ CS2 AV SS P80/IRQ0 P81/IRQ1 P82/IRQ2 AV SS P80/IRQ0 P81/IRQ1 P82/IRQ2 20 Pin No. FP-100B TFP-100B 90 FP-100A 92 Mode 1 P83/IRQ3/ CS1/ ADTRG P84/CS0 VSS PA 0/TP0/ TCLKA PA 1/TP1/ TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD PA 4/TP4/ TIOCA1 PA 5/TP5/ TIOCB1 PA 6/TP6/ TIOCA2 PA 7/TP7/ TIOCB2 Mode 2 P83/IRQ3/ CS1/ ADTRG P84/CS0 VSS PA 0/TP0/ TCLKA PA 1/TP1/ TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD PA 4/TP4/ TIOCA1 PA 5/TP5/ TIOCB1 PA 6/TP6/ TIOCA2 PA 7/TP7/ TIOCB2 Mode 3 P83/IRQ3/ CS1/ ADTRG P84/CS0 VSS PA 0/TP0/ TCLKA PA 1/TP1 /TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD Pin Name Mode 4 P83/IRQ3/ CS1/ ADTRG P84/CS0 VSS PA 0/TP0/ TCLKA PA 1/TP1/ TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD Mode 5 P83/IRQ3/ CS1/ ADTRG P84/CS0 VSS PA 0/TP0/ TCLKA PA 1/TP1/ TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD Mode 6 P83/IRQ3/ ADTRG P84 VSS PA 0/TP0/ TCLKA PA 1/TP1/ TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD Mode 7 P83/IRQ3/ ADTRG P84 VSS PA 0/TP0/ TCLKA PA 1/TP1/ TCLKB PA 2/TP2/ TIOCA0/ TCLKC PA 3/TP3/ TIOCB0/ TCLKD PA 4/TP4/ TIOCA1 PA 5/TP5/ TIOCB1 PA 6/TP6/ TIOCA2 PA 7/TP7/ TIOCB2 91 92 93 94 95 93 94 95 96 97 96 98 97 98 99 100 99 100 1 2 PA 4/TP4/ PA 4/TP4/ PA 4/TP4/ PA 4/TP4/ TIOCA1/A 23 TIOCA1/A 23 TIOCA1/A 23 TIOCA1 PA 5/TP5/ PA 5/TP5/ PA 5/TP5/ PA 5/TP5/ TIOCB1/A 22 TIOCB1/A 22 TIOCB1/A 22 TIOCB1 PA 6/TP6/ PA 6/TP6/ PA 6/TP6/ PA 6/TP6/ TIOCA2/A 21 TIOCA2/A 21 TIOCA2/A 21 TIOCA2 A20 A20 PA 7/TP7/ PA 7/TP7/ TIOCB2/A 20 TIOCB2 Notes: *1 In modes 1, 3, and 5 the P4 0 to P4 7 functions of pins P40/D0 to P4 7/D7 are selected after a reset, but they can be changed by software. *2 In modes 2 and 4 the D 0 to D7 functions of pins P40/D0 to P4 7/D7 are selected after a reset, but they can be changed by software. *3 Functions as RESO in the on-chip mask ROM versions, and as FWE in the on-chip flash memory versions. Functions as the programming control signal in modes 5 and 7. *4 Functions as V CC in the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, and H8/3060 mask ROM version. In the H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version, this pin functions as VCL. 21 1.4 Notes on H8/3062F-ZTAT R-Mask Version There are two models with on-chip flash memory in the H8/3062 Series: the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version. Points to be noted when using the H8/3062F-ZTAT R-mask version are given below. 1.4.1 Pin Arrangement The H8/3062F-ZTAT R-mask version has the same pin arrangement as the H8/3062F-ZTAT and the H8/3062 mask ROM version, H8/3061 mask ROM version, and H8/3060 mask ROM version. Except for the VCL pin, it also has the same pin arrangement as the H8/3062F-ZTAT B-mask version, H8/3064F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. 22 1.4.2 Product Type Names and Markings Table 1.5 shows the product type names and differences in sample markings for the H8/3062FZTAT and the H8/3062F-ZTAT R-mask version. Table 1.5 Differences in H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Markings H8/3062F-ZTAT TFP-100 Product type name Sample markings HD64F3062TE H8/3062 HD 64F3062TE20 JAPAN H8/3062F-ZTAT R-Mask Version HD64F3062RTE H8/3062 R HD 64F3062TE20 JAPAN "R" is printed above the type name. FP-100B Product type name Sample markings HD64F3062F H8/3062 HD 64F3062F20 JAPAN HD64F3062RF H8/3062 R HD 64F3062F20 JAPAN "R" is printed above the type name. FP-100A Product type name Sample markings HD64F3062FP H8/3062 HD 64F3062FP20 JAPAN HD64F3062RFP H8/3062 R HD 64F3062FP20 JAPAN "R" is printed above the type name. 1.4.3 Differences between H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Table 1.6 shows the differences between the H8/3062F-ZTAT, the H8/3062F-ZTAT R-mask version, and the on-chip mask ROM versions. 23 Table 1.6 Differences between H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, and On-Chip Mask ROM Versions On-Chip Flash Memory Versions On-Chip Mask ROM Versions HD6433062 HD6433061 HD6433060 128 kbytes mask ROM 96 kbytes mask ROM 64 kbytes mask ROM Item ROM Address output functions ADRCR register (H'FEE01E) HD64F3062 128 kbytes flash memory Compatible with previous H8/300H Series -- Corresponding address consists of reserved bits HD64F3062R Choice of address update mode 1 (compatible with previous H8/300H Series) or address update mode 2 See the section on the bus controller for details. 7 -- 6 -- 5 -- 4 -- 3 -- 2 -- 1 -- 0 ADRCTL See the section on the bus controller for the bit function. The address output functions and ADRCR register specification of the H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version are the same as for the H8/3062F-ZTAT R-mask version. 1.5 Notes on H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version The H8/3062 Series includes one model with 128-kbyte on-chip flash memory, the H8/3062FZTAT B-mask version developed on the basis of the H8/3062F-ZTAT R-mask version, and one model with 256-kbyte large-capacity on-chip flash memory, the H8/3064F-ZTAT B-mask version. The H8/3062F-ZTAT B-mask version and H8/3064F-ZTAT B-mask version have the following features: 1. Low power consumption 2. Functional compatibility with the H8/3062F-ZTAT R-mask version 3. Pin arrangement compatibility (except for the VCL pin) Points to be noted when using the H8/3062F-ZTAT B-mask version or H8/3064F-ZTAT B-mask version are given below. 24 1.5.1 Pin Arrangement Except for the VCL pin, the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version have the same pin arrangement as the H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. 1.5.2 Product Type Names and Markings Table 1.7 shows the product type names and differences in sample markings for the H8/3062FZTAT R-mask version, H8/3062F-ZTAT B-mask version, and H8/3064F-ZTAT B-mask version. Table 1.7 Differences in H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version, and H8/3064F-ZTAT B-Mask Version Markings H8/3062F-ZTAT R-Mask Version TFP-100 Product HD64F3062RTE type name Sample markings H8/3062 R HD 64F3062TE20 JAPAN H8/3062F-ZTAT B-Mask Version HD64F3062BTE H8/3064F-ZTAT B-Mask Version HD64F3064BTE H8/3062 B HD 64F3062TE25 JAPAN H8/3064 B HD 64F3064TE25 JAPAN "B" is printed above the type name. FP-100B Product HD64F3062RF type name Sample markings H8/3062 R HD 64F3062F20 JAPAN "B" is printed above the type name. HD64F3064BF HD64F3062BF H8/3062 B HD 64F3062F25 JAPAN H8/3064 B HD 64F3064F25 JAPAN "B" is printed above the type name. FP-100A Product HD64F3062RFP type name Sample markings H8/3062 R HD 64F3062FP20 JAPAN "B" is printed above the type name. HD64F3064BFP HD64F3062BFP H8/3062 B HD 64F3062FP25 JAPAN H8/3064 B HD 64F3064FP25 JAPAN "B" is printed above the type name. "B" is printed above the type name. 25 1.5.3 VCL Pin The H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, and on-chip mask ROM B-mask versions have a VCL (internal step-down) pin, to which a 0.1 F internal voltage stabilization capacitor must be connected. The method of connecting the external capacitor is shown in figure 1.6. Do not connect the V CC power supply to the VCL pin (Connect the V CC power supply to other VCC pins as usual). Note that the VCL output pin occupies the same location as a VCC pin in the H8/3062F-ZTAT R-mask version and on-chip mask ROM versions. VCC power supply External capacitor 0.1 F VCL H8/3062F-ZTAT, H8/3062F-ZTAT B-mask version, H8/3064F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, H8/3060 mask ROM B-mask version (5 V model) VCC H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask ROM version Do not connect the VCC power supply to the VCL pin (Connect the VCC power supply to other VCC pins as usual). Place the capacitor close to the pin. These versions have a VCC power supply pin in the same pin position as a VCC pin in the H8/3062F-ZTAT B-mask version and H8/3064F-ZTAT B-mask version. Figure 1.6 H8/3062F-ZTAT B-Mask Version, H8/3064F-ZTAT B-Mask Version, and On-Chip Mask ROM B-Mask Versions 26 1.5.4 Notes on Changeover to On-Chip Mask ROM Versions and On-Chip Mask ROM B-Mask Versions (1) Care is required when changing from the H8/3062F-ZTAT B-mask version with on-chip flash memory to a model with on-chip mask ROM. An external capacitor must be connected to the VCL pin of the H8/3062F-ZTAT B-mask version (5 V model). This VCL pin occupies the same location as a VCC pin in the on-chip mask ROM versions. Changeover to a mask ROM version must therefore be taken into account when undertaking pattern design, etc., in the board design stage. (2) When changing from the H8/3062F-ZTAT B-mask version with on-chip flash memory to the on-chip mask ROM B-mask version, note (1) above does not need to be considered because the VCL pin is assigned to the same location in both versions. It does not need to be considered either when changing from the H8/3064F-ZTAT B-mask version to the on-chip mask ROM B-mask version. VCC power supply H8/3062 Series chip VCC pin VCL pin Land pattern for on-chip mask ROM versions (0 resistance mounted) Land pattern for H8/3062F-ZTAT B-mask version (0.1 F capacitor mounted) Figure 1.7 Example of Board Pattern Providing for External Capacitor 27 1.6 Setting Oscillation Settling Wait Time When software standby mode is used, after exiting software standby mode a wait period must be provided to allow the clock to stabilize. Select the length of time for which the CPU and peripheral functions are to wait by setting bits STS2 to STS0 in the system control register (SYSCR) and bits DIV1 and DIV0 in the division ratio control register (DIVCR) according to the operating frequency of the chip. For the H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, and on-chip mask ROM B-mask versions ensure that the oscillation settling wait time is at least 0.1 ms when operating on an external clock. For setting details, see section 21.4.3, Selection of Waiting Time for Exit from Software Standby Mode. 1.7 Caution on Crystal Resonator Connection The H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, and on-chip mask ROM B-mask versions support an operating frequency of up to 25 MHz. If a crystal resonator with a frequency higher than 20 MHz is connected, attention must be paid to circuit constants such as external load capacitance values. For details see section 20.2.1, Connecting a Crystal Resonator. 28 Section 2 CPU 2.1 Overview The H8/300H CPU is a high-speed central processing unit with an internal 32-bit architecture that is upward-compatible with the H8/300 CPU. The H8/300H CPU has sixteen 16-bit general registers, can address a 16-Mbyte linear address space, and is ideal for realtime control. 2.1.1 Features The H8/300H CPU has the following features. * Upward compatibility with H8/300 CPU Can execute H8/300 Series object programs. * General-register architecture Sixteen 16-bit general registers (also usable as sixteen 8-bit registers or eight 32-bit registers) * 64 basic instructions 8/16/32-bit arithmetic and logic instructions Multiply and divide instructions Powerful bit-manipulation instructions * Eight addressing modes Register direct [Rn] Register indirect [@ERn] Register indirect with displacement [@(d:16, ERn) or @(d:24, ERn)] Register indirect with post-increment or pre-decrement [@ERn+ or @-ERn] Absolute address [@aa:8, @aa:16, or @aa:24] Immediate [#xx:8, #xx:16, or #xx:32] Program-counter relative [@(d:8, PC) or @(d:16, PC)] Memory indirect [@@aa:8] * 16-Mbyte linear address space * High-speed operation All frequently-used instructions execute in two to four states Maximum clock frequency: 20 MHz (H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask ROM version) 25 MHz (H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version) 29 8/16/32-bit register-register add/subtract: 100 ns@20 MHz (80 ns@25 MHz) 8 x 8-bit register-register multiply: 700 ns@20 MHz (560 ns@25 MHz) 16 / 8-bit register-register divide: 700 ns@20 MHz (560 ns@25 MHz) 16 x 16-bit register-register multiply: 1.1 s@20 MHz (0.88 s@25 MHz) 32 / 16-bit register-register divide: 1.1 s@20 MHz (0.88 s@25 MHz) * Two CPU operating modes Normal mode Advanced mode * Low-power mode Transition to power-down state by SLEEP instruction 2.1.2 Differences from H8/300 CPU In comparison to the H8/300 CPU, the H8/300H has the following enhancements. * More general registers Eight 16-bit registers have been added. * Expanded address space Advanced mode supports a maximum 16-Mbyte address space. Normal mode supports the same 64-kbyte address space as the H8/300 CPU. * Enhanced addressing The addressing modes have been enhanced to make effective use of the 16-Mbyte address space. * Enhanced instructions Data transfer, arithmetic, and logic instructions can operate on 32-bit data. Signed multiply/divide instructions and other instructions have been added. 30 2.2 CPU Operating Modes The H8/300H CPU has two operating modes: normal and advanced. Normal mode supports a maximum 64-kbyte address space. Advanced mode supports up to 16 Mbytes. Maximum 64 kbytes, program and data areas combined. Normal mode CPU operating modes Maximum 16 Mbytes, program and data areas combined. Advanced mode Figure 2.1 CPU Operating Modes 2.3 Address Space Figure 2.2 shows a simple memory map for the H8/3062 Series. The H8/300H CPU can address a linear address space with a maximum size of 64 kbytes in normal mode, and 16 Mbytes in advanced mode. For further details see section 3.6, Memory Map in Each Operating Mode. The 1-Mbyte operating modes use 20-bit addressing. The upper 4 bits of effective addresses are ignored. H'0000 H'FFFF H'00000 H'000000 H'FFFFF H'FFFFFF a. 1-Mbyte mode Normal mode b. 16-Mbyte mode Advanced mode Figure 2.2 Memory Map 31 2.4 2.4.1 Register Configuration Overview The H8/300H CPU has the internal registers shown in figure 2.3. There are two types of registers: general registers and control registers. General Registers (ERn) 15 ER0 ER1 ER2 ER3 ER4 ER5 ER6 ER7 Control Registers (CR) 23 PC 76543210 CCR I UI H U N Z V C Legend: SP : Stack pointer PC : Program counter CCR : Condition code register I : Interrupt mask bit UI : User bit or interrupt mask bit H : Half-carry flag U : User bit N : Negative flag Z : Zero flag V : Overflow flag C : Carry flag 0 E0 E1 E2 E3 E4 E5 E6 E7 (SP) 07 R0H R1H R2H R3H R4H R5H R6H R7H 07 R0L R1L R2L R3L R4L R5L R6L R7L 0 Figure 2.3 CPU Registers 32 2.4.2 General Registers The H8/300H CPU has eight 32-bit general registers. These general registers are all functionally alike and can be used without distinction between data registers and address registers. When a general register is used as a data register, it can be accessed as a 32-bit, 16-bit, or 8-bit register. When the general registers are used as 32-bit registers or as address registers, they are designated by the letters ER (ER0 to ER7). The ER registers divide into 16-bit general registers designated by the letters E (E0 to E7) and R (R0 to R7). These registers are functionally equivalent, providing a maximum sixteen 16-bit registers. The E registers (E0 to E7) are also referred to as extended registers. The R registers divide into 8-bit general registers designated by the letters RH (R0H to R7H) and RL (R0L to R7L). These registers are functionally equivalent, providing a maximum sixteen 8-bit registers. Figure 2.4 illustrates the usage of the general registers. The usage of each register can be selected independently. * Address registers * 32-bit registers * 16-bit registers E registers (extended registers) E0 to E7 * 8-bit registers ER registers ER0 to ER7 R registers R0 to R7 RH registers R0H to R7H RL registers R0L to R7L Figure 2.4 Usage of General Registers General register ER7 has the function of stack pointer (SP) in addition to its general-register function, and is used implicitly in exception handling and subroutine calls. Figure 2.5 shows the stack. 33 Free area SP (ER7) Stack area Figure 2.5 Stack 2.4.3 Control Registers The control registers are the 24-bit program counter (PC) and the 8-bit condition code register (CCR). Program Counter (PC): This 24-bit counter indicates the address of the next instruction the CPU will execute. The length of all CPU instructions is 2 bytes (one word), so the least significant PC bit is ignored. When an instruction is fetched, the least significant PC bit is regarded as 0. Condition Code Register (CCR): This 8-bit register contains internal CPU status information, including the interrupt mask bit (I) and half-carry (H), negative (N), zero (Z), overflow (V), and carry (C) flags. Bit 7--Interrupt Mask Bit (I): Masks interrupts other than NMI when set to 1. NMI is accepted regardless of the I bit setting. The I bit is set to 1 at the start of an exception-handling sequence. Bit 6--User Bit or Interrupt Mask Bit (UI): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. This bit can also be used as an interrupt mask bit. For details see section 5, Interrupt Controller. Bit 5--Half-Carry Flag (H): When the ADD.B, ADDX.B, SUB.B, SUBX.B, CMP.B, or NEG.B instruction is executed, this flag is set to 1 if there is a carry or borrow at bit 3, and cleared to 0 otherwise. When the ADD.W, SUB.W, CMP.W, or NEG.W instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 11, and cleared to 0 otherwise. When the ADD.L, SUB.L, CMP.L, or NEG.L instruction is executed, the H flag is set to 1 if there is a carry or borrow at bit 27, and cleared to 0 otherwise. Bit 4--User Bit (U): Can be written and read by software using the LDC, STC, ANDC, ORC, and XORC instructions. Bit 3--Negative Flag (N): Stores the value of the most significant bit of data, regarded as the sign bit. Bit 2--Zero Flag (Z): Set to 1 to indicate zero data, and cleared to 0 to indicate non-zero data. 34 Bit 1--Overflow Flag (V): Set to 1 when an arithmetic overflow occurs, and cleared to 0 at other times. Bit 0--Carry Flag (C): Set to 1 when a carry is generated by execution of an operation, and cleared to 0 otherwise. Used by: * Add instructions, to indicate a carry * Subtract instructions, to indicate a borrow * Shift and rotate instructions The carry flag is also used as a bit accumulator by bit manipulation instructions. Some instructions leave flag bits unchanged. Operations can be performed on CCR by the LDC, STC, ANDC, ORC, and XORC instructions. The N, Z, V, and C flags are used by conditional branch (Bcc) instructions. For the action of each instruction on the flag bits, see appendix A.1, Instruction List. For the I and UI bits, see section 5, Interrupt Controller. 2.4.4 Initial CPU Register Values In reset exception handling, PC is initialized to a value loaded from the vector table, and the I bit in CCR is set to 1. The other CCR bits and the general registers are not initialized. In particular, the initial value of the stack pointer (ER7) is also undefined. The stack pointer (ER7) must therefore be initialized by an MOV.L instruction executed immediately after a reset. 35 2.5 Data Formats The H8/300H CPU can process 1-bit, 4-bit (BCD), 8-bit (byte), 16-bit (word), and 32-bit (longword) data. Bit-manipulation instructions operate on 1-bit data by accessing bit n (n = 0, 1, 2, ..., 7) of byte operand data. The DAA and DAS decimal-adjust instructions treat byte data as two digits of 4-bit BCD data. 2.5.1 General Register Data Formats Figures 2.6 and 2.7 show the data formats in general registers. General Register Data Type Data Format 7 0 Don't care 7 0 1-bit data RnH 76543210 1-bit data RnL 7 Don't care 43 0 76543210 4-bit BCD data RnH Upper digit Lower digit Don't care 7 43 0 4-bit BCD data RnL 7 Don't care 0 Upper digit Lower digit Byte data RnH MSB LSB 7 Don't care 0 LSB Byte data RnL Don't care MSB Legend: RnH : General register RH RnL : General register RL Figure 2.6 General Register Data Formats 36 Data Type General Register Data Format 15 0 LSB Word data Rn MSB 15 0 LSB 16 15 0 LSB Word data En MSB 31 Longword data ERn MSB Legend: ERn : General register En : General register E Rn : General register R MSB : Most significant bit LSB : Least significant bit Figure 2.7 General Register Data Formats 2.5.2 Memory Data Formats Figure 2.8 shows the data formats on memory. The H8/300H CPU can access word data and longword data on memory, but word or longword data must begin at an even address. If an attempt is made to access word or longword data at an odd address, no address error occurs but the least significant bit of the address is regarded as 0, so the access starts at the preceding address. This also applies to instruction fetches. 37 Data Type Address Data Format 7 1-bit data Byte data Word data Address L Address L Address 2M Address 2M + 1 Address 2N Longword data Address 2N + 1 Address 2N + 2 Address 2N + 3 MSB 0 6 5 4 3 2 1 0 LSB 7 MSB MSB LSB LSB Figure 2.8 Memory Data Formats When ER7 (SP) is used as an address register to access the stack, the operand size should be word size or longword size. 38 2.6 2.6.1 Instruction Set Instruction Set Overview The H8/300H CPU has 64 types of instructions, which are classified in table 2.1. Table 2.1 Function Data transfer Arithmetic operations Logic operations Shift operations Bit manipulation Branch System control Block data transfer Instruction Classification Instruction MOV, PUSH* , POP* , MOVTPE* , MOVFPE* 1 1 2 2 Types 5 ADD, SUB, ADDX, SUBX, INC, DEC, ADDS, SUBS, DAA, DAS, 18 MULXU, MULXS, DIVXU, DIVXS, CMP, NEG, EXTS, EXTU AND, OR, XOR, NOT SHAL, SHAR, SHLL, SHLR, ROTL, ROTR, ROTXL, ROTXR 4 8 BSET, BCLR, BNOT, BTST, BAND, BIAND, BOR, BIOR, BXOR, 14 BIXOR, BLD, BILD, BST, BIST Bcc* 3, JMP, BSR, JSR, RTS TRAPA, RTE, SLEEP, LDC, STC, ANDC, ORC, XORC, NOP EEPMOV 5 9 1 Total 64 types Notes: *1 POP.W Rn is identical to MOV.W @SP+, Rn. PUSH.W Rn is identical to MOV.W Rn, @-SP. POP.L ERn is identical to MOV.L @SP+, Rn. PUSH.L ERn is identical to MOV.L Rn, @-SP. *2 Not available in the H8/3062 Series. *3 Bcc is a generic branching instruction. 39 2.6.2 Instructions and Addressing Modes Table 2.2 indicates the instructions available in the H8/300H CPU. Table 2.2 Instructions and Addressing Modes Addressing Modes @ (d:16, ERn) BWL -- -- @ (d:24, ERn) BWL -- -- @ (d:8, PC) -- -- -- @ (d:16, PC) -- -- -- Function Data transfer Instruction MOV POP, PUSH MOVFPE, MOVTPE #xx BWL -- -- Rn BWL -- -- @ERn BWL -- -- @ERn+/ @-ERn BWL -- -- @ aa:8 B -- -- @ aa:16 BWL -- -- @ aa:24 BWL -- -- @@ aa:8 -- -- -- -- -- WL -- Arithmetic operations ADD, CMP SUB ADDX, SUBX ADDS, SUBS INC, DEC DAA, DAS MULXU, MULXS, DIVXU, DIVXS NEG EXTU, EXTS BWL WL B -- -- -- -- BWL BWL B L BWL B BW -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- BWL WL BWL -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Logic operations AND, OR, XOR -- NOT Shift instructions Bit manipulation Branch Bcc, BSR JMP, JSR RTS System control TRAPA RTE SLEEP LDC STC ANDC, ORC, XORC NOP Block data transfer -- -- -- -- -- -- -- -- -- B -- B BWL BWL B -- -- -- -- -- -- B B -- -- -- B -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- -- -- -- -- -- -- -- -- W W -- -- -- B -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- W W -- -- -- -- -- W W -- -- -- -- -- W W -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- BW 40 2.6.3 Tables of Instructions Classified by Function Tables 2.3 to 2.10 summarize the instructions in each functional category. The operation notation used in these tables is defined next. Operation Notation Rd Rs Rn ERn (EAd) (EAs) CCR N Z V C PC SP #IMM disp + - x / :3/:8/:16/:24 General register (destination)* General register (source)* General register* General register (32-bit register or address register)* Destination operand Source operand Condition code register N (negative) flag of CCR Z (zero) flag of CCR V (overflow) flag of CCR C (carry) flag of CCR Program counter Stack pointer Immediate data Displacement Addition Subtraction Multiplication Division AND logical OR logical Exclusive OR logical Move NOT (logical complement) 3-, 8-, 16-, or 24-bit length Note: * General registers include 8-bit registers (R0H to R7H, R0L to R7L), 16-bit registers (R0 to R7, E0 to E7), and 32-bit data or address registers (ER0 to ER7). 41 Table 2.3 Data Transfer Instructions Function (EAs) Rd, Rs (EAd) Moves data between two general registers or between a general register and memory, or moves immediate data to a general register. Instruction Size* MOV B/W/L MOVFPE B (EAs) Rd Cannot be used in the H8/3062 Series. Rs (EAs) Cannot be used in the H8/3062 Series. @SP+ Rn Pops a general register from the stack. POP.W Rn is identical to MOV.W @SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn. MOVTPE B POP W/L PUSH W/L Rn @-SP Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W Rn, @-SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @-SP. Note: * Size refers to the operand size. B : Byte W : Word L : Longword 42 Table 2.4 Arithmetic Operation Instructions Function Rd Rs Rd, Rd #IMM Rd Performs addition or subtraction on data in two general registers, or on immediate data and data in a general register. (Immediate byte data cannot be subtracted from data in a general register. Use the SUBX or ADD instruction.) Instruction Size* ADD,SUB B/W/L ADDX, SUBX B Rd Rs C Rd, Rd #IMM C Rd Performs addition or subtraction with carry or borrow on data in two general registers, or on immediate data and data in a general register. INC, DEC B/W/L Rd 1 Rd, Rd 2 Rd Increments or decrements a general register by 1 or 2. (Byte operands can be incremented or decremented by 1 only.) ADDS, SUBS DAA, DAS L Rd 1 Rd, Rd 2 Rd, Rd 4 Rd Adds or subtracts the value 1, 2, or 4 to or from data in a 32-bit register. Rd decimal adjust Rd Decimal-adjusts an addition or subtraction result in a general register by referring to CCR to produce 4-bit BCD data. B MULXU B/W Rd x Rs Rd Performs unsigned multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits. MULXS B/W Rd x Rs Rd Performs signed multiplication on data in two general registers: either 8 bits x 8 bits 16 bits or 16 bits x 16 bits 32 bits. 43 Instruction Size* DIVXU B/W Function Rd / Rs Rd Performs unsigned division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8-bit remainder or 32 bits / 16 bits 16-bit quotient and 16-bit remainder DIVXS B/W Rd / Rs Rd Performs signed division on data in two general registers: either 16 bits / 8 bits 8-bit quotient and 8-bit remainder, or 32 bits / 16 bits 16-bit quotient and 16-bit remainder CMP B/W/L Rd - Rs, Rd - #IMM Compares data in a general register with data in another general register or with immediate data, and sets CCR according to the result. NEG B/W/L 0 - Rd Rd Takes the two's complement (arithmetic complement) of data in a general register. EXTS W/L Rd (sign extension) Rd Extends byte data in the lower 8 bits of a 16-bit register to word data, or extends word data in the lower 16 bits of a 32-bit register to longword data, by extending the sign bit. EXTU W/L Rd (zero extension) Rd Extends byte data in the lower 8 bits of a 16-bit register to word data, or extends word data in the lower 16 bits of a 32-bit register to longword data, by padding with zeros. Note: * Size refers to the operand size. B : Byte W : Word L : Longword 44 Table 2.5 Logic Operation Instructions Function Rd Rs Rd, Rd #IMM Rd Performs a logical AND operation on a general register and another general register or immediate data. Instruction Size* AND B/W/L OR B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical OR operation on a general register and another general register or immediate data. XOR B/W/L Rd Rs Rd, Rd #IMM Rd Performs a logical exclusive OR operation on a general register and another general register or immediate data. NOT B/W/L Rd Rd Takes the one's complement (logical complement) of general register contents. Note: * Size refers to the operand size. B : Byte W : Word L : Longword Table 2.6 Shift Instructions Function Rd (shift) Rd Performs an arithmetic shift on general register contents. B/W/L Rd (shift) Rd Performs a logical shift on general register contents. B/W/L Rd (rotate) Rd Rotates general register contents. B/W/L Rd (rotate) Rd Rotates general register contents, including the carry bit. Instruction Size* SHAL, SHAR SHLL, SHLR ROTL, ROTR ROTXL, ROTXR B/W/L Note: * Size refers to the operand size. B : Byte W : Word L : Longword 45 Table 2.7 Bit Manipulation Instructions Function 1 ( Instruction Size* BSET B BCLR B 0 ( BNOT B ( BTST B ( BAND B C ( BIAND B 46 Instruction Size* BOR B Function C ( BIOR B BXOR B BIXOR B BLD B BILD B BST B BIST B Note: * Size refers to the operand size. B : Byte 47 Table 2.8 Branching Instructions Function Branches to a specified address if address specified condition is met. The branching conditions are listed below. Mnemonic BRA (BT) BRN (BF) BHI BLS Bcc (BHS) BCS (BLO) BNE BEQ BVC BVS BPL BMI BGE BLT BGT BLE Description Always (true) Never (false) High Low or same Condition Always Never CZ=0 CZ=1 Instruction Size Bcc -- Carry clear (high or same) C = 0 Carry set (low) Not equal Equal Overflow clear Overflow set Plus Minus Greater or equal Less than Greater than Less or equal C=1 Z=0 Z=1 V=0 V=1 N=0 N=1 NV=0 NV=1 Z (N V) = 0 Z (N V) = 1 JMP BSR JSR RTS -- -- -- -- Branches unconditionally to a specified address. Branches to a subroutine at a specified address. Branches to a subroutine at a specified address. Returns from a subroutine. 48 Table 2.9 System Control Instructions Function Starts trap-instruction exception handling. Returns from an exception-handling routine. Causes a transition to the power-down state. (EAs) CCR Moves the source operand contents to the condition code register. The condition code register size is one byte, but in transfer from memory, data is read by word access. Instruction Size* TRAPA RTE SLEEP LDC -- -- -- B/W STC B/W CCR (EAd) Transfers the CCR contents to a destination location. The condition code register size is one byte, but in transfer to memory, data is written by word access. ANDC B CCR #IMM CCR Logically ANDs the condition code register with immediate data. CCR #IMM CCR Logically ORs the condition code register with immediate data. CCR #IMM CCR Logically exclusive-ORs the condition code register with immediate data. PC + 2 PC Only increments the program counter. ORC B XORC B NOP -- Note: * Size refers to the operand size. B : Byte W : Word 49 Table 2.10 Block Transfer Instruction Instruction EEPMOV.B Size -- Function if R4L 0 then repeat @ER5+ @ER6+, R4L - 1 R4L until R4L = 0 else next; if R4 0 then repeat @ER5+ @ER6+, R4 - 1 R4 until R4 = 0 else next; Block transfer instruction. This instruction transfers the number of data bytes specified by R4L or R4, starting from the address indicated by ER5, to the location starting at the address indicated by ER6. At the end of the transfer, the next instruction is executed. EEPMOV.W -- 2.6.4 Basic Instruction Formats The H8/300H instructions consist of 2-byte (word) units. An instruction consists of an operation field (OP field), a register field (r field), an effective address extension (EA field), and a condition field (cc). Operation Field: Indicates the function of the instruction, the addressing mode, and the operation to be carried out on the operand. The operation field always includes the first 4 bits of the instruction. Some instructions have two operation fields. Register Field: Specifies a general register. Address registers are specified by 3 bits, data registers by 3 bits or 4 bits. Some instructions have two register fields. Some have no register field. Effective Address Extension: 8, 16, or 32 bits specifying immediate data, an absolute address, or a displacement. A 24-bit address or displacement is treated as 32-bit data in which the first 8 bits are 0 (H'00). Condition Field: Specifies the branching condition of Bcc instructions. Figure 2.9 shows examples of instruction formats. 50 Operation field only op Operation field and register fields op rn rm ADD.B Rn, Rm, etc. NOP, RTS, etc. Operation field, register fields, and effective address extension op EA (disp) Operation field, effective address extension, and condition field op cc EA (disp) BRA d:8 rn rm MOV.B @(d:16, Rn), Rm Figure 2.9 Instruction Formats 2.6.5 Notes on Use of Bit Manipulation Instructions The BSET, BCLR, BNOT, BST, and BIST instructions read a byte of data, modify a bit in the byte, then write the byte back. Care is required when these instructions are used to access registers with write-only bits, or to access ports. Step 1 2 3 Read Modify Write Description Read one data byte at the specified address Modify one bit in the data byte Write the modified data byte back to the specified address Example 1: BCLR is executed to clear bit 0 in the port 4 data direction register (P4DDR) under the following conditions. P4 7, P4 6: Input pins P4 5 - P4 0: Output pins The intended purpose of this BCLR instruction is to switch P40 from output to input. 51 Before Execution of BCLR Instruction P47 Input/output DDR Input 0 P46 Input 0 P45 Output 1 P44 Output 1 P43 Output 1 P42 Output 1 P41 Output 1 P40 Output 1 Execution of BCLR Instruction BCLR #0, P4DDR ; Execute BCLR instruction on DDR After Execution of BCLR Instruction P47 Input/output DDR Output 1 P46 Output 1 P45 Output 1 P44 Output 1 P43 Output 1 P42 Output 1 P41 Output 1 P40 Input 0 Explanation: To execute the BCLR instruction, the CPU begins by reading P4DDR. Since P4DDR is a write-only register, it is read as H'FF, even though its true value is H'3F. Next the CPU clears bit 0 of the read data, changing the value to H'FE. Finally, the CPU writes this value (H'FE) back to P4DDR to complete the BCLR instruction. As a result, P40DDR is cleared to 0, making P40 an input pin. In addition, P47DDR and P46DDR are set to 1, making P4 7 and P46 output pins. The BCLR instruction can be used to clear flags in the on-chip registers to 0. In the case of the IRQ status register (ISR), for example, a flag must be read as a condition for clearing it, but when using the BCLR instruction, if it is known that a flag has been set to 1 in an interrupt-handling routine, for instance, it is not necessary to read the flag ahead of time. 52 2.7 2.7.1 Addressing Modes and Effective Address Calculation Addressing Modes The H8/300H CPU supports the eight addressing modes listed in table 2.11. Each instruction uses a subset of these addressing modes. Arithmetic and logic instructions can use the register direct and immediate modes. Data transfer instructions can use all addressing modes except programcounter relative and memory indirect. Bit manipulation instructions use register direct, register indirect, or absolute (@aa:8) addressing mode to specify an operand, and register direct (BSET, BCLR, BNOT, and BTST instructions) or immediate (3-bit) addressing mode to specify a bit number in the operand. Table 2.11 Addressing Modes No. 1 2 3 4 5 6 7 8 Addressing Mode Register direct Register indirect Register indirect with displacement Register indirect with post-increment Register indirect with pre-decrement Absolute address Immediate Program-counter relative Memory indirect Symbol Rn @ERn @(d:16, ERn)/@(d:24, ERn) @ERn+ @-ERn @aa:8/@aa:16/@aa:24 #xx:8/#xx:16/#xx:32 @(d:8, PC)/@(d:16, PC) @@aa:8 1 Register Direct--Rn: The register field of the instruction code specifies an 8-, 16-, or 32-bit register containing the operand. R0H to R7H and R0L to R7L can be specified as 8-bit registers. R0 to R7 and E0 to E7 can be specified as 16-bit registers. ER0 to ER7 can be specified as 32-bit registers. 2 Register Indirect--@ERn: The register field of the instruction code specifies an address register (ERn), the lower 24 bits of which contain the address of the operand. 3 Register Indirect with Displacement--@(d:16, ERn) or @(d:24, ERn): A 16-bit or 24-bit displacement contained in the instruction code is added to the contents of an address register (ERn) specified by the register field of the instruction, and the lower 24 bits of the sum specify the address of a memory operand. A 16-bit displacement is sign-extended when added. 53 4 Register Indirect with Post-Increment or Pre-Decrement--@ERn+ or @-ERn: * Register indirect with post-increment--@ERn+ The register field of the instruction code specifies an address register (ERn) the lower 24 bits of which contain the address of a memory operand. After the operand is accessed, 1, 2, or 4 is added to the address register contents (32 bits) and the sum is stored in the address register. The value added is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the register value should be even. * Register indirect with pre-decrement--@-ERn The value 1, 2, or 4 is subtracted from an address register (ERn) specified by the register field in the instruction code, and the lower 24 bits of the result become the address of a memory operand. The result is also stored in the address register. The value subtracted is 1 for byte access, 2 for word access, or 4 for longword access. For word or longword access, the resulting register value should be even. 5 Absolute Address--@aa:8, @aa:16, or @aa:24: The instruction code contains the absolute address of a memory operand. The absolute address may be 8 bits long (@aa:8), 16 bits long (@aa:16), or 24 bits long (@aa:24). For an 8-bit absolute address, the upper 16 bits are all assumed to be 1 (H'FFFF). For a 16-bit absolute address the upper 8 bits are a sign extension. A 24-bit absolute address can access the entire address space. Table 2.12 indicates the accessible address ranges. Table 2.12 Absolute Address Access Ranges Absolute Address 8 bits (@aa:8) 16 bits (@aa:16) 1-Mbyte Modes H'FFF00 to H'FFFFF (1048320 to 1048575) H'00000 to H'07FFF, H'F8000 to H'FFFFF (0 to 32767, 1015808 to 1048575) H'00000 to H'FFFFF (0 to 1048575) 16-Mbyte Modes H'FFFF00 to H'FFFFFF (16776960 to 16777215) H'000000 to H'007FFF, H'FF8000 to H'FFFFFF (0 to 32767, 16744448 to 16777215) H'000000 to H'FFFFFF (0 to 16777215) 24 bits (@aa:24) 6 Immediate--#xx:8, #xx:16, or #xx:32: The instruction code contains 8-bit (#xx:8), 16-bit (#xx:16), or 32-bit (#xx:32) immediate data as an operand. The instruction codes of the ADDS, SUBS, INC, and DEC instructions contain immediate data implicitly. The instruction codes of some bit manipulation instructions contain 3-bit immediate data specifying a bit number. The TRAPA instruction code contains 2-bit immediate data specifying a vector address. 7 Program-Counter Relative--@(d:8, PC) or @(d:16, PC): This mode is used in the Bcc and BSR instructions. An 8-bit or 16-bit displacement contained in the instruction code is sign54 extended to 24 bits and added to the 24-bit PC contents to generate a 24-bit branch address. The PC value to which the displacement is added is the address of the first byte of the next instruction, so the possible branching range is -126 to +128 bytes (-63 to +64 words) or -32766 to +32768 bytes (-16383 to +16384 words) from the branch instruction. The resulting value should be an even number. 8 Memory Indirect--@@aa:8: This mode can be used by the JMP and JSR instructions. The instruction code contains an 8-bit absolute address specifying a memory operand. This memory operand contains a branch address. The memory operand is accessed by longword access. The first byte of the memory operand is ignored, generating a 24-bit branch address. See figure 2.10. The upper bits of the 8-bit absolute address are assumed to be 0 (H'0000), so the address range is 0 to 255 (H'000000 to H'0000FF). Note that the first part of this range is also the exception vector area. For further details see section 5, Interrupt Controller. Specified by @aa:8 Reserved Branch address Figure 2.10 Memory-Indirect Branch Address Specification When a word-size or longword-size memory operand is specified, or when a branch address is specified, if the specified memory address is odd, the least significant bit is regarded as 0. The accessed data or instruction code therefore begins at the preceding address. See section 2.5.2, Memory Data Formats. 2.7.2 Effective Address Calculation Table 2.13 explains how an effective address is calculated in each addressing mode. In the 1-Mbyte operating modes the upper 4 bits of the calculated address are ignored in order to generate a 20-bit effective address. 55 56 Effective Address Calculation Operand is general register contents 31 23 General register contents r 31 General register contents 0 23 0 0 0 Effective Address rm rn r Sign extension disp 31 General register contents 0 23 0 r 31 General register contents 1, 2, or 4 0 23 1, 2, or 4 1 for a byte operand, 2 for a word operand, 4 for a longword operand 0 r No. Addressing Mode and Instruction Format 1 Register direct (Rn) op 2 Register indirect (@ERn) op 3 Register indirect with displacement @(d:16, ERn)/@(d:24, ERn) Table 2.13 Effective Address Calculation op 4 Register indirect with post-increment or pre-decrement Register indirect with post-increment @ERn+ op Register indirect with pre-decrement @-ERn op No. 23 H'FFFF Addressing Mode and Instruction Format Effective Address Calculation Effective Address 87 0 5 abs 23 op abs 23 op abs Absolute address @aa:8 op 16 15 Sign extension 0 @aa:16 0 @aa:24 6 op IMM Immediate #xx:8, #xx:16, or #xx:32 Operand is immediate data 7 Program-counter relative @(d:8, PC) or @(d:16, PC) 23 PC contents 0 23 Sign extension 0 disp op disp 57 58 Effective Address Calculation Effective Address abs 23 H'0000 15 0 Memory contents abs 23 16 15 H'00 0 87 0 abs 23 H'0000 31 Memory contents 87 abs 0 23 0 0 No. Addressing Mode and Instruction Format 8 Memory indirect @@aa:8 Normal mode op Advanced mode op Legend: r, rm, rn : Register field op : Operation field disp : Displacement IMM : Immediate data abs : Absolute address 2.8 2.8.1 Processing States Overview The H8/300H CPU has five processing states: the program execution state, exception-handling state, power-down state, reset state, and bus-released state. The power-down state includes sleep mode, software standby mode, and hardware standby mode. Figure 2.11 classifies the processing states. Figure 2.13 indicates the state transitions. Processing states Program execution state The CPU executes program instructions in sequence. Exception-handling state A transient state in which the CPU executes a hardware sequence (saving PC and CCR, fetching a vector, etc.) in response to a reset, interrupt, or other exception. Bus-released state The external bus has been released in response to a bus request signal from a bus master other than the CPU. Reset state The CPU and all on-chip supporting modules are initialized and halted. Power-down state The CPU is halted to conserve power. Sleep mode Software standby mode Hardware standby mode Figure 2.11 Processing States 2.8.2 Program Execution State In this state the CPU executes program instructions in normal sequence. 59 2.8.3 Exception-Handling State The exception-handling state is a transient state that occurs when the CPU alters the normal program flow due to a reset, interrupt, or trap instruction. The CPU fetches a starting address from the exception vector table and branches to that address. In interrupt and trap exception handling the CPU refers to the stack pointer (ER7) and saves the program counter and condition code register. Types of Exception Handling and Their Priority: Exception handling is performed for resets, interrupts, and trap instructions. Table 2.14 indicates the types of exception handling and their priority. Trap instruction exceptions are accepted at all times in the program execution state. Table 2.14 Exception Handling Types and Priority Priority High Type of Exception Detection Timing Reset Interrupt Synchronized with clock End of instruction execution or end of exception handling* Start of Exception Handling Exception handling starts immediately when RES changes from low to high When an interrupt is requested, exception handling starts at the end of the current instruction or current exception-handling sequence Trap instruction Low When TRAPA instruction Exception handling starts when a trap is executed (TRAPA) instruction is executed Note: * Interrupts are not detected at the end of the ANDC, ORC, XORC, and LDC instructions, or immediately after reset exception handling. Figure 2.12 classifies the exception sources. For further details about exception sources, vector numbers, and vector addresses, see section 4, Exception Handling, and section 5, Interrupt Controller. Reset External interrupts Exception sources Interrupt Internal interrupts (from on-chip supporting modules) Trap instruction Figure 2.12 Classification of Exception Sources 60 Bus request End of bus release Program execution state End of bus release Bus request Exception handling source Bus-released state End of exception handling Exception-handling state SLEEP instruction with SSBY = 0 Sleep mode Interrupt source NMI, IRQ 0 , IRQ 1, or IRQ 2 interrupt SLEEP instruction with SSBY = 1 Software standby mode RES = "High" STBY="High", RES ="Low" Reset state *1 Hardware standby mode Power-down state *2 Notes: *1 From any state except hardware standby mode, a transition to the reset state occurs whenever RES goes low. *2 From any state, a transition to hardware standby mode occurs when STBY goes low. Figure 2.13 State Transitions 2.8.4 Exception Handling Operation Reset Exception Handling: Reset exception handling has the highest priority. The reset state is entered when the RES signal goes low. Reset exception handling starts after that, when RES changes from low to high. When reset exception handling starts the CPU fetches a start address from the exception vector table and starts program execution from that address. All interrupts, including NMI, are disabled during the reset exception-handling sequence and immediately after it ends. Interrupt Exception Handling and Trap Instruction Exception Handling: When these exception-handling sequences begin, the CPU references the stack pointer (ER7) and pushes the program counter and condition code register on the stack. Next, if the UE bit in the system control register (SYSCR) is set to 1, the CPU sets the I bit in the condition code register to 1. If the UE bit is cleared to 0, the CPU sets both the I bit and the UI bit in the condition code register to 1. Then the CPU fetches a start address from the exception vector table and execution branches to that address. 61 Figure 2.14 shows the stack after the exception-handling sequence. SP-4 SP-3 SP-2 SP-1 SP (ER7) Stack area SP (ER7) SP+1 SP+2 SP+3 SP+4 CCR PC Even address Before exception handling starts Legend: CCR: Condition code register SP: Stack pointer Pushed on stack After exception handling ends Notes: 1. PC is the address of the first instruction executed after the return from the exception-handling routine. 2. Registers must be saved and restored by word access or longword access, starting at an even address. Figure 2.14 Stack Structure after Exception Handling 2.8.5 Bus-Released State In this state the bus is released to a bus master other than the CPU, in response to a bus request. The bus masters other than the CPU is an external bus master. While the bus is released, the CPU halts except for internal operations. Interrupt requests are not accepted. For details see section 6.6, Bus Arbiter. 2.8.6 Reset State When the RES input goes low all current processing stops and the CPU enters the reset state. The I bit in the condition code register is set to 1 by a reset. All interrupts are masked in the reset state. Reset exception handling starts when the RES signal changes from low to high. The reset state can also be entered by a watchdog timer overflow. For details see section 11, Watchdog Timer. 62 2.8.7 Power-Down State In the power-down state the CPU stops operating to conserve power. There are three modes: sleep mode, software standby mode, and hardware standby mode. Sleep Mode: A transition to sleep mode is made if the SLEEP instruction is executed while the SSBY bit is cleared to 0 in the system control register (SYSCR). CPU operations stop immediately after execution of the SLEEP instruction, but the contents of CPU registers are retained. Software Standby Mode: A transition to software standby mode is made if the SLEEP instruction is executed while the SSBY bit is set to 1 in SYSCR. The CPU and clock halt and all on-chip supporting modules stop operating. The on-chip supporting modules are reset, but as long as a specified voltage is supplied the contents of CPU registers and on-chip RAM are retained. The I/O ports also remain in their existing states. Hardware Standby Mode: A transition to hardware standby mode is made when the STBY input goes low. As in software standby mode, the CPU and all clocks halt and the on-chip supporting modules are reset, but as long as a specified voltage is supplied, on-chip RAM contents are retained. For further information see section 21, Power-Down State. 2.9 2.9.1 Basic Operational Timing Overview The H8/300H CPU operates according to the system clock (o). The interval from one rise of the system clock to the next rise is referred to as a "state." A memory cycle or bus cycle consists of two or three states. The CPU uses different methods to access on-chip memory, the on-chip supporting modules, and the external address space. Access to the external address space can be controlled by the bus controller. 2.9.2 On-Chip Memory Access Timing On-chip memory is accessed in two states. The data bus is 16 bits wide, permitting both byte and word access. Figure 2.15 shows the on-chip memory access cycle. Figure 2.16 indicates the pin states. All H8/3062 Series models except the H8/3062F-ZTAT have a function for changing the method of outputting addresses from the address pins. For details see section 6.3.5, Address Output Method. 63 Bus cycle T1 state Internal address bus Internal read signal Internal data bus (read access) Internal write signal Internal data bus (write access) Write data Read data Address T2 state Figure 2.15 On-Chip Memory Access Cycle T1 Address bus AS , RD, HWR , LWR Address T2 High High impedance D15 to D0 Figure 2.16 Pin States during On-Chip Memory Access (Address Update Mode 1) 2.9.3 On-Chip Supporting Module Access Timing The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide, depending on the internal I/O register being accessed. Figure 2.17 shows the on-chip supporting module access timing. Figure 2.18 indicates the pin states. 64 Bus cycle T1 state Address bus Internal read signal Internal data bus Address T2 state T3 state Read access Read data Internal write signal Write access Internal data bus Write data Figure 2.17 Access Cycle for On-Chip Supporting Modules T1 Address bus AS , RD, HWR , LWR Address T2 T3 High High impedance D15 to D0 Figure 2.18 Pin States during Access to On-Chip Supporting Modules 2.9.4 Access to External Address Space The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings determine whether each area is accessed via an 8-bit or 16-bit data bus, and whether it is accessed in two or three states. For details see section 6, Bus Controller. 65 66 Section 3 MCU Operating Modes 3.1 3.1.1 Overview Operating Mode Selection The H8/3062 Series has seven operating modes (modes 1 to 7) that are selected by the mode pins (MD2 to MD0) as indicated in table 3.1. The input at these pins determines the size of the address space and the initial bus mode. Table 3.1 Operating Mode Selection Description Mode Pins Operating Mode MD2 MD1 MD0 -- Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Initial Bus On-Chip Mode*1 ROM Setting prohibited 8 bits 16 bits 8 bits 16 bits 8 bits -- -- On-Chip RAM Address Space Setting prohibited Expanded mode Expanded mode Expanded mode Expanded mode Expanded mode Single-chip normal mode Single-chip advanced mode Setting Setting prohibited prohibited Disabled Disabled Disabled Disabled Enabled Enabled Enabled Enabled* 2 Enabled* 2 Enabled* 2 Enabled* 2 Enabled* 2 Enabled Enabled Notes: *1 In modes 1 to 5, an 8-bit or 16-bit data bus can be selected on a per-area basis by settings made in the area bus width control register (ABWCR). For details see section 6, Bus Controller. *2 If the RAME bit in SYSCR is cleared to 0, these addresses become external addresses. For the address space size there are three choices: 64 kbytes, 1 Mbyte, or 16 Mbyte. The external data bus is either 8 or 16 bits wide depending on ABWCR settings. 8-bit bus mode is used only if 8-bit access is selected for all areas. For details see section 6, Bus Controller. Modes 1 to 4 are externally expanded modes that enable access to external memory and peripheral devices and disable access to the on-chip ROM. Modes 1 and 2 support a maximum address space of 1 Mbyte. Modes 3 and 4 support a maximum address space of 16 Mbytes. 67 Mode 5 is an externally expanded mode that enables access to external memory and peripheral devices and also enables access to the on-chip ROM. Mode 5 supports a maximum address space of 16 Mbytes. Modes 6 and 7 are single-chip modes in which the chip operates using only the on-chip ROM, RAM, and I/O registers. All ports are available in these modes. Mode 6 supports a maximum address space of 64 kbytes. Mode 7 supports a maximum address space of 1 Mbyte. The H8/3062 Series can be used only in modes 1 to 7. The inputs at the mode pins must select one of these seven modes. The inputs at the mode pins must not be changed during operation. Set the reset state before changing the inputs at these pins. 3.1.2 Register Configuration The H8/3062 Series has a mode control register (MDCR) that indicates the inputs at the mode pins (MD2 to MD0), and a system control register (SYSCR). Table 3.2 summarizes these registers. Table 3.2 Address* H'EE011 H'EE012 Registers Name Mode control register System control register Abbreviation MDCR SYSCR R/W R R/W Initial Value Undetermined H'09 Note: * Lower 20 bits of the address in advanced mode. 3.2 Mode Control Register (MDCR) MDCR is an 8-bit read-only register that indicates the current operating mode of the H8/3062 Series. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 0 -- Reserved bits 4 -- 0 -- 3 -- 0 -- 2 MDS2 --* R 1 MDS1 --* R 0 MDS0 --* R Mode select 2 to 0 Bits indicating the current operating mode Note: * Determined by pins MD 2 to MD 0 . 68 Bits 7 and 6--Reserved: These bits can not be modified and are always read as 1. Bits 5 to 3--Reserved: These bits can not be modified and are always read as 0. Bits 2 to 0--Mode Select 2 to 0 (MDS2 to MDS0): These bits indicate the logic levels at pins MD2 to MD0 (the current operating mode). MDS2 to MDS0 correspond to MD2 to MD0. MDS2 to MDS0 are read-only bits. The mode pin (MD 2 to MD0) levels are latched into these bits when MDCR is read. Note: The versions with on-chip flash memory have a boot mode in which flash memory can be programmed. In boot mode, the MDS2 bit value is the inverse of the level at the MD2 pin. 3.3 System Control Register (SYSCR) SYSCR is an 8-bit register that controls the operation of the H8/3062 Series. Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 SSOE 0 R/W 0 RAME 1 R/W RAM enable Enables or disables on-chip RAM Software standby output port enable Selects the output state of the address bus and bus control signals in software standby mode NMI edge select Selects the valid edge of the NMI input User bit enable Selects whether to use the UI bit in CCR as a user bit or an interrupt mask bit Standby timer select 2 to 0 These bits select the waiting time at recovery from software standby mode Software standby Enables transition to software standby mode 69 Bit 7--Software Standby (SSBY): Enables transition to software standby mode. (For further information about software standby mode see section 21, Power-Down State.) When software standby mode is exited by an external interrupt, and a transition is made to normal operation, this bit remains set to 1. To clear this bit, write 0. Bit 7 SSBY 0 1 Description SLEEP instruction causes transition to sleep mode SLEEP instruction causes transition to software standby mode (Initial value) Bits 6 to 4--Standby Timer Select 2 to 0 (STS2 to STS0): These bits select the length of time the CPU and on-chip supporting modules wait for the internal clock oscillator to settle when software standby mode is exited by an external interrupt. When using a crystal oscillator, set these bits so that the waiting time will be at least 7 ms at the system clock rate. When operating on an external clock, care is required in the case of the H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM Bmask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version. For further information about waiting time selection, see section 21.4.3, Selection of Waiting Time for Exit from Software Standby Mode. Bit 6 STS2 0 0 0 0 1 1 1 1 Bit 5 STS1 0 0 1 1 0 0 1 1 Bit 4 STS0 0 1 0 1 0 1 0 1 Description Waiting time = 8,192 states Waiting time = 16,384 states Waiting time = 32,768 states Waiting time = 65,536 states Waiting time = 131,072 states Waiting time = 262,144 states Waiting time = 1,024 states Illegal setting (Initial value) 70 Bit 3--User Bit Enable (UE): Selects whether to use the UI bit in the condition code register as a user bit or an interrupt mask bit. Bit 3 UE 0 1 Description UI bit in CCR is used as an interrupt mask bit UI bit in CCR is used as a user bit (Initial value) Bit 2--NMI Edge Select (NMIEG): Selects the valid edge of the NMI input. Bit 2 NMIEG 0 1 Description An interrupt is requested at the falling edge of NMI An interrupt is requested at the rising edge of NMI (Initial value) Bit 1--Software Standby Output Port Enable (SSOE): Specifies whether the address bus and bus control signals (CS0 to CS7, AS, RD, HWR, LWR) are kept as outputs or fixed high, or placed in the high-impedance state in software standby mode. Bit 1 SSOE 0 1 Description In software standby mode, the address bus and bus control signals are all highimpedance (Initial value) In software standby mode, the address bus retains its output state and bus control signals are fixed high Bit 0--RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized by the rising edge of the RES signal. It is not initialized in software standby mode. Bit 0 RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value) 71 3.4 3.4.1 Operating Mode Descriptions Mode 1 Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 3.4.2 Mode 2 Ports 1, 2, and 5 function as address pins A19 to A0, permitting access to a maximum 1-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits. 3.4.3 Mode 3 Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of the bus release control register (BRCR) (In this mode A20 is always used for address output). 3.4.4 Mode 4 Ports 1, 2, and 5 and part of port A function as address pins A23 to A0, permitting access to a maximum 16-Mbyte address space. The initial bus mode after a reset is 16 bits, with 16-bit access to all areas. If all areas are designated for 8-bit access in ABWCR, the bus mode switches to 8 bits. A23 to A21 are valid when 0 is written in bits 7 to 5 of BRCR (In this mode A20 is always used for address output). 3.4.5 Mode 5 Ports 1, 2, and 5 and part of port A can function as address pins A 23 to A0, permitting access to a maximum 16-Mbyte address space, but following a reset they are input ports. To use ports 1, 2, and 5 as an address bus, the corresponding bits in their data direction registers (P1DDR, P2DDR, and P5DDR) must be set to 1, setting ports 1, 2, and 5 to output mode. For A23 to A20 output, write 0 in bits 7 to 4 of BRCR. The versions with on-chip flash memory support an on-board programming mode in which the flash memory can be programmed. The initial bus mode after a reset is 8 bits, with 8-bit access to all areas. If at least one area is designated for 16-bit access in ABWCR, the bus mode switches to 16 bits. 72 3.4.6 Mode 6 This mode operates using the on-chip ROM, RAM, and registers. All I/O ports are available. Mode 6 supports a maximum address space of 64 kbytes. 3.4.7 Mode 7 This mode operates using the on-chip ROM, RAM, and registers. All I/O ports are available. Mode 7 supports a 1-Mbyte address space. The versions with on-chip flash memory support an on-board programming mode in which the flash memory can be programmed. 3.5 Pin Functions in Each Operating Mode The pin functions of ports 1 to 5 and port A vary depending on the operating mode. Table 3.3 indicates their functions in each operating mode. Table 3.3 Port Port 1 Port 2 Port 3 Port 4 Port 5 Port A Pin Functions in Each Mode Mode 2 A7 to A0 A15 to A8 D15 to D8 1 Mode 1 A7 to A0 A15 to A8 D15 to D8 P47 to P40* A19 to A16 PA 7 to PA4 Mode 3 A7 to A0 A15 to A8 D15 to D8 1 Mode 4 A7 to A0 A15 to A8 D15 to D8 1 Mode 5 P17 to P10*2 P27 to P20*2 D15 to D8 1 Mode 6 P17 to P10 P27 to P20 P37 to P30 1 Mode 7 P17 to P10 P27 to P20 P37 to P30 P47 to P40 P53 to P50 PA 7 to PA4 D7 to D0* P47 to P40* A19 to A16 D7 to D0* P47 to P40* P47 to P40 P53 to P50 A19 to A16 PA 7 to PA4 A19 to A16 PA 6 to PA4, A20*3 P53 to P50*2 PA 6 to PA4, A20*3 PA 7 to PA4*4 PA 7 to PA4 Notes: *1 Initial state. The bus mode can be switched by settings in ABWCR. These pins function as P47 to P4 0 in 8-bit bus mode, and as D 7 to D0 in 16-bit bus mode. *2 Initial state. These pins become address output pins when the corresponding bits in the data direction registers (P1DDR, P2DDR, P5DDR) are set to 1. *3 Initial state. A20 is always an address output pin. PA6 to PA 4 are switched over to A 23 to A21 output by writing 0 in bits 7 to 5 of BRCR. *4 Initial state. PA7 to PA 4 are switched over to A 23 to A 20 output by writing 0 in bits 7 to 4 of BRCR. 73 3.6 Memory Map in Each Operating Mode Figures 3.1 to 3.4 show memory maps of the H8/3062 Series. In the expanded modes, the address space is divided into eight areas. The initial bus mode differs between modes 1 and 2, and also between modes 3 and 4. The address locations of the on-chip RAM and on-chip registers differ between the 64-kbyte mode (mode 6), the 1-Mbyte modes (modes 1, 2, and 7), and the 16-Mbyte modes (modes 3, 4, and 5). The address range specifiable by the CPU in the 8- and 16-bit absolute addressing modes (@aa:8 and @aa:16) also differs. 3.6.1 Comparison of H8/3062 Series Memory Maps In the H8/3062 Series, the address maps vary according to the size of the on-chip ROM and RAM. The internal I/O register space is the same in all models, and the H8/3062F-ZTAT B-mask version and H8/3062 have the same address map. The H8/3064F-ZTAT B-mask version and H8/3064 mask ROM B-mask version have the same address map. Table 3.4 shows the various address maps in mode 5. Table 3.4 Address Maps in Mode 5 H8/3062 Mask ROM Version, H8/3062 Mask ROM B-Mask Version, H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version On-chip ROM Size Address area On-chip RAM Size Address area 128 kbytes H'000000 to H'01FFFF 4 kbytes H'FFEF20 to H'FFFF1F H8/3061 Mask ROM Version, H8/3061 Mask ROM B-Mask Version 96 kbytes H'000000 to H'017FFF 4 kbytes H'FFEF20 to H'FFFF1F H8/3060 Mask ROM Version, H8/3060 Mask ROM B-Mask Version 64 kbytes H'000000 to H'00FFFF 2 kbytes H'FFF720 to H'FFFF1F H8/3064 Mask ROM B-Mask Version, H8/3064F-ZTAT B-Mask Version 256 kbytes H'000000 to H'03FFFF 8 kbytes H'FFDF20 to H'FFFF1F 74 3.6.2 Reserved Areas The H8/3062 Series memory map includes reserved areas to which access (reading or writing) is prohibited. Normal operation cannot be guaranteed if the following reserved areas are accessed. Reserved Area in Internal I/O Register Space: The H8/3062 Series internal I/O register space includes a reserved area to which access is prohibited. For details see Appendix B, Internal I/O Registers. Other Reserved Areas: In mode 5 in the H8/3061 mask ROM version, H8/3061 mask ROM B-mask version, H8/3060 mask ROM version, and H8/3060 mask ROM B-mask version there is a reserved area in area 0, as shown in figures 3.2 and 3.3. In modes 1 to 5 in the H8/3060 mask ROM version and H8/3060 mask ROM B-mask version there is a reserved area in area 7, as shown in figure 3.3. 75 Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Memory-indirect branch addresses H'00000 Vector area Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Vector area Memory-indirect branch addresses Area 0 H'1FFFFF H'200000 Area 1 H'3FFFFF H'400000 Area 2 H'5FFFFF H'600000 H'7FFFFF H'800000 H'9FFFFF H'A00000 Area 5 H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 H'FFEF1F H'FFEF20 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF External address space H'000000 16-bit absolute addresses H'000FF H'0000FF H'07FFF H'007FFF H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000 H'EE000 H'EE0FF H'F8000 H'FEF1F H'FEF20 H'FFF00 H'FFF1F H'FFF20 H'FFFE9 H'FFFEA H'FFFFF Internal I/O registers (2) External address space Internal I/O registers (1) External address space Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 External address space Area 3 Area 4 On-chip RAM* 8-bit absolute addresses 16-bit absolute addresses Area 7 Internal I/O registers (1) Internal I/O registers (2) External address space Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.1 Memory Map of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM Version, and H8/3062 Mask ROM B-Mask Version in Each Operating Mode 76 8-bit absolute addresses On-chip RAM* 16-bit absolute addresses 16-bit absolute addresses Mode 5 (16-Mbyte expanded mode with on-chip ROM enabled) Memory-indirect branch addresses H'000000 Vector area Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) H'00000 H'000FF On-chip ROM H'07FFF H'1FFFF Memory-indirect branch addresses 16-bit absolute addresses H'0000FF On-chip ROM H'007FFF H'01FFFF H'020000 H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 External address space H'7FFFFF H'800000 H'9FFFFF H'A00000 H'BFFFFF H'C00000 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 External address space H'00FF On-chip ROM Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 H'DFFF H'E000 Internal I/O registers (1) H'E0FF H'EF20 On-chip RAM H'FF00 H'FF1F H'FF20 H'FFE9 Internal I/O registers (2) 8-bit absolute addresses H'EE000 H'EE0FF H'F8000 Internal I/O registers (1) H'FFFF On-chip RAM H'FFF00 8-bit absolute addresses 16-bit absolute addresses H'FFF1F H'FFF20 H'FFFE9 H'FFEF1F H'FFEF20 On-chip RAM* H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA Internal I/O registers (2) External address space Internal I/O registers (2) H'FFFFF H'FFFFFF Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.1 Memory Map of H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM Version, and H8/3062 Mask ROM B-Mask Version in Each Operating Mode (cont) 8-bit absolute addresses H'FEF20 16-bit absolute addresses Internal I/O registers (1) 16-bit absolute addresses Vector area Vector area Memory-indirect branch addresses H'0000 77 Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Memory-indirect branch addresses H'00000 Vector area Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Vector area Memory-indirect branch addresses Area 0 H'1FFFFF H'200000 Area 1 H'3FFFFF H'400000 Area 2 H'5FFFFF H'600000 H'7FFFFF H'800000 H'9FFFFF H'A00000 Area 5 H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 H'FFEF1F H'FFEF20 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF External address space H'000000 16-bit absolute addresses H'0000FF H'000FF H'07FFF H'007FFF H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000 H'EE000 H'EE0FF H'F8000 H'FEF1F H'FEF20 H'FFF00 H'FFF1F H'FFF20 H'FFFE9 H'FFFEA H'FFFFF Internal I/O registers (2) External address space Internal I/O registers (1) External address space Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 External address space Area 3 Area 4 On-chip RAM* 8-bit absolute addresses 16-bit absolute addresses Area 7 Internal I/O registers (1) Internal I/O registers (2) External address space Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.2 Memory Map of H8/3061 Mask ROM Version and H8/3061 Mask ROM B-Mask Version in Each Operating Mode 78 8-bit absolute addresses On-chip RAM* 16-bit absolute addresses 16-bit absolute addresses Mode 5 (16-Mbyte expanded mode with on-chip ROM enabled) Memory-indirect branch addresses H'000000 Vector area Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) H'00000 H'000FF On-chip ROM (mask ROM) H'07FFF H'1FFFF Memory-indirect branch addresses 16-bit absolute addresses H'0000FF On-chip ROM (mask ROM) H'007FFF H'017FFF H'018000 H'01FFFF H'020000 H'00FF On-chip ROM (mask ROM) H'DFFF H'E000 Reserved*1 Area 0 Area 1 Area 2 Area 4 Area 5 Area 6 Area 7 H'FF00 H'FF1F H'FF20 H'FFE9 H'FFFF On-chip RAM 8-bit absolute addresses H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 External address space H'7FFFFF H'800000 H'9FFFFF H'A00000 H'BFFFFF H'C00000 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF External address space H'FF8000 Internal I/O registers (1) H'E0FF Area 3 H'EF20 H'EE000 H'EE0FF H'F8000 Internal I/O registers (2) Internal I/O registers (1) On-chip RAM H'FFF00 H'FFF1F H'FFF20 8-bit absolute addresses 16-bit absolute addresses H'FFFE9 H'FFEF1F H'FFEF20 On-chip RAM*2 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA Internal I/O registers (2) External address space Internal I/O registers(2) H'FFFFF H'FFFFFF Notes: *1 Do not access the reserved area. *2 External addresses can be accessed by disabling on-chip RAM. Figure 3.2 Memory Map of H8/3061 Mask ROM Version and H8/3061 Mask ROM B-Mask Version in Each Operating Mode (cont) 8-bit absolute addresses Internal I/O registers (1) H'FEF20 16-bit absolute addresses 16-bit absolute addresses Vector area Vector area Memory-indirect branch addresses H'0000 79 Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Memory-indirect branch addresses H'00000 Vector area Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Vector area Memory-indirect branch addresses Area 0 H'1FFFFF H'200000 Area 1 H'3FFFFF H'400000 Area 2 H'5FFFFF H'600000 H'7FFFFF H'800000 H'9FFFFF H'A00000 Area 5 16-bit absolute addresses H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 H'FFEF1F H'FFEF20 H'FFF71F H'FFF720 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA External address space H'000000 16-bit absolute addresses H'000FF H'0000FF H'07FFF H'007FFF H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000 H'EE000 H'EE0FF H'F8000 H'FEF1F H'FEF20 H'FF71F H'FF720 H'FFF00 H'FFF1F H'FFF20 H'FFFE9 H'FFFEA H'FFFFF Internal I/O registers (1) External address space Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 External address space Area 3 Area 4 Reserved*1 On-chip RAM*2 Internal I/O registers (2) External address space 8-bit absolute addresses Area 7 Internal I/O registers (1) Reserved*1 16-bit absolute addresses 8-bit absolute addresses On-chip RAM*2 Internal I/O registers (2) External address space H'FFFFFF Notes: *1 Do not access the reserved area. *2 External addresses can be accessed by disabling on-chip RAM. Figure 3.3 Memory Map of H8/3060 Mask ROM Version and H8/3060 Mask ROM B-Mask Version in Each Operating Mode 80 16-bit absolute addresses Mode 5 (16-Mbyte expanded mode with on-chip ROM enabled) Memory-indirect branch addresses H'000000 Vector area Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) H'00000 H'000FF On-chip ROM (mask ROM) H'07FFF H'1FFFF Memory-indirect branch addresses 16-bit absolute addresses H'0000FF On-chip ROM (mask ROM) H'007FFF H'00FFFF H'010000 Reserved*1 H'01FFFF H'020000 H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 External address space H'7FFFFF H'800000 H'9FFFFF H'A00000 H'BFFFFF H'C00000 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 H'FFEF1F H'FFEF20 H'FFF71F H'FFF720 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA Internal I/O registers (1) External address space H'00FF On-chip ROM (mask ROM) H'DFFF H'E000 Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 H'FF00 H'FF1F H'FF20 H'FFE9 H'FFFF H'EF20 H'E0FF Internal I/O registers (1) On-chip RAM 8-bit absolute addresses H'EE000 H'EE0FF H'F8000 Internal I/O registers (2) Internal I/O registers (1) On-chip RAM H'FFF00 H'FFF1F H'FFF20 8-bit absolute addresses 16-bit absolute addresses H'FFFE9 Reserved*1 Internal I/O registers(2) On-chip RAM*2 Internal I/O registers (2) External address space H'FFFFF H'FFFFFF Notes: *1 Do not access the reserved area. *2 External addresses can be accessed by disabling on-chip RAM. Figure 3.3 Memory Map of H8/3060 Mask ROM Version and H8/3060 Mask ROM B-Mask Version in Each Operating Mode (cont) 8-bit absolute addresses H'FEF20 16-bit absolute addresses 16-bit absolute addresses Vector area Vector area Memory-indirect branch addresses H'0000 81 Modes 1 and 2 (1-Mbyte expanded modes with on-chip ROM disabled) Memory-indirect branch addresses H'00000 Vector area Modes 3 and 4 (16-Mbyte expanded modes with on-chip ROM disabled) Vector area Memory-indirect branch addresses Area 0 H'1FFFFF H'200000 Area 1 H'3FFFFF H'400000 Area 2 H'5FFFFF H'600000 H'7FFFFF H'800000 H'9FFFFF H'A00000 Area 5 H'BFFFFF H'C00000 Area 6 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 H'FFDF1F H'FFDF20 H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF External address space H'000000 16-bit absolute addresses H'000FF H'0000FF H'07FFF H'007FFF H'1FFFF H'20000 H'3FFFF H'40000 H'5FFFF H'60000 External address space H'7FFFF H'80000 H'9FFFF H'A0000 H'BFFFF H'C0000 H'DFFFF H'E0000 H'EE000 H'EE0FF H'F8000 H'FDF1F H'FDF20 H'FFF00 H'FFF1F H'FFF20 H'FFFE9 H'FFFEA H'FFFFF Internal I/O registers (2) External address space Internal I/O registers (1) External address space Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 External address space Area 3 Area 4 On-chip RAM* 8-bit absolute addresses 16-bit absolute addresses Area 7 Internal I/O registers (1) Internal I/O registers (2) External address space Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.4 H8/3064F-ZTAT B-Mask Version and H8/3064 Mask ROM B-Mask Version Memory Map in Each Operating Mode 82 8-bit absolute addresses On-chip RAM* 16-bit absolute addresses 16-bit absolute addresses Mode 5 (16-Mbyte expanded mode with on-chip ROM enabled) Memory-indirect branch addresses H'000000 Vector area Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) H'00000 H'000FF On-chip ROM (flash memory) H'07FFF H'3FFFF Memory-indirect branch addresses 16-bit absolute addresses H'0000FF On-chip ROM (flash memory) H'007FFF H'03FFFF H'040000 H'1FFFFF H'200000 H'3FFFFF H'400000 H'5FFFFF H'600000 External address space H'7FFFFF H'800000 H'9FFFFF H'A00000 H'BFFFFF H'C00000 H'DFFFFF H'E00000 H'FEE000 H'FEE0FF H'FF8000 External address space H'00FF On-chip ROM (flash memory) H'DFFF H'E000 Internal I/O registers (1) H'E0FF Area 0 Area 1 Area 2 Area 3 Area 4 Area 5 Area 6 Area 7 H'E720 On-chip RAM H'FF00 H'FF1F H'FF20 H'FFE9 Internal I/O registers (2) 8-bit absolute addresses H'EE000 H'EE0FF H'F8000 Internal I/O registers (1) H'FFFF On-chip RAM H'FFF00 8-bit absolute addresses 16-bit absolute addresses H'FFF1F H'FFF20 H'FFFE9 H'FFDF1F H'FFDF20 On-chip RAM* H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA Internal I/O registers (2) External address space Internal I/O registers(2) H'FFFFF H'FFFFFF Note: * External addresses can be accessed by disabling on-chip RAM. Figure 3.4 H8/3064F-ZTAT B-Mask Version and H8/3064 Mask ROM B-Mask Version Memory Map in Each Operating Mode (cont) 8-bit absolute addresses H'FDF20 16-bit absolute addresses Internal I/O registers (1) 16-bit absolute addresses Vector area Vector area Memory-indirect branch addresses H'0000 83 84 Section 4 Exception Handling 4.1 4.1.1 Overview Exception Handling Types and Priority As table 4.1 indicates, exception handling may be caused by a reset, interrupt, or trap instruction. Exception handling is prioritized as shown in table 4.1. If two or more exceptions occur simultaneously, they are accepted and processed in priority order. Trap instruction exceptions are accepted at all times in the program execution state. Table 4.1 Exception Types and Priority Start of Exception Handling Starts immediately after a low-to-high transition at the RES pin Interrupt requests are handled when execution of the current instruction or handling of the current exception is completed Priority Exception Type High Reset Interrupt Low Trap instruction (TRAPA) Started by execution of a trap instruction (TRAPA) 4.1.2 Exception Handling Operation Exceptions originate from various sources. Trap instructions and interrupts are handled as follows. 1. The program counter (PC) and condition code register (CCR) are pushed onto the stack. 2. The CCR interrupt mask bit is set to 1. 3. A vector address corresponding to the exception source is generated, and program execution starts from that address. Note: For a reset exception, steps 2 and 3 above are carried out. 85 4.1.3 Exception Vector Table The exception sources are classified as shown in figure 4.1. Different vectors are assigned to different exception sources. Table 4.2 lists the exception sources and their vector addresses. * Reset External interrupts: NMI, IRQ 0 to IRQ5 Exception sources * Interrupts Internal interrupts: 27 interrupts from on-chip supporting modules * Trap instruction Figure 4.1 Exception Sources 86 Table 4.2 Exception Vector Table Vector Address*1 Exception Source Reset Reserved for system use Vector Number 0 1 2 3 4 5 6 Advanced Mode H'0000 to H'0003 H'0004 to H'0007 H'0008 to H'000B H'000C to H'000F H'0010 to H'0013 H'0014 to H'0017 H'0018 to H'001B H'001C to H'001F H'0020 to H'0023 H'0024 to H'0027 H'0028 to H'002B H'002C to H'002F H'0030 to H'0033 H'0034 to H'0037 H'0038 to H'003B H'003C to H'003F H'0040 to H'0043 H'0044 to H'0047 H'0048 to H'004B H'004C to H'004F H'0050 to H'0053 to H'00FC to H'00FF Normal Mode H'0000 to H'0001 H'0002 to H'0003 H'0004 to H'0005 H'0006 to H'0007 H'0008 to H'0009 H'000A to H'000B H'000C to H'000D H'000E to H'000F H'0010 to H'0011 H'0012 to H'0013 H'0014 to H'0015 H'0016 to H'0017 H'0018 to H'0019 H'001A to H'001B H'001C to H'001D H'001E to H'001F H'0020 to H'0021 H'0022 to H'0023 H'0024 to H'0025 H'0026 to H'0027 H'0028 to H'0029 to H'007E to H'007F External interrupt (NMI) Trap instruction (4 sources) 7 8 9 10 11 External interrupt IRQ0 External interrupt IRQ1 External interrupt IRQ2 External interrupt IRQ3 External interrupt IRQ4 External interrupt IRQ5 Reserved for system use 12 13 14 15 16 17 18 19 Internal interrupts*2 20 to 63 Notes: *1 Lower 16 bits of the address *2 For the internal interrupt vectors, see section 5.3.3, Interrupt Vector Table. 87 4.2 4.2.1 Reset Overview A reset is the highest-priority exception. When the RES pin goes low, all processing halts and the chip enters the reset state. A reset initializes the internal state of the CPU and the registers of the on-chip supporting modules. Reset exception handling begins when the RES pin changes from low to high. The chip can also be reset by overflow of the watchdog timer. For details see section 11, Watchdog Timer. 4.2.2 Reset Sequence The chip enters the reset state when the RES pin goes low. To ensure that the chip is reset, hold the RES pin low for at least 20 ms at power-up. To reset the chip during operation, hold the RES pin low for at least 10 system clock (o) cycles. In the versions with on-chip flash memory, the RES pin must be held low for at least 20 system clock cycles. See appendix D.2, Pin States at Reset, for the states of the pins in the reset state. When the RES pin goes high after being held low for the necessary time, the chip starts reset exception handling as follows. * The internal state of the CPU and the registers of the on-chip supporting modules are initialized, and the I bit is set to 1 in CCR. * The contents of the reset vector address (H'0000 to H'0003 in advanced mode, H'0000 to H'0001 in normal mode) are read, and program execution starts from the address indicated in the vector address. Figure 4.2 shows the reset sequence in modes 1 and 3. Figure 4.3 shows the reset sequence in modes 2 and 4. Figure 4.4 shows the reset sequence in mode 6. 88 Vector fetch Internal processing Prefetch of first program instruction RES Address bus (1) (3) (5) (7) (9) RD HWR , LWR (2) (4) High (6) (8) (10) Figure 4.2 Reset Sequence (Modes 1 and 3) : : : : D15 to D8 (1), (3), (5), (7) (2), (4), (6), (8) (9) (10) Address of reset exception handling vector: (1) = H'000000, (3) = H'000001, (5) = H'000002, (7) = H'000003 Start address (contents of reset exception handling vector address) Start address First instruction of program Note: After a reset, the wait-state controller inserts three wait states in every bus cycle. 89 Vector fetch Internal processing Prefetch of first program instruction RES Address bus (1) (3) (5) RD HWR , LWR D15 to D0 High (2) (4) (6) (1), (3) (2), (4) (5) (6) : : : : Address of reset exception handling vector: (1) = H'000000, (3) = H'000002 Start address (contents of reset exception handling vector address) Start address First instruction of program Note: After a reset, the wait-state controller inserts three wait states in every bus cycle. Figure 4.3 Reset Sequence (Modes 2 and 4) 90 Vector fetch Internal processing Prefetch of first program instruction RES Internal address bus Internal read signal Internal write signal Internal data bus (16 bits wide) High (1) (2) (2) (3) (1) : Address of reset exception handling vector (H'0000) (2) : Start address (contents of reset exception handling vector address) (3) : First instruction of program Figure 4.4 Reset Sequence (Mode 6) 4.2.3 Interrupts after Reset If an interrupt is accepted after a reset but before the stack pointer (SP) is initialized, PC and CCR will not be saved correctly, leading to a program crash. To prevent this, all interrupt requests, including NMI, are disabled immediately after a reset exception handling. The first instruction of the program is always executed immediately after the reset state ends. This instruction should initialize the stack pointer (example: MOV.L #xx:32, SP). 91 4.3 Interrupts Interrupt exception handling can be requested by seven external sources (NMI, IRQ0 to IRQ5), and 27 internal sources in the on-chip supporting modules. Figure 4.5 classifies the interrupt sources and indicates the number of interrupts of each type. The on-chip supporting modules that can request interrupts are the watchdog timer (WDT), 16-bit timer, 8-bit timer, serial communication interface (SCI), and A/D converter. Each interrupt source has a separate vector address. NMI is the highest-priority interrupt and is always accepted*. Interrupts are controlled by the interrupt controller. The interrupt controller can assign interrupts other than NMI to two priority levels, and arbitrate between simultaneous interrupts. Interrupt priorities are assigned in interrupt priority registers A and B (IPRA and IPRB) in the interrupt controller. For details on interrupts see section 5, Interrupt Controller. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.6.4, NMI Input Disabling Conditions. NMI (1) IRQ 0 to IRQ 5 (6) External interrupts Interrupts Internal interrupts WDT* (1) 16-bit timer (9) 8-bit timer (8) SCI (8) A/D converter (1) Note: Numbers in parentheses are the number of interrupt sources. * When the watchdog timer is used as an interval timer, it generates an interrupt request at every counter overflow. Figure 4.5 Interrupt Sources and Number of Interrupts 4.4 Trap Instruction Trap instruction exception handling starts when a TRAPA instruction is executed. If the UE bit is set to 1 in the system control register (SYSCR), the exception handling sequence sets the I bit to 1 in CCR. If the UE bit is 0, the I and UI bits are both set to 1 in CCR. The TRAPA instruction fetches a start address from a vector table entry corresponding to a vector number from 0 to 3, which is specified in the instruction code. 92 4.5 Stack Status after Exception Handling Figure 4.6 shows the stack after completion of trap instruction exception handling and interrupt exception handling. SP-4 SP-3 SP-2 SP-1 SP (ER7) Stack area SP (ER7) SP+1 SP+2 SP+3 SP+4 CCR CCR * PC H PC L Even address Before exception handling Pushed on stack a. Normal mode After exception handling SP-4 SP-3 SP-2 SP-1 SP (ER7) Stack area SP (ER7) SP+1 SP+2 SP+3 SP+4 CCR PC E PC H PC L Even address Before exception handling Pushed on stack b. Advanced mode Legend: PCE : Bits 23 to 16 of program counter (PC) PCH : Bits 15 to 8 of program counter (PC) PCL : Bits 7 to 0 of program counter (PC) CCR : Condition code register SP : Stack pointer After exception handling Notes: * Ignored at return. 1. PC indicates the address of the first instruction that will be executed after return. 2. Registers must be saved in word or longword size at even addresses. Figure 4.6 Stack after Completion of Exception Handling 93 4.6 Notes on Stack Usage When accessing word data or longword data, the H8/3062 Series regards the lowest address bit as 0. The stack should always be accessed by word access or longword access, and the value of the stack pointer (SP:ER7) should always be kept even. Use the following instructions to save registers: PUSH.W Rn PUSH.L ERn (or MOV.W Rn, @-SP) (or MOV.L ERn, @-SP) Use the following instructions to restore registers: POP.W Rn POP.L ERn (or MOV.W @SP+, Rn) (or MOV.L @SP+, ERn) Setting SP to an odd value may lead to a malfunction. Figure 4.7 shows an example of what happens when the SP value is odd. 94 CCR SP PC SP R1L H'FFFEFA H'FFFEFB PC H'FFFEFC H'FFFEFD H'FFFEFE SP H'FFFEFF TRAPA instruction executed MOV. B R1L, @-ER7 SP set to H'FFFEFF Legend: CCR : Condition code register PC : Program counter R1L : General register R1L SP : Stack pointer Data saved above SP CCR contents lost Note: The diagram illustrates modes 3 to 5. Figure 4.7 Operation when SP Value is Odd 95 96 Section 5 Interrupt Controller 5.1 5.1.1 Overview Features The interrupt controller has the following features: * Interrupt priority registers (IPRs) for setting interrupt priorities Interrupts other than NMI can be assigned to two priority levels on a module-by-module basis in interrupt priority registers A and B (IPRA and IPRB). * Three-level enabling/disabling by the I and UI bits in the CPU's condition code register (CCR) and the UE bit in the system control register (SYSCR) * Seven external interrupt pins NMI has the highest priority and is always accepted*; either the rising or falling edge can be selected. For each of IRQ0 to IRQ5, sensing of the falling edge or level sensing can be selected independently. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.6.4, NMI Input Disabling Conditions. 97 5.1.2 Block Diagram Figure 5.1 shows a block diagram of the interrupt controller. CPU ISCR NMI input IRQ input OVF TME . . . . . . . TEI TEIE IRQ input section ISR Priority decision logic IER IPRA, IPRB Interrupt request Vector number . . . I Interrupt controller UE Legend: ISCR : IER : ISR : IPRA : IPRB : SYSCR : SYSCR IRQ sense control register IRQ enable register IRQ status register Interrupt priority register A Interrupt priority register B System control register UI CCR Figure 5.1 Interrupt Controller Block Diagram 98 5.1.3 Pin Configuration Table 5.1 lists the interrupt pins. Table 5.1 Name Nonmaskable interrupt External interrupt request 5 to 0 Interrupt Pins Abbreviation I/O NMI IRQ5 to IRQ0 Function Input Nonmaskable interrupt * , rising edge or falling edge selectable Input Maskable interrupts, falling edge or level sensing selectable Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.6.4, NMI Input Disable Conditions. 5.1.4 Register Configuration Table 5.2 lists the registers of the interrupt controller. Table 5.2 Address* 1 H'EE012 H'EE014 H'EE015 H'EE016 H'EE018 H'EE019 Interrupt Controller Registers Name System control register IRQ sense control register IRQ enable register IRQ status register Interrupt priority register A Interrupt priority register B Abbreviation SYSCR ISCR IER ISR IPRA IPRB R/W R/W R/W R/W R/(W)* R/W R/W 2 Initial Value H'09 H'00 H'00 H'00 H'00 H'00 Notes: *1 Lower 20 bits of the address in advanced mode *2 Only 0 can be written, to clear flags. 5.2 5.2.1 Register Descriptions System Control Register (SYSCR) SYSCR is an 8-bit readable/writable register that controls software standby mode, selects the action of the UI bit in CCR, selects the NMI edge, and enables or disables the on-chip RAM. Only bits 3 and 2 are described here. For the other bits, see section 3.3, System Control Register (SYSCR). 99 SYSCR is initialized to H'09 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit Initial value Read/Write 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 SSOE 0 R/W 0 RAME 1 R/W RAM enable Software standby output port enable Standby timer select 2 to 0 Software standby NMI edge select Selects the NMI input edge User bit enable Selects whether to use the UI bit in CCR as a user bit or interrupt mask bit Bit 3--User Bit Enable (UE): Selects whether to use the UI bit in CCR as a user bit or an interrupt mask bit. Bit 3 UE 0 1 Description UI bit in CCR is used as interrupt mask bit UI bit in CCR is used as user bit (Initial value) Bit 2--NMI Edge Select (NMIEG): Selects the NMI input edge. Bit 2 NMIEG 0 1 Description Interrupt is requested at falling edge of NMI input Interrupt is requested at rising edge of NMI input (Initial value) 5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB) IPRA and IPRB are 8-bit readable/writable registers that control interrupt priority. 100 Interrupt Priority Register A (IPRA): IPRA is an 8-bit readable/writable register in which interrupt priority levels can be set. Bit Initial value Read/Write 7 IPRA7 0 R/W 6 IPRA6 0 R/W 5 IPRA5 0 R/W 4 IPRA4 0 R/W 3 IPRA3 0 R/W 2 IPRA2 0 R/W 1 IPRA1 0 R/W 0 IPRA0 0 R/W Priority level A0 Selects the priority level of 16-bit timer channel 2 interrupt requests Priority level A1 Selects the priority level of 16-bit timer channel 1 interrupt requests Priority level A2 Selects the priority level of 16-bit timer channel 0 interrupt requests Priority level A3 Selects the priority level of WDT, and A/D converter interrupt requests Priority level A4 Selects the priority level of IRQ4 and IRQ 5 interrupt requests Priority level A5 Selects the priority level of IRQ 2 and IRQ 3 interrupt requests Priority level A6 Selects the priority level of IRQ1 interrupt requests Priority level A7 Selects the priority level of IRQ 0 interrupt requests IPRA is initialized to H'00 by a reset and in hardware standby mode. 101 Bit 7--Priority Level A7 (IPRA7): Selects the priority level of IRQ 0 interrupt requests. Bit 7 IPRA7 0 1 Description IRQ0 interrupt requests have priority level 0 (low priority) IRQ0 interrupt requests have priority level 1 (high priority) (Initial value) Bit 6--Priority Level A6 (IPRA6): Selects the priority level of IRQ 1 interrupt requests. Bit 6 IPRA6 0 1 Description IRQ1 interrupt requests have priority level 0 (low priority) IRQ1 interrupt requests have priority level 1 (high priority) (Initial value) Bit 5--Priority Level A5 (IPRA5): Selects the priority level of IRQ 2 and IRQ 3 interrupt requests. Bit 5 IPRA5 0 1 Description IRQ2 and IRQ3 interrupt requests have priority level 0 (low priority) IRQ2 and IRQ3 interrupt requests have priority level 1 (high priority) (Initial value) Bit 4--Priority Level A4 (IPRA4): Selects the priority level of IRQ 4 and IRQ 5 interrupt requests. Bit 4 IPRA4 0 1 Description IRQ4 and IRQ5 interrupt requests have priority level 0 (low priority) IRQ4 and IRQ5 interrupt requests have priority level 1 (high priority) (Initial value) Bit 3--Priority Level A3 (IPRA3): Selects the priority level of WDT, and A/D converter interrupt requests. Bit 3 IPRA3 0 1 Description WDT, and A/D converter interrupt requests have priority level 0 (low priority) (Initial value) WDT, and A/D converter interrupt requests have priority level 1 (high priority) 102 Bit 2--Priority Level A2 (IPRA2): Selects the priority level of 16-bit timer channel 0 interrupt requests. Bit 2 IPRA2 0 1 Description 16-bit timer channel 0 interrupt requests have priority level 0 (low priority) (Initial value) 16-bit timer channel 0 interrupt requests have priority level 1 (high priority) Bit 1--Priority Level A1 (IPRA1): Selects the priority level of 16-bit timer channel 1 interrupt requests. Bit 1 IPRA1 0 1 Description 16-bit timer channel 1 interrupt requests have priority level 0 (low priority) (Initial value) 16-bit timer channel 1 interrupt requests have priority level 1 (high priority) Bit 0--Priority Level A0 (IPRA0): Selects the priority level of 16-bit timer channel 2 interrupt requests. Bit 0 IPRA0 0 1 Description 16-bit timer channel 2 interrupt requests have priority level 0 (low priority) (Initial value) 16-bit timer channel 2 interrupt requests have priority level 1 (high priority) 103 Interrupt Priority Register B (IPRB): IPRB is an 8-bit readable/writable register in which interrupt priority levels can be set. Bit Initial value Read/Write 7 IPRB7 0 R/W 6 IPRB6 0 R/W 5 -- 0 R/W 4 -- 0 R/W 3 IPRB3 0 R/W 2 IPRB2 0 R/W 1 -- 0 R/W 0 -- 0 R/W Reserved bit Priority level B2 Selects the priority level of SCI channel 1 interrupt requests Priority level B3 Selects the priority level of SCI channel 0 interrupt requests Reserved bit Priority level B6 Selects the priority level of 8-bit timer channel 2, 3 interrupt requests Priority level B7 Selects the priority level of 8-bit timer channel 0, 1 interrupt requests IPRB is initialized to H'00 by a reset and in hardware standby mode. Bit 7--Priority Level B7 (IPRB7): Selects the priority level of 8-bit timer channel 0, 1 interrupt requests. Bit 7 IPRB7 0 1 Description 8-bit timer channel 0 and 1 interrupt requests have priority level 0 (low priority) (Initial value) 8-bit timer channel 0 and 1 interrupt requests have priority level 1 (high priority) 104 Bit 6--Priority Level B6 (IPRB6): Selects the priority level of 8-bit timer channel 2, 3 interrupt requests. Bit 6 IPRB6 0 1 Description 8-bit timer channel 2 and 3 interrupt requests have priority level 0 (low priority) (Initial value) 8-bit timer channel 2 and 3 interrupt requests have priority level 1 (high priority) Bits 5 and 4--Reserved: This bit can be written and read, but it does not affect interrupt priority. Bit 3--Priority Level B3 (IPRB3): Selects the priority level of SCI channel 0 interrupt requests. Bit 3 IPRB3 0 1 Description SCI0 channel 0 interrupt requests have priority level 0 (low priority) SCI0 channel 0 interrupt requests have priority level 1 (high priority) (Initial value) Bit 2--Priority Level B2 (IPRB2): Selects the priority level of SCI channel 1 interrupt requests. Bit 2 IPRB2 0 1 Description SCI1 channel 1 interrupt requests have priority level 0 (low priority) SCI1 channel 1 interrupt requests have priority level 1 (high priority) (Initial value) Bits 1 and 0--Reserved: This bit can be written and read, but it does not affect interrupt priority. 5.2.3 IRQ Status Register (ISR) ISR is an 8-bit readable/writable register that indicates the status of IRQ0 to IRQ5 interrupt requests. 105 Bit Initial value Read/Write 7 -- 0 -- 6 -- 0 -- 5 IRQ5F 0 R/(W)* 4 IRQ4F 0 R/(W)* 3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)* 1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)* Reserved bits IRQ 5 to IRQ0 flags These bits indicate IRQ 5 to IRQ 0 flag interrupt request status Note: * Only 0 can be written, to clear flags. ISR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6--Reserved: These bits can not be modified and are always read as 0. Bits 5 to 0--IRQ5 to IRQ0 Flags (IRQ5F to IRQ0F): These bits indicate the status of IRQ5 to IRQ0 interrupt requests. Bits 5 to 0 IRQ5F to IRQ0F Description 0 [Clearing conditions] (Initial value) 0 is written in IRQnF after reading the IRQnF flag when IRQnF = 1. IRQnSC = 0, IRQn input is high, and interrupt exception handling is carried out. IRQnSC = 1 and IRQn interrupt exception handling is carried out. [Setting conditions] IRQnSC = 0 and IRQn input is low. IRQnSC = 1 and IRQn input changes from high to low. 1 Note: n = 5 to 0 5.2.4 IRQ Enable Register (IER) IER is an 8-bit readable/writable register that enables or disables IRQ5 to IRQ0 interrupt requests. Bit Initial value Read/Write 7 -- 0 R/W 6 -- 0 R/W 5 IRQ5E 0 R/W 4 IRQ4E 0 R/W 3 IRQ3E 0 R/W 2 IRQ2E 0 R/W 1 IRQ1E 0 R/W 0 IRQ0E 0 R/W Reserved bits IRQ 5 to IRQ0 enable These bits enable or disable IRQ 5 to IRQ 0 interrupts IER is initialized to H'00 by a reset and in hardware standby mode. 106 Bits 7 and 6--Reserved: These bits can be written and read, but they do not enable or disable interrupts. Bits 5 to 0--IRQ5 to IRQ0 Enable (IRQ5E to IRQ0E): These bits enable or disable IRQ5 to IRQ0 interrupts. Bits 5 to 0 IRQ5E to IRQ0E Description 0 1 IRQ5 to IRQ 0 interrupts are disabled IRQ5 to IRQ 0 interrupts are enabled (Initial value) 5.2.5 IRQ Sense Control Register (ISCR) ISCR is an 8-bit readable/writable register that selects level sensing or falling-edge sensing of the inputs at pins IRQ5 to IRQ0. Bit Initial value Read/Write 7 -- 0 R/W 6 -- 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Reserved bits IRQ 5 to IRQ0 sense control These bits select level sensing or falling-edge sensing for IRQ 5 to IRQ 0 interrupts ISCR is initialized to H'00 by a reset and in hardware standby mode. Bits 7 and 6--Reserved: These bits can be written and read, but they do not select level or falling-edge sensing. Bits 5 to 0--IRQ5 to IRQ0 Sense Control (IRQ5SC to IRQ0SC): These bits select whether interrupts IRQ5 to IRQ0 are requested by level sensing of pins IRQ5 to IRQ0, or by falling-edge sensing. Bits 5 to 0 IRQ5SC to IRQ0SC Description 0 1 Interrupts are requested when IRQ5 to IRQ0 inputs are low Interrupts are requested by falling-edge input at IRQ5 to IRQ0 (Initial value) 107 5.3 Interrupt Sources The interrupt sources include external interrupts (NMI, IRQ0 to IRQ5) and 27 internal interrupts. 5.3.1 External Interrupts There are seven external interrupts: NMI, and IRQ0 to IRQ5. Of these, NMI, IRQ0, IRQ1, and IRQ2 can be used to exit software standby mode. NMI: NMI is the highest-priority interrupt and is always accepted, regardless of the states of the I and UI bits in CCR*. The NMIEG bit in SYSCR selects whether an interrupt is requested by the rising or falling edge of the input at the NMI pin. NMI interrupt exception handling has vector number 7. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.6.4, NMI Input Disable Conditions. IRQ0 to IRQ5 Interrupts: These interrupts are requested by input signals at pins IRQ0 to IRQ5. The IRQ0 to IRQ5 interrupts have the following features. * ISCR settings can select whether an interrupt is requested by the low level of the input at pins IRQ0 to IRQ5, or by the falling edge. * IER settings can enable or disable the IRQ0 to IRQ5 interrupts. Interrupt priority levels can be assigned by four bits in IPRA (IPRA7 to IPRA4). * The status of IRQ0 to IRQ5 interrupt requests is indicated in ISR. The ISR flags can be cleared to 0 by software. Figure 5.2 shows a block diagram of interrupts IRQ0 to IRQ5. IRQnSC IRQnF Edge/level sense circuit IRQn input S R Clear signal Note: n = 5 to 0 Q IRQn interrupt request IRQnE Figure 5.2 Block Diagram of Interrupts IRQ0 to IRQ5 108 Figure 5.3 shows the timing of the setting of the interrupt flags (IRQnF). IRQn input pin IRQnF Note: n = 5 to 0 Figure 5.3 Timing of Setting of IRQnF Interrupts IRQ 0 to IRQ5 have vector numbers 12 to 17. These interrupts are detected regardless of whether the corresponding pin is set for input or output. When using a pin for external interrupt input, clear its DDR bit to 0 and do not use the pin for chip select output, SCI input/output, or A/D external trigger input. 5.3.2 Internal Interrupts 27 internal interrupts are requested from the on-chip supporting modules. * Each on-chip supporting module has status flags for indicating interrupt status, and enable bits for enabling or disabling interrupts. * Interrupt priority levels can be assigned in IPRA and IPRB. 5.3.3 Interrupt Exception Handling Vector Table Table 5.3 lists the interrupt exception handling sources, their vector addresses, and their default priority order. In the default priority order, smaller vector numbers have higher priority. The priority of interrupts other than NMI can be changed in IPRA and IPRB. The priority order after a reset is the default order shown in table 5.3. 109 Table 5.3 Interrupt Sources, Vector Addresses, and Priority Vector Address* Vector Number Advanced Mode Normal Mode 7 12 13 14 15 16 17 -- Watchdog timer -- A/D 18 19 20 21 22 23 Interrupt Source NMI IRQ0 IRQ1 IRQ2 IRQ3 IRQ4 IRQ5 Reserved WOVI (interval timer) Reserved ADI (A/D end) IMIA0 (compare match/ input capture A0) IMIB0 (compare match/ input capture B0) OVI0 (overflow 0) Reserved IMIA1 (compare match/ inputcapture A1) IMIB1 (compare match/ input capture B1) OVI1 (overflow 1) Reserved Origin External pins IPR Priority High H'001C to H'001F H'000E to H'000F -- H'0030 to H'0033 H'0034 to H0037 H'0018 to H'0019 IPRA7 H'001A to H'001B IPRA6 H'0038 to H'003B H'001C to H'001D IPRA5 H'003C to H'003F H'001E to H'001F H'0040 to H'0043 H'0044 to H'0047 H'0020 to H'0021 H'0022 to H'0023 IPRA4 H'0048 to H'004B H'0024 to H'0025 H'004C to H'004F H'0026 to H'0027 H'0050 to H'0053 H'0028 to H'0029 IPRA3 H'0054 to H'0057 H'002A to H'002B H'0058 to H'005B H'002C to H'002D H'005C to H'005F H'002E to H'002F H'0060 to H'0063 H'0030 to H'0031 IPRA2 16-bit timer 24 channel 0 25 H'0064 to H'0067 H'0032 to H'0033 26 -- 27 H'0068 to H'006B H'0034 to H'0035 H'006C to H'006F H'0036 to H'0037 H'0070 to H'0073 H'0038 to H'0039 IPRA1 16-bit timer 28 channel 1 29 H'0074 to H'0077 H'003A to H'003B 30 -- 31 H'0078 to H'007B H'003C to H'003D H'007C to H'007F H'003E to H'003F Low 110 Interrupt Source IMIA2 (compare match/ input capture A2) IMIB2 (compare match/ input capture B2) OVI2 (overflow 2) Reserved CMIA0 (compare match A0) CMIB0 (compare match B0) CMIA1/CMIB1 (compare match A1/B1) TOVI0/TOVI1 (overflow 0/1) CMIA2 (compare match A2) CMIB2 (compare match B2) CMIA3/CMIB3 (compare match A3/B3) TOVI2/TOVI3 (overflow 2/3) Reserved Origin Vector Address* Vector Number Advanced Mode Normal Mode H'0080 to H'0083 H'0040 to H'0041 IPR IPRA0 Priority High 16-bit timer 32 channel 2 33 H'0084 to H'0087 H'0042 to H'0043 34 -- 35 H'0088 to H'008B H'0044 to H'0045 H'008C to H'008F H'0046 to H'0047 H'0090 to H'0093 H'0048 to H'0049 IPRB7 8-bit timer 36 channel 0/1 37 H'0094 to H'0097 H'004A to H'004B 38 H'0098 to H'009B H'004C to H'004D 39 8-bit timer 40 channel 2/3 41 H'009C to H'009F H'004E to H'004F H'00A0 to H'00A3 H'0050 to H'0051 IPRB6 H'00A4 to H'00A7 H'0052 to H'0053 42 H'00A8 to H'00AB H'0054 to H'0055 43 -- 44 45 46 47 48 49 50 51 H'00AC to H'00AF H'0056 to H'0057 H'00B0 to H'00B3 H'00B4 to H'00B7 H'00B8 to H'00BB H'00BC to H'00BF H'00C0 to H'00C3 H'00C4 to H'00C7 H'00C8 to H'00CB H'00CC to H'00CF H'0058 to H'0059 -- H'005A to H'005B H'005C to H'005D H'005E to H'005F H'0060 to H'0061 H'0062 to H'0063 H'0064 to H'0065 H'0066 to H'0067 Low 111 Interrupt Source ERI0 (receive error 0) RXI0 (receive data full 0) TXI0 (transmit data empty 0) TEI0 (transmit end 0) ERI1 (receive error 1) RXI1 (receive data full 1) TXI1 (transmit data empty 1) TEI1 (transmit end 1) Reserved Origin SCI channel 0 Vector Address* Vector Number Advanced Mode Normal Mode 52 53 54 55 H'00D0 to H'00D3 H'0068 to H'0069 H'00D4 to H'00D7 H'006A to H'006B H'00D8 to H'00DB H'006C to H'006D H'00DC to H'00DF H'006E to H'006F H'00E0 to H'00E3 H'0070 to H'0071 H'00E4 to H'00E7 H'0072 to H'0073 H'00E8 to H'00EB H'0074 to H'0075 H'00EC to H'00EF H'0076 to H'0077 H'00F0 to H'00F3 H'0078 to H'0079 H'00F4 to H'00F7 H'007A to H'007B H'00F8 to H'00FB H'007C to H'007D H'00FC to H'00FF H'007E to H'007F IPR IPRB3 Priority High SCI channel 1 56 57 58 59 IPRB2 -- 60 61 62 63 -- Low Note: * Lower 16 bits of the address 112 5.4 5.4.1 Interrupt Operation Interrupt Handling Process The H8/3062 Series handles interrupts differently depending on the setting of the UE bit. When UE = 1, interrupts are controlled by the I bit. When UE = 0, interrupts are controlled by the I and UI bits. Table 5.4 indicates how interrupts are handled for all setting combinations of the UE, I, and UI bits. NMI interrupts are always accepted except in the reset and hardware standby states*. IRQ interrupts and interrupts from the on-chip supporting modules have their own enable bits. Interrupt requests are ignored when the enable bits are cleared to 0. Note: * In the versions with on-chip flash memory, NMI input is sometimes disabled. For details see 17.6.4, NMI Input Disable Conditions. Table 5.4 SYSCR UE 1 I 0 1 0 0 1 UE, I, and UI Bit Settings and Interrupt Handling CCR UI -- -- -- 0 1 Description All interrupts are accepted. Interrupts with priority level 1 have higher priority. No interrupts are accepted except NMI. All interrupts are accepted. Interrupts with priority level 1 have higher priority. NMI and interrupts with priority level 1 are accepted. No interrupts are accepted except NMI. UE = 1: Interrupts IRQ0 to IRQ5 and interrupts from the on-chip supporting modules can all be masked by the I bit in the CPU's CCR. Interrupts are masked when the I bit is set to 1, and unmasked when the I bit is cleared to 0. Interrupts with priority level 1 have higher priority. Figure 5.4 is a flowchart showing how interrupts are accepted when UE = 1. 113 Program execution state No Interrupt requested? Yes Yes NMI No No Priority level 1? Yes No No Pending IRQ 0 Yes IRQ 0 No Yes IRQ 1 Yes IRQ 1 Yes No TEI1 Yes TEI1 Yes No I=0 Yes Save PC and CCR I 1 Read vector address Branch to interrupt service routine Figure 5.4 Process Up to Interrupt Acceptance when UE = 1 114 * If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. * When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending. If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt controller follows the priority order shown in table 5.3. * The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request is accepted. If the I bit is set to 1, only NMI is accepted; other interrupt requests are held pending. * When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. * In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is saved indicates the address of the first instruction that will be executed after the return from the interrupt service routine. * Next the I bit is set to 1 in CCR, masking all interrupts except NMI. * The vector address of the accepted interrupt is generated, and the interrupt service routine starts executing from the address indicated by the contents of the vector address. UE = 0: The I and UI bits in the CPU's CCR and the IPR bits enable three-level masking of IRQ0 to IRQ5 interrupts and interrupts from the on-chip supporting modules. * Interrupt requests with priority level 0 are masked when the I bit is set to 1, and are unmasked when the I bit is cleared to 0. * Interrupt requests with priority level 1 are masked when the I and UI bits are both set to 1, and are unmasked when either the I bit or the UI bit is cleared to 0. For example, if the interrupt enable bits of all interrupt requests are set to 1, IPRA is set to H'20, and IPRB is set to H'00 (giving IRQ2 and IRQ 3 interrupt requests priority over other interrupts), interrupts are masked as follows: a. If I = 0, all interrupts are unmasked (priority order: NMI > IRQ2 > IRQ3 >IRQ0 ...). b. If I = 1 and UI = 0, only NMI, IRQ2, and IRQ3 are unmasked. c. If I = 1 and UI = 1, all interrupts are masked except NMI. Figure 5.5 shows the transitions among the above states. 115 I0 a. All interrupts are unmasked I 1, UI 0 b. Only NMI, IRQ 2 , and IRQ 3 are unmasked I0 Exception handling, or I 1, UI 1 UI 0 Exception handling, or UI 1 c. All interrupts are masked except NMI Figure 5.5 Interrupt Masking State Transitions (Example) Figure 5.6 is a flowchart showing how interrupts are accepted when UE = 0. * If an interrupt condition occurs and the corresponding interrupt enable bit is set to 1, an interrupt request is sent to the interrupt controller. * When the interrupt controller receives one or more interrupt requests, it selects the highestpriority request, following the IPR interrupt priority settings, and holds other requests pending. If two or more interrupts with the same IPR setting are requested simultaneously, the interrupt controller follows the priority order shown in table 5.3. * The interrupt controller checks the I bit. If the I bit is cleared to 0, the selected interrupt request is accepted regardless of its IPR setting, and regardless of the UI bit. If the I bit is set to 1 and the UI bit is cleared to 0, only interrupts with priority level 1 are accepted; interrupt requests with priority level 0 are held pending. If the I bit and UI bit are both set to 1, all other interrupt requests are held pending. * When an interrupt request is accepted, interrupt exception handling starts after execution of the current instruction has been completed. * In interrupt exception handling, PC and CCR are saved to the stack area. The PC value that is saved indicates the address of the first instruction that will be executed after the return from the interrupt service routine. * The I and UI bits are set to 1 in CCR, masking all interrupts except NMI. * The vector address of the accepted interrupt is generated, and the interrupt service routine starts executing from the address indicated by the contents of the vector address. 116 Program execution state No Interrupt requested? Yes Yes NMI No No Priority level 1? Yes No No Pending IRQ 0 Yes IRQ 0 No Yes IRQ 1 Yes IRQ 1 Yes No TEI1 Yes TEI1 Yes No I=0 Yes No UI = 0 Yes I=0 Yes No Save PC and CCR I 1, UI 1 Read vector address Branch to interrupt service routine Figure 5.6 Process Up to Interrupt Acceptance when UE = 0 117 118 Interrupt accepted Instruction Internal prefetch processing Stack Vector fetch Prefetch of interrupt Internal service routine processing instruction (1) (3) (5) (7) (9) (11) (13) High (2) (4) (6) (8) (10) (12) (14) (6), (8) : PC and CCR saved to stack (9), (11) : Vector address (10), (12) : Starting address of interrupt service routine (contents of vector address) (13) : Starting address of interrupt service routine; (13) = (10), (12) (14) : First instruction of interrupt service routine 5.4.2 Interrupt level decision and wait for end of instruction Interrupt request signal Address bus Interrupt Exception Handling Sequence RD HWR , LWR D15 to D8 Figure 5.7 shows the interrupt exception handling sequence in mode 2 when the program code and stack are in an external memory area accessed in two states via a 16-bit bus. Figure 5.7 Interrupt Exception Handling Sequence (1) : Instruction prefetch address (not executed; return address, same as PC contents) (2), (4) : Instruction code (not executed) (3) : Instruction prefetch address (not executed) (5) : SP - 2 (7) : SP - 4 Note: Mode 2, with program code and stack in external memory area accessed in two states via 16-bit bus. 5.4.3 Interrupt Response Time Table 5.5 indicates the interrupt response time from the occurrence of an interrupt request until the first instruction of the interrupt service routine is executed. Table 5.5 Interrupt Response Time External Memory On-Chip Memory 2* 1 1 to 23 8-Bit Bus 2 States 2* 1 1 to 27 3 States 2* 1 1 to 31 * 4 16-Bit Bus 2 States 2* 1 1 to 23 3 States 2* 1 1 to 25 * 4 No. 1 2 Item Interrupt priority decision Maximum number of states until end of current instruction Saving PC and CCR to stack Vector fetch Instruction fetch * 2 Internal processing* 3 3 4 5 6 Total 4 4 4 4 19 to 41 8 8 8 4 31 to 57 12* 4 12* 4 12* 4 4 43 to 73 4 4 4 4 19 to 41 6* 4 6* 4 6* 4 4 25 to 49 Notes: *1 1 state for internal interrupts *2 Prefetch after the interrupt is accepted and prefetch of the first instruction in the interrupt service routine *3 Internal processing after the interrupt is accepted and internal processing after vector fetch *4 The number of states increases if wait states are inserted in external memory access. 119 5.5 5.5.1 Usage Notes Contention between Interrupt and Interrupt-Disabling Instruction When an instruction clears an interrupt enable bit to 0 to disable the interrupt, the interrupt is not disabled until after execution of the instruction is completed. If an interrupt occurs while a BCLR, MOV, or other instruction is being executed to clear its interrupt enable bit to 0, at the instant when execution of the instruction ends the interrupt is still enabled, so its interrupt exception handling is carried out. If a higher-priority interrupt is also requested, however, interrupt exception handling for the higher-priority interrupt is carried out, and the lower-priority interrupt is ignored. This also applies to the clearing of an interrupt flag to 0. Figure 5.8 shows an example in which an IMIEA bit is cleared to 0 in the 16-bit timer's TISRA register. TISRA write cycle by CPU Internal address bus Internal write signal IMIEA IMIA exception handling TISRA address IMIA IMFA interrupt signal Figure 5.8 Contention between Interrupt and Interrupt-Disabling Instruction This type of contention will not occur if the interrupt is masked when the interrupt enable bit or flag is cleared to 0. 120 5.5.2 Instructions that Inhibit Interrupts The LDC, ANDC, ORC, and XORC instructions inhibit interrupts. When an interrupt occurs, after determining the interrupt priority, the interrupt controller requests a CPU interrupt. If the CPU is currently executing one of these interrupt-inhibiting instructions, however, when the instruction is completed the CPU always continues by executing the next instruction. 5.5.3 Interrupts during EEPMOV Instruction Execution The EEPMOV.B and EEPMOV.W instructions differ in their reaction to interrupt requests. When the EEPMOV.B instruction is executing a transfer, no interrupts are accepted until the transfer is completed, not even NMI. When the EEPMOV.W instruction is executing a transfer, interrupt requests other than NMI are not accepted until the transfer is completed. If NMI is requested, NMI exception handling starts at a transfer cycle boundary. The PC value saved on the stack is the address of the next instruction. Programs should be coded as follows to allow for NMI interrupts during EEPMOV.W execution: L1: EEPMOV.W MOV.W R4,R4 BNE L1 121 122 Section 6 Bus Controller 6.1 Overview The H8/3062 Series has an on-chip bus controller (BSC) that manages the external address space divided into eight areas. The bus specifications, such as bus width and number of access states, can be set independently for each area, enabling multiple memories to be connected easily. The bus controller also has a bus arbitration function that controls the operation of the internal bus masters--the CPU can release the bus to an external device. 6.1.1 Features The features of the bus controller are listed below. * Manages external address space in area units Manages the external space as eight areas (0 to 7) of 128 kbytes in 1-Mbyte modes, or 2 Mbytes in 16-Mbyte modes Bus specifications can be set independently for each area * Basic bus interface Chip select (CS0 to CS7) can be output for areas 0 to 7 8-bit access or 16-bit access can be selected for each area Two-state access or three-state access can be selected for each area Program wait states can be inserted for each area Pin wait insertion capability is provided * Idle cycle insertion An idle cycle can be inserted in case of an external read cycle between different areas An idle cycle can be inserted when an external read cycle is immediately followed by an external write cycle * Bus arbitration function A built-in bus arbiter grants the bus right to the CPU, or an external bus master * Other features Choice of two address update modes (except H8/3062F-ZTAT) 123 6.1.2 Block Diagram Figure 6.1 shows a block diagram of the bus controller. CS0 to CS7 ABWCR ASTCR BCR Internal address bus Area decoder Chip select control signals CSCR ADRCR Bus control circuit Internal data bus Internal signals Bus mode control signal Bus size control signal Access state control signal Wait request signal WAIT Wait state controller WCRH WCRL Internal signals CPU bus request signal CPU bus acknowledge signal BRCR Bus arbiter BACK Legend: ABWCR ASTCR WCRH WCRL BRCR CSCR ADRCR* BCR : : : : : : : : Bus width control register Access state control register Wait control register H Wait control register L Bus release control register Chip select control register Address control register Bus control register BREQ Note: * This register is not provided in the H8/3062F-ZTAT. Figure 6.1 Block Diagram of Bus Controller 124 6.1.3 Pin Configuration Table 6.1 summarizes the input/output pins of the bus controller. Table 6.1 Name Chip select 0 to 7 Address strobe Read High write Bus Controller Pins Abbreviation CS 0 to CS 7 AS RD HWR I/O Output Output Output Output Function Strobe signals selecting areas 0 to 7 Strobe signal indicating valid address output on the address bus Strobe signal indicating reading from the external address space Strobe signal indicating writing to the external address space, with valid data on the upper data bus (D 15 to D8) Strobe signal indicating writing to the external address space, with valid data on the lower data bus (D 7 to D0) Wait request signal for access to external three-state access areas Request signal for releasing the bus to an external device Acknowledge signal indicating release of the bus to an external device Low write LWR Output Wait Bus request Bus acknowledge WAIT BREQ BACK Input Input Output 125 6.1.4 Register Configuration Table 6.2 summarizes the bus controller's registers. Table 6.2 Address* 1 H'EE020 H'EE021 H'EE022 H'EE023 H'EE013 H'EE01F H'EE01E H'EE024 Notes: *1 *2 *3 *4 Bus Controller Registers Name Bus width control register Access state control register Wait control register H Wait control register L Bus release control register Chip select control register Address control register* Bus control register 4 Abbreviation ABWCR ASTCR WCRH WCRL BRCR CSCR ADRCR BCR R/W R/W R/W R/W R/W R/W R/W R/W R/W Initial Value H'FF* 2 H'FF H'FF H'FF H'FE * 3 H'0F H'FF H'C6 Lower 20 bits of the address in advanced mode In modes 2 and 4, the initial value is H'00. In modes 3 and 4, the initial value is H'EE. This register is not provided in the H8/3062F-ZTAT. 6.2 6.2.1 Register Descriptions Bus Width Control Register (ABWCR) ABWCR is an 8-bit readable/writable register that selects 8-bit or 16-bit access for each area. Bit 7 ABW7 Modes Initial value 1 1, 3, 5, 6, and 7 Read/Write R/W Modes Initial value 0 2 and 4 Read/Write R/W 6 ABW6 1 R/W 0 R/W 5 ABW5 1 R/W 0 R/W 4 ABW4 1 R/W 0 R/W 3 ABW3 1 R/W 0 R/W 2 ABW2 1 R/W 0 R/W 1 ABW1 1 R/W 0 R/W 0 ABW0 1 R/W 0 R/W When ABWCR contains H'FF (selecting 8-bit access for all areas), the chip operates in 8-bit bus mode: the upper data bus (D 15 to D8) is valid, and port 4 is an input/output port. When at least one bit is cleared to 0 in ABWCR, the chip operates in 16-bit bus mode with a 16-bit data bus (D15 to D0). In modes 1, 3, 5, 6, and 7, ABWCR is initialized to H'FF by a reset and in hardware standby mode. In modes 2 and 4, ABWCR is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. 126 Bits 7 to 0--Area 7 to 0 Bus Width Control (ABW7 to ABW0): These bits select 8-bit access or 16-bit access for the corresponding areas. Bits 7 to 0 ABW7 to ABW0 0 1 Description Areas 7 to 0 are 16-bit access areas Areas 7 to 0 are 8-bit access areas ABWCR specifies the data bus width of external memory areas. The data bus width of on-chip memory and registers is fixed, and does not depend on ABWCR settings. These settings are therefore invalid in the single-chip modes (modes 6 and 7). 6.2.2 Access State Control Register (ASTCR) ASTCR is an 8-bit readable/writable register that selects whether each area is accessed in two states or three states. Bit 7 AST7 Initial value Read/Write 1 R/W 6 AST6 1 R/W 5 AST5 1 R/W 4 AST4 1 R/W 3 AST3 1 R/W 2 AST2 1 R/W 1 AST1 1 R/W 0 AST0 1 R/W Bits selecting number of states for access to each area ASTCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Area 7 to 0 Access State Control (AST7 to AST0): These bits select whether the corresponding area is accessed in two or three states. Bits 7 to 0 AST7 to AST0 0 1 Description Areas 7 to 0 are accessed in two states Areas 7 to 0 are accessed in three states (Initial value) ASTCR specifies the number of states in which external areas are accessed. On-chip memory and registers are accessed in a fixed number of states that does not depend on ASTCR settings. These settings are therefore meaningless in the single-chip modes (modes 6 and 7). 127 6.2.3 Wait Control Registers H and L (WCRH, WCRL) WCRH and WCRL are 8-bit readable/writable registers that select the number of program wait states for each area. On-chip memory and registers are accessed in a fixed number of states that does not depend on WCRH/WCRL settings. WCRH and WCRL are initialized to H'FF by a reset and in hardware standby mode. They are not initialized in software standby mode. WCRH Bit 7 W71 Initial value Read/Write 1 R/W 6 W70 1 R/W 5 W61 1 R/W 4 W60 1 R/W 3 W51 1 R/W 2 W50 1 R/W 1 W41 1 R/W 0 W40 1 R/W Bits 7 and 6--Area 7 Wait Control 1 and 0 (W71, W70): These bits select the number of program wait states when area 7 in external space is accessed while the AST7 bit in ASTCR is set to 1. Bit 7 W71 0 Bit 6 W70 0 1 1 0 1 Description Program wait not inserted when external space area 7 is accessed 1 program wait state inserted when external space area 7 is accessed 2 program wait states inserted when external space area 7 is accessed 3 program wait states inserted when external space area 7 is accessed (Initial value) 128 Bits 5 and 4--Area 6 Wait Control 1 and 0 (W61, W60): These bits select the number of program wait states when area 6 in external space is accessed while the AST6 bit in ASTCR is set to 1. Bit 5 W61 0 Bit 4 W60 0 1 1 0 1 Description Program wait not inserted when external space area 6 is accessed 1 program wait state inserted when external space area 6 is accessed 2 program wait states inserted when external space area 6 is accessed 3 program wait states inserted when external space area 6 is accessed (Initial value) Bits 3 and 2--Area 5 Wait Control 1 and 0 (W51, W50): These bits select the number of program wait states when area 5 in external space is accessed while the AST5 bit in ASTCR is set to 1. Bit 3 W51 0 Bit 2 W50 0 1 1 0 1 Description Program wait not inserted when external space area 5 is accessed 1 program wait state inserted when external space area 5 is accessed 2 program wait states inserted when external space area 5 is accessed 3 program wait states inserted when external space area 5 is accessed (Initial value) Bits 1 and 0--Area 4 Wait Control 1 and 0 (W41, W40): These bits select the number of program wait states when area 4 in external space is accessed while the AST4 bit in ASTCR is set to 1. Bit 1 W41 0 Bit 0 W40 0 1 1 0 1 Description Program wait not inserted when external space area 4 is accessed 1 program wait state inserted when external space area 4 is accessed 2 program wait states inserted when external space area 4 is accessed 3 program wait states inserted when external space area 4 is accessed (Initial value) 129 WCRL Bit 7 W31 Initial value Read/Write 1 R/W 6 W30 1 R/W 5 W21 1 R/W 4 W20 1 R/W 3 W11 1 R/W 2 W10 1 R/W 1 W01 1 R/W 0 W00 1 R/W Bits 7 and 6--Area 3 Wait Control 1 and 0 (W31, W30): These bits select the number of program wait states when area 3 in external space is accessed while the AST3 bit in ASTCR is set to 1. Bit 7 W31 0 Bit 6 W30 0 1 1 0 1 Description Program wait not inserted when external space area 3 is accessed 1 program wait state inserted when external space area 3 is accessed 2 program wait states inserted when external space area 3 is accessed 3 program wait states inserted when external space area 3 is accessed (Initial value) Bits 5 and 4--Area 2 Wait Control 1 and 0 (W21, W20): These bits select the number of program wait states when area 2 in external space is accessed while the AST2 bit in ASTCR is set to 1. Bit 5 W21 0 Bit 4 W20 0 1 1 0 1 Description Program wait not inserted when external space area 2 is accessed 1 program wait state inserted when external space area 2 is accessed 2 program wait states inserted when external space area 2 is accessed 3 program wait states inserted when external space area 2 is accessed (Initial value) 130 Bits 3 and 2--Area 1 Wait Control 1 and 0 (W11, W10): These bits select the number of program wait states when area 1 in external space is accessed while the AST1 bit in ASTCR is set to 1. Bit 3 W11 0 Bit 2 W10 0 1 1 0 1 Description Program wait not inserted when external space area 1 is accessed 1 program wait state inserted when external space area 1 is accessed 2 program wait states inserted when external space area 1 is accessed 3 program wait states inserted when external space area 1 is accessed (Initial value) Bits 1 and 0--Area 0 Wait Control 1 and 0 (W01, W00): These bits select the number of program wait states when area 0 in external space is accessed while the AST0 bit in ASTCR is set to 1. Bit 1 W01 0 Bit 0 W00 0 1 1 0 1 Description Program wait not inserted when external space area 0 is accessed 1 program wait state inserted when external space area 0 is accessed 2 program wait states inserted when external space area 0 is accessed 3 program wait states inserted when external space area 0 is accessed (Initial value) 131 6.2.4 Bus Release Control Register (BRCR) BRCR is an 8-bit readable/writable register that enables address output on bus lines A23 to A20 and enables or disables release of the bus to an external device. Bit Modes 1, 2, 6, and 7 Initial value 7 A23E 1 Read/Write -- 6 A22E 1 -- 1 R/W 1 R/W 5 A21E 1 -- 1 R/W 1 R/W 4 A20E 1 -- 0 -- 1 R/W 3 -- 1 -- 1 -- 1 -- 2 -- 1 -- 1 -- 1 -- 1 -- 1 -- 1 -- 1 -- 0 BRLE 0 R/W 0 R/W 0 R/W Modes Initial value 1 3 and 4 Read/Write R/W Mode 5 Initial value 1 Read/Write R/W Reserved bits Address 23 to 20 enable These bits enable PA7 to PA4 to be used for A23 to A20 address output Bus release enable Enables or disables release of the bus to an external device BRCR is initialized to H'FE in modes 1, 2, 5, 6, and 7, and to H'EE in modes 3 and 4, by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Address 23 Enable (A23E): Enables PA4 to be used as the A23 address output pin. Writing 0 in this bit enables A23 output from PA4. In modes other than 3, 4, and 5, this bit cannot be modified and PA4 has its ordinary port functions. Bit 7 A23E 0 1 Description PA4 is the A 23 address output pin PA4 is an input/output pin (Initial value) Bit 6--Address 22 Enable (A22E): Enables PA5 to be used as the A22 address output pin. Writing 0 in this bit enables A22 output from PA5. In modes other than 3, 4, and 5, this bit cannot be modified and PA5 has its ordinary port functions. Bit 6 A22E 0 1 Description PA5 is the A 22 address output pin PA5 is an input/output pin (Initial value) 132 Bit 5--Address 21 Enable (A21E): Enables PA6 to be used as the A21 address output pin. Writing 0 in this bit enables A21 output from PA6. In modes other than 3, 4, and 5, this bit cannot be modified and PA6 has its ordinary port functions. Bit 5 A21E 0 1 Description PA6 is the A 21 address output pin PA6 is an input/output pin (Initial value) Bit 4--Address 20 Enable (A20E): Enables PA7 to be used as the A20 address output pin. Writing 0 in this bit enables A20 output from PA7. This bit can only be modified in mode 5. Bit 4 A20E 0 1 Description PA7 is the A 20 address output pin (Initial value when in mode 3 or 4) PA7 is an input/output pin (Initial value when in mode 1, 2, 5, 6 or 7) Bits 3 to 1--Reserved: These bits cannot be modified and are always read as 1. Bit 0--Bus Release Enable (BRLE): Enables or disables release of the bus to an external device. Bit 0 BRLE 0 1 Description The bus cannot be released to an external device BREQ and BACK can be used as input/output pins The bus can be released to an external device (Initial value) 6.2.5 Bit Bus Control Register (BCR) 7 ICIS1 6 ICIS0 1 R/W 5 -- 0* -- 4 -- 0* -- 3 -- 0* -- 2 -- 1 -- 1 RDEA 1 R/W 0 WAITE 0 R/W Initial value Read/Write 1 R/W Note: * 1 must not be written in bits 5 to 3. BCR is an 8-bit readable/writable register that enables or disables idle cycle insertion, selects the area division unit, and enables or disables WAIT pin input. 133 BCR is initialized to H'C6 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7--Idle Cycle Insertion 1 (ICIS1): Selects whether one idle cycle state is to be inserted between bus cycles in case of consecutive external read cycles for different areas. Bit 7 ICIS1 0 1 Description No idle cycle inserted in case of consecutive external read cycles for different areas Idle cycle inserted in case of consecutive external read cycles for different areas (Initial value) Bit 6--Idle Cycle Insertion 0 (ICIS0): Selects whether one idle cycle state is to be inserted between bus cycles in case of consecutive external read and write cycles. Bit 6 ICIS0 0 1 Description No idle cycle inserted in case of consecutive external read and write cycles Idle cycle inserted in case of consecutive external read and write cycles (Initial value) Bits 5 to 3--Reserved (must not be set to 1): These bits can be read and written, but must not be set to 1. Normal operation cannot be guaranteed if 1 is written in these bits. Bit 2--Reserved: Read-only bit, always read as 1. Bit 1--Area Division Unit Select (RDEA): Selects the memory map area division units. This bit is valid in modes 3, 4, and 5, and is invalid in modes 1, 2, 6, and 7. Bit 1 RDEA 0 Description Area divisions are as follows: Area 0: 2 Mbytes Area 1: 2 Mbytes Area 2: 8 Mbytes Area 3: 2 Mbytes 1 Areas 0 to 7 are the same size (2 Mbytes) Area 4: 1.93 Mbytes Area 5: 4 kbytes Area 6: 23.75 kbytes (19.75 kbytes)* Area 7: 22 bytes (Initial value) Note: * Division in the H8/3064F-ZTAT B-mask version. 134 Bit 0--WAIT Pin Enable (WAITE): Enables or disables wait insertion by means of the WAIT pin. Bit 0 WAITE 0 1 Description WAIT pin wait input is disabled, and the WAIT pin can be used as an input/output port (Initial value) WAIT pin wait input is enabled 6.2.6 Chip Select Control Register (CSCR) CSCR is an 8-bit readable/writable register that enables or disables output of chip select signals (CS7 to CS4). If output of a chip select signal CS7 to CS4 is enabled by a setting in this register, the corresponding pin functions a chip select signal (CS7 to CS4) output regardless of any other settings. CSCR cannot be modified in single-chip mode. Bit 7 CS7E Initial value Read/Write 0 R/W 6 CS6E 0 R/W 5 CS5E 0 R/W 4 CS4E 0 R/W 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- Reserved bits 0 -- 1 -- Chip select 7 to 4 enable These bits enable or disable chip select signal output CSCR is initialized to H'0F by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4--Chip Select 7 to 4 Enable (CS7E to CS4E): These bits enable or disable output of the corresponding chip select signal. Bit n CSnE 0 1 Note: n = 7 to 4 Description Output of chip select signal CSn is disabled Output of chip select signal CSn is enabled (Initial value) Bits 3 to 0--Reserved: These bits cannot be modified and are always read as 1. 135 6.2.7 Address Control Register (ADRCR) ADRCR is an 8-bit readable/writable register that selects either address update mode 1 or address update mode 2 as the address output method. Bit 7 -- Initial value Read/Write 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 ADRCTL 1 R/W Reserved bits Address control Selects address update mode 1 or address update mode 2 ADRCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 1--Reserved: Read-only bits, always read as 1. Bit 0--Address Control (ADRCTL): Selects the address output method. Bit 0 ADRCTL 0 1 Description Address update mode 2 is selected Address update mode 1 is selected (Initial value) This register is not provided in the H8/3062F-ZTAT (HD64F3062). If this space is accessed in the H8/3062F-ZTAT (HD64F3062), a write access will be invalid and a read access will always return H'FF. 136 6.3 6.3.1 Operation Area Division The external address space is divided into areas 0 to 7. Each area has a size of 128 kbytes in the 1Mbyte modes, or 2 Mbytes in the 16-Mbyte modes. Figure 6.2 shows a general view of the memory map. H' 00000 Area 0 (128 kbytes) H' 1FFFF H' 20000 Area 1 (128 kbytes) H' 3FFFF H' 40000 Area 2 (128 kbytes) H' 5FFFF H' 60000 Area 3 (128 kbytes) H' 7FFFF H' 80000 Area 4 (128 kbytes) H' 9FFFF H' A0000 Area 5 (128 kbytes) H' BFFFF H' C0000 H' DFFFF H' E0000 Area 6 (128 kbytes) Area 7 (128 Mbytes) H' BFFFFF H' C00000 H' DFFFFF H' E00000 Area 6 (2 Mbytes) Area 7 (2 Mbytes) H' 9FFFFF H' A00000 Area 5 (2 Mbytes) H' 7FFFFF H' 800000 Area 4 (2 Mbytes) H' 5FFFFF H' 600000 Area 3 (2 Mbytes) H' 3FFFFF H' 400000 Area 2 (2 Mbytes) H' 1FFFFF H' 200000 Area 1 (2 Mbytes) H' 000000 Area 0 (2 Mbytes) H' FFFFF (a) 1-Mbyte modes (modes 1 and 2) H' FFFFFF (b) 16-Mbyte modes (modes 3 to 5) Figure 6.2 Access Area Map for Each Operating Mode Chip select signals (CS0 to CS7) can be output for areas 0 to 7. The bus specifications for each area are selected in ABWCR, ASTCR, WCRH, and WCRL. In 16-Mbyte mode, the area division units can be selected with the RDEA bit in BCR. 137 Area 0 2 Mbytes H'1FFFFF H'200000 Area 1 2 Mbytes H'3FFFFF H'400000 Area 2 2 Mbytes H'5FFFFF H'600000 Area 3 2 Mbytes H'7FFFFF H'800000 Area 4 2 Mbytes H'9FFFFF H'A00000 Area 5 2 Mbytes H'BFFFFF H'C00000 Area 6 2 Mbytes H'DFFFFF H'E00000 Area 7 1.93 Mbytes Area 0 2 Mbytes Area 1 2 Mbytes Area 2 8 Mbytes Area 3 2 Mbytes Area 4 1.93 Mbytes H'FEE000 Internal I/O registers (1) H'FEE0FF H'FEE100 Reserved 39.75 kbytes H'FF7FFF H'FF8000 H'FF8FFF H'FF9000 Area 5 4 kbytes Internal I/O registers (1) H'FFEF1F H'FFEF20 On-chip RAM 4 kbytes On-chip RAM 4 kbytes* H'FFFEFF H'FFFF00 H'FFFF1F H'FFFF20 Internal I/O registers (2) H'FFFFE9 H'FFFFEA H'FFFFFF Area 7 22 bytes (A) Memory map when RDEA = 1 Internal I/O registers (2) Area 7 22 bytes (b) Memory map when RDEA = 0 Absolute address 8 bits Note: * Area 6 when the RAME bit is cleared. Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3062F-ZTAT, H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version) (1) 138 Absolute address 16 bits 2 Mbytes Area 7 67.5 kbytes Area 6 23.75 kbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes H'000000 Area 0 2 Mbytes H'1FFFFF H'200000 Area 1 2 Mbytes H'3FFFFF H'400000 Area 2 2 Mbytes H'5FFFFF H'600000 Area 3 2 Mbytes H'7FFFFF H'800000 Area 4 2 Mbytes H'9FFFFF H'A00000 Area 5 2 Mbytes H'BFFFFF H'C00000 Area 6 2 Mbytes H'DFFFFF H'E00000 Area 7 1.93 Mbytes Area 0 2 Mbytes Area 1 2 Mbytes Area 2 8 Mbytes Area 3 2 Mbytes Area 4 1.93 Mbytes H'FEE000 Internal I/O registers (1) H'FEE0FF H'FEE100 Reserved 39.75 kbytes H'FF7FFF H'FF8000 H'FF8FFF H'FF9000 Area 5 4 kbytes Internal I/O registers (1) H'FFEF1F H'FFF720 On-chip RAM 2 kbytes On-chip RAM 2 kbytes* H'FFFEFF H'FFFF00 H'FFFF1F H'FFFF20 Internal I/O registers (2) H'FFFFE9 H'FFFFEA H'FFFFFF Area 7 22 bytes (A) Memory map when RDEA = 1 Internal I/O registers (2) Area 7 22 bytes (b) Memory map when RDEA = 0 Absolute address 8 bits Note: * Area 6 when the RAME bit is cleared. Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3060 Mask ROM Version, H8/3060 Mask ROM B-Mask Version) (2) 139 Absolute address 16 bits 2 Mbytes Area 7 67.5 kbytes Area 6 23.75 kbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes H'000000 Area 0 2 Mbytes H'1FFFFF H'200000 Area 1 2 Mbytes H'3FFFFF H'400000 Area 2 2 Mbytes H'5FFFFF H'600000 Area 3 2 Mbytes H'7FFFFF H'800000 Area 4 2 Mbytes H'9FFFFF H'A00000 Area 5 2 Mbytes H'BFFFFF H'C00000 Area 6 2 Mbytes H'DFFFFF H'E00000 Area 7 1.93 Mbytes Internal I/O registers (1) H'FEE0FF H'FEE100 Area 0 2 Mbytes Area 1 2 Mbytes Area 2 8 Mbytes Area 3 2 Mbytes Area 4 1.93 Mbytes Internal I/O registers (1) H'FEE000 Reserved 39.75 kbytes H'FF7FFF H'FF8000 H'FF8FFF H'FF9000 Area 5 4 kbytes H'FFDF1F H'FFDF20 On-chip RAM 8 kbytes On-chip RAM 8 kbytes* H'FFFEFF H'FFFF00 H'FFFF1F H'FFFF20 H'FFFFE9 H'FFFFEA H'FFFFFF Absolute address 8 bits Internal I/O registers (2) Area 7 22 bytes (A) Memory map when RDEA = 1 Internal I/O registers (2) Area 7 22 bytes (b) Memory map when RDEA = 0 Note: * Area 6 when the RAME bit is cleared. Figure 6.3 Memory Map in 16-Mbyte Mode (H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version) (3) 140 Absolute address 16 bits 2 Mbytes Area 7 63.5 kbytes Area 6 19.75 kbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes 2 Mbytes H'000000 6.3.2 Bus Specifications The external space bus specifications consist of three elements: bus width, number of access states, and number of program wait states. The bus width and number of access states for on-chip memory and registers are fixed, and are not affected by the bus controller. Bus Width: A bus width of 8 or 16 bits can be selected with ABWCR. An area for which an 8-bit bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected functions as a16-bit access space. If all areas are designated for 8-bit access, 8-bit bus mode is set; if any area is designated for 16bit access, 16-bit bus mode is set. Number of Access States: Two or three access states can be selected with ASTCR. An area for which two-state access is selected functions as a two-state access space, and an area for which three-state access is selected functions as a three-state access space. When two-state access space is designated, wait insertion is disabled. Number of Program Wait States: When three-state access space is designated in ASTCR, the number of program wait states to be inserted automatically is selected with WCRH and WCRL. From 0 to 3 program wait states can be selected. Table 6.3 shows the bus specifications for each basic bus interface area. Table 6.3 Bus Specifications for Each Area (Basic Bus Interface) Bus Specifications (Basic Bus Interface) Bus Width 16 Access States 2 3 Program Wait States 0 0 1 2 3 8 2 3 0 0 1 2 3 ABWCR ASTCR WCRH/WCRL ABWn 0 ASTn 0 1 Wn1 -- 0 Wn0 -- 0 1 1 0 1 1 0 1 -- 0 -- 0 1 1 0 1 Note: n = 0 to 7 141 6.3.3 Memory Interfaces As its memory interface, the H8/3062 Series has only a basic bus interface that allows direct connection of ROM, SRAM, and so on. It is not possible to select a DRAM interface that allows direct connection of DRAM, or a burst ROM interface that allows direct connection of burst ROM. 6.3.4 Chip Select Signals For each of areas 0 to 7, the H8/3062 Series can output a chip select signal (CS0 to CS7) that goes low when the corresponding area is selected in expanded mode. Figure 6.4 shows the output timing of a CSn signal. Output of CS0 to CS3: Output of CS0 to CS3 is enabled or disabled in the data direction register (DDR) of the corresponding port. In the expanded modes with on-chip ROM disabled, a reset leaves pin CS0 in the output state and pins CS1 to CS3 in the input state. To output chip select signals CS1 to CS3, the corresponding DDR bits must be set to 1. In the expanded modes with on-chip ROM enabled, a reset leaves pins CS0 to CS3 in the input state. To output chip select signals CS0 to CS3, the corresponding DDR bits must be set to 1. For details, see section 7, I/O Ports. Output of CS4 to CS7: Output of CS4 to CS7 is enabled or disabled in the chip select control register (CSCR). A reset leaves pins CS4 to CS7 in the input state. To output chip select signals CS4 to CS7, the corresponding CSCR bits must be set to 1. For details, see section 7, I/O Ports. Address bus External address in area n CSn Figure 6.4 CSn Signal Output Timing (n = 0 to 7) When the on-chip ROM, on-chip RAM, and internal I/O registers are accessed, CS0 to CS7 remain high. The CSn signals are decoded from the address signals. They can be used as chip select signals for SRAM and other devices. 142 6.3.5 Address Output Method The H8/3062F-ZTAT R-mask version, H8/3062F-ZTAT B-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask ROM version, and H8/3064F-ZTAT Bmask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version provide a choice of two address update methods: either the same method as in the previous H8/300H Series (address update mode 1), or a method in which address updating is restricted to external space accesses (address update mode 2). Figure 6.5 shows examples of address output in these two update modes. On-chip memory cycle External read cycle On-chip memory cycle External read cycle On-chip memory cycle Address bus (Address update mode 1) Address bus (Address update mode 2) RD Figure 6.5 Sample Address Output in Each Address Update Mode (Basic Bus Interface, 3-State Space) Address Update Mode 1: Address update mode 1 is compatible with the previous H8/300H Series. Addresses are always updated between bus cycles. Address Update Mode 2: In address update mode 2, address updating is performed only in external space accesses. In this mode, the address can be retained between an external space read cycle and an instruction fetch cycle (on-chip memory) by placing the program in on-chip memory. Address update mode 2 is therefore useful when connecting a device that requires address hold time with respect to the rise of the RD strobe. Switching between address update modes 1 and 2 is performed by means of the ADRCTL bit in ADRCR. The initial value of ADRCR is the address update mode 1 setting, providing compatibility with the previous H8/300H Series. Cautions: The address output methods are designed so that the initial state with the bit selection method is compatible with the H8/3062F-ZTAT (i.e. address update mode 1), and so there is 143 basically no problem if the H8/3062F-ZTAT is replaced with the H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, or H8/3062 mask ROM B-mask version. However, the following points should be noted. * ADRCR is allocated to address H'FEE01E. In the H8/3062F-ZTAT, the corresponding address is empty space, but it is necessary to confirm that no accesses are made to H'FEE01E in the program. * When address update mode 2 is selected, the address in an internal space (on-chip memory or internal I/O) access cycle is not output externally. * In order to secure address holding with respect to the rise of RD, when address update mode 2 is used an external space read access must be completed within a single access cycle. For example, in a word access to 8-bit access space, the bus cycle is split into two as shown in figure 6.6., and so there is not a single access cycle. In this case, address holding is not guaranteed at the rise of RD between the first (even address) and second (odd address) access cycles (area inside the ellipse in the figure). External read cycle (8-bit space word access) On-chip memory cycle On-chip memory cycle Address update mode 2 RD Even address Odd address Figure 6.6 Example of Consecutive External Space Accesses in Address Update Mode 2 144 6.4 6.4.1 Basic Bus Interface Overview The basic bus interface enables direct connection of ROM, SRAM, and so on. The bus specifications can be selected with ABWCR, ASTCR, WCRH, and WCRL (see table 6.3). 6.4.2 Data Size and Data Alignment Data sizes for the CPU and other internal bus masters are byte, word, and longword. The bus controller has a data alignment function, and when accessing external space, controls whether the upper data bus (D15 to D8) or lower data bus (D7 to D0) is used according to the bus specifications for the area being accessed (8-bit access area or 16-bit access area) and the data size. 8-Bit Access Areas: Figure 6.7 illustrates data alignment control for 8-bit access space. With 8bit access space, the upper data bus (D15 to D8) is always used for accesses. The amount of data that can be accessed at one time is one byte: a word access is performed as two byte accesses, and a longword access, as four byte accesses. Upper data bus Lower data bus D15 D8 D7 D0 Byte size Word size 1st bus cycle 2nd bus cycle 1st bus cycle Longword size 2nd bus cycle 3rd bus cycle 4th bus cycle Figure 6.7 Access Sizes and Data Alignment Control (8-Bit Access Area) 16-Bit Access Areas: Figure 6.8 illustrates data alignment control for 16-bit access areas. With 16-bit access areas, the upper data bus (D15 to D8) and lower data bus (D7 to D0) are used for accesses. The amount of data that can be accessed at one time is one byte or one word, and a longword access is executed as two word accesses. 145 In byte access, whether the upper or lower data bus is used is determined by whether the address is even or odd. The upper data bus is used for an even address, and the lower data bus for an odd address. Upper data bus Lower data bus D15 D8 D7 D0 Byte size Byte size * Even address * Odd address Word size Longword size 1st bus cycle 2nd bus cycle Figure 6.8 Access Sizes and Data Alignment Control (16-Bit Access Area) 6.4.3 Valid Strobes Table 6.4 shows the data buses used, and the valid strobes, for the access spaces. In a read, the RD signal is valid for both the upper and the lower half of the data bus. In a write, the HWR signal is valid for the upper half of the data bus, and the LWR signal for the lower half. Table 6.4 Area 8-bit access area 16-bit access area Data Buses Used and Valid Strobes Access Size Byte Read/ Write Read Write Byte Read Valid Address Strobe -- -- Even Odd Write Even Odd Word Read Write -- -- HWR LWR RD HWR, LWR RD HWR RD Valid Invalid Valid Upper Data Bus (D15 to D8) Valid Lower Data Bus (D7 to D0) Invalid Undetermined data Invalid Valid Undetermined data Undetermined data Valid Valid Valid Valid Valid Notes: 1. Undetermined data means that unpredictable data is output. 2. Invalid means that the bus is in the input state and the input is ignored. 146 6.4.4 Memory Areas The initial state of each area is basic bus interface, three-state access space. The initial bus width is selected according to the operating mode. Area 0: Area 0 includes on-chip ROM, and in ROM-disabled expansion mode, all of area 0 is external space. In ROM-enabled expansion mode, the space excluding on-chip ROM is external space. When area 0 external space is accessed, the CS0 signal can be output. The size of area 0 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3 to 5. Areas 1 to 6: In external expansion mode, areas 1 to 6 are entirely external space. When area 1 to 6 external space is accessed, the CS1 to CS6 pin signals respectively can be output. The size of areas 1 to 6 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3 to 5. Area 7: Area 7 includes the on-chip RAM and registers. In external expansion mode, the space excluding the on-chip RAM and registers is external space. The on-chip RAM is enabled when the RAME bit in the system control register (SYSCR) is set to 1; when the RAME bit is cleared to 0, the on-chip RAM is disabled and the corresponding space becomes external space . When area 7 external space is accessed, the CS7 signal can be output. The size of area 7 is 128 kbytes in modes 1 and 2, and 2 Mbytes in modes 3 to 5. 147 6.4.5 Basic Bus Control Signal Timing 8-Bit, Three-State-Access Areas: Figure 6.9 shows the timing of bus control signals for an 8-bit, three-state-access area. The upper data bus (D 15 to D8) is used in accesses to these areas. The LWR pin is always high. Wait states can be inserted. Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Valid Undetermined data High Valid Invalid External address in area n T2 T3 Note: n = 7 to 0 Figure 6.9 Bus Control Signal Timing for 8-Bit, Three-State-Access Area 148 8-Bit, Two-State-Access Areas: Figure 6.10 shows the timing of bus control signals for an 8-bit, two-state-access area. The upper data bus (D 15 to D8) is used in accesses to these areas. The LWR pin is always high. Wait states cannot be inserted. Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Valid Undetermined data High Valid Invalid External address in area n T2 Note: n = 7 to 0 Figure 6.10 Bus Control Signal Timing for 8-Bit, Two-State-Access Area 149 16-Bit, Three-State-Access Areas: Figures 6.11 to 6.13 show the timing of bus control signals for a 16-bit, three-state-access area. In these areas, the upper data bus (D 15 to D8) is used in accesses to even addresses and the lower data bus (D7 to D0) in accesses to odd addresses. Wait states can be inserted. Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Valid Undetermined data High Valid Invalid Even external address in area n T2 T3 Note: n = 7 to 0 Figure 6.11 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (1) (Byte Access to Even Address) 150 Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Undetermined data Valid High Invalid Valid Odd external address in area n T2 T3 Note: n = 7 to 0 Figure 6.12 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (2) (Byte Access to Odd Address) 151 Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Valid Valid Valid Valid External address in area n T2 T3 Note: n = 7 to 0 Figure 6.13 Bus Control Signal Timing for 16-Bit, Three-State-Access Area (3) (Word Access) 152 16-Bit, Two-State-Access Areas: Figures 6.14 to 6.16 show the timing of bus control signals for a 16-bit, two-state-access area. In these areas, the upper data bus (D15 to D8) is used in accesses to even addresses and the lower data bus (D7 to D0) in accesses to odd addresses. Wait states cannot be inserted. Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Valid Undetermined data High Valid Invalid Even external address in area n T2 Note: n = 7 to 0 Figure 6.14 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (1) (Byte Access to Even Address) 153 Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Undetermined data Valid High Invalid Valid Odd external address in area n T2 Note: n = 7 to 0 Figure 6.15 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (2) (Byte Access to Odd Address) 154 Bus cycle T1 Address bus CSn AS RD Read access D15 to D8 D7 to D0 HWR LWR Write access D15 to D8 D7 to D0 Valid Valid Valid Valid External address in area n T2 Note: n = 7 to 0 Figure 6.16 Bus Control Signal Timing for 16-Bit, Two-State-Access Area (3) (Word Access) 6.4.6 Wait Control When accessing external space, the H8/3062 Series can extend the bus cycle by inserting wait states (Tw). There are two ways of inserting wait states: program wait insertion and pin wait insertion using the WAIT pin. Program Wait Insertion: From 0 to 3 wait states can be inserted automatically between the T2 state and T3 state on an individual area basis in three-state access space, according to the settings of WCRH and WCRL. 155 Pin Wait Insertion: Setting the WAITE bit in BCR to 1 enables wait insertion by means of the WAIT pin. When external space is accessed in this state, a program wait is first inserted. If the WAIT pin is low at the falling edge of in the last T2 or TW state, another TW state is inserted. If the WAIT pin is held low, TW states are inserted until it goes high. This is useful when inserting four or more TW states, or when changing the number of T W states for different external devices. The WAITE bit setting applies to all areas. Figure 6.17 shows an example of the timing for insertion of one program wait state in 3-state space. Inserted by program wait Inserted by WAIT pin T2 Tw Tw Tw T3 T1 WAIT Address bus AS RD Read access Data bus Read data HWR, LWR Write access Data bus Note: Write data indicates the timing of WAIT pin sampling. Figure 6.17 Example of Wait State Insertion Timing 156 6.5 6.5.1 Idle Cycle Operation When the H8/3062 Series chip accesses external space, it can insert a 1-state idle cycle (Ti) between bus cycles in the following cases: when read accesses between different areas occur consecutively, and when a write cycle occurs immediately after a read cycle. By inserting an idle cycle it is possible, for example, to avoid data collisions between ROM, which has a long output floating time, and high-speed memory, I/O interfaces, and so on. The initial value of the ICIS1 and ICIS0 bits in BCR is 1, so that idle cycle insertion is performed in the initial state. If there are no data collisions, the ICIS bits can be cleared. Consecutive Reads between Different Areas: If consecutive reads between different areas occur while the ICIS1 bit is set to 1 in BCR, an idle cycle is inserted at the start of the second read cycle. Figure 6.18 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a read cycle from SRAM, each being located in a different area. In (a), an idle cycle is not inserted, and a collision occurs in bus cycle B between the read data from ROM and that from SRAM. In (b), an idle cycle is inserted, and a data collision is prevented. Bus cycle A Bus cycle B Address bus RD Data bus Data collision Long buffer-off time (a) Idle cycle not inserted T1 T2 T3 T1 T2 Address bus RD Data bus Bus cycle A Bus cycle B T1 T2 T3 Ti T1 T2 (b) Idle cycle inserted Figure 6.18 Example of Idle Cycle Operation (ICIS1 = 1) Write after Read: If an external write occurs after an external read while the ICIS0 bit is set to 1 in BCR, an idle cycle is inserted at the start of the write cycle. Figure 6.19 shows an example of the operation in this case. In this example, bus cycle A is a read cycle from ROM with a long output floating time, and bus cycle B is a CPU write cycle. In (a), an idle cycle is not inserted, and a collision occurs in bus cycle B between the read data from ROM and the CPU write data. In (b), an idle cycle is inserted, and a data collision is prevented. 157 Bus cycle A Bus cycle B Address bus RD HWR Data bus Long buffer-off time (a) Idle cycle not inserted Data collision T1 T2 T3 T1 T2 Address bus RD HWR Data bus Bus cycle A Bus cycle B T1 T2 T3 Ti T1 T2 (b) Idle cycle inserted Figure 6.19 Example of Idle Cycle Operation (ICIS0 = 1) Usage Note: When non-insertion of an idle cycle is specified, the rise (negation) of RD and fall (assertion) of CSn may occur simultaneously. Figure 6.20 shows an example of the operation in this case. If consecutive reads to a different external area occur while the ICIS1 bit in BCR is cleared to 0, or if an external read is followed by a write cycle for a different external area while the ICIS0 bit is cleared to 0, negation of RD in the first read cycle and assertion of CSn in the following bus cycle will occur simultaneously. Depending on the output delay time of each signal, therefore, it is possible that the RD low output in the previous read cycle and the CSn low output in the following bus cycle will overlap. As long as RD and CSn do not change simultaneously, or if there is no problem even if they do, non-insertion of an idle cycle can be specified. Bus cycle A Bus cycle B Address bus RD CSn T1 T2 T3 T1 T2 Address bus RD CSn Bus cycle A Bus cycle B T1 T2 T3 Ti T1 T2 Simultaneous change of RD and CSn: possibility of mutual overlap (a) Idle cycle not inserted (b) Idle cycle inserted Figure 6.20 Example of Idle Cycle Operation 158 6.5.2 Pin States in Idle Cycle Table 6.5 shows the pin states in an idle cycle. Table 6.5 Pins A23 to A 0 D15 to D0 CSn AS RD HWR LWR Pin States in Idle Cycle Pin State Next cycle address value High impedance High High High High High 6.6 Bus Arbiter The bus controller has a built-in bus arbiter that arbitrates between different bus masters. The bus master can be either the CPU or an external bus master. When a bus master has the bus right it can carry out read and write operations. Each bus master uses a bus request signal to request the bus right. At fixed times the bus arbiter determines priority and uses a bus acknowledge signal to grant the bus to a bus master, which can the operate using the bus. The bus arbiter checks whether the bus request signal from a bus master is active or inactive, and returns an acknowledge signal to the bus master. When two or more bus masters request the bus, the highest-priority bus master receives an acknowledge signal. The bus master that receives an acknowledge signal can continue to use the bus until the acknowledge signal is deactivated. The bus master priority order is: (High) External bus master > CPU (Low) The bus arbiter samples the bus request signals and determines priority at all times, but it does not always grant the bus immediately, even when it receives a bus request from a bus master with higher priority than the current bus master. Each bus master has certain times at which it can release the bus to a higher-priority bus master. 159 6.6.1 Operation CPU: The CPU is the lowest-priority bus master. If an external bus master requests the bus while the CPU has the bus right, the bus arbiter transfers the bus right to the bus master that requested it. The bus right is transferred at the following times: * The bus right is transferred at the boundary of a bus cycle. If word data is accessed by two consecutive byte accesses, however, the bus right is not transferred between the two byte accesses. * If another bus master requests the bus while the CPU is performing internal operations, such as executing a multiply or divide instruction, the bus right is transferred immediately. The CPU continues its internal operations. * If another bus master requests the bus while the CPU is in sleep mode, the bus right is transferred immediately. External Bus Master: When the BRLE bit is set to 1 in BRCR, the bus can be released to an external bus master. The external bus master has highest priority, and requests the bus right from the bus arbiter driving the BREQ signal low. Once the external bus master acquires the bus, it keeps the bus until the BREQ signal goes high. While the bus is released to an external bus master, the H8/3062 Series chip holds the address bus, data bus, bus control signals (AS, RD, HWR, and LWR), and chip select signals (CSn: n = 7 to 0) in the high-impedance state, and holds the BACK pin in the low output state. The bus arbiter samples the BREQ pin at the rise of the system clock (). If BREQ is low, the bus is released to the external bus master at the appropriate opportunity. The BREQ signal should be held low until the BACK signal goes low. When the BREQ pin is high in two consecutive samples, the BACK pin is driven high to end the bus-release cycle. Figure 6.21 shows the timing when the bus right is requested by an external bus master during a read cycle in a two-state access area. There is a minimum interval of three states from when the BREQ signal goes low until the bus is released. 160 CPU cycles T0 T1 T2 External bus released CPU cycles Address bus Data bus AS RD Address High-impedance High-impedance High-impedance High-impedance High High-impedance HWR, LWR BREQ BACK Minimum 3 cycles (1) (2) (3) (4) (5) (6) Figure 6.21 Example of External Bus Master Operation When making a transition to software standby mode, if there is contention with a bus request from an external bus master, the BACK and strobe states may be indefinite when the transition is made. When using software standby mode, clear the BRLE bit to 0 in BRCR before executing the SLEEP instruction. 161 6.7 6.7.1 Register and Pin Input Timing Register Write Timing ABWCR, ASTCR, WCRH, and WCRL Write Timing: Data written to ABWCR, ASTCR, WCRH, and WCRL takes effect starting from the next bus cycle. Figure 6.22 shows the timing when an instruction fetched from area 0 changes area 0 from three-state access to two-state access. T1 Address bus 3-state access to area 0 T2 T3 T1 T2 T3 T1 T2 ASTCR address 2-state access to area 0 Figure 6.22 ASTCR Write Timing DDR and CSCR Write Timing: Data written to DDR or CSCR for the port corresponding to the CSn pin to switch between CSn output and generic input takes effect starting from the T3 state of the DDR write cycle. Figure 6.23 shows the timing when the CS1 pin is changed from generic input to CS1 output. T1 Address bus CS1 High-impedance T2 T3 P8DDR address Figure 6.23 DDR Write Timing BRCR Write Timing: Data written to BRCR to switch between A23, A22, A21, or A20 output and generic input or output takes effect starting from the T3 state of the BRCR write cycle. Figure 6.24 shows the timing when a pin is changed from generic input to A23, A22, A21, or A20 output. 162 T1 Address bus PA7 to PA4 (A23 to A20) T2 T3 BRCR address High-impedance Figure 6.24 BRCR Write Timing 6.7.2 BREQ Pin Input Timing After driving the BREQ pin low, hold it low until BACK goes low. If BREQ returns to the high level before BACK goes lows, the bus arbiter may operate incorrectly. To terminate the external-bus-released state, hold the BREQ signal high for at least three states. If BREQ is high for too short an interval, the bus arbiter may operate incorrectly. 163 164 Section 7 I/O Ports 7.1 Overview The H8/3062 Series has 10 input/output ports (ports 1, 2, 3, 4, 5, 6, 8, 9, A, and B) and one inputonly port (port 7). Table 7.1 summarizes the port functions. The pins in each port are multiplexed as shown in table 7.1. Each port has a data direction register (DDR) for selecting input or output, and a data register (DR) for storing output data. In addition to these registers, ports 2, 4, and 5 have an input pull-up control register (PCR) for switching input pull-up transistors on and off. Ports 1 to 6 and port 8 can drive one TTL load and a 90-pF capacitive load. Ports 9, A, and B can drive one TTL load and a 30-pF capacitive load. Ports 1 to 6 and 8 to B can drive a darlington pair. Ports 1, 2, and 5 can drive LEDs (with 10-mA current sink). Pins P82 to P80, PA7 to PA 0 have Schmitt-trigger input circuits. For block diagrams of the ports see appendix C, I/O Port Block Diagrams. Table 7.1 Port Functions Expanded Modes Port Description Pins P17 to P10/ A7 to A0 Mode 1 Mode 2 Mode 3 Mode 4 Address output pins (A7 to A0) Mode 5 Port 1 * 8-bit I/O port * Can drive LEDs Single-Chip Modes Mode 6 Mode 7 Address output Generic input/ (A7 to A0) and output generic input DDR = 0: generic input DDR = 1: address output Port 2 * 8-bit I/O port * Built-in input pull-up transistors * Can drive LEDs Port 3 * 8-bit I/O port P27 to P20/ A15 to A8 Address output pins (A15 to A8) Address output Generic input/ (A15 to A8) and output generic input DDR = 0: generic input DDR = 1: address output P37 to P30/ D15 to D8 Data input/output (D 15 to D8) Generic input/ output 165 Expanded Modes Port Description Pins P47 to P40/ D7 to D0 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Port 4 * 8-bit I/O port * Built-in input pull-up transistors Port 5 * 4-bit I/O port * Built-in input pull-up transistors * Can drive LEDs Port 6 * 8-bit I/O port P67/ P66/LWR P65/HWR P64/RD P63/AS P62/BACK P61/BREQ P60/WAIT Port 7 * 8-bit I/O port P77/AN7/ DA1 P76/AN6/ DA0 P75 to P70/ AN5 to AN0 Port 8 * 5-bit I/O port * P82 to P80 have Schmitt inputs P84/CS0 Bus control signal input/output (BACK, BREQ, WAIT) and 3-bit generic input/output Clock output () and generic input Bus control signal output (LWR, HWR, RD, AS) P53 to P50/ A19 to A16 Single-Chip Modes Mode 6 Mode 7 Generic input/ output Data input/output (D 7 to D0) and 8-bit generic input/output 8-bit bus mode: generic input/output 16-bit bus mode: data input/output Address output (A19 to A16) Address output Generic input/ (A19 to A16) and output 4-bit generic input DDR = 0: generic input DDR = 1: address output Generic input/ output Generic input/ output Analog input (AN7, AN 6) to A/D converter, analog output (DA 1, DA 0) from D/A converter, and generic input Analog input (AN5 to AN0) to A/D converter, and generic input DDR = 0: generic input DDR = 1 (after reset): CS0 output DDR = 0 (after reset): generic input DDR = 1: CS0 output Generic input/ output P83/IRQ3/ IRQ3 input, CS1 output, external trigger input (ADTRG) IRQ3 input, CS1/ADTRG to A/D converter, and generic input external trigger input (ADTRG) to DDR = 0 (after reset): generic input A/D converter, DDR = 1: CS1 output and generic input/output 166 Expanded Modes Port Description Pins P82/IRQ2/ CS2 P81/IRQ1/ CS3 Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Port 8 * 5-bit I/O port * P82 to P80 have Schmitt inputs Port 9 * 6-bit I/O port Single-Chip Modes Mode 6 Mode 7 IRQ2 and IRQ1 input, CS2 and CS3 output, and generic IRQ2 and IRQ1 input input and generic input/output DDR = 0 (after reset): generic input DDR = 1: CS2 and CS3 output P80/IRQ0 P95/IRQ5 / SCK1 P94/IRQ4 / SCK0 P93/RxD1 P92/RxD0 P91/TxD1 P90/TxD0 Port A * 8-bit I/O port * Schmitt inputs PA 7/TP7/ TIOCB2/A 20 IRQ0 input, and generic input/output Input and output (SCK1, SCK0, RxD1, RxD0, TxD1, TxD0) for serial communication interfaces 1 and 0 (SCI1/0), IRQ5 and IRQ4 input, and 6-bit generic input/output Output (TP7) from Address output pro-grammable (A20 ) timing pattern controller (TPC), input or output (TIOCB2) for 16bit timer and generic input/ output TPC output (TP 6 to TP4), 16-bit timer input and output (TIOCA 2, TIOCB1, TIOCA1), and generic input/output Address output (A20 ), TPC output (TP7), input or output (TIOCB2) for 16-bit timer, and generic input/output TPC output (TP 7), 16-bit timer input or output (TIOCB2), and generic input/output PA 6/TP6/ TIOCA2/A 21 PA 5/TP5/ TIOCB1/A 22 PA 4/TP4/ TIOCA1/A 23 PA 3/TP3/ TIOCB0/ TCLKD PA 2/TP2/ TIOCA0/ TCLKC PA 1/TP1/ TCLKB PA 0/TP0/ TCLKA TPC output (TP 6 to TP4),16-bit timer input and output (TIOCA 2, TIOCB1, TIOCA1), address output (A23 to A21), and generic input/ output TPC output (TP 6 to TP4), 16-bit timer input and output (TIOCA 2, TIOCB1, TIOCA1) and generic input/output TPC output (TP 3 to TP0), 16-bit timer input and output (TIOCB0, TIOCA0, TCLKD, TCLKC, TCLKB, TCLKA), 8-bit timer input (TCLKD, TCLKC, TCLKB, TCLKA), and generic input/output 167 Expanded Modes Port Description Pins PB 7/TP15 PB 6/TP14 PB 5/TP13 PB 4/TP12 PB 3/TP11/ TMIO3/CS4 PB 2/TP10/ TMO2/CS5 PB 1/TP9/ TMIO1/CS6 PB 0/TP8/ TMO0/CS7 TPC output (TP 11 to TP8), 8-bit timer input and output (TMIO 3, TMO2, TMIO1, TMO0), CS7 to CS4 output, and generic input/output Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Port B * 8-bit I/O port Single-Chip Modes Mode 6 Mode 7 TPC output (TP 15 to TP12) and generic input/output TPC output (TP 11 to TP8), 8-bit timer input and output (TMIO 3, TMO2, TMIO1, TMO0), and generic input/output Legend: SCI0 : 16TIM : SCI1 : 8TIM : TPC : Serial communication interface channel 0 16-bit timer Serial communication interface channel 1 8-bit timer Programmable timing pattern controller 168 7.2 7.2.1 Port 1 Overview Port 1 is an 8-bit input/output port also used for address output, with the pin configuration shown in figure 7.1. The pin functions differ according to the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), they are address bus output pins (A7 to A0). In mode 5 (expanded modes with on-chip ROM enabled), settings in the port 1 data direction register (P1DDR) can designate pins for address bus output (A7 to A0) or generic input. In modes 6 and 7 (single-chip mode), port 1 is a generic input/output port. Pins in port 1 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair. Port 1 pins P17 /A 7 P16 /A 6 P15 /A 5 Port 1 P14 /A 4 P13 /A 3 P12 /A 2 P11 /A 1 P10 /A 0 Modes 1 to 4 A 7 (output) A 6 (output) A 5 (output) A 4 (output) A 3 (output) A 2 (output) A 1 (output) A 0 (output) Mode 5 P17 (input)/A 7 (output) P16 (input)/A 6 (output) P15 (input)/A 5 (output) P14 (input)/A 4 (output) P13 (input)/A 3 (output) P12 (input)/A 2 (output) P11 (input)/A 1 (output) P10 (input)/A 0 (output) Modes 6 and 7 P17 (input/output) P16 (input/output) P15 (input/output) P14 (input/output) P13 (input/output) P12 (input/output) P11 (input/output) P10 (input/output) Figure 7.1 Port 1 Pin Configuration 7.2.2 Register Descriptions Table 7.2 summarizes the registers of port 1. Table 7.2 Port 1 Registers Initial Value Address* H'EE000 H'FFFD0 Name Abbreviation R/W W R/W Modes 1 to 4 H'FF H'00 Modes 5 to 7 H'00 H'00 Port 1 data direction register P1DDR Port 1 data register P1DR Note: * Lower 20 bits of the address in advanced mode 169 Port 1 Data Direction Register (P1DDR): P1DDR is an 8-bit write-only register that can select input or output for each pin in port 1. Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 -- 0 W 6 1 -- 0 W 5 1 -- 0 W 4 1 -- 0 W 3 1 -- 0 W 2 1 -- 0 W 1 1 -- 0 W 0 1 -- 0 W P1 7 DDR P1 6 DDR P1 5 DDR P1 4 DDR P1 3 DDR P1 2 DDR P1 1 DDR P1 0 DDR Port 1 data direction 7 to 0 These bits select input or output for port 1 pins * Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled) P1DDR values are fixed at 1. Port 1 functions as an address bus. * Mode 5 (Expanded Modes with On-Chip ROM Enabled) After a reset, port 1 functions as an input port. A pin in port 1 becomes an address output pin if the corresponding P1DDR bit is set to 1, and a generic input pin if this bit is cleared to 0. * Modes 6 and 7 (Single-Chip Mode) Port 1 functions as an input/output port. A pin in port 1 becomes an output port if the corresponding P1DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P1DDR bits are always read as 1, and cannot be modified. In modes 5 to 7, P1DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P1DDR is initialized to H'FF in modes 1 to 4, and to H'00 in modes 5 to 7, by a reset and in hardware standby mode. In sofware standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 1 is functioning as an input/output port and a P1DDR bit is set to 1, the corresponding pin maintains its output state. 170 Port 1 Data Register (P1DR): P1DR is an 8-bit readable/writable register that stores port 1 output data. When port 1 functions as an output port, the value of this register is output. When this register is read, the pin logic level is read for bits for which the P1DDR setting is 0, and the P1DR value is read for bits for which the P1DDR setting is 1. Bit Initial value Read/Write 7 P17 0 R/W 6 P16 0 R/W 5 P15 0 R/W 4 P14 0 R/W 3 P13 0 R/W 2 P12 0 R/W 1 P11 0 R/W 0 P10 0 R/W Port 1 data 7 to 0 These bits store data for port 1 pins P1DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 171 7.3 7.3.1 Port 2 Overview Port 2 is an 8-bit input/output port which also has an address output function. It's pin configuration is shown in figure 7.2. The pin functions differ according to the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 2 consists of address bus output pins (A15 to A8). In mode 5 (expanded modes with on-chip ROM enabled), settings in the port 2 data direction register (P2DDR) can designate pins for address bus output (A15 to A8) or generic input. In modes 6 and 7 (single-chip mode), port 2 is a generic input/output port. Port 2 has software-programmable built-in pull-up transistors. Pins in port 2 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair. Port 2 pins P27 /A 15 P26 /A 14 P25 /A 13 Port 2 P24 /A 12 P23 /A 11 P22 /A 10 P21 /A 9 P20 /A 8 Modes 1 to 4 A15 (output) A14 (output) A13 (output) A12 (output) A11 (output) A10 (output) A9 (output) A8 (output) Mode 5 P27 (input)/A15 (output) P26 (input)/A14 (output) P25 (input)/A13 (output) P24 (input)/A12 (output) P23 (input)/A11 (output) P22 (input)/A10 (output) P21 (input)/A9 (output) P20 (input)/A8 (output) Modes 6 and 7 P27 (input/output) P26 (input/output) P25 (input/output) P24 (input/output) P23 (input/output) P22 (input/output) P21 (input/output) P20 (input/output) Figure 7.2 Port 2 Pin Configuration 172 7.3.2 Register Descriptions Table 7.3 summarizes the registers of port 2. Table 7.3 Port 2 Registers Initial Value Address* H'EE001 H'FFFD1 H'EE03C Name Port 2 data direction register Port 2 data register Port 2 input pull-up MOS control register Abbreviation R/W Modes 1 to 4 Modes 5 to 7 P2DDR P2DR P2PCR W H'FF H'00 H'00 H'00 R/W H'00 R/W H'00 Note: * Lower 20 bits of the address in advanced mode Port 2 Data Direction Register (P2DDR): P2DDR is an 8-bit write-only register that can select input or output for each pin in port 2. Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 1 -- 0 W 6 1 -- 0 W 5 1 -- 0 W 4 1 -- 0 W 3 1 -- 0 W 2 1 -- 0 W 1 1 -- 0 W 0 1 -- 0 W P2 7 DDR P2 6 DDR P2 5 DDR P2 4 DDR P2 3 DDR P2 2 DDR P2 1 DDR P2 0 DDR Port 2 data direction 7 to 0 These bits select input or output for port 2 pins * Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled) P2DDR values are fixed at 1. Port 2 functions as an address bus. * Mode 5 (Expanded Modes with On-Chip ROM Enabled) Following a reset, port 2 is an input port. A pin in port 2 becomes an address output pin if the corresponding P2DDR bit is set to 1, and a generic input port if this bit is cleared to 0. * Modes 6 and 7 (Single-Chip Mode) Port 2 functions as an input/output port. A pin in port 2 becomes an output port if the corresponding P2DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P2DDR bits are always read as 1, and cannot be modified. 173 In modes 5 to 7, P2DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P2DDR is initialized to H'FF in modes 1 to 4, and to H'00 in modes 5 to 7, by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 2 is functioning as an input/output port and a P2DDR bit is set to 1, the corresponding pin maintains its output state. Port 2 Data Register (P2DR): P2DR is an 8-bit readable/writable register that stores output data for Port 2. When port 2 functions as an output port, the value of this register is output. When a bit in P2DDR is set to 1, if port 2 is read the value of the corresponding P2DR bit is returned. When a bit in P2DDR is cleared to 0, if port 2 is read the corresponding pin logic level is read. Bit Initial value Read/Write 7 P27 0 R/W 6 P26 0 R/W 5 P25 0 R/W 4 P24 0 R/W 3 P23 0 R/W 2 P22 0 R/W 1 P21 0 R/W 0 P20 0 R/W Port 2 data 7 to 0 These bits store data for port 2 pins P2DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 2 Input Pull-Up MOS Control Register (P2PCR): P2PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 2. Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W P2 7 PCR P2 6 PCR P2 5 PCR P2 4 PCR P2 3 PCR P2 2 PCR P2 1 PCR P2 0 PCR Port 2 input pull-up MOS control 7 to 0 These bits control input pull-up transistors built into port 2 In modes 5 to 7, when a P2DDR bit is cleared to 0 (selecting generic input), if the corresponding bit in P2PCR is set to 1, the input pull-up transistor is turned on. P2PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 174 Table 7.4 summarizes the states of the input pull-ups in each mode. Table 7.4 Mode 1 2 3 4 5 6 7 Input Pull-Up Transistor States (Port 2) Hardware Standby Mode Off Software Standby Mode Off Other Modes Off Reset Off Off Off On/off On/off Legend: Off : The input pull-up transistor is always off. On/off : The input pull-up transistor is on if P2PCR = 1 and P2DDR = 0. Otherwise, it is off. 175 7.4 7.4.1 Port 3 Overview Port 3 is an 8-bit input/output port which also functions as a data bus. It's pin configuration is shown in figure 7.3. Port 3 is a data bus in modes 1 to 5 (expanded modes) and a generic input/output port in modes 6 and 7 (single-chip mode). Pins in port 3 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Port 3 pins P37 /D15 P36 /D14 P35 /D13 Port 3 P34 /D12 P33 /D11 P32 /D10 P31 /D9 P30 /D8 Modes 1 to 5 D15 (input/output) D14 (input/output) D13 (input/output) D12 (input/output) D11 (input/output) D10 (input/output) D9 (input/output) D8 (input/output) Modes 6 and 7 P37 (input/output) P36 (input/output) P35 (input/output) P34 (input/output) P33 (input/output) P32 (input/output) P31 (input/output) P30 (input/output) Figure 7.3 Port 3 Pin Configuration 7.4.2 Register Descriptions Table 7.5 summarizes the registers of port 3. Table 7.5 Address* H'EE002 H'FFFD2 Port 3 Registers Name Port 3 data direction register Port 3 data register Abbreviation P3DDR P3DR R/W W R/W Initial Value H'00 H'00 Note: * Lower 20 bits of the address in advanced mode 176 Port 3 Data Direction Register (P3DDR): P3DDR is an 8-bit write-only register that can select input or output for each pin in port 3. Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W P3 7 DDR P3 6 DDR P3 5 DDR P3 4 DDR P3 3 DDR P3 2 DDR P3 1 DDR P3 0 DDR Port 3 data direction 7 to 0 These bits select input or output for port 3 pins * Modes 1 to 5 (Expanded Modes) Port 3 functions as a data bus, regardless of the P3DDR settings. * Modes 6 and 7 (Single-Chip Mode) Port 3 functions as an input/output port. A pin in port 3 becomes an output port if the corresponding P3DDR bit is set to 1, and an input port if this bit is cleared to 0. P3DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P3DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 3 is functioning as an input/output port and a P3DDR bit is set to 1, the corresponding pin maintains its output state. Port 3 Data Register (P3DR): P3DR is an 8-bit readable/writable register that stores output data for port 3. When port 3 functions as an output port, the value of this register is output. When a bit in P3DDR is set to 1, if port 3 is read the value of the corresponding P3DR bit is returned. When a bit in P3DDR is cleared to 0, if port 3 is read the corresponding pin logic level is read. Bit Initial value Read/Write 7 P3 7 0 R/W 6 P3 6 0 R/W 5 P3 5 0 R/W 4 P3 4 0 R/W 3 P3 3 0 R/W 2 P3 2 0 R/W 1 P3 1 0 R/W 0 P3 0 0 R/W Port 3 data 7 to 0 These bits store data for port 3 pins P3DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 177 7.5 7.5.1 Port 4 Overview Port 4 is an 8-bit input/output port which also functions as a data bus. It's pin configuration is shown in figure 7.4. The pin functions differ depending on the operating mode. In modes 1 to 5 (expanded modes), when the bus width control register (ABWCR) designates areas 0 to 7 all as 8-bit-access areas, the chip operates in 8-bit bus mode and port 4 is a generic input/output port. When at least one of areas 0 to 7 is designated as a 16-bit-access area, the chip operates in 16-bit bus mode and port 4 becomes part of the data bus. In modes 6 and 7 (single-chip mode), port 4 is a generic input/output port. Port 4 has software-programmable built-in pull-up transistors. Pins in port 4 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Port 4 pins P47 /D7 P46 /D6 P45 /D5 Port 4 P44 /D4 P43 /D3 P42 /D2 P41 /D1 P40 /D0 Modes 1 to 5 P47 (input/output)/D7 (input/output) P46 (input/output)/D6 (input/output) P45 (input/output)/D5 (input/output) P44 (input/output)/D4 (input/output) P43 (input/output)/D3 (input/output) P42 (input/output)/D2 (input/output) P41 (input/output)/D1 (input/output) P40 (input/output)/D0 (input/output) Modes 6 and 7 P47 (input/output) P46 (input/output) P45 (input/output) P44 (input/output) P43 (input/output) P42 (input/output) P41 (input/output) P40 (input/output) Figure 7.4 Port 4 Pin Configuration 178 7.5.2 Register Descriptions Table 7.6 summarizes the registers of port 4. Table 7.6 Address* H'EE003 H'FFFD3 H'EE03E Port 4 Registers Name Port 4 data direction register Port 4 data register Port 4 input pull-up MOS control register Abbreviation P4DDR P4DR P4PCR R/W W R/W R/W Initial Value H'00 H'00 H'00 Note: * Lower 20 bits of the address in advanced mode Port 4 Data Direction Register (P4DDR): P4DDR is an 8-bit write-only register that can select input or output for each pin in port 4. Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W P4 7 DDR P4 6 DDR P4 5 DDR P4 4 DDR P4 3 DDR P4 2 DDR P4 1 DDR P4 0 DDR Port 4 data direction 7 to 0 These bits select input or output for port 4 pins * Modes 1 to 5 (Expanded Modes) When all areas are designated as 8-bit-access areas by the bus controller's bus width control register (ABWCR), selecting 8-bit bus mode, port 4 functions as an input/output port. In this case, a pin in port 4 becomes an output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0. When at least one area is designated as a 16-bit-access area, selecting 16-bit bus mode, port 4 functions as part of the data bus, regardless of the P4DDR settings. * Modes 6 and 7 (Single-Chip Mode) Port 4 functions as an input/output port. A pin in port 4 becomes an output port if the corresponding P4DDR bit is set to 1, and an input port if this bit is cleared to 0. P4DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P4DDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 179 ABWCR and P4DDR are not initialized in software standby mode. Therefore, if a transition is made to software standby mode while port 4 is functioning as an input/output port and a P4DDR bit is set to 1, the corresponding pin maintains its output state. Port 4 Data Register (P4DR): P4DR is an 8-bit readable/writable register that stores output data for port 4. When port 4 functions as an output port, the value of this register is output. When a bit in P4DDR is set to 1, if port 4 is read the value of the corresponding P4DR bit is returned. When a bit in P4DDR is cleared to 0, if port 4 is read the corresponding pin logic level is read. Bit Initial value Read/Write 7 P47 0 R/W 6 P46 0 R/W 5 P45 0 R/W 4 P44 0 R/W 3 P43 0 R/W 2 P42 0 R/W 1 P41 0 R/W 0 P40 0 R/W Port 4 data 7 to 0 These bits store data for port 4 pins P4DR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 4 Input Pull-Up MOS Control Register (P4PCR): P4PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 4. Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W P4 7 PCR P4 6 PCR P4 5 PCR P4 4 PCR P4 3 PCR P4 2 PCR P4 1 PCR P4 0 PCR Port 4 input pull-up MOS control 7 to 0 These bits control input pull-up transistors built into port 4 In modes 6 and 7 (single-chip mode), and in 8-bit bus mode in modes 1 to 5 (expanded modes), when a P4DDR bit is cleared to 0 (selecting generic input), if the corresponding P4PCR bit is set to 1, the input pull-up transistor is turned on. P4PCR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 7.7 summarizes the states of the input pull-up MOS in each operating mode. 180 Table 7.7 Mode 1 to 5 Input Pull-Up Transistor States (Port 4) Reset 8-bit bus mode 16-bit bus mode Off Hardware Standby Mode Off Software Standby Mode On/off Off On/off Other Modes On/off Off On/off 6 and 7 Legend: Off : The input pull-up transistor is always off. On/off : The input pull-up transistor is on if P4PCR = 1 and P4DDR = 0. Otherwise, it is off. 7.6 7.6.1 Port 5 Overview Port 5 is a 4-bit input/output port which also has an address output function. It's pin configuration is shown in figure 7.5. The pin functions differ depending on the operating mode. In modes 1 to 4 (expanded modes with on-chip ROM disabled), port 5 consists of address output pins (A19 to A16). In mode 5 (expanded modes with on-chip ROM enabled), settings in the port 5 data direction register (P5DDR) designate pins for address bus output (A 19 to A16) or generic input. In modes 6 and 7 (single-chip mode), port 5 is a generic input/output port. Port 5 has software-programmable built-in pull-up transistors. Pins in port 5 can drive one TTL load and a 90-pF capacitive load. They can also drive an LED or a darlington transistor pair. Port 5 pins P53 /A 19 Port 5 P52 /A 18 P51 /A 17 P50 /A 16 Modes 1 to 4 A19 (output) A18 (output) A17 (output) A16 (output) Mode 5 P5 3 (input)/A19 (output) P5 2 (input)/A18 (output) P5 1 (input)/A17 (output) P5 0 (input)/A16 (output) Modes 6 and 7 P5 3 (input/output) P5 2 (input/output) P5 1 (input/output) P5 0 (input/output) Figure 7.5 Port 5 Pin Configuration 181 7.6.2 Register Descriptions Table 7.8 summarizes the registers of port 5. Table 7.8 Port 5 Registers Initial Value Address* Name H'EE004 Port 5 data direction register H'FFFD4 Port 5 data register H'EE03F Port 5 input pull-up MOS control register Abbreviation R/W P5DDR P5DR P5PCR W R/W R/W Modes 1 to 4 Modes 5 to 7 H'FF H'F0 H'F0 H'F0 H'F0 H'F0 Note: * Lower 20 bits of the address in advanced mode Port 5 Data Direction Register (P5DDR): P5DDR is an 8-bit write-only register that can select input or output for each pin in port 5. Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified. Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 -- 1 -- 1 -- 6 -- 1 -- 1 -- Reserved bits 5 -- 1 -- 1 -- 4 -- 1 -- 1 -- 3 1 -- 0 W 2 1 -- 0 W 1 1 -- 0 W 0 1 -- 0 W P5 3 DDR P5 2 DDR P5 1 DDR P5 0 DDR Port 5 data direction 3 to 0 These bits select input or output for port 5 pins * Modes 1 to 4 (Expanded Modes with On-Chip ROM Disabled) P5DDR values are fixed at 1. Port 5 functions as an address bus output. * Mode 5 (Expanded Modes with On-Chip ROM Enabled) Following a reset, port 5 is an input port. A pin in port 5 becomes an address output pin if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0. * Modes 6 and 7 (Single-Chip Mode) Port 5 functions as an input/output port. A pin in port 5 becomes an output port if the corresponding P5DDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 1 to 4, P5DDR bits are always read as 1, and cannot be modified. 182 In modes 5 to 7, P5DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P5DDR is initialized to H'FF in modes 1 to 4, and to H'F0 in modes 5 to 7, by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 5 is functioning as an input/output port and a P5DDR bit is set to 1, the corresponding pin maintains its output state. Port 5 Data Register (P5DR): P5DR is an 8-bit readable/writable register that stores output data for port 5. When port 5 functions as an output port, the value of this register is output. When a bit in P5DDR is set to 1, if port 5 is read the value of the corresponding P5DR bit is returned. When a bit in P5DDR is cleared to 0, if port 5 is read the corresponding pin logic level is read. Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 P5 0 R/W 3 2 P5 0 R/W 2 1 P5 0 R/W 1 0 P5 0 R/W 0 Reserved bits Port 5 data 3 to 0 These bits store data for port 5 pins P5DR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Port 5 Input Pull-Up MOS Control Register (P5PCR): P5PCR is an 8-bit readable/writable register that controls the MOS input pull-up transistors in port 5. Bits 7 to 4 are reserved. They are fixed at 1, and cannot be modified. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W P5 3 PCR P5 2 PCR P5 1 PCR P5 0 PCR Reserved bits Port 5 input pull-up MOS control 3 to 0 These bits control input pull-up transistors built into port 5 In modes 5 to 7, when a P5DDR bit is cleared to 0 (selecting generic input), if the corresponding bit in P5PCR is set to 1, the input pull-up transistor is turned on. 183 P5PCR is initialized to H'F0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Table 7.9 summarizes the states of the input pull-ups in each mode. Table 7.9 Mode 1 2 3 4 5 6 7 Input Pull-Up Transistor States (Port 5) Hardware Standby Mode Off Software Standby Mode Off Other Modes Off Reset Off Off Off On/off On/off Legend: Off : The input pull-up transistor is always off. On/off : The input pull-up transistor is on if P5PCR = 1 and P5DDR = 0. Otherwise, it is off. 7.7 7.7.1 Port 6 Overview Port 6 is an 8-bit input/output port that is also used for input and output of bus control signals (LWR, HWR, RD, AS, BACK, BREQ, WAIT) and for clock () output. The port 6 pin configuration is shown in figure 7.6. See table 7.11 for the selection of the pin functions. Pins in port 6 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. 184 Port 6 pins P6 7 / P6 6 / LWR P6 5 / HWR Port 6 P6 4 / RD P6 3 / AS P6 2 / BACK P6 1 / BREQ P6 0 / WAIT Modes 1 to 5 (expanded modes) P67 (input)/ (output) Modes 6 and 7 (single-chip mode) P6 7 (input) / (output) P6 6 (input/output) P6 5 (input/output) P6 4 (input/output) P6 3 (input/output) P6 2 (input/output) P6 1 (input/output) P6 0 (input/output) LWR (output) HWR (output) RD AS (output) (output) P62 (input/output) BACK (output) P61 (input/output)/ BREQ (input) P60 (input/output)/ WAIT (input) Figure 7.6 Port 6 Pin Configuration 7.7.2 Register Descriptions Table 7.10 summarizes the registers of port 6. Table 7.10 Port 6 Registers Address* H'EE005 H'FFFD5 Name Port 6 data direction register Port 6 data register Abbreviation P6DDR P6DR R/W W R/W Initial Value H'80 H'80 Note: * Lower 20 bits of the address in advanced mode Port 6 Data Direction Register (P6DDR): P6DDR is an 8-bit write-only register that can select input or output for each pin in port 6. Bit 7 is reserved. It is fixed at 1, and cannot be modified. Bit Initial value Read/Write 7 -- 1 -- Reserved bit 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W P6 6 DDR P6 5 DDR P6 4 DDR P6 3 DDR P6 2 DDR P6 1 DDR P6 0 DDR Port 6 data direction 6 to 0 These bits select input or output for port 6 pins 185 * Modes 1 to 5 (Expanded Modes) P6 7 functions as the clock output pin () or an input port. P67 is the clock output pin (o) if the PSTOP bit in MSTRCH is cleared to 0 (initial value), and an input port if this bit is set to 1. P6 6 to P63 function as bus control output pins (LWR, HWR, RD, and AS), regardless of the settings of bits P66DDR to P63DDR. P6 2 to P60 function as bus control input/output pins (BACK, BREQ, and WAIT) or input/output ports. For the method of selecting the pin functions, see table 7.11. When P62 to P60 function as input/output ports, the pin becomes an output port if the corresponding P6DDR bit is set to 1, and an input port if this bit is cleared to 0. * Modes 6 and 7 (Single-Chip Mode) P6 7 functions as the clock output pin () or an input port. P66 to P60 function as generic input/output ports. P67 is the clock output pin () if the PSTOP bit in MSTCRH is cleared to 0 (initial value), and an input port if this bit is set to 1. A pin in port 6 becomes an output port if the corresponding bit of P66DDR to P60DDR is set to 1, and an input port if this pin is cleared to 0. P6DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P6DDR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 6 is functioning as an input/output port and a P6DDR bit is set to 1, the corresponding pin maintains its output state. Port 6 Data Register (P6DR): P6DR is an 8-bit readable/writable register that stores output data for port 6. When port 6 functions as an output port, the value of this register is output. For bit 7, a value of 1 is returned if the bit is read while the PSTOP bit in MSTCRH is cleared to 0, and the P6 7 pin logic level is returned if the bit is read while the PSTOP bit is set to 1. Bit 7 cannot be modified. For bits 6 to 0, the pin logic level is returned if the bit is read while the corresponding bit in P6DDR is cleared to 0, and the P6DR value is returned if the bit is read while the corresponding bit in P6DDR is set to 1. Bit Initial value Read/Write 7 P67 1 R 6 P6 6 0 R/W 5 P6 5 0 R/W 4 P6 4 0 R/W 3 P6 3 0 R/W 2 P6 2 0 R/W 1 P6 1 0 R/W 0 P6 0 0 R/W Port 6 data 7 to 0 These bits store data for port 6 pins P6DR is initialized to H'80 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 186 Table 7.11 Port 6 Pin Functions in Modes 1 to 5 Pin P67/ Pin Functions and Selection Method Bit PSTOP in MSTCRH selects the pin function. PSTOP Pin function 0 output 1 P67 input LWR Functions as LWR regardless of the setting of bit P66DDR. P66DDR Pin function 0 LWR output 1 HWR Functions as HWR regardless of the setting of bit P65DDR. P65DDR Pin function 0 HWR output 1 RD Functions as RD regardless of the setting of bit P64DDR. P64DDR Pin function 0 RD output 1 AS Functions as AS regardless of the setting of bit P63DDR. P63DDR Pin function 0 AS output 1 P62/BACK Bit BRLE in BRCR and bit P62DDR select the pin function as follows. BRLE P62DDR Pin function 0 P62 input 0 1 P62 output 1 -- BACK output P61/BREQ Bit BRLE in BRCR and bit P61DDR select the pin function as follows. BRLE P61DDR Pin function 0 P61 input 0 1 P61 output 1 -- BREQ input 187 Pin P60/WAIT Pin Functions and Selection Method Bit WAITE in BCR and bit P6 0DDR select the pin function as follows. WAITE P60DDR Pin function 0 0 P60 input 1 P60 output 1 0* WAIT input Note: * Do not set bit P6 0DDR to 1. 7.8 7.8.1 Port 7 Overview Port 7 is an 8-bit input port that is also used for analog input to the A/D converter and analog output from the D/A converter. The pin functions are the same in all operating modes. Figure 7.7 shows the pin configuration of port 7. See section 14, A/D Converter, for details of the A/D converter analog input pins, and section 15, D/A Converter, for details of the D/A converter analog output pins. Port 7 pins P77 (input)/AN 7 (input)/DA 1 (output) P76 (input)/AN 6 (input)/DA 0 (output) P75 (input)/AN 5 (input) Port 7 P74 (input)/AN 4 (input) P73 (input)/AN 3 (input) P72 (input)/AN 2 (input) P71 (input)/AN 1 (input) P70 (input)/AN 0 (input) Figure 7.7 Port 7 Pin Configuration 188 7.8.2 Register Description Table 7.12 summarizes the port 7 register. Port 7 is an input port, and port 7 has no data direction register. Table 7.12 Port 7 Data Register Address* H'FFFD6 Name Port 7 data register Abbreviation P7DR R/W R Initial Value Undetermined Note: * Lower 20 bits of the address in advanced mode Port 7 Data Register (P7DR) Bit Initial value Read/Write 7 P77 --* R 6 P76 --* R 5 P75 --* R 4 P74 --* R 3 P73 --* R 2 P72 --* R 1 P71 --* R 0 P70 --* R Note: * Determined by pins P7 7 to P70 . When port 7 is read, the pin logic levels are always read. P7DR cannot be modified. 189 7.9 7.9.1 Port 8 Overview Port 8 is a 5-bit input/output port that is also used for CS3 to CS0 output, IRQ3 to IRQ0 input, and A/D converter ADTRG input. Figure 7.8 shows the pin configuration of port 8. In modes 1 to 5 (expanded modes), port 8 can provide CS3 to CS0 output, IRQ3 to IRQ0 input, and ADTRG input. See table 7.14 for the selection of pin functions in expanded modes. In modes 6 and 7 (single-chip modes), port 8 can provide IRQ3 to IRQ0 input and ADTRG input. See table 7.15 for the selection of pin functions in single-chip mode. See section 14, A/D Converter, for a description of the A/D converter's ADTRG input pin. The IRQ3 to IRQ0 functions are selected by IER settings, regardless of whether the pin is used for input or output. Caution is therefore required. For details see section 5.3.1, External Interrupts. Pins in port 8 can drive one TTL load and a 90-pF capacitive load. They can also drive a darlington transistor pair. Pins P82 to P80 have Schmitt-trigger inputs. Port 8 pins Pin functions in modes 1 to 5 (expanded modes) P84 (input)/ CS 0 (output) P83 (input)/ CS 1 (output)/ IRQ 3 (input) / ADTRG (input) P82 (input)/ CS 2 (output)/ IRQ 2 (input) P81 (input)/ CS 3 (output)/ IRQ 1 (input) P80 (input/output)/ IRQ 0 (input) P84 / CS 0 P83 / CS 1 / IRQ 3 / ADTRG Port 8 P82 / CS 2 / IRQ 2 P81 / CS 3 / IRQ 1 P80 / IRQ 0 Pin functions in modes 6 and 7 (single-chip mode) P84 /(input/output) P83 /(input/output)/ IRQ 3 (input) / ADTRG (input) P82 /(input/output)/ IRQ 2 (input) P81 /(input/output)/ IRQ 1 (input) P80 /(input/output)/ IRQ 0 (input) Figure 7.8 Port 8 Pin Configuration 190 7.9.2 Register Descriptions Table 7.13 summarizes the registers of port 8. Table 7.13 Port 8 Registers Initial Value Address* H'EE007 H'FFFD7 Name Port 8 data direction register Port 8 data register Abbreviation P8DDR P8DR R/W W R/W Mode 1 to 4 H'F0 H'E0 Mode 5 to 7 H'E0 H'E0 Note: * Lower 20 bits of the address in advanced mode Port 8 Data Direction Register (P8DDR): P8DDR is an 8-bit write-only register that can select input or output for each pin in port 8. Bits 7 to 5 are reserved. They are fixed at 1, and cannot be modified. Bit Modes Initial value 1 to 4 Read/Write Modes Initial value 5 to 7 Read/Write 7 -- 1 -- 1 -- 6 -- 1 -- 1 -- 5 -- 1 -- 1 -- 4 1 W 0 W 3 0 W 0 W 2 0 W 0 W 1 0 W 0 W 0 0 W 0 W P8 4 DDR P8 3 DDR P8 2 DDR P8 1 DDR P8 0 DDR Reserved bits Port 8 data direction 4 to 0 These bits select input or output for port 8 pins * Modes 1 to 5 (Expanded Modes) When bits in P8DDR bit are set to 1, P84 to P81 become CS0 to CS3 output pins. When bits in P8DDR are cleared to 0, the corresponding pins become input ports. In modes 1 to 4 (expanded modes with on-chip ROM disabled), following a reset P84 functions as the CS0 output, while CS1 to CS3 are input ports. In mode 5 (expanded mode with on-chip ROM enabled), following a reset CS0 to CS3 are all input ports. * Modes 6 and 7 (Single-Chip Mode) Port 8 is a generic input/output port. A pin in port 8 becomes an output port if the corresponding P8DDR bit is set to 1, and an input port if this bit is cleared to 0. P8DDR is a write-only register. Its value cannot be read. All bits return 1 when read. 191 P8DDR is initialized to H'F0 in modes 1 to 4, and to H'E0 in modes 5 to 7, by a reset and in hardware standby mode. In software standby mode P8DDR retains its previous setting. Therefore, if a transition is made to software standby mode while port 8 is functioning as an input/output port and a P8DDR bit is set to 1, the corresponding pin maintains its output state. Port 8 Data Register (P8DR): P8DR is an 8-bit readable/writable register that stores output data for port 8. When port 8 functions as an output port, the value of this register is output. When a bit in P8DDR is set to 1, if port 8 is read the value of the corresponding P8DR bit is returned. When a bit in P8DDR is cleared to 0, if port 8 is read the corresponding pin logic level is read. Bits 7 to 5 are reserved. They are fixed at 1, and cannot be modified. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- Reserved bits 5 -- 1 -- 4 P84 0 R/W 3 P83 0 R/W 2 P82 0 R/W 1 P81 0 R/W 0 P80 0 R/W Port 8 data 4 to 0 These bits store data for port 8 pins P8DR is initialized to H'E0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 192 Table 7.14 Port 8 Pin Functions in Modes 1 to 5 Pin P84/CS 0 Pin Functions and Selection Method Bit P84DDR selects the pin function as follows. P84DDR Pin function 0 P84 input 1 CS 0 output P83/CS 1/IRQ3/ ADTRG Bit P83DDR selects the pin function as follows P83DDR Pin function 0 P83 input IRQ3 input ADTRG input 1 CS 1 output P82/CS 2/IRQ2 Bit P82DDR selects the pin function as follows. P82DDR Pin function 0 P82 input IRQ2 input 1 CS 2 output P81/CS 3/IRQ1 Bit P81DDR selects the pin function as follows. P81DDR Pin function 0 P81 input IRQ1 input 1 CS 3 output P80/IRQ0 Bit P80DDR selects the pin function as follows. P80DDR Pin function 0 P80 input IRQ0 input 1 P80 output 193 Table 7.15 Port 8 Pin Functions in Modes 6 and 7 Pin P84 Pin Functions and Selection Method Bit P84DDR selects the pin function as follows. P84DDR Pin function 0 P84 input 1 P84 output P83/IRQ3/ADTRG Bit P83DDR selects the pin function as follows. P83DDR Pin function 0 P83 input IRQ3 input ADTRG input 1 P83 output P82/IRQ2 Bit P82DDR selects the pin function as follows. P82DDR Pin function 0 P82 input IRQ2 input 1 P82 output P81/IRQ1 Bit P81DDR selects the pin function as follows. P81DDR Pin function 0 P81 input IRQ1 input 1 P81 output P80/IRQ0 Bit P80DDR select the pin function as follows. P80DDR Pin function 0 P80 input IRQ0 input 1 P80 output 194 7.10 7.10.1 Port 9 Overview Port 9 is a 6-bit input/output port that is also used for input and output (TxD0, TxD1, RxD0, RxD1, SCK0, SCK1) by serial communication interface channels 0 and 1 (SCI0 and SCI1), and for IRQ5 and IRQ4 input. See table 7.17 for the selection of pin functions. The IRQ5 and IRQ4 functions are selected by IER settings, regardless of whether the pin is used for input or output. Caution is therefore required. For details see section 5.3.1, External Interrupts. Port 9 has the same set of pin functions in all operating modes. Figure 7.9 shows the pin configuration of port 9. Pins in port 9 can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair. Port 9 pins P95 (input/output)/SCK 1 (input/output)/IRQ 5 (input) P94 (input/output)/SCK 0 (input/output)/IRQ 4 (input) Port 9 P93 (input/output)/RxD1 (input) P92 (input/output)/RxD0 (input) P91 (input/output)/TxD1 (output) P90 (input/output)/TxD0 (output) Figure 7.9 Port 9 Pin Configuration 195 7.10.2 Register Descriptions Table 7.16 summarizes the registers of port 9. Table 7.16 Port 9 Registers Address* H'EE008 H'FFFD8 Name Port 9 data direction register Port 9 data register Abbreviation P9DDR P9DR R/W W R/W Initial Value H'C0 H'C0 Note: * Lower 20 bits of the address in advanced mode Port 9 Data Direction Register (P9DDR): P9DDR is an 8-bit write-only register that can select input or output for each pin in port 9. Bits 7 and 6 are reserved. They are fixed at 1, and cannot be modified. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W P9 5 DDR P9 4 DDR P9 3 DDR P9 2 DDR P9 1 DDR P9 0 DDR Reserved bits Port 9 data direction 5 to 0 These bits select input or output for port 9 pins When port 9 functions as an input/output port, a pin in port 9 becomes an output port if the corresponding P9DDR bit is set to 1, and an input port if this bit is cleared to 0. For the method of selecting the pin functions, see table 7.17. P9DDR is a write-only register. Its value cannot be read. All bits return 1 when read. P9DDR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port 9 is functioning as an input/output port and a P9DDR bit is set to 1, the corresponding pin maintains its output state. 196 Port 9 Data Register (P9DR): P9DR is an 8-bit readable/writable register that stores output data for port 9. When port 9 functions as an output port, the value of this register is output. When a bit in P9DDR is set to 1, if port 9 is read the value of the corresponding P9DR bit is returned. When a bit in P9DDR is cleared to 0, if port 9 is read the corresponding pin logic level is read. Bits 7 and 6 are reserved. They are fixed at 1, and cannot be modified. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 P95 0 R/W 4 P94 0 R/W 3 P93 0 R/W 2 P92 0 R/W 1 P91 0 R/W 0 P90 0 R/W Reserved bits Port 9 data 5 to 0 These bits store data for port 9 pins P9DR is initialized to H'C0 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 197 Table 7.17 Port 9 Pin Functions Pin P95/SCK1/IRQ5 Pin Functions and Selection Method Bit C/A in SMR of SCI1, bits CKE0 and CKE1 in SCR, and bit P9 5DDR select the pin function as follows. CKE1 C/A CKE0 P95DDR Pin function 0 P95 input 0 1 P95 output 0 1 -- SCK 1 output IRQ5 input 0 1 -- -- SCK 1 output 1 -- -- -- SCK 1 input P94/SCK0/IRQ4 Bit C/A in SMR of SCI0, bits CKE0 and CKE1 in SCR, and bit P9 4DDR select the pin function as follows. CKE1 C/A CKE0 P94DDR Pin function 0 P94 input 0 1 P94 output 0 1 -- SCK 0 output IRQ4 input 0 1 -- -- SCK 0 output 1 -- -- -- SCK 0 input P93/RxD1 Bit RE in SCR of SCI1, bit SMIF in SCMR, and bit P9 3DDR select the pin function as follows. SMIF RE P93DDR Pin function 0 P93 input 0 1 P93 output 0 1 -- RxD1 input 1 -- -- RxD1 input P92/RxD0 Bit RE in SCR of SCI0, bit SMIF in SCMR, and bit P9 2DDR select the pin function as follows. SMIF RE P92DDR Pin function 0 P92 input 0 1 P92 output 0 1 -- RxD0 input 1 -- -- RxD0 input 198 Pin P91/TxD1 Pin Functions and Selection Method Bit TE in SCR of SCI1, bit SMIF in SCMR, and bit P9 1DDR select the pin function as follows. SMIF TE P91 DDR Pin function 0 P91 input 0 1 P91 output 0 1 -- 1 -- -- TxD1 output TxD1 output * Note: * Functions as the TxD1 output pin, but there are two states: one in which the pin is driven, and another in which the pin is at highimpedance. P90/TxD0 Bit TE in SCR of SCI0, bit SMIF in SCMR, and bit P9 0DDR select the pin function as follows. SMIF TE P90DDR Pin function 0 P90 input 0 1 P90 output 0 1 -- 1 -- -- TxD0 output TxD0 output * Note: * Functions as the TxD0 output pin, but there are two states: one in which the pin is driven, and another in which the pin is at highimpedance. 199 7.11 7.11.1 Port A Overview Port A is an 8-bit input/output port that is also used for output (TP7 to TP0) from the programmable timing pattern controller (TPC), input and output (TIOCB2, TIOCA 2, TIOCB1, TIOCA 1, TIOCB0, TIOCA 0, TCLKD, TCLKC, TCLKB, TCLKA) by the 16-bit timer, clock input (TCLKD, TCLKC, TCLKB, TCLKA) to the 8-bit timer, and address output (A23 to A20). A reset or hardware standby transition leaves port A as an input port, except that in modes 3 and 4, one pin is always used for A20 output. See table 7.19 to 7.21 for the selection of pin functions. Usage of pins for TPC, 16-bit timer, and 8-bit timer input and output is described in the sections on those modules. For output of address bits A23 to A20 in modes 3, 4, and 5, see section 6.2.4, Bus Release Control Register (BRCR). Pins not assigned to any of these functions are available for generic input/output. Figure 7.10 shows the pin configuration of port A. Pins in port A can drive one TTL load and a 30-pF capacitive load. They can also drive a darlington transistor pair. Port A has Schmitt-trigger inputs. 200 Port A pins PA 7 /TP7 /TIOCB2 /A20 PA 6 /TP6 /TIOCA2 /A21 PA 5 /TP5 /TIOCB1 /A22 PA 4 /TP4 /TIOCA1 /A23 Port A PA 3 /TP3 /TIOCB0 /TCLKD PA 2 /TP2 /TIOCA0 /TCLKC PA 1 /TP1 /TCLKB PA 0 /TP0 /TCLKA Pin functions in modes 1, 2, 6 and 7 PA 7 (input/output)/TP 7 (output)/TIOCB 2 (input/output) PA 6 (input/output)/TP 6 (output)/TIOCA 2 (input/output) PA 5 (input/output)/TP 5 (output)/TIOCB 1 (input/output) PA 4 (input/output)/TP 4 (output)/TIOCA 1 (input/output) PA 3 (input/output)/TP 3 (output)/TIOCB 0 (input/output)/TCLKD (input) PA 2 (input/output)/TP 2 (output)/TIOCA 0 (input/output)/TCLKC (input) PA 1 (input/output)/TP 1 (output)/TCLKB (input) PA 0 (input/output)/TP 0 (output)/TCLKA (input) Pin functions in modes 3 and 4 A 20 (output) PA 6 (input/output)/TP 6 (output)/TIOCA 2 (input/output)/A 21(output) PA 5 (input/output)/TP 5 (output)/TIOCB 1 (input/output)/A 22(output) PA 4 (input/output)/TP 4 (output)/TIOCA 1 (input/output)/A 23(output) PA 3 (input/output)/TP 3 (output)/TIOCB 0 (input/output)/TCLKD (input) PA 2 (input/output)/TP 2 (output)/TIOCA 0 (input/output)/TCLKC (input) PA 1 (input/output)/TP 1 (output)/TCLKB (input) PA 0 (input/output)/TP 0 (output)/TCLKA (input) Pin functions in mode 5 PA 7 (input/output)/TP7 (output)/TIOCB2 (input/output)/A 20 (output) PA 6 (input/output)/TP6 (output)/TIOCA2 (input/output)/A 21 (output) PA 5 (input/output)/TP5 (output)/TIOCB1 (input/output)/A 22 (output) PA 4 (input/output)/TP4 (output)/TIOCA1 (input/output)/A 23 (output) PA 3 (input/output)/TP3 (output)/TIOCB0 (input/output)/TCLKD (input) PA 2 (input/output)/TP2 (output)/TIOCA0 (input/output)/TCLKC (input) PA 1 (input/output)/TP1 (output)/TCLKB (input) PA 0 (input/output)/TP0 (output)/TCLKA (input) Figure 7.10 Port A Pin Configuration 201 7.11.2 Register Descriptions Table 7.18 summarizes the registers of port A. Table 7.18 Port A Registers Initial Value Address* H'EE009 H'FFFD9 Name Port A data direction register Port A data register PADDR PADR R/W W R/W Modes 1, 2, 5, 6 and 7 H'00 H'00 Modes 3, 4 H'80 H'00 Note: * Lower 20 bits of the address in advanced mode Port A Data Direction Register (PADDR): PADDR is an 8-bit write-only register that can select input or output for each pin in port A. When pins are used for TPC output, the corresponding PADDR bits must also be set. Bit 7 6 0 W 0 W 5 0 W 0 W 4 0 W 0 W 3 0 W 0 W 2 0 W 0 W 1 0 W 0 W 0 0 W 0 W PA 7 DDR PA 6 DDR PA 5 DDR PA 4 DDR PA 3 DDR PA 2 DDR PA 1 DDR PA 0 DDR Modes Initial value 1 3 and 4 Read/Write -- Modes Initial value 0 1, 2, 5, 6 and 7 Read/Write W Port A data direction 7 to 0 These bits select input or output for port A pins The pin functions that can be selected for pins PA7 to PA 4 differ between modes 1, 2, 6, and 7, and modes 3 to 5. For the method of selecting the pin functions, see tables 7.19 and 7.20. The pin functions that can be selected for pins PA3 to PA 0 are the same in modes 1 to 7. For the method of selecting the pin functions, see table 7.21. When port A functions as an input/output port, a pin in port A becomes an output port if the corresponding PADDR bit is set to 1, and an input port if this bit is cleared to 0. In modes 3 and 4, PA7DDR is fixed at 1 and PA7 functions as the A20 address output pin. PADDR is a write-only register. Its value cannot be read. All bits return 1 when read. PADDR is initialized to H'00 by a reset and in hardware standby mode in modes 1, 2, 5, 6, and 7. It is initialized to H'80 by a reset and in hardware standby mode in modes 3 and 4. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby 202 mode while port A is functioning as an input/output port and a PADDR bit is set to 1, the corresponding pin maintains its output state. Port A Data Register (PADR): PADR is an 8-bit readable/writable register that stores output data for port A. When port A functions as an output port, the value of this register is output. When a bit in PADDR is set to 1, if port A is read the value of the corresponding PADR bit is returned. When a bit in PADDR is cleared to 0, if port A is read the corresponding pin logic level is read. Bit Initial value Read/Write 7 PA7 0 R/W 6 PA6 0 R/W 5 PA5 0 R/W 4 PA4 0 R/W 3 PA3 0 R/W 2 PA2 0 R/W 1 PA1 0 R/W 0 PA0 0 R/W Port A data 7 to 0 These bits store data for port A pins PADR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 203 Table 7.19 Port A Pin Functions (Modes 1, 2, 6, and 7) Pin PA7/TP7/ TIOCB2 Pin Functions and Selection Method Bit PWM2 in TMDR, bits IOB2 to IOB0 in TIOR2, bit NDER7 in NDERA, and bit PA7DDR select the pin function as follows. 16-bit timer channel 2 settings PA7DDR NDER7 Pin function (1) in table below -- -- TIOCB2 output 0 -- PA7 input (2) in table below 1 0 PA7 output TIOCB2 input* Note: * TIOCB2 input when IOB2 = 1 and PWM2 = 0. 16-bit timer channel 2 settings IOB2 IOB1 IOB0 0 0 (2) 0 0 1 1 -- (1) (2) 1 -- -- 1 1 TP 7 output PA6/TP6/ TIOCA2 Bit PWM2 in TMDR, bits IOA2 to IOA0 in TIOR2, bit NDER6 in NDERA, and bit PA6DDR select the pin function as follows. 16-bit timer channel 2 settings PA6DDR NDER6 Pin function (1) in table below -- -- TIOCA2 output 0 -- PA6 input (2) in table below 1 0 PA6 output TIOCA2 input* Note: * TIOCA2 input when IOA2 = 1. 16-bit timer channel 2 settings PWM2 IOA2 IOA1 IOA0 0 0 0 0 1 1 -- (2) (1) 0 1 -- -- (2) (1) 1 -- -- -- 1 1 TP 6 output 204 Pin PA5/TP5/ TIOCB1 Pin Functions and Selection Method Bit PWM1 in TMDR, bits IOB2 to IOB0 in TIOR1, bit NDER5 in NDERA, and bit PA5DDR select the pin function as follows. 16-bit timer channel 1 settings PA5DDR NDER5 Pin function (1) in table below -- -- TIOCB1 output 0 -- PA5 input (2) in table below 1 0 PA5 output TIOCB1 input* Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0. 16-bit timer channel 1 settings IOB2 IOB1 IOB0 0 0 (2) 0 0 1 1 -- (1) (2) 1 -- -- 1 1 TP 5 output PA4/TP4/ TIOCA1 Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, and bit PA4DDR select the pin function as follows. 16-bit timer channel 1 settings PA4DDR NDER4 Pin function (1) in table below -- -- TIOCA1 output 0 -- PA4 input (2) in table below 1 0 PA4 output TIOCA1 input* Note: * TIOCA1 input when IOA2 = 1. 16-bit timer channel 1 settings PWM1 IOA2 IOA1 IOA0 0 0 0 0 1 1 -- (2) (1) 0 1 -- -- (2) (1) 1 -- -- -- 1 1 TP 4 output 205 Table 7.20 Port A Pin Functions (Modes 3 to 5) Pin Pin Functions and Selection Method Modes 3 and 4: Always used as A20 output. PA7/TP7/ TIOCB2/ A20 Pin function A20 output Mode 5: Bit PWM2 in TMDR, bits IOB2 to IOB0 in TIOR2, bit NDER7 in NDERA, bit A20E in BRCR, and bit PA7DDR select the pin function as follows. A20E 16-bit timer channel 2 settings PA7DDR NDER7 Pin function (1) in table below -- -- TIOCB2 output 0 -- PA7 input 1 (2) in table below 1 0 PA7 output TIOCB2 input* Note: * TIOCB2 input when IOB2 = 1 and PWM2 = 0. 16-bit timer channel 2 settings IOB2 IOB1 IOB0 0 0 (2) 0 0 1 1 -- (1) (2) 1 -- -- 1 1 TP 7 output 0 -- -- -- A20 output 206 Pin Pin Functions and Selection Method Bit PWM2 in TMDR, bits IOA2 to IOA0 in TIOR2, bit NDER6 in NDERA, bit A21E in PA6/TP6/ TIOCA2/A 21 BRCR, and bit PA6DDR select the pin function as follows. A21E 16-bit timer channel 2 settings PA6DDR NDER6 Pin function (1) in table below -- -- TIOCA2 output 0 -- PA6 input 1 (2) in table below 1 0 PA6 output TIOCA2 input* Note: * TIOCA2 input when IOA2 = 1. 16-bit timer channel 2 settings PWM2 IOA2 IOA1 IOA0 0 0 0 0 1 1 -- (2) (1) 0 1 -- -- (2) (1) 1 -- -- -- 1 1 TP 6 output 0 -- -- -- A21 output PA5/TP5/ Bit PWM1 in TMDR, bits IOB2 to IOB0 in TIOR1, bit NDER5 in NDERA, bit A22E in TIOCB1/A 22 BRCR, and bit PA5DDR select the pin function as follows. A22E 16-bit timer channel 1 settings PA5DDR NDER5 Pin function (1) in table below -- -- TIOCB1 output 0 -- PA5 input 1 (2) in table below 1 0 PA5 output TIOCB1 input* Note: * TIOCB1 input when IOB2 = 1 and PWM1 = 0. 16-bit timer channel 1 settings IOB2 IOB1 IOB0 0 0 (2) 0 0 1 1 -- (1) (2) 1 -- -- 1 1 TP 5 output 0 -- -- -- A22 output 207 Pin Pin Functions and Selection Method Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, bit A23E in PA4/TP4/ TIOCA1/A 23 BRCR, and bit PA4DDR select the pin function as follows. A23E 16-bit timer channel 1 settings PA4DDR NDER4 Pin function (1) in table below -- -- TIOCA1 output 0 -- PA4 input 1 (2) in table below 1 0 PA4 output TIOCA1 input* Note: * TIOCA1 input when IOA2 = 1. 16-bit timer channel 1 settings PWM1 IOA2 IOA1 IOA0 0 0 0 0 1 1 -- (2) (1) 0 1 -- -- (2) (1) 1 -- -- -- 1 1 TP 4 output 0 -- -- -- A23 output 208 Table 7.21 Port A Pin Functions (Modes 1 to 7) Pin PA3/TP3/ TIOCB0/ TCLKD Pin Functions and Selection Method Bit PWM0 in TMDR, bits IOB2 to IOB0 in TIOR0, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR2 of the 8-bit timer, bit NDER3 in NDERA, and bit PA 3DDR select the pin function as follows. 16-bit timer channel 0 settings PA3DDR NDER3 Pin function (1) in table below -- -- TIOCB0 output 0 -- PA3 input (2) in table below 1 0 PA3 output TIOCB0 input* 1 TCLKD input * 2 Notes: *1 TIOCB0 input when IOB2 = 1 and PWM0 = 0. *2 TCLKD input when TPSC2 = TPSC1 = TPSC0 = 1 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR2 are as shown in (3) in the table below. 16-bit timer channel 0 settings IOB2 IOB1 IOB0 0 0 (2) 0 0 1 1 -- (1) (2) 1 -- -- 1 1 TP 3 output 8-bit timer channel 2 settings CKS2 CKS1 CKS0 0 -- -- (4) 1 0 0 1 (3) 1 -- 209 Pin PA2/TP2/ TIOCA0/ TCLKC Pin Functions and Selection Method Bit PWM0 in TMDR, bits IOA2 to IOA0 in TIOR0, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR0 of the 8-bit timer, bit NDER2 in NDERA, and bit PA 2DDR select the pin function as follows. 16-bit timer channel 0 settings PA2DDR NDER2 Pin function (1) in table below -- -- TIOCA0 output 0 -- PA2 input (2) in table below 1 0 PA2 output TIOCA0 input* 1 TCLKC input * 2 Notes: *1 TIOCA0 input when IOA2 = 1. *2 TCLKC input when TPSC2 = TPSC1 = 1 and TPSC0 = 0 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR0 are as shown in (3) in the table below. 16-bit timer channel 0 settings PWM0 IOA2 IOA1 IOA0 0 0 0 0 1 1 -- (2) (1) 0 1 -- -- (2) (1) 1 -- -- -- 1 1 TP 2 output 8-bit timer channel 0 settings CKS2 CKS1 CKS0 0 -- -- (4) 1 0 0 1 (3) 1 -- 210 Pin PA1/TP1/ TCLKB Pin Functions and Selection Method Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR3 of the 8-bit timer, bit NDER1 in NDERA, and bit PA1DDR select the pin function as follows. PA1DDR NDER1 Pin function 0 -- PA1 input 1 0 PA1 output TCLKB input* Note: * CLKB input when MDF = 1 in TMDR, or TPSC2 = 1, TPSC1 = 0, and TPSC0 = 1 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR3 are as shown in (1) in the table below. 8-bit timer channel 3 settings CKS2 CKS1 CKS0 0 -- -- 0 0 1 (2) 1 1 -- (1) 1 1 TP 1 output PA0/TP0/ TCLKA Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer, bits CKS2 to CKS0 in 8TCR1 of the 8-bit timer, bit NDER0 in NDERA, and bit PA0DDR select the pin function as follows. PA0DDR NDER0 Pin function 0 -- PA0 input 0 PA0 output TCLKA input* Note: * TCLKA input when MDF = 1 in TMDR, or TPSC2 = 1 and TPSC1 = 0, and TPSC0 = 0 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in 8TCR1 are as shown in (1) in the table below. 8-bit timer channel 1 settings CKS2 CKS1 CKS0 0 -- -- 0 0 1 (2) 1 1 -- (1) 1 1 TP 0 output 211 7.12 7.12.1 Port B Overview Port B is an 8-bit input/output port that is also used for output (TP15 to TP8) from the programmable timing pattern controller (TPC), input/output (TMIO3, TMO2, TMIO1, TMO0) by the 8-bit timer, and CS7 to CS4 output. See tables 7.23 and 7.24 for the selection of pin functions. A reset or hardware standby transition leaves port B as an input/output port. For output of CS7 to CS4 in modes 1 to 5, see section 6.3.4, Chip Select Signals. Pins not assigned to any of these functions are available for generic input/output. Figure 7.11 shows the pin configuration of port B. Pins in port B can drive one TTL load and a 30-pF capacitive load. They can also drive darlington transistor pair. 212 Port B pins PB7/TP15 PB6/TP14 PB5/TP13 PB4/TP12 Port B PB3/TP11 /TMIO3/CS4 PB2/TP10 /TMO2/CS5 PB1/TP9 /TMIO1/CS6 PB0/TP8 /TMO0/CS7 Pin functions in modes 1 to 5 PB7 (input/output)/TP15 (output) PB6 (input/output)/TP14 (output) PB5 (input/output)/TP13 (output) PB4 (input/output)/TP12 (output) PB3 (input/output)/TP11 (output) /TMIO3 (input/output) /CS4 (output) PB2 (input/output)/TP10 (output) /TMO2 (output) /CS5 (output) PB1 (input/output)/TP9 (output) /TMIO1 (input/output) /CS6 (output) PB0 (input/output)/TP8 (output) /TMO0 (output) /CS7 (output) Pin functions in modes 6 and 7 PB7 (input/output)/TP15 (output) PB6 (input/output)/TP14 (output) PB5 (input/output)/TP13 (output) PB4 (input/output)/TP12 (output) PB3 (input/output)/TP11 (output) /TMIO3 (input/output) PB2 (input/output)/TP10 (output) /TMO2 (output) PB1 (input/output)/TP9 (output) /TMIO1 (input/output) PB0 (input/output)/TP8 (output) /TMO0 (output) Figure 7.11 Port B Pin Configuration 213 7.12.2 Register Descriptions Table 7.22 summarizes the registers of port B. Table 7.22 Port B Registers Address* H'EE00A H'FFFDA Name Port B data direction register Port B data register Abbreviation PBDDR PBDR R/W W R/W Initial Value H'00 H'00 Note: * Lower 20 bits of the address in advanced mode. Port B Data Direction Register (PBDDR): PBDDR is an 8-bit write-only register that can select input or output for each pin in port B. When pins are used for TPC output, the corresponding PBDDR bits must also be set. Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR Port B data direction 7 to 0 These bits select input or output for port B pins The pin functions that can be selected for port B differ between modes 1 to 5, and modes 6 and 7. For the method of selecting the pin functions, see tables 7.23 and 7.24. When port B functions as an input/output port, a pin in port B becomes an output port if the corresponding PBDDR bit is set to 1, and an input port if this bit is cleared to 0. PBDDR is a write-only register. Its value cannot be read. All bits return 1 when read. PBDDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. Therefore, if a transition is made to software standby mode while port B is functioning as an input/output port and a PBDDR bit is set to 1, the corresponding pin maintains its output state. 214 Port B Data Register (PBDR): PBDR is an 8-bit readable/writable register that stores output data for pins port B. When port B functions as an output port, the value of this register is output. When a bit in PBDDR is set to 1, if port B is read the value of the corresponding PBDR bit is returned. When a bit in PBDDR is cleared to 0, if port B is read the corresponding pin logic level is read. Bit Initial value Read/Write 7 PB7 0 R/W 6 PB6 0 R/W 5 PB5 0 R/W 4 PB4 0 R/W 3 PB3 0 R/W 2 PB2 0 R/W 1 PB1 0 R/W 0 PB0 0 R/W Port B data 7 to 0 These bits store data for port B pins PBDR is initialized to H'00 by a reset and in hardware standby mode. In software standby mode it retains its previous setting. 215 Table 7.23 Port B Pin Functions (Modes 1 to 5) Pin PB7/TP15 Pin Functions and Selection Method Bit NDER15 in NDERB and bit PB7DDR select the pin function as follows. PB7DDR NDER15 Pin function 0 -- PB7 input 1 0 PB7 output 1 1 TP 15 output PB6/TP14 Bit NDER14 in NDERB and bit PB6DDR select the pin function as follows. PB6DDR NDER14 Pin function 0 -- PB6 input 1 0 PB6 output 1 1 TP 14 output PB5/TP13 Bit NDER13 in NDERB and bit PB5DDR select the pin function as follows. PB5DDR NDER13 Pin function 0 -- PB5 input 1 0 PB5 output 1 1 TP 13 output PB4/TP12 Bit NDER12 in NDERB and bit PB4DDR select the pin function as follows. PB4DDR NDER12 Pin function 0 -- PB4 input 1 0 PB4 output 1 1 TP 12 output PB3/TP11 / TMIO3/CS 4 Bits OIS3/2 and OS1/0 in 8TCSR3, bits CCLR1/0 in 8TCR3, bit CS4E in CSCR, bit NDER11 in NDERB, and bit PB 3DDR select the pin function as follows. OIS3/2 and OS1/0 CS4E PB3DDR NDER11 Pin function 0 -- PB3 input 0 1 0 PB3 output 1 1 TP 11 output All 0 1 -- -- CS 4 output Not all 0 -- -- -- TMIO3 output TMIO3 input* Note: * TMIO3 input when bit ICE = 1 in 8TCSR3. 216 Pin PB2/TP10 / TMO2/CS 5 Pin Functions and Selection Method Bits OIS3/2 and OS1/0 in 8TCSR2, bit CS5E in CSCR, bit NDER10 in NDERB, and bit PB2DDR select the pin function as follows. OIS3/2 and OS1/0 CS5E PB2DDR NDER10 Pin function 0 -- PB2 input 0 1 0 PB2 output 1 1 TP 10 output All 0 1 -- -- CS 5 output Not all 0 -- -- -- TMIO2 output PB1/TP9/ TMIO1/CS 6 Bits OIS3/2 and OS1/0 in 8TCSR1, bits CCLR1/0 in 8TCR1, bit CS6E in CSCR, bit NDER9 in NDERB, and bit PB 1DDR select the pin function as follows. OIS3/2 and OS1/0 CS6E PB1DDR NDER9 Pin function 0 -- PB1 input 0 1 0 PB1 output 1 1 TP 9 output TMIO1 input* Note: * TMIO1 input when bit ICE = 1 in 8TCSR1. All 0 1 -- -- CS 6 output Not all 0 -- -- -- TMIO1 output PB0/TP8/ TMO0/CS 7 Bits OIS3/2 and OS1/0 in 8TCSR0, bit CS7E in CSCR, bit NDER8 in NDERB, and bit PB0DDR select the pin function as follows. OIS3/2 and OS1/0 CS7E PB0DDR NDER8 Pin function 0 -- PB0 input 0 1 0 PB0 output 1 1 TP 8 output All 0 1 -- -- CS 7 output Not all 0 -- -- -- TMO0 output 217 Table 7.24 Port B Pin Functions (Modes 6 and 7) Pin PB7/TP15 Pin Functions and Selection Method Bit NDER15 in NDERB and bit PB7DDR select the pin function as follows. PB7DDR NDER15 Pin function 0 -- PB7 input 1 0 PB7 output 1 1 TP 15 output PB6/TP14 Bit NDER14 in NDERB and bit PB6DDR select the pin function as follows. PB6DDR NDER14 Pin function 0 -- PB6 input 1 0 PB6 output 1 1 TP 14 output PB5/TP13 Bit NDER13 in NDERB and bit PB5DDR select the pin function as follows. PB5DDR NDER13 Pin function 0 -- PB5 input 1 0 PB5 output 1 1 TP 13 output PB4/TP12 Bit NDER12 in NDERB and bit PB4DDR select the pin function as follows. PB4DDR NDER12 Pin function 0 -- PB4 input 1 0 PB4 output 1 1 TP 12 output PB3/TP11 / TMIO3 Bits OIS3/2 and OS1/0 in 8TCSR3, bits CCLR1/0 in 8TCR3, bit NDER11 in NDERB, and bit PB 3DDR select the pin function as follows. OIS3/2 and OS1/0 PB3DDR NDER11 Pin function 0 -- PB3 input All 0 1 0 PB3 output 1 1 TP 11 output Not all 0 -- -- TMIO3 output TMIO3 input* Note: * TMIO3 input when bit ICE = 1 in 8TCSR3. 218 Pin PB2/TP10 / TMO2 Pin Functions and Selection Method Bits OIS3/2 and OS1/0 in 8TCSR2, bit NDER10 in NDERB, and bit PB2DDR select the pin function as follows. OIS3/2 and OS1/0 PB2DDR NDER10 Pin function 0 -- PB2 input All 0 1 0 PB2 output 1 1 TP 10 output Not all 0 -- -- TMO2 output PB1/TP9/ TMIO1 Bits OIS3/2 and OS1/0 in 8TCSR1, bits CCLR1 and CCLR0 in 8TCR0, bit NDER9 in NDERB, and bit PB1DDR select the pin function as follows. OIS3/2 and OS1/0 PB1DDR NDER9 Pin function 0 -- PB1 input All 0 1 0 PB1 output 1 1 TP 9 output Not all 0 -- -- TMIO1 output TMIO1 input* Note: * TMIO1 input when bit ICE = 1 in 8TCSR1. PB2/TP8/ TMO0 Bits OIS3/2 and OS1/0 in 8TCSR0, bit NDER8 in NDERB, and bit PB0DDR select the pin function as follows. OIS3/2 and OS1/0 PB2DDR NDER8 Pin function 0 -- PB0 input All 0 1 0 PB0 output 1 1 TP 8 output Not all 0 -- -- TMO0 output 219 220 Section 8 16-Bit Timer 8.1 Overview The H8/3062 Series has built-in 16-bit timer module with three 16-bit counter channels. 8.1.1 Features 16-bit timer features are listed below. * Capability to process up to six pulse outputs or six pulse inputs * Six general registers (GRs, two per channel) with independently-assignable output compare or input capture functions * Selection of eight counter clock sources for each channel: Internal clocks: , /2, /4, /8 External clocks: TCLKA, TCLKB, TCLKC, TCLKD * Five operating modes selectable in all channels: Waveform output by compare match Selection of 0 output, 1 output, or toggle output (only 0 or 1 output in channel 2) Input capture function Rising edge, falling edge, or both edges (selectable) Counter clearing function Counters can be cleared by compare match or input capture Synchronization Two or more timer counters (16TCNTs) can be preset simultaneously, or cleared simultaneously by compare match or input capture. Counter synchronization enables synchronous register input and output. PWM mode PWM output can be provided with an arbitrary duty cycle. With synchronization, up to three-phase PWM output is possible * Phase counting mode selectable in channel 2 Two-phase encoder output can be counted automatically. * High-speed access via internal 16-bit bus The 16TCNTs and GRs can be accessed at high speed via a 16-bit bus. * Any initial timer output value can be set * Nine interrupt sources Each channel has two compare match/input capture interrupts and an overflow interrupt. All interrupts can be requested independently. 221 * Output triggering of programmable timing pattern controller (TPC) Compare match/input capture signals from channels 0 to 2 can be used as TPC output triggers. Table 8.1 summarizes the 16-bit timer functions. Table 8.1 Item Clock sources 16-bit timer Functions Channel 0 Channel 1 Channel 2 Internal clocks: , /2, /4, /8 External clocks: TCLKA, TCLKB, TCLKC, TCLKD, selectable independently General registers (output compare/input capture registers) Input/output pins Counter clearing function Initial output value setting function Compare match output 0 1 Toggle Input capture function Synchronization PWM mode Phase counting mode Interrupt sources GRA0, GRB0 GRA1, GRB1 GRA2, GRB2 TIOCA0, TIOCB0 GRA0/GRB0 compare match or input capture Available Available Available Available Available Available Available Not available Three sources TIOCA1, TIOCB1 GRA1/GRB1 compare match or input capture Available Available Available Available Available Available Available Not available Three sources TIOCA2, TIOCB2 GRA2/GRB2 compare match or input capture Available Available Available Not available Available Available Available Available Three sources * Compare match/input * Compare match/input * Compare match/input capture A0 capture A1 capture A2 * Compare match/input * Compare match/input * Compare match/input capture B0 capture B1 capture B2 * Overflow * Overflow * Overflow 222 8.1.2 Block Diagrams 16-bit timer Block Diagram (Overall): Figure 8.1 is a block diagram of the 16-bit timer. TCLKA to TCLKD , /2, /4, /8 Clock selector Control logic IMIA0 to IMIA2 IMIB0 to IMIB2 OVI0 to OVI2 TIOCA0 to TIOCA2 TIOCB0 to TIOCB2 TSTR 16-bit timer channel 2 16-bit timer channel 1 16-bit timer channel 0 TSNR Bus interface TMDR TOLR TISRA TISRB TISRC Module data bus Legend: TSTR : TSNR : TMDR : TOLR : TISRA : TISRB : TISRC : Internal data bus 223 Timer start register (8 bits) Timer synchro register (8 bits) Timer mode register (8 bits) Timer output level setting register (8 bits) Timer interrupt status register A (8 bits) Timer interrupt status register B (8 bits) Timer interrupt status register C (8 bits) Figure 8.1 16-bit timer Block Diagram (Overall) Block Diagram of Channels 0 and 1: 16-bit timer channels 0 and 1 are functionally identical. Both have the structure shown in figure 8.2. TCLKA to TCLKD , /2, /4, /8 Clock selector Control logic Comparator TIOCA0 TIOCB0 IMIA0 IMIB0 OVI0 16TCNT 16TCR Module data bus Legend: 16TCNT GRA, GRB TCR TIOR : : : : Timer counter (16 bits) General registers A and B (input capture/output compare registers) (16 bits x 2) Timer control register (8 bits) Timer I/O control register (8 bits) Figure 8.2 Block Diagram of Channels 0 and 1 224 TIOR GRA GRB Block Diagram of Channel 2: Figure 8.3 is a block diagram of channel 2 TCLKA to TCLKD , /2, /4, /8 Clock selector Control logic Comparator TIOCA2 TIOCB2 IMIA2 IMIB2 OVI2 16TCNT2 16TCR2 Module data bus Legend: 16TCNT2 : Timer counter 2 (16 bits) GRA2, GRB2 : General registers A2 and B2 (input capture/output compare registers) (16 bits x 2) TCR2 : Timer control register 2 (8 bits) TIOR2 : Timer I/O control register 2 (8 bits) Figure 8.3 Block Diagram of Channel 2 TIOR2 GRA2 GRB2 225 8.1.3 Pin Configuration Table 8.2 summarizes the 16-bit timer pins. Table 8.2 16-bit timer Pins Abbreviation TCLKA TCLKB TCLKC TCLKD Input/ Output Input Input Input Input Input/ output Input/ output Input/ output Input/ output Input/ output Input/ output Function External clock A input pin (phase-A input pin in phase counting mode) External clock B input pin (phase-B input pin in phase counting mode) External clock C input pin External clock D input pin GRA0 output compare or input capture pin PWM output pin in PWM mode GRB0 output compare or input capture pin GRA1 output compare or input capture pin PWM output pin in PWM mode GRB1 output compare or input capture pin GRA2 output compare or input capture pin PWM output pin in PWM mode GRB2 output compare or input capture pin Channel Name Common Clock input A Clock input B Clock input C Clock input D 0 Input capture/output TIOCA0 compare A0 Input capture/output TIOCB0 compare B0 1 Input capture/output TIOCA1 compare A1 Input capture/output TIOCB1 compare B1 2 Input capture/output TIOCA2 compare A2 Input capture/output TIOCB2 compare B2 226 8.1.4 Register Configuration Table 8.3 summarizes the 16-bit timer registers. Table 8.3 Channel Common 16-bit timer Registers Address* 1 H'FFF60 H'FFF61 H'FFF62 H'FFF63 H'FFF64 H'FFF65 H'FFF66 Name Timer start register Timer synchro register Timer mode register Timer output level setting register Timer interrupt status register A Timer interrupt status register B Timer interrupt status register C Timer control register 0 Timer I/O control register 0 Timer counter 0H Timer counter 0L General register A0H General register A0L General register B0H General register B0L Timer control register 1 Timer I/O control register 1 Timer counter 1H Timer counter 1L General register A1H General register A1L General register B1H General register B1L Abbreviation TSTR TSNC TMDR TOLR TISRA TISRB TISRC 16TCR0 TIOR0 R/W R/W R/W R/W W R/(W) * R/(W) * R/(W) * R/W R/W 2 2 2 Initial Value H'F8 H'F8 H'98 H'C0 H'88 H'88 H'88 H'80 H'88 H'00 H'00 H'FF H'FF H'FF H'FF H'80 H'88 H'00 H'00 H'FF H'FF H'FF H'FF 0 H'FFF68 H'FFF69 H'FFF6A H'FFF6B H'FFF6C H'FFF6D H'FFF6E H'FFF6F 16TCNT0H R/W 16TCNT0L R/W GRA0H GRA0L GRB0H GRB0L 16TCR1 TIOR1 R/W R/W R/W R/W R/W R/W 1 H'FFF70 H'FFF71 H'FFF72 H'FFF73 H'FFF74 H'FFF75 H'FFF76 H'FFF77 16TCNT1H R/W 16TCNT1L R/W GRA1H GRA1L GRB1H GRB1L R/W R/W R/W R/W 227 Channel 2 Address* 1 H'FFF78 H'FFF79 H'FFF7A H'FFF7B H'FFF7C H'FFF7D H'FFF7E H'FFF7F Name Timer control register 2 Timer I/O control register 2 Timer counter 2H Timer counter 2L General register A2H General register A2L General register B2H General register B2L Abbreviation 16TCR2 TIOR2 R/W R/W R/W Initial Value H'80 H'88 H'00 H'00 H'FF H'FF H'FF H'FF 16TCNT2H R/W 16TCNT2L R/W GRA2H GRA2L GRB2H GRB2L R/W R/W R/W R/W Notes: *1 The lower 20 bits of the address in advanced mode are indicated. *2 Only 0 can be written in bits 3 to 0, to clear the flags. 8.2 8.2.1 Register Descriptions Timer Start Register (TSTR) TSTR is an 8-bit readable/writable register that starts and stops the timer counter (16TCNT) in channels 0 to 2. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- Reserved bits 4 -- 1 -- 3 -- 1 -- 2 STR2 0 R/W 1 STR1 0 R/W 0 STR0 0 R/W Counter start 2 to 0 These bits start and stop 16TCNT2 to 16TCNT0 TSTR is initialized to H'F8 by a reset and in standby mode. Bits 7 to 3--Reserved: These bits cannot be modified and are always read as 1. Bit 2--Counter Start 2 (STR2): Starts and stops timer counter 2 (16TCNT2). Bit 2 STR2 0 1 Description 16TCNT2 is halted 16TCNT2 is counting (Initial value) 228 Bit 1--Counter Start 1 (STR1): Starts and stops timer counter 1 (16TCNT1). Bit 1 STR1 0 1 Description 16TCNT1 is halted 16TCNT1 is counting (Initial value) Bit 0--Counter Start 0 (STR0): Starts and stops timer counter 0 (16TCNT0). Bit 0 STR0 0 1 Description 16TCNT0 is halted 16TCNT0 is counting (Initial value) 8.2.2 Timer Synchro Register (TSNC) TSNC is an 8-bit readable/writable register that selects whether channels 0 to 2 operate independently or synchronously. Channels are synchronized by setting the corresponding bits to 1. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- Reserved bits 4 -- 1 -- 3 -- 1 -- 2 SYNC2 0 R/W 1 SYNC1 0 R/W 0 SYNC0 0 R/W Timer sync 2 to 0 These bits synchronize channels 2 to 0 TSNC is initialized to H'F8 by a reset and in standby mode. Bits 7 to 3--Reserved: These bits cannot be modified and are always read as 1. Bit 2--Timer Sync 2 (SYNC2): Selects whether channel 2 operates independently or synchronously. Bit 2 SYNC2 0 1 Description Channel 2's timer counter (16TCNT2) operates independently 16TCNT2 is preset and cleared independently of other channels Channel 2 operates synchronously 16TCNT2 can be synchronously preset and cleared (Initial value) 229 Bit 1--Timer Sync 1 (SYNC1): Selects whether channel 1 operates independently or synchronously. Bit 1 SYNC1 0 1 Description Channel 1's timer counter (16TCNT1) operates independently 16TCNT1 is preset and cleared independently of other channels Channel 1 operates synchronously 16TCNT1 can be synchronously preset and cleared (Initial value) Bit 0--Timer Sync 0 (SYNC0): Selects whether channel 0 operates independently or synchronously. Bit 0 SYNC0 0 1 Description Channel 0's timer counter (16TCNT0) operates independently 16TCNT0 is preset and cleared independently of other channels Channel 0 operates synchronously 16TCNT0 can be synchronously preset and cleared (Initial value) 8.2.3 Timer Mode Register (TMDR) TMDR is an 8-bit readable/writable register that selects PWM mode for channels 0 to 2. It also selects phase counting mode and the overflow flag (OVF) setting conditions for channel 2. Bit Initial value Read/Write 7 -- 1 -- 6 MDF 0 R/W 5 FDIR 0 R/W 4 -- 1 -- 3 -- 1 -- 2 PWM2 0 R/W 1 PWM1 0 R/W 0 PWM0 0 R/W Reserved bit PWM mode 2 to 0 These bits select PWM mode for channels 2 to 0 Flag direction Selects the setting condition for the overflow flag (OVF) in TISRC Phase counting mode flag Selects phase counting mode for channel 2 Reserved bit TMDR is initialized to H'98 by a reset and in standby mode. 230 Bit 7--Reserved: This bit cannot be modified and is always read as 1. Bit 6--Phase Counting Mode Flag (MDF): Selects whether channel 2 operates normally or in phase counting mode. Bit 6 MDF 0 1 Description Channel 2 operates normally Channel 2 operates in phase counting mode (Initial value) When MDF is set to 1 to select phase counting mode, 16TCNT2 operates as an up/down-counter and pins TCLKA and TCLKB become counter clock input pins. 16TCNT2 counts both rising and falling edges of TCLKA and TCLKB, and counts up or down as follows. Counting Direction TCLKA pin TCLKB pin Low Down-Counting High High Low Up-Counting Low High High Low In phase counting mode, external clock edge selection by bits CKEG1 and CKEG0 in 16TCR2 and counter clock selection by bits TPSC2 to TPSC0 are invalid, and the above phase counting mode operations take precedence. The counter clearing condition selected by the CCLR1 and CCLR0 bits in 16TCR2 and the compare match/input capture settings and interrupt functions of TIOR2, TISRA, TISRB, TISRC remain effective in phase counting mode. Bit 5--Flag Direction (FDIR): Designates the setting condition for the OVF flag in TISRC. The FDIR designation is valid in all modes in channel 2. Bit 5 FDIR 0 1 Description OVF is set to 1 in TISRC when 16TCNT2 overflows or underflows OVF is set to 1 in TISRC when 16TCNT2 overflows (Initial value) Bits 4 and 3--Reserved: These bits cannot be modified and are always read as 1. 231 Bit 2--PWM Mode 2 (PWM2): Selects whether channel 2 operates normally or in PWM mode. Bit 2 PWM2 0 1 Description Channel 2 operates normally Channel 2 operates in PWM mode (Initial value) When bit PWM2 is set to 1 to select PWM mode, pin TIOCA2 becomes a PWM output pin. The output goes to 1 at compare match with GRA2, and to 0 at compare match with GRB2. Bit 1--PWM Mode 1 (PWM1): Selects whether channel 1 operates normally or in PWM mode. Bit 1 PWM1 0 1 Description Channel 1 operates normally Channel 1 operates in PWM mode (Initial value) When bit PWM1 is set to 1 to select PWM mode, pin TIOCA1 becomes a PWM output pin. The output goes to 1 at compare match with GRA1, and to 0 at compare match with GRB1. Bit 0--PWM Mode 0 (PWM0): Selects whether channel 0 operates normally or in PWM mode. Bit 0 PWM0 0 1 Description Channel 0 operates normally Channel 0 operates in PWM mode (Initial value) When bit PWM0 is set to 1 to select PWM mode, pin TIOCA0 becomes a PWM output pin. The output goes to 1 at compare match with GRA0, and to 0 at compare match with GRB0. 232 8.2.4 Timer Interrupt Status Register A (TISRA) TISRA is an 8-bit readable/writable register that indicates GRA compare match or input capture and enables or disables GRA compare match and input capture interrupt requests. Bit 7 -- Initial value Read/Write 1 -- 6 5 4 3 -- 1 -- 2 IMFA2 0 R/(W)* 1 IMFA1 0 R/(W)* 0 IMFA0 0 R/(W)* IMIEA2 IMIEA1 IMIEA0 0 R/W 0 R/W 0 R/W Input capture/compare match flags A2 to A0 Status flags indicating GRA compare match or input capture Reserved bit Input capture/compare match interrupt enable A2 to A0 These bits enable or disable interrupts by the IMFA flags Reserved bit Note: * Only 0 can be written, to clear the flag. TISRA is initialized to H'88 by a reset and in standby mode. Bit 7--Reserved: This bit cannot be modified and is always read as 1. Bit 6--Input Capture/Compare Match Interrupt Enable A2 (IMIEA2): Enables or disables the interrupt requested by the IMFA2 when IMFA2 flag is set to 1. Bit 6 IMIEA2 0 1 Description IMIA2 interrupt requested by IMFA2 flag is disabled IMIA2 interrupt requested by IMFA2 flag is enabled (Initial value) Bit 5--Input Capture/Compare Match Interrupt Enable A1 (IMIEA1): Enables or disables the interrupt requested by the IMFA1 flag when IMFA1 is set to 1. 233 Bit 5 IMIEA1 0 1 Description IMIA1 interrupt requested by IMFA1 flag is disabled IMIA1 interrupt requested by IMFA1 flag is enabled (Initial value) Bit 4--Input Capture/Compare Match Interrupt Enable A0 (IMIEA0): Enables or disables the interrupt requested by the IMFA0 flag when IMFA0 is set to 1. Bit 4 IMIEA0 0 1 Description IMIA0 interrupt requested by IMFA0 flag is disabled IMIA0 interrupt requested by IMFA0 flag is enabled (Initial value) Bit 3--Reserved: This bit cannot be modified and is always read as 1. Bit 2--Input Capture/Compare Match Flag A2 (IMFA2): This status flag indicates GRA2 compare match or input capture events. Bit 2 IMFA2 0 Description [Clearing condition] Read IMFA2 flag when IMFA2 =1, then write 0 in IMFA2 flag 1 [Setting conditions] * * 16TCNT2 = GRA2 when GRA2 functions as an output compare register 16TCNT2 value is transferred to GRA2 by an input capture signal when GRA2 functions as an input capture register (Initial value) Bit 1--Input Capture/Compare Match Flag A1 (IMFA1): This status flag indicates GRA1 compare match or input capture events. Bit 1 IMFA1 0 Description [Clearing condition] Read IMFA1 flag when IMFA1 =1, then write 0 in IMFA1 flag 1 [Setting conditions] * * 16TCNT1 = GRA1 when GRA1 functions as an output compare register 16TCNT1 value is transferred to GRA1 by an input capture signal when GRA1 functions as an input capture register (Initial value) 234 Bit 0--Input Capture/Compare Match Flag A0 (IMFA0): This status flag indicates GRA0 compare match or input capture events. Bit 0 IMFA0 0 Description [Clearing condition] Read IMFA0 flag when IMFA0 =1, then write 0 in IMFA0 flag 1 [Setting conditions] * * 16TCNT0 = GRA0 when GRA0 functions as an output compare register 16TCNT0 value is transferred to GRA0 by an input capture signal when GRA0 functions as an input capture register (Initial value) 8.2.5 Timer Interrupt Status Register B (TISRB) TISRB is an 8-bit readable/writable register that indicates GRB compare match or input capture and enables or disables GRB compare match and input capture interrupt requests. Bit 7 -- Initial value Read/Write 1 -- 6 5 4 3 -- 1 -- 2 IMFB2 0 R/(W)* 1 IMFB1 0 R/(W)* 0 IMFB0 0 R/(W)* IMIEB2 IMIEB1 IMIEB0 0 R/W 0 R/W 0 R/W Input capture/compare match flags B2 to B0 Status flags indicating GRB compare match or input capture Reserved bit Input capture/compare match interrupt enable B2 to B0 These bits enable or disable interrupts by the IMFB flags Reserved bit Note: * Only 0 can be written, to clear the flag. TISRB is initialized to H'88 by a reset and in standby mode. 235 Bit 7--Reserved: This bit cannot be modified and is always read as 1. Bit 6--Input Capture/Compare Match Interrupt Enable B2 (IMIEB2): Enables or disables the interrupt requested by the IMFB2 when IMFB2 flag is set to 1. Bit 6 IMIEB2 0 1 Description IMIB2 interrupt requested by IMFB2 flag is disabled IMIB2 interrupt requested by IMFB2 flag is enabled (Initial value) Bit 5--Input Capture/Compare Match Interrupt Enable B1 (IMIEB1): Enables or disables the interrupt requested by the IMFB1 when IMFB1 flag is set to 1. Bit 5 IMIEB1 0 1 Description IMIB1 interrupt requested by IMFB1 flag is disabled IMIB1 interrupt requested by IMFB1 flag is enabled (Initial value) Bit 4--Input Capture/Compare Match Interrupt Enable B0 (IMIEB0): Enables or disables the interrupt requested by the IMFB0 when IMFB0 flag is set to 1. Bit 4 IMIEB0 0 1 Description IMIB0 interrupt requested by IMFB0 flag is disabled IMIB0 interrupt requested by IMFB0 flag is enabled (Initial value) Bit 3--Reserved: This bit cannot be modified and is always read as 1. Bit 2--Input Capture/Compare Match Flag B2 (IMFB2): This status flag indicates GRB2 compare match or input capture events. Bit 2 IMFB2 0 Description [Clearing condition] Read IMFB2 flag when IMFB2 =1, then write 0 in IMFB2 flag 1 [Setting conditions] * * 16TCNT2 = GRB2 when GRB2 functions as an output compare register 16TCNT2 value is transferred to GRB2 by an input capture signal when GRB2 functions as an input capture register (Initial value) 236 Bit 1--Input Capture/Compare Match Flag B1 (IMFB1): This status flag indicates GRB1 compare match or input capture events. Bit 1 IMFB1 0 Description [Clearing condition] Read IMFB1 flag when IMFB1 =1, then write 0 in IMFB1 flag 1 [Setting conditions] * * 16TCNT1 = GRB1 when GRB1 functions as an output compare register 16TCNT1 value is transferred to GRB1 by an input capture signal when GRB1 functions as an input capture register (Initial value) Bit 0--Input Capture/Compare Match Flag B0 (IMFB0): This status flag indicates GRB0 compare match or input capture events. Bit 0 IMFB0 0 Description [Clearing condition] Read IMFB0 flag when IMFB0 =1, then write 0 in IMFB0 flag 1 [Setting conditions] * * 16TCNT0 = GRB0 when GRB0 functions as an output compare register 16TCNT0 value is transferred to GRB0 by an input capture signal when GRB0 functions as an input capture register (Initial value) 237 8.2.6 Timer Interrupt Status Register C (TISRC) TISRC is an 8-bit readable/writable register that indicates 16TCNT overflow or underflow and enables or disables overflow interrupt requests. Bit 7 -- Initial value Read/Write 1 -- 6 OVIE2 0 R/W 5 OVIE1 0 R/W 4 OVIE0 0 R/W 3 -- 1 -- 2 OVF2 0 R/(W)* 1 OVF1 0 R/(W)* 0 OVF0 0 R/(W)* Overflow flags 2 to 0 Status flags indicating interrupts by OVF flags Reserved bit Overflow interrupt enable 2 to 0 These bits enable or disable interrupts by the OVF flags Reserved bit Note: * Only 0 can be written, to clear the flag. TISRC is initialized to H'88 by a reset and in standby mode. Bit 7--Reserved: This bit cannot be modified and is always read as 1. Bit 6--Overflow Interrupt Enable 2 (OVIE2): Enables or disables the interrupt requested by the OVF2 when OVF2 flag is set to 1. Bit 6 OVIE2 0 1 Description OVI2 interrupt requested by OVF2 flag is disabled OVI2 interrupt requested by OVF2 flag is enabled (Initial value) Bit 5--Overflow Interrupt Enable 1 (OVIE1): Enables or disables the interrupt requested by the OVF1 when OVF1 flag is set to 1. Bit 5 OVIE1 0 1 Description OVI1 interrupt requested by OVF1 flag is disabled OVI1 interrupt requested by OVF1 flag is enabled (Initial value) 238 Bit 4--Overflow Interrupt Enable 0 (OVIE0): Enables or disables the interrupt requested by the OVF0 when OVF0 flag is set to 1. Bit 4 OVIE0 0 1 Description OVI0 interrupt requested by OVF0 flag is disabled OVI0 interrupt requested by OVF0 flag is enabled (Initial value) Bit 3--Reserved: This bit cannot be modified and is always read as 1. Bit 2--Overflow Flag 2 (OVF2): This status flag indicates 16TCNT2 overflow. Bit 2 OVF2 0 Description [Clearing condition] Read OVF2 flag when OVF2 =1, then write 0 in OVF2 flag 1 [Setting condition] 16TCNT2 overflowed from H'FFFF to H'0000, or underflowed from H'0000 to H'FFFF Note: 16TCNT underflow occurs when 16TCNT operates as an up/down-counter. Underflow occurs only when channel 2 operates in phase counting mode (MDF = 1 in TMDR). (Initial value) Bit 1--Overflow Flag 1 (OVF1): This status flag indicates 16TCNT1 overflow. Bit 1 OVF1 0 Description [Clearing condition] Read OVF1 flag when OVF1 =1, then write 0 in OVF1 flag 1 [Setting condition] 16TCNT1 overflowed from H'FFFF to H'0000 (Initial value) Bit 0--Overflow Flag 0 (OVF0): This status flag indicates 16TCNT0 overflow. Bit 0 OVF0 0 Description [Clearing condition] Read OVF0 flag when OVF0 =1, then write 0 in OVF0 flag 1 [Setting condition] 16TCNT0 overflowed from H'FFFF to H'0000 (Initial value) 239 8.2.7 Timer Counters (16TCNT) 16TCNT is a 16-bit counter. The 16-bit timer has three 16TCNTs, one for each channel. Channel 0 1 2 Abbreviation 16TCNT0 16TCNT1 16TCNT2 Phase counting mode: up/down-counter Other modes: up-counter Function Up-counter Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Each 16TCNT is a 16-bit readable/writable register that counts pulse inputs from a clock source. The clock source is selected by bits TPSC2 to TPSC0 in 16TCR. 16TCNT0 and 16TCNT1 are up-counters. 16TCNT2 is an up/down-counter in phase counting mode and an up-counter in other modes. 16TCNT can be cleared to H'0000 by compare match with GRA or GRB or by input capture to GRA or GRB (counter clearing function). When 16TCNT overflows (changes from H'FFFF to H'0000), the OVF flag is set to 1 in TISRC of the corresponding channel. When 16TCNT underflows (changes from H'0000 to H'FFFF), the OVF flag is set to 1 in TISRC of the corresponding channel. The 16TCNTs are linked to the CPU by an internal 16-bit bus and can be written or read by either word access or byte access. Each 16TCNT is initialized to H'0000 by a reset and in standby mode. 240 8.2.8 General Registers (GRA, GRB) The general registers are 16-bit registers. The 16-bit timer has 6 general registers, two in each channel. Channel 0 1 2 Abbreviation GRA0, GRB0 GRA1, GRB1 GRA2, GRB2 Function Output compare/input capture register Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W A general register is a 16-bit readable/writable register that can function as either an output compare register or an input capture register. The function is selected by settings in TIOR. When a general register is used as an output compare register, its value is constantly compared with the 16TCNT value. When the two values match (compare match), the IMFA or IMFB flag is set to 1 in TISRA/TISRB. Compare match output can be selected in TIOR. When a general register is used as an input capture register, an external input capture signal are detected and the current 16TCNT value is stored in the general register. The corresponding IMFA or IMFB flag in TISRA/TISRB is set to 1 at the same time. The edges of the input capture signal are selected in TIOR. TIOR settings are ignored in PWM mode. General registers are linked to the CPU by an internal 16-bit bus and can be written or read by either word access or byte access. General registers are set as output compare registers (with no pin output) and initialized to H'FFFF by a reset and in standby mode. 241 8.2.9 Timer Control Registers (16TCR) 16TCR is an 8-bit register. The 16-bit timer has three 16TCRs, one in each channel. Channel 0 1 2 Abbreviation 16TCR0 16TCR1 16TCR2 Function 16TCR controls the timer counter. The 16TCRs in all channels are functionally identical. When phase counting mode is selected in channel 2, the settings of bits CKEG1 and CKEG0 and TPSC2 to TPSC0 in 16TCR2 are ignored. Bit Initial value Read/Write 7 -- 1 -- 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 0 R/W 3 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0 TPSC0 0 R/W CKEG1 CKEG0 Timer prescaler 2 to 0 These bits select the timer counter clock Clock edge 1/0 These bits select external clock edges Counter clear 1/0 These bits select the counter clear source Reserved bit Each 16TCR is an 8-bit readable/writable register that selects the timer counter clock source, selects the edge or edges of external clock sources, and selects how the counter is cleared. 16TCR is initialized to H'80 by a reset and in standby mode. Bit 7--Reserved: This bit cannot be modified and is always read as 1. 242 Bits 6 and 5--Counter Clear 1 and 0 (CCLR1, CCLR0): These bits select how 16TCNT is cleared. Bit 6 CCLR1 0 Bit 5 CCLR0 0 1 1 0 1 Description 16TCNT is not cleared 16TCNT is cleared by GRA compare match or input capture * 1 (Initial value) 16TCNT is cleared by GRB compare match or input capture * 1 Synchronous clear: 16TCNT is cleared in synchronization with other synchronized timers* 2 Notes: *1 16TCNT is cleared by compare match when the general register functions as an output compare register, and by input capture when the general register functions as an input capture register. *2 Selected in TSNC. Bits 4 and 3--Clock Edge 1 and 0 (CKEG1, CKEG0): These bits select external clock input edges when an external clock source is used. Bit 4 CKEG1 0 Bit 3 CKEG0 0 1 1 -- Description Count rising edges Count falling edges Count both edges (Initial value) When channel 2 is set to phase counting mode, bits CKEG1 and CKEG0 in 16TCR2 are ignored. Phase counting takes precedence. Bits 2 to 0--Timer Prescaler 2 to 0 (TPSC2 to TPSC0): These bits select the counter clock source. Bit 2 TPSC2 0 Bit 1 TPSC1 0 Bit 0 TPSC0 0 1 1 0 1 1 0 0 1 1 0 1 Function Internal clock: Internal clock: /2 Internal clock: /4 Internal clock: /8 External clock A: TCLKA input External clock B: TCLKB input External clock C: TCLKC input External clock D: TCLKD input 243 (Initial value) When bit TPSC2 is cleared to 0 an internal clock source is selected, and the timer counts only falling edges. When bit TPSC2 is set to 1 an external clock source is selected, and the timer counts the edges selected by bits CKEG1 and CKEG0. When channel 2 is set to phase counting mode (MDF = 1 in TMDR), the settings of bits TPSC2 to TPSC0 in 16TCR2 are ignored. Phase counting takes precedence. 8.2.10 Timer I/O Control Register (TIOR) TIOR is an 8-bit register. The 16-bit timer has three TIORs, one in each channel. Channel Abbreviation Function 0 1 2 TIOR0 TIOR1 TIOR2 TIOR controls the general registers. Some functions differ in PWM mode. Bit Initial value Read/Write 7 -- 1 -- 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 -- 1 -- 2 IOA2 0 R/W 1 IOA1 0 R/W 0 IOA0 0 R/W I/O control A2 to A0 These bits select GRA functions Reserved bit I/O control B2 to B0 These bits select GRB functions Reserved bit Each TIOR is an 8-bit readable/writable register that selects the output compare or input capture function for GRA and GRB, and specifies the functions of the TIORA and TIORB pins. If the output compare function is selected, TIOR also selects the type of output. If input capture is selected, TIOR also selects the edges of the input capture signal. TIOR is initialized to H'88 by a reset and in standby mode. Bit 7--Reserved: This bit cannot be modified and is always read as 1. 244 Bits 6 to 4--I/O Control B2 to B0 (IOB2 to IOB0): These bits select the GRB function. Bit 6 IOB2 0 Bit 5 IOB1 0 Bit 4 IOB0 0 1 1 0 1 1 0 0 1 1 0 1 Notes: *1 After a reset, the output conforms to the TOLR setting until the first compare match. *2 Channel 2 output cannot be toggled by compare match. When this setting is made, 1 output is selected automatically. GRB is an input compare register Function GRB is an output compare register No output at compare match (Initial value) 0 output at GRB compare match* 1 1 output at GRB compare match* 1 Output toggles at GRB compare match (1 output in channel 2) * 1, * 2 GRB captures rising edge of input GRB captures falling edge of input GRB captures both edges of input Bit 3--Reserved: This bit cannot be modified and is always read as 1. Bits 2 to 0--I/O Control A2 to A0 (IOA2 to IOA0): These bits select the GRA function. Bit 2 IOA2 0 Bit 1 IOA1 0 Bit 0 IOA0 0 1 1 0 1 1 0 0 1 1 0 1 Notes: *1 After a reset, the output conforms to the TOLR setting until the first compare match. *2 Channel 2 output cannot be toggled by compare match. When this setting is made, 1 output is selected automatically. GRA is an input compare register Function GRA is an output compare register No output at compare match (Initial value) 0 output at GRA compare match* 1 1 output at GRA compare match* 1 Output toggles at GRA compare match (1 output in channel 2) * 1 * 2 GRA captures rising edge of input GRA captures falling edge of input GRA captures both edges of input 245 8.2.11 Timer Output Level Setting Register C (TOLR) TOLR is an 8-bit write-only register that selects the timer output level for channels 0 to 2. Bit 7 -- Initial value Read/Write 1 -- 6 -- 1 -- 5 TOB2 0 W 4 TOA2 0 W 3 TOB1 0 W 2 TOA1 0 W 1 TOB0 0 W 0 TOA0 0 W Output level setting A2 to A0, B2 to B0 These bits set the levels of the timer outputs (TIOCA2 to TIOCA0, and TIOCB2 to TIOCB0) Reserved bits A TOLR setting can only be made when the corresponding bit in TSTR is 0. TOLR is a write-only register, and cannot be read. If it is read, all bits will return a value of 1. TOLR is initialized to H'C0 by a reset and in standby mode. Bits 7 and 6--Reserved: These bits cannot be modified. Bit 5--Output Level Setting B2 (TOB2): Sets the value of timer output TIOCB2. Bit 5 TOB2 0 1 Description TIOCB2 is 0 TIOCB2 is 1 (Initial value) Bit 4--Output Level Setting A2 (TOA2): Sets the value of timer output TIOCA 2. Bit 4 TOA2 0 1 Description TIOCA2 is 0 TIOCA2 is 1 (Initial value) 246 Bit 3--Output Level Setting B1 (TOB1): Sets the value of timer output TIOCB1. Bit 3 TOB1 0 1 Description TIOCB1 is 0 TIOCB1 is 1 (Initial value) Bit 2--Output Level Setting A1 (TOA1): Sets the value of timer output TIOCA 1. Bit 2 TOA1 0 1 Description TIOCA1 is 0 TIOCA1 is 1 (Initial value) Bit 1--Output Level Setting B0 (TOB0): Sets the value of timer output TIOCB0. Bit 0 TOB0 0 1 Description TIOCB0 is 0 TIOCB0 is 1 (Initial value) Bit 0--Output Level Setting A0 (TOA0): Sets the value of timer output TIOCA 0. Bit 0 TOA0 0 1 Description TIOCA0 is 0 TIOCA0 is 1 (Initial value) 247 8.3 8.3.1 CPU Interface 16-Bit Accessible Registers The timer counters (16TCNTs), general registers A and B (GRAs and GRBs) are 16-bit registers, and are linked to the CPU by an internal 16-bit data bus. These registers can be written or read a word at a time, or a byte at a time. Figures 8.4 and 8.5 show examples of word read/write access to a timer counter (16TCNT). Figures 8.6 to 8.9 show examples of byte read/write access to 16TCNTH and 16TCNTL. Internal data bus H CPU L Bus interface H L Module data bus 16TCNTH 16TCNTL Figure 8.4 16TCNT Access Operation [CPU 16TCNT (Word)] Internal data bus H CPU L Bus interface H L Module data bus 16TCNTH 16TCNTL Figure 8.5 Access to Timer Counter (CPU Reads 16TCNT, Word) 248 Internal data bus H CPU L Bus interface H L Module data bus 16TCNTH 16TCNTL Figure 8.6 Access to Timer Counter H (CPU Writes to 16TCNTH, Upper Byte) Internal data bus H CPU L Bus interface H L Module data bus 16TCNTH 16TCNTL Figure 8.7 Access to Timer Counter L (CPU Writes to 16TCNTL, Lower Byte) Internal data bus H CPU L Bus interface H L Module data bus 16TCNTH 16TCNTL Figure 8.8 Access to Timer Counter H (CPU Reads 16TCNTH, Upper Byte) 249 Internal data bus H CPU L Bus interface H L Module data bus 16TCNTH 16TCNTL Figure 8.9 Access to Timer Counter L (CPU Reads 16TCNTL, Lower Byte) 8.3.2 8-Bit Accessible Registers The registers other than the timer counters and general registers are 8-bit registers. These registers are linked to the CPU by an internal 8-bit data bus. Figures 8.10 and 8.11 show examples of byte read and write access to a 16TCR. If a word-size data transfer instruction is executed, two byte transfers are performed. Internal data bus H CPU L Bus interface H L Module data bus 16TCR Figure 8.10 16TCR Access (CPU Writes to 16TCR) Internal data bus H CPU L Bus interface H L Module data bus 16TCR Figure 8.11 16TCR Access (CPU Reads 16TCR) 250 8.4 8.4.1 Operation Overview A summary of operations in the various modes is given below. Normal Operation: Each channel has a timer counter (16TCNT) and general registers. The 16TCNT counts up, and can operate as a free-running counter, periodic counter, or external event counter. GRA and GRB can be used for input capture or output compare. Synchronous Operation: The timer counters in designated channels are preset synchronously. Data written to the timer counter in any one of these channels is simultaneously written to the timer counters in the other channels as well. The timer counters can also be cleared synchronously if so designated by the CCLR1 and CCLR0 bits in the TCRs. PWM Mode: A PWM waveform is output from the TIOCA pin. The output goes to 1 at compare match A and to 0 at compare match B. The duty cycle can be varied from 0% to 100% depending on the settings of GRA and GRB. When a channel is set to PWM mode, its GRA and GRB automatically become output compare registers. Phase Counting Mode: The phase relationship between two clock signals input at TCLKA and TCLKB is detected and 16TCNT2 counts up or down accordingly. When phase counting mode is selected TCLKA and TCLKB become clock input pins and 16TCNT2 operates as an up/downcounter. 8.4.2 Basic Functions Counter Operation: When one of bits STR0 to STR2 is set to 1 in the timer start register (TSTR), 16TCNT in the corresponding channel starts counting. The counting can be free-running or periodic. * Sample setup procedure for counter Figure 8.12 shows a sample procedure for setting up a counter. 251 Counter setup Select counter clock 1 Count operation Yes Periodic counting No Free-running counting Select counter clear source 2 Select output compare register function 3 Set period 4 Start counter Periodic counter 5 Start counter Free-running counter 5 Figure 8.12 Counter Setup Procedure (Example) 1. Set bits TPSC2 to TPSC0 in 16TCR to select the counter clock source. If an external clock source is selected, set bits CKEG1 and CKEG0 in 16TCR to select the desired edge(s) of the external clock signal. 2. For periodic counting, set CCLR1 and CCLR0 in 16TCR to have 16TCNT cleared at GRA compare match or GRB compare match. 3. Set TIOR to select the output compare function of GRA or GRB, whichever was selected in step 2. 4. Write the count period in GRA or GRB, whichever was selected in step 2. 5. Set the STR bit to 1 in TSTR to start the timer counter. 252 * Free-running and periodic counter operation A reset leaves the counters (16TCNTs) in 16-bit timer channels 0 to 2 all set as free-running counters. A free-running counter starts counting up when the corresponding bit in TSTR is set to 1. When the count overflows from H'FFFF to H'0000, the OVF flag is set to 1 in TISRC. After the overflow, the counter continues counting up from H'0000. Figure 8.13 illustrates free-running counting. 16TCNT value H'FFFF H'0000 STR0 to STR2 bit OVF Time Figure 8.13 Free-Running Counter Operation When a channel is set to have its counter cleared by compare match, in that channel 16TCNT operates as a periodic counter. Select the output compare function of GRA or GRB, set bit CCLR1 or CCLR0 in 16TCR to have the counter cleared by compare match, and set the count period in GRA or GRB. After these settings, the counter starts counting up as a periodic counter when the corresponding bit is set to 1 in TSTR. When the count matches GRA or GRB, the IMFA or IMFB flag is set to 1 in TISRA/TISRB and the counter is cleared to H'0000. If the corresponding IMIEA or IMIEB bit is set to 1 in TISRA/TISRB, a CPU interrupt is requested at this time. After the compare match, 16TCNT continues counting up from H'0000. Figure 8.14 illustrates periodic counting. 16TCNT value GR Counter cleared by general register compare match H'0000 STR bit IMF Time Figure 8.14 Periodic Counter Operation 253 * 16TCNT count timing Internal clock source Bits TPSC2 to TPSC0 in 16TCR select the system clock () or one of three internal clock sources obtained by prescaling the system clock (/2, /4, /8). Figure 8.15 shows the timing. Internal clock 16TCNT input clock 16TCNT N-1 N N+1 Figure 8.15 Count Timing for Internal Clock Sources External clock source The external clock pin (TCLKA to TCLKD) can be selected by bits TPSC2 to TPSC0 in 16TCR, and the detected edge by bits CKEG1 and CKEG0. The rising edge, falling edge, or both edges can be selected. The pulse width of the external clock signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses will not be counted correctly. Figure 8.16 shows the timing when both edges are detected. External clock input 16TCNT input clock 16TCNT N-1 N N+1 Figure 8.16 Count Timing for External Clock Sources (when Both Edges are Detected) 254 Waveform Output by Compare Match: In 16-bit timer channels 0, 1 compare match A or B can cause the output at the TIOCA or TIOCB pin to go to 0, go to 1, or toggle. In channel 2 the output can only go to 0 or go to 1. * Sample setup procedure for waveform output by compare match Figure 8.17 shows an example of the setup procedure for waveform output by compare match. Output setup Select waveform output mode 1 1. Select the compare match output mode (0, 1, or toggle) in TIOR. When a waveform output mode is selected, the pin switches from its generic input/ output function to the output compare function (TIOCA or TIOCB). An output compare pin outputs the value set in TOLR until the first compare match occurs. 2. Set a value in GRA or GRB to designate the compare match timing. Set output timing 2 Start counter 3 3. Set the STR bit to 1 in TSTR to start the timer counter. Waveform output Figure 8.17 Setup Procedure for Waveform Output by Compare Match (Example) 255 * Examples of waveform output Figure 8.18 shows examples of 0 and 1 output. 16TCNT operates as a free-running counter, 0 output is selected for compare match A, and 1 output is selected for compare match B. When the pin is already at the selected output level, the pin level does not change. 16TCNT value H'FFFF GRB GRA H'0000 TIOCB Time No change No change 1 output TIOCA No change No change 0 output Figure 8.18 0 and 1 Output (TOA = 1, TOB = 0) Figure 8.19 shows examples of toggle output. 16TCNT operates as a periodic counter, cleared by compare match B. Toggle output is selected for both compare match A and B. 16TCNT value GRB Counter cleared by compare match with GRB GRA H'0000 TIOCB Time Toggle output Toggle output TIOCA Figure 8.19 Toggle Output (TOA = 1, TOB = 0) 256 * Output compare output timing The compare match signal is generated in the last state in which 16TCNT and the general register match (when 16TCNT changes from the matching value to the next value). When the compare match signal is generated, the output value selected in TIOR is output at the output compare pin (TIOCA or TIOCB). When 16TCNT matches a general register, the compare match signal is not generated until the next counter clock pulse. Figure 8.20 shows the output compare timing. 16TCNT input clock 16TCNT N N+1 GR Compare match signal TIOCA, TIOCB N Figure 8.20 Output Compare Output Timing Input Capture Function: The 16TCNT value can be transferred to a general register when an input edge is detected at an input capture input/output compare pin (TIOCA or TIOCB). Risingedge, falling-edge, or both-edge detection can be selected. The input capture function can be used to measure pulse width or period. 257 * Sample setup procedure for input capture Figure 8.21 shows a sample procedure for setting up input capture. Input selection 1. Set TIOR to select the input capture function of a general register and the rising edge, falling edge, or both edges of the input capture signal. Clear the DDR bit to 0 before making these TIOR settings. 1 Select input-capture input Start counter 2 2. Set the STR bit to 1 in TSTR to start the timer counter. Input capture Figure 8.21 Setup Procedure for Input Capture (Example) * Examples of input capture Figure 8.22 illustrates input capture when the falling edge of TIOCB and both edges of TIOCA are selected as capture edges. 16TCNT is cleared by input capture into GRB. 16TCNT value H'0180 H'0160 H'0005 H'0000 TIOCB TIOCA GRA H'0005 H'0160 GRB H'0180 Figure 8.22 Input Capture (Example) 258 * Input capture signal timing Input capture on the rising edge, falling edge, or both edges can be selected by settings in TIOR. Figure 8.23 shows the timing when the rising edge is selected. The pulse width of the input capture signal must be at least 1.5 system clocks for single-edge capture, and 2.5 system clocks for capture of both edges. Input-capture input Input capture signal 16TCNT N GRA, GRB N Figure 8.23 Input Capture Signal Timing 8.4.3 Synchronization The synchronization function enables two or more timer counters to be synchronized by writing the same data to them simultaneously (synchronous preset). With appropriate 16TCR settings, two or more timer counters can also be cleared simultaneously (synchronous clear). Synchronization enables additional general registers to be associated with a single time base. Synchronization can be selected for all channels (0 to 2). Sample Setup Procedure for Synchronization: Figure 8.24 shows a sample procedure for setting up synchronization. 259 Setup for synchronization Select synchronization 1 Synchronous preset Synchronous clear Write to 16TCNT 2 Clearing synchronized to this channel? Yes Select counter clear source No 3 Select counter clear source 4 Start counter 5 Start counter 5 Synchronous preset Counter clear Synchronous clear 1. Set the SYNC bits to 1 in TSNC for the channels to be synchronized. 2. When a value is written in 16TCNT in one of the synchronized channels, the same value is simultaneously written in 16TCNT in the other channels. 3. Set the CCLR1 or CCLR0 bit in 16TCR to have the counter cleared by compare match or input capture. 4. Set the CCLR1 and CCLR0 bits in 16TCR to have the counter cleared synchronously. 5. Set the STR bits in TSTR to 1 to start the synchronized counters. Figure 8.24 Setup Procedure for Synchronization (Example) Example of Synchronization: Figure 8.25 shows an example of synchronization. Channels 0, 1, and 2 are synchronized, and are set to operate in PWM mode. Channel 0 is set for counter clearing by compare match with GRB0. Channels 1 and 2 are set for synchronous counter clearing. The timer counters in channels 0, 1, and 2 are synchronously preset, and are synchronously cleared by compare match with GRB0. A three-phase PWM waveform is output from pins TIOCA0, TIOCA1, and TIOCA2. For further information on PWM mode, see section 8.4.4, PWM Mode. 260 Value of 16TCNT0 to 16TCNT2 Cleared by compare match with GRB0 GRB0 GRB1 GRA0 GRB2 GRA1 GRA2 H'0000 TIOCA0 TIOCA1 TIOCA2 Figure 8.25 Synchronization (Example) 8.4.4 PWM Mode In PWM mode GRA and GRB are paired and a PWM waveform is output from the TIOCA pin. GRA specifies the time at which the PWM output changes to 1. GRB specifies the time at which the PWM output changes to 0. If either GRA or GRB compare match is selected as the counter clear source, a PWM waveform with a duty cycle from 0% to 100% is output at the TIOCA pin. PWM mode can be selected in all channels (0 to 2). Table 8.4 summarizes the PWM output pins and corresponding registers. If the same value is set in GRA and GRB, the output does not change when compare match occurs. Table 8.4 Channel 0 1 2 PWM Output Pins and Registers Output Pin TIOCA0 TIOCA1 TIOCA2 1 Output GRA0 GRA1 GRA2 0 Output GRB0 GRB1 GRB2 261 Sample Setup Procedure for PWM Mode: Figure 8.26 shows a sample procedure for setting up PWM mode. PWM mode Select counter clock 1 1. Set bits TPSC2 to TPSC0 in 16TCR to select the counter clock source. If an external clock source is selected, set bits CKEG1 and CKEG0 in 16TCR to select the desired edge(s) of the external clock signal. 2. Set bits CCLR1 and CCLR0 in 16TCR to select the counter clear source. 3. Set the time at which the PWM waveform should go to 1 in GRA. Select counter clear source 2 Set GRA 3 4. Set the time at which the PWM waveform should go to 0 in GRB. 5. Set the PWM bit in TMDR to select PWM mode. When PWM mode is selected, regardless of the TIOR contents, GRA and GRB become output compare registers specifying the times at which the PWM output goes to 1 and 0. The TIOCA pin automatically becomes the PWM output pin. The TIOCB pin conforms to the settings of bits IOB1 and IOB0 in TIOR. If TIOCB output is not desired, clear both IOB1 and IOB0 to 0. 6. Set the STR bit to 1 in TSTR to start the timer counter. Set GRB 4 Select PWM mode 5 Start counter 6 PWM mode Figure 8.26 Setup Procedure for PWM Mode (Example) 262 Examples of PWM Mode: Figure 8.27 shows examples of operation in PWM mode. In PWM mode TIOCA becomes an output pin. The output goes to 1 at compare match with GRA, and to 0 at compare match with GRB. In the examples shown, 16TCNT is cleared by compare match with GRA or GRB. Synchronized operation and free-running counting are also possible. 16TCNT value Counter cleared by compare match A GRA GRB H'0000 Time TIOCA a. Counter cleared by GRA (TOA = 1) 16TCNT value Counter cleared by compare match B GRB GRA H'0000 Time TIOCA b. Counter cleared by GRB (TOA = 0) Figure 8.27 PWM Mode (Example 1) 263 Figure 8.28 shows examples of the output of PWM waveforms with duty cycles of 0% and 100%. If the counter is cleared by compare match with GRB, and GRA is set to a higher value than GRB, the duty cycle is 0%. If the counter is cleared by compare match with GRA, and GRB is set to a higher value than GRA, the duty cycle is 100%. 16TCNT value GRB Counter cleared by compare match B GRA H'0000 Time TIOCA Write to GRA Write to GRA a. 0% duty cycle (TOA=0) 16TCNT value GRA Counter cleared by compare match A GRB H'0000 Time TIOCA Write to GRB Write to GRB b. 100% duty cycle (TOA=1) Figure 8.28 PWM Mode (Example 2) 264 8.4.5 Phase Counting Mode In phase counting mode the phase difference between two external clock inputs (at the TCLKA and TCLKB pins) is detected, and 16TCNT2 counts up or down accordingly. In phase counting mode, the TCLKA and TCLKB pins automatically function as external clock input pins and 16TCNT2 becomes an up/down-counter, regardless of the settings of bits TPSC2 to TPSC0, CKEG1, and CKEG0 in 16TCR2. Settings of bits CCLR1, CCLR0 in 16TCR2, and settings in TIOR2, TISRA, TISRB, TISRC, setting of STR2 bit in TSTR, GRA2, and GRB2 are valid. The input capture and output compare functions can be used, and interrupts can be generated. Phase counting is available only in channel 2. Sample Setup Procedure for Phase Counting Mode: Figure 8.29 shows a sample procedure for setting up phase counting mode. Phase counting mode Select phase counting mode 1 1. Set the MDF bit in TMDR to 1 to select phase counting mode. 2. Select the flag setting condition with the FDIR bit in TMDR. Select flag setting condition 2 3. Set the STR2 bit to 1 in TSTR to start the timer counter. Start counter 3 Phase counting mode Figure 8.29 Setup Procedure for Phase Counting Mode (Example) 265 Example of Phase Counting Mode: Figure 8.30 shows an example of operations in phase counting mode. Table 8.5 lists the up-counting and down-counting conditions for 16TCNT2. In phase counting mode both the rising and falling edges of TCLKA and TCLKB are counted. The phase difference between TCLKA and TCLKB must be at least 1.5 states, the phase overlap must also be at least 1.5 states, and the pulse width must be at least 2.5 states. 16TCNT2 value Counting up Counting down TCLKB TCLKA Figure 8.30 Operation in Phase Counting Mode (Example) Table 8.5 Up/Down Counting Conditions Up-Counting High Low High Low Down-Counting High Low Low High Counting Direction TCLKB pin TCLKA pin Phase difference Phase difference Pulse width Pulse width TCLKA TCLKB Phase difference and overlap: at least 1.5 states Pulse width: at least 2.5 states Overlap Overlap Figure 8.31 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode 266 8.4.6 16-Bit Timer Output Timing The initial value of 16-bit timer output when a timer count operation begins can be specified arbitrarily by making a setting in TOLR. Figure 8.32 shows the timing for setting the initial value with TOLR. Only write to TOLR when the corresponding bit in TSTR is cleared to 0. T1 T2 T3 Address bus TOLR address TOLR N 16-bit timer output pin N Figure 8.32 Timing for Setting 16-Bit Timer Output Level by Writing to TOLR 267 8.5 Interrupts The 16-bit timer has two types of interrupts: input capture/compare match interrupts, and overflow interrupts. 8.5.1 Setting of Status Flags Timing of Setting of IMFA and IMFB at Compare Match: IMFA and IMFB are set to 1 by a compare match signal generated when 16TCNT matches a general register (GR). The compare match signal is generated in the last state in which the values match (when 16TCNT is updated from the matching count to the next count). Therefore, when 16TCNT matches a general register, the compare match signal is not generated until the next 16TCNT clock input. Figure 8.33 shows the timing of the setting of IMFA and IMFB. 16TCNT input clock 16TCNT N N+1 GR N Compare match signal IMF IMI Figure 8.33 Timing of Setting of IMFA and IMFB by Compare Match 268 Timing of Setting of IMFA and IMFB by Input Capture: IMFA and IMFB are set to 1 by an input capture signal. The 16TCNT contents are simultaneously transferred to the corresponding general register. Figure 8.34 shows the timing. Input capture signal IMF 16TCNT N GR N IMI Figure 8.34 Timing of Setting of IMFA and IMFB by Input Capture 269 Timing of Setting of Overflow Flag (OVF): OVF is set to 1 when 16TCNT overflows from H'FFFF to H'0000 or underflows from H'0000 to H'FFFF. Figure 8.35 shows the timing. 16TCNT Overflow signal OVF OVI Figure 8.35 Timing of Setting of OVF 8.5.2 Timing of Clearing of Status Flags If the CPU reads a status flag while it is set to 1, then writes 0 in the status flag, the status flag is cleared. Figure 8.36 shows the timing. TISR write cycle T1 T2 T3 Address TISR address IMF, OVF Figure 8.36 Timing of Clearing of Status Flags 270 8.5.3 Interrupt Sources Each 16-bit timer channel can generate a compare match/input capture A interrupt, a compare match/input capture B interrupt, and an overflow interrupt. In total there are nine interrupt sources of three kinds, all independently vectored. An interrupt is requested when the interrupt request flag are set to 1. The priority order of the channels can be modified in interrupt priority registers A (IPRA). For details see section 5, Interrupt Controller. Table 8.6 lists the interrupt sources. Table 8.6 16-bit timer Interrupt Sources Interrupt Source IMIA0 IMIB0 OVI0 IMIA1 IMIB1 OVI1 IMIA2 IMIB2 OVI2 Channel 0 Description Compare match/input capture A0 Compare match/input capture B0 Overflow 0 Compare match/input capture A1 Compare match/input capture B1 Overflow 1 Compare match/input capture A2 Compare match/input capture B2 Overflow 2 Priority* High 1 2 Low Note: * The priority immediately after a reset is indicated. Inter-channel priorities can be changed by settings in IPRA. 271 8.6 Usage Notes This section describes contention and other matters requiring special attention during 16-bit timer operations. Contention between 16TCNT Write and Clear: If a counter clear signal occurs in the T3 state of a 16TCNT write cycle, clearing of the counter takes priority and the write is not performed. See figure 8.37. 16TCNT write cycle T1 T2 T3 Address bus 16TCNT address Internal write signal Counter clear signal 16TCNT N H'0000 Figure 8.37 Contention between 16TCNT Write and Clear 272 Contention between 16TCNT Word Write and Increment: If an increment pulse occurs in the T3 state of a 16TCNT word write cycle, writing takes priority and 16TCNT is not incremented. Figure 8.38 shows the timing in this case. 16TCNT word write cycle T1 T2 T3 Address bus 16TCNT address Internal write signal 16TCNT input clock 16TCNT N M 16TCNT write data Figure 8.38 Contention between 16TCNT Word Write and Increment 273 Contention between 16TCNT Byte Write and Increment: If an increment pulse occurs in the T2 or T3 state of a 16TCNT byte write cycle, writing takes priority and 16TCNT is not incremented. The byte data for which a write was not performed is not incremented, and retains its pre-write value. See figure 8.39, which shows an increment pulse occurring in the T2 state of a byte write to 16TCNTH. 16TCNTH byte write cycle T1 T2 T3 Address bus 16TCNTH address Internal write signal 16TCNT input clock 16TCNTH N 16TCNT write data M 16TCNTL X X+1 X Figure 8.39 Contention between 16TCNT Byte Write and Increment 274 Contention between General Register Write and Compare Match: If a compare match occurs in the T3 state of a general register write cycle, writing takes priority and the compare match signal is inhibited. See figure 8.40. General register write cycle T1 T2 T3 Address bus GR address Internal write signal 16TCNT N N+1 GR N M General register write data Compare match signal Inhibited Figure 8.40 Contention between General Register Write and Compare Match 275 Contention between 16TCNT Write and Overflow or Underflow: If an overflow occurs in the T3 state of a 16TCNT write cycle, writing takes priority and the counter is not incremented. OVF is set to 1. The same holds for underflow. See figure 8.41. 16TCNT write cycle T1 T2 T3 Address bus 16TCNT address Internal write signal 16TCNT input clock Overflow signal 16TCNT H'FFFF 16TCNT write data M OVF Figure 8.41 Contention between 16TCNT Write and Overflow 276 Contention between General Register Read and Input Capture: If an input capture signal occurs during the T3 state of a general register read cycle, the value before input capture is read. See figure 8.42. General register read cycle T1 T2 T3 Address bus GR address Internal read signal Input capture signal GR X M Internal data bus X Figure 8.42 Contention between General Register Read and Input Capture 277 Contention between Counter Clearing by Input Capture and Counter Increment: If an input capture signal and counter increment signal occur simultaneously, the counter is cleared according to the input capture signal. The counter is not incremented by the increment signal. The value before the counter is cleared is transferred to the general register. See figure 8.43. Input capture signal Counter clear signal 16TCNT input clock 16TCNT N H'0000 GR N Figure 8.43 Contention between Counter Clearing by Input Capture and Counter Increment 278 Contention between General Register Write and Input Capture: If an input capture signal occurs in the T3 state of a general register write cycle, input capture takes priority and the write to the general register is not performed. See figure 8.44. General register write cycle T1 T2 T3 Address bus GR address Internal write signal Input capture signal 16TCNT M GR M Figure 8.44 Contention between General Register Write and Input Capture 279 Note on Waveform Period Setting: When a counter is cleared by compare match, the counter is cleared in the last state at which the 16TCNT value matches the general register value, at the time when this value would normally be updated to the next count. The actual counter frequency is therefore given by the following formula: f= (N+1) (f: counter frequency. : system clock frequency. N: value set in general register.) Note on Writes in Synchronized Operation: When channels are synchronized, if a 16TCNT value is modified by byte write access, all 16 bits of all synchronized counters assume the same value as the counter that was addressed. (Example) When channels 1 and 2 are synchronized * Byte write to channel 1 or byte write to channel 2 Write A to upper byte of channel 1 16TCNT1 16TCNT2 W Y X Z 16TCNT1 16TCNT2 A A X X Upper byte Lower byte Write A to lower byte of channel 2 16TCNT1 16TCNT2 Upper byte Lower byte Y Y A A Upper byte Lower byte * Word write to channel 1 or word write to channel 2 16TCNT1 16TCNT2 W Y X Z Write AB word to channel 1 or 2 16TCNT1 16TCNT2 A A B B Upper byte Lower byte Upper byte Lower byte 280 16-bit timer Operating Modes Table 8.7 (a) 16-bit timer Operating Modes (Channel 0) Register Settings TSNC Operating Mode Synchronous preset PWM mode Output compare A Synchronization MDF TMDR FDIR PWM -- -- -- PWM0 = 1 PWM0 = 0 -- IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted PWM0 = 0 IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 CCLR1 = 1 CCLR0 = 0 CCLR1 = 1 CCLR0 = 1 * IOA TIOR0 IOB 16TCR0 Clear Select Clock Select SYNC0 = 1 -- -- -- Output compare B -- -- Input capture A -- -- Input capture B -- -- PWM0 = 0 Counter By compare clearing match/input capture A By compare match/input capture B Synchronous clear Legend: -- -- -- -- SYNC0 = 1 -- -- Setting available (valid). -- Setting does not affect this mode. Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. 281 Table 8.7 (b) 16-bit timer Operating Modes (Channel 1) Register Settings TSNC Operating Mode Synchronous preset PWM mode Output compare A Synchronization MDF TMDR FDIR PWM -- -- -- PWM1 = 1 PWM1 = 0 -- IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted PWM1 = 0 IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 CCLR1 = 1 CCLR0 = 0 CCLR1 = 1 CCLR0 = 1 * IOA TIOR1 IOB 16TCR1 Clear Select Clock Select SYNC1 = 1 -- -- -- Output compare B -- -- Input capture A -- -- Input capture B -- -- PWM1 = 0 Counter By compare clearing match/input capture A By compare match/input capture B Synchronous clear -- -- -- -- SYNC1 = 1 -- -- Legend: Setting available (valid). -- Setting does not affect this mode. Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. 282 Table 8.7 (c) 16-bit timer Operating Modes (Channel 2) Register Settings TSNC Operating Mode Synchronous preset PWM mode Output compare A Synchronization SYNC2 = 1 MDF TMDR FDIR PWM -- -- -- PWM2 = 1 PWM2 = 0 -- IOA2 = 0 Other bits unrestricted IOB2 = 0 Other bits unrestricted PWM2 = 0 IOA2 = 1 Other bits unrestricted IOB2 = 1 Other bits unrestricted CCLR1 = 0 CCLR0 = 1 CCLR1 = 1 CCLR0 = 0 CCLR1 = 1 CCLR0 = 1 -- * IOA TIOR2 IOB 16TCR2 Clear Select Clock Select Output compare B -- Input capture A -- Input capture B -- PWM2 = 0 Counter By compare clearing match/input capture A By compare match/input capture B Synchronous clear Phase counting mode SYNC2 = 1 -- -- -- MDF = 1 Legend: Setting available (valid). -- Setting does not affect this mode. Note: * The input capture function cannot be used in PWM mode. If compare match A and compare match B occur simultaneously, the compare match signal is inhibited. 283 284 Section 9 8-Bit Timers 9.1 Overview The H8/3062 Series has a built-in 8-bit timer module with four channels (TMR0, TMR1, TMR2, and TMR3), based on 8-bit counters. Each channel has an 8-bit timer counter (8TCNT) and two 8-bit time constant registers (TCORA and TCORB) that are constantly compared with the 8TCNT value to detect compare match events. The timers can be used as multifunctional timers in a variety of applications, including the generation of a rectangular-wave output with an arbitrary duty cycle. 9.1.1 Features The features of the 8-bit timer module are listed below. * Selection of four clock sources The counters can be driven by one of three internal clock signals (/8, /64, or /8192) or an external clock input (enabling use as an external event counter). * Selection of three ways to clear the counters The counters can be cleared on compare match A or B, or input capture B. * Timer output controlled by two compare match signals The timer output signal in each channel is controlled by two independent compare match signals, enabling the timer to generate output waveforms with an arbitrary duty cycle or PWM output. * A/D converter can be activated by a compare match * Two channels can be cascaded Channels 0 and 1 can be operated as the upper and lower halves of a 16-bit timer (16-bit count mode). Channels 2 and 3 can be operated as the upper and lower halves of a 16-bit timer (16-bit count mode). Channel 1 can count channel 0 compare match events (compare match count mode). Channel 3 can count channel 2 compare match events (compare match count mode). * Input capture function can be set 8-bit or 16-bit input capture operation is available. 285 * Twelve interrupt sources There are twelve interrupt sources: four compare match sources, four compare match/input capture sources, four overflow sources. Two of the compare match sources and two of the combined compare match/input capture sources each have an independent interrupt vector. The remaining compare match interrupts, combined compare match/input capture interrupts, and overflow interrupts have one interrupt vector for two sources. 286 9.1.2 Block Diagram The 8-bit timers are divided into two groups of two channels each: group 0 comprising channels 0 and 1, and group 1 comprising channels 2 and 3. Figure 9.1 shows a block diagram of 8-bit timer group 0. External clock sources TCLKA TCLKC Internal clock sources /8 /64 /8192 Clock 1 Clock select Clock 0 TCORA0 Compare match A1 Compare match A0 Comparator A0 Overflow 1 Overflow 0 TMO0 TMIO1 Control logic Compare match B0 Comparator B0 Input capture B1 TCORB0 Comparator B1 8TCNT0 8TCNT1 Internal bus TCORB1 8TCSR0 8TCSR1 8TCR0 CMIA0 CMIB0 CMIA1/CMIB1 OVI0/OVI1 Interrupt signals Time constant register A Time constant register B Timer counter Timer control/status register Timer control register 8TCR1 Comparator A1 TCORA1 Compare match B1 Legend: TCORA : TCORB : 8TCNT : 8TCSR : 8TCR : Figure 9.1 Block Diagram of 8-Bit Timer Unit (Two Channels: Group 0) 287 9.1.3 Pin Configuration Table 9.1 summarizes the input/output pins of the 8-bit timer module. Table 9.1 Group 0 8-Bit Timer Pins Abbreviation I/O TMO0 TCLKC Function Channel Name 0 Timer output Timer clock input 1 Output Compare match output Input I/O Input Counter external clock input Compare match output/input capture input Counter external clock input Timer input/output TMIO1 Timer clock input TCLKA TMO2 TCLKD 1 2 Timer output Timer clock input Output Compare match output Input I/O Input Counter external clock input Compare match output/input capture input Counter external clock input 3 Timer input/output TMIO3 Timer clock input TCLKB 288 9.1.4 Register Configuration Table 9.2 summarizes the registers of the 8-bit timer module. Table 9.2 8-Bit Timer Registers Name Timer control register 0 Timer control/status register 0 Time constant register A0 Time constant register B0 Timer counter 0 Timer control register 1 Timer control/status register 1 Time constant register A1 Time constant register B1 Timer counter 1 Timer control register 2 Timer control/status register 2 Time constant register A2 Time constant register B2 Timer counter 2 Timer control register 3 Timer control/status register 3 Time constant register A3 Time constant register B3 Timer counter 3 Abbreviation R/W 8TCR0 8TCSR0 TCORA0 TCORB0 8TCNT0 8TCR1 8TCSR1 TCORA1 TCORB1 8TCNT1 8TCR2 8TCSR2 TCORA2 TCORB2 8TCNT2 8TCR3 8TCSR3 TCORA3 TCORB3 8TCNT3 R/W 2 Channel Address* 1 0 H'FFF80 H'FFF82 H'FFF84 H'FFF86 H'FFF88 1 H'FFF81 H'FFF83 H'FFF85 H'FFF87 H'FFF89 2 H'FFF90 H'FFF92 H'FFF94 H'FFF96 H'FFF98 3 H'FFF91 H'FFF93 H'FFF95 H'FFF97 H'FFF99 Initial value H'00 R/(W)* H'00 R/W R/W R/W R/W 2 H'FF H'FF H'00 H'00 R/(W)* H'00 R/W R/W R/W R/W 2 H'FF H'FF H'00 H'00 R/(W)* H'10 R/W R/W R/W R/W 2 H'FF H'FF H'00 H'00 R/(W)* H'00 R/W R/W R/W H'FF H'FF H'00 Notes: *1 Indicates the lower 20 bits of the address in advanced mode. *2 Only 0 can be written to bits 7 to 5, to clear these flags. Each pair of registers for channel 0 and channel 1 comprises a 16-bit register with the channel 0 register as the upper 8 bits and the channel 1 register as the lower 8 bits, so they can be accessed together by word access. Similarly, each pair of registers for channel 2 and channel 3 comprises a 16-bit register with the channel 2 register as the upper 8 bits and the channel 3 register as the lower 8 bits, so they can be accessed together by word access. 289 9.2 9.2.1 Register Descriptions Timer Counters (8TCNT) 8TCNT0 Bit 15 0 14 0 13 0 12 0 11 0 10 0 9 0 8 0 7 0 6 0 5 0 8TCNT1 4 0 3 0 2 0 1 0 0 0 Initial value Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 8TCNT2 8TCNT3 10 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0 Bit Initial value Read/Write 15 0 14 0 13 0 12 0 11 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W The timer counters (8TCNT) are 8-bit readable/writable up-counters that increment on pulses generated from an internal or external clock source. The clock source is selected by clock select bits 2 to 0 (CKS2 to CKS0) in the timer control register (8TCR). The CPU can always read or write to the timer counters. The 8TCNT0 and 8TCNT1 pair, and the 8TCNT2 and 8TCNT3 pair, can each be accessed as a 16-bit register by word access. 8TCNT can be cleared by an input capture signal or compare match signal. Counter clear bits 1 and 0 (CCLR1 and CCLR0) in 8TCR select the method of clearing. When 8TCNT overflows from H'FF to H'00, the overflow flag (OVF) in the timer control/status register (8TCSR) is set to 1. Each 8TCNT is initialized to H'00 by a reset and in standby mode. 290 9.2.2 Time Constant Registers A (TCORA) TCORA0 to TCORA3 are 8-bit readable/writable registers. TCORA0 Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1 5 1 TCORA1 4 1 3 1 2 1 1 1 0 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORA2 TCORA3 10 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1 Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W The TCORA0 and TCORA1 pair, and the TCORA2 and TCORA3 pair, can each be accessed as a 16-bit register by word access. The TCORA value is constantly compared with the 8TCNT value. When a match is detected, the corresponding compare match flag A (CMFA) is set to 1 in 8TCSR. The timer output can be freely controlled by these compare match signals and the settings of output select bits 1 and 0 (OS1, OS0) in 8TCSR. Each TCORA register is initialized to H'FF by a reset and in standby mode. 291 9.2.3 Time Constant Registers B (TCORB) TCORB0 Bit 15 1 14 1 13 1 12 1 11 1 10 1 9 1 8 1 7 1 6 1 5 1 TCORB1 4 1 3 1 2 1 1 1 0 1 Initial value Read/Write R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB2 TCORB3 10 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 0 1 Bit Initial value Read/Write 15 1 14 1 13 1 12 1 11 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB0 to TCORB3 are 8-bit readable/writable registers. The TCORB0 and TCORB1 pair, and the TCORB2 and TCORB3 pair, can each be accessed as a 16-bit register by word access. The TCORB value is constantly compared with the 8TCNT value. When a match is detected, the corresponding compare match flag B (CMFB) is set to 1 in 8TCSR *. The timer output can be freely controlled by these compare match signals and the settings of output/input capture edge select bits 3 and 2 (OIS3, OIS2) in 8TCSR. When TCORB is used for input capture, it stores the 8TCNT value on detection of an external input capture signal. At this time, the CMFB flag is set to 1 in the corresponding 8TCSR register. The detected edge of the input capture signal is set in 8TCSR. Each TCORB register is initialized to H'FF by a reset and in standby mode. Note: * When channel 1 and channel 3 are designated for TCORB input capture, the CMFB flag is not set by a channel 0 or channel 2 compare match B. 292 9.2.4 Timer Control Register (8TCR) Bit 7 CMIEB 0 R/W 6 CMIEA 0 R/W 5 OVIE 0 R/W 4 CCLR1 0 R/W 3 CCLR0 0 R/W 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Initial value Read/Write 8TCR is an 8-bit readable/writable register that selects the 8TCNT input clock, gives the 8TCNT clearing specification, and enables interrupt requests. 8TCR is initialized to H'00 by a reset and in standby mode. For the timing, see section 9.4, Operation. Bit 7--Compare Match Interrupt Enable B (CMIEB): Enables or disables the CMIB interrupt request when the CMFB flag is set to 1 in 8TCSR. Bit 7 CMIEB 0 1 Description CMIB interrupt requested by CMFB is disabled CMIB interrupt requested by CMFB is enabled (Initial value) Bit 6--Compare Match Interrupt Enable A (CMIEA): Enables or disables the CMIA interrupt request when the CMFA flag is set to 1 in 8TCSR. Bit 6 CMIEA 0 1 Description CMIA interrupt requested by CMFA is disabled CMIA interrupt requested by CMFA is enabled (Initial value) Bit 5--Timer Overflow Interrupt Enable (OVIE): Enables or disables the OVI interrupt request when the OVF flag is set to 1 in 8TCSR. Bit 5 OVIE 0 1 Description OVI interrupt requested by OVF is disabled OVI interrupt requested by OVF is enabled (Initial value) 293 Bits 4 and 3--Counter Clear 1 and 0 (CCLR1, CCLR0): These bits specify the 8TCNT clearing source. Compare match A or B, or input capture B, can be selected as the clearing source. Bit 4 CCLR1 0 Bit 3 CCLR0 Description 0 1 1 0 1 Clearing is disabled Cleared by compare match A Cleared by compare match B/input capture B Cleared by input capture B (Initial value) Note: When input capture B is set as the 8TCNT1 and 8TCNT3 counter clear source, 8TCNT0 and 8TCNT2 are not cleared by compare match B. Bits 2 to 0--Clock Select 2 to 0 (CSK2 to CSK0): These bits select whether the clock input to 8TCNT is an internal or external clock. Three internal clocks can be selected, all divided from the system clock (): /8, /64, and /8192. The rising edge of the selected internal clock triggers the count. When use of an external clock is selected, three types of count can be selected: at the rising edge, the falling edge, and both rising and falling edges. When CKS2, CKS1, CKS0 = 1, 0, 0, channels 0 and 1 and channels 2 and 3 are cascaded. The incrementing clock source is different when 8TCR0 and 8TCR2 are set, and when 8TCR1 and 8TCR3 are set. 294 Bit 2 CSK2 0 Bit 1 CSK1 0 Bit 0 CSK0 0 1 Description Clock input disabled Internal clock, counted on falling edge of /8 Internal clock, counted on falling edge of /64 Internal clock, counted on falling edge of /8192 Channel 0 (16-bit count mode): Count on 8TCNT1 overflow signal * 1 Channel 1 (compare match count mode): Count on 8TCNT0 compare match A * 1 Channel 2 (16-bit count mode): Count on 8TCNT3 overflow signal * 2 Channel 3 (compare match count mode): Count on 8TCNT2 compare match A * 2 (Initial value) 1 0 1 1 0 0 1 1 0 1 External clock, counted on rising edge External clock, counted on falling edge External clock, counted on both rising and falling edges Notes: *1 If the clock input of channel 0 is the 8TCNT1 overflow signal and that of channel 1 is the 8TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting. *2 If the clock input of channel 2 is the 8TCNT3 overflow signal and that of channel 3 is the 8TCNT2 compare match signal, no incrementing clock is generated. Do not use this setting. 295 9.2.5 Timer Control/Status Registers (8TCSR) 8TCSR0 Bit 7 CMFB 0 R/(W)* 6 CMFA 0 R/(W)* 5 OVF 0 R/(W)* 4 ADTE 0 R/W 3 OIS3 0 R/W 2 OIS2 0 R/W 1 OS1 0 R/W 0 OS0 0 R/W Initial value Read/Write 8TCSR2 Bit Initial value Read/Write 7 CMFB 0 R/(W)* 6 CMFA 0 R/(W)* 5 OVF 0 R/(W)* 4 -- 1 -- 3 OIS3 0 R/W 2 OIS2 0 R/W 1 OS1 0 R/W 0 OS0 0 R/W 8TCSR1, 8TCSR3 7 Bit CMFB Initial value Read/Write 0 R/(W)* 6 CMFA 0 R/(W)* 5 OVF 0 R/(W)* 4 ICE 0 R/W 3 OIS3 0 R/W 2 OIS2 0 R/W 1 OS1 0 R/W 0 OS0 0 R/W Note: * Only 0 can be written to bits 7 to 5, to clear these flags. The timer control/status registers 8TCSR are 8-bit registers that indicate compare match/input capture and overflow statuses, and control compare match output/input capture edge selection. 8TCSR2 is initialized to H'10, and 8TCSR0, 8TCSR1, and 8TCSR3 to H'00, by a reset and in standby mode. 296 Bit 7--Compare Match/Input Capture Flag B (CMFB): Status flag that indicates the occurrence of a TCORB compare match or input capture. Bit 7 CMFB 0 1 Description [Clearing condition] Read CMFB when CMFB = 1, then write 0 in CMFB (Initial value) [Setting conditions] * 8TCNT = TCORB* * The 8TCNT value is transferred to TCORB by an input capture signal when TCORB functions as an input capture register Note: * When bit ICE is set to 1 in 8TCSR1 and 8TCSR3, the CMFB flag is not set when 8TCNT0 = TCORB0 or 8TCNT2 = TCORB2. Bit 6--Compare Match Flag A (CMFA): Status flag that indicates the occurrence of a TCORA compare match. Bit 6 CMFA 0 1 Description [Clearing condition] Read CMFA when CMFA = 1, then write 0 in CMFA [Setting condition] 8TCNT = TCORA (Initial value) Bit 5--Timer Overflow Flag (OVF): Status flag that indicates that the 8TCNT has overflowed from H'FF to H'00. Bit 5 OVF 0 1 Description [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF [Setting condition] 8TCNT overflows from H'FF to H'00 (Initial value) 297 Bit 4--A/D Trigger Enable (ADTE) (In 8TCSR0): In combination with TRGE in the A/D control register (ADCR), enables or disables A/D converter start requests by compare match A or an external trigger. TRGE* 0 Bit 4 ADTE 0 1 1 0 1 Description A/D converter start requests by compare match A or external trigger pin (ADTRG) input are disabled (Initial value) A/D converter start requests by compare match A or external trigger pin (ADTRG) input are disabled A/D converter start requests by external trigger pin (ADTRG) input are enabled, and A/D converter start requests by compare match A are disabled A/D converter start requests by compare match A are enabled, and A/D converter start requests by external trigger pin (ADTRG) input are disabled Note: * TRGE is bit 7 of the A/D control register (ADCR). Bit 4--Reserved (In 8TCSR1): This bit is a reserved bit, but can be read and written. Bit 4--Input Capture Enable (ICE) (In 8TCSR1 and 8TCSR3): Selects the function of TCORB1 and TCORB3. Bit 4 ICE 0 1 Description TCORB1 and TCORB3 are compare match registers TCORB1 and TCORB3 are input capture registers (Initial value) When bit ICE is set to 1 in 8TCSR1 or 8TCSR3, the operation of the TCORA and TCORB registers in channels 0 to 3 is as shown in the tables below. 298 Table 9.3 Operation of Channels 0 and 1 when Bit ICE is Set to 1 in 8TCSR1 Register Status Flag Change Timer Output Capture Input Interrupt Request CMIA0 interrupt request generated by compare match CMIB0 interrupt request not generated by compare match Register Register Function TCORA0 Compare match CMFA changed from 0 TMO0 output controllable operation to 1 in 8TCSR0 by compare match TCORB0 Compare match CMFB not changed No output from operation from 0 to 1 in 8TCSR0 TMO0 by compare match TCORA1 Compare match CMFA changed from 0 TMIO1 is dedicated CMIA1 interrupt request operation to 1 in 8TCSR1 by input capture pin generated by compare compare match match TCORB1 Input capture operation CMFB changed from 0 TMIO1 is dedicated CMIB1 interrupt request to 1 in 8TCSR1 by input capture pin generated by input input capture capture Table 9.4 Operation of Channels 2 and 3 when Bit ICE is Set to 1 in 8TCSR3 Register Status Flag Change Timer Output Capture Input Interrupt Request CMIA2 interrupt request generated by compare match CMIB2 interrupt request not generated by compare match Register Register Function TCORA2 Compare match CMFA changed from 0 TMO2 output controllable operation to 1 in 8TCSR2 by compare match TCORB2 Compare match CMFB not changed No output from operation from 0 to 1 in 8TCSR2 TMO2 by compare match TCORA3 Compare match CMFA changed from 0 TMIO3 is dedicated CMIA3 interrupt request operation to 1 in 8TCSR3 by input capture pin generated by compare compare match match TCORB3 Input capture operation CMFB changed from 0 TMIO3 is dedicated CMIB3 interrupt request to 1 in 8TCSR3 by input capture pin generated by input input capture capture 299 Bits 3 and 2--Output/Input Capture Edge Select B3 and B2 (OIS3, OIS2): In combination with the ICE bit in 8TCSR1 (8TCSR3), these bits select the compare match B output level or the input capture input detected edge. The function of TCORB1 (TCORB3) depends on the setting of bit 4 of 8TCSR1 (8TCSR3). ICE Bit in 8TCSR1 Bit 3 Bit 2 (8TCSR3) OIS3 OIS2 Description 0 0 0 1 1 0 1 1 0 0 1 1 0 1 No change when compare match B occurs 0 is output when compare match B occurs 1 is output when compare match B occurs Output is inverted when compare match B occurs (toggle output) TCORB input capture on rising edge TCORB input capture on falling edge TCORB input capture on both rising and falling edges (Initial value) * When the compare match register function is used, the timer output priority order is: toggle output > 1 output > 0 output. * If compare match A and B occur simultaneously, the output changes in accordance with the higher-priority compare match. * When bits OIS3, OIS2, OS1, and OS0 are all cleared to 0, timer output is disabled. Bits 1 and 0--Output Select A1 and A0 (OS1, OS0): These bits select the compare match A output level. Bit 1 OS1 0 Bit 0 OS0 0 1 1 0 1 Description No change when compare match A occurs 0 is output when compare match A occurs 1 is output when compare match A occurs Output is inverted when compare match A occurs (toggle output) (Initial value) * When the compare match register function is used, the timer output priority order is: toggle output > 1 output > 0 output. * If compare match A and B occur simultaneously, the output changes in accordance with the higher-priority compare match. * When bits OIS3, OIS2, OS1, and OS0 are all cleared to 0, timer output is disabled. 300 9.3 9.3.1 CPU Interface 8-Bit Registers 8TCNT, TCORA, TCORB, 8TCR, and 8TCSR are 8-bit registers. These registers are connected to the CPU by an internal 16-bit data bus and can be read and written a word at a time or a byte at a time. Figures 9.2 and 9.3 show the operation in word read and write accesses to 8TCNT. Figures 9.4 to 9.7 show the operation in byte read and write accesses to 8TCNT0 and 8TCNT1. Internal data bus H C P U L Bus interface H L Module data bus 8TCNT0 8TCNT1 Figure 9.2 8TCNT Access Operation (CPU Writes to 8TCNT, Word) Internal data bus H C P U L Bus interface H L Module data bus 8TCNT0 8TCNT1 Figure 9.3 8TCNT Access Operation (CPU Reads 8TCNT, Word) Internal data bus H C P U L Bus interface H L Module data bus 8TCNTH0 8TCNTL1 Figure 9.4 8TCNT0 Access Operation (CPU Writes to 8TCNT0, Upper Byte) 301 Internal data bus H C P U L Bus interface H L Module data bus 8TCNTH0 8TCNTL1 Figure 9.5 8TCNT1 Access Operation (CPU Writes to 8TCNT1, Lower Byte) Internal data bus H C P U L Bus interface H L Module data bus 8TCNT0 8TCNT1 Figure 9.6 8TCNT0 Access Operation (CPU Reads 8TCNT0, Upper Byte) Internal data bus H C P U L Bus interface H L Module data bus 8TCNT0 8TCNT1 Figure 9.7 8TCNT1 Access Operation (CPU Reads 8TCNT1, Lower Byte) 302 9.4 9.4.1 Operation 8TCNT Count Timing 8TCNT is incremented by input clock pulses (either internal or external). Internal Clock: Three different internal clock signals (/8, /64, or /8192) divided from the system clock () can be selected, by setting bits CKS2 to CKS0 in 8TCR. Figure 9.8 shows the count timing. Internal clock 8TCNT input clock 8TCNT N-1 N N+1 Note: Even if the same internal clock is selected for the 16-bit timer and the 8-bit timer, the same operation will not be performed since the incrementing edge is different in each case. Figure 9.8 Count Timing for Internal Clock Input External Clock: Three incrementation methods can be selected by setting bits CKS2 to CKS0 in 8TCR: on the rising edge, the falling edge, and both rising and falling edges. The pulse width of the external clock signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. Shorter pulses will not be counted correctly. Figure 9.9 shows the timing for incrementation on both edges of the external clock signal. 303 External clock input 8TCNT input clock 8TCNT N-1 N N+1 Figure 9.9 Count Timing for External Clock Input (Both-Edge Detection) 9.4.2 Compare Match Timing Timer Output Timing: When compare match A or B occurs, the timer output is as specified by the OIS3, OIS2, OS1, and OS0 bits in 8TCSR (unchanged, 0 output, 1 output, or toggle output). Figure 9.10 shows the timing when the output is set to toggle on compare match A. Compare match A signal Timer output Figure 9.10 Timing of Timer Output 304 Clear by Compare Match: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR, 8TCNT can be cleared when compare match A or B occurs, Figure 9.11 shows the timing of this operation. Compare match signal 8TCNT N H'00 Figure 9.11 Timing of Clear by Compare Match Clear by Input Capture: Depending on the setting of the CCLR1 and CCLR0 bits in 8TCR, 8TCNT can be cleared when input capture B occurs. Figure 9.12 shows the timing of this operation. Input capture input Input capture signal 8TCNT N H '00 Figure 9.12 Timing of Clear by Input Capture 9.4.3 Input Capture Signal Timing Input capture on the rising edge, falling edge, or both edges can be selected by settings in 8TCSR. Figure 9.13 shows the timing when the rising edge is selected. The pulse width of the input capture input signal must be at least 1.5 system clocks when a single edge is selected, and at least 2.5 system clocks when both edges are selected. 305 Input capture input Input capture signal 8TCNT N TCORB N Figure 9.13 Timing of Input Capture Input Signal 9.4.4 Timing of Status Flag Setting Timing of CMFA/CMFB Flag Setting when Compare Match Occurs: The CMFA and CMFB flags in 8TCSR are set to 1 by the compare match signal output when the TCORA or TCORB and 8TCNT values match. The compare match signal is generated in the last state of the match (when the matched 8TCNT count value is updated). Therefore, after the 8TCNT and TCORA or TCORB values match, the compare match signal is not generated until an incrementing clock pulse signal is generated. Figure 9.14 shows the timing in this case. 8TCNT TCOR N N N+1 Compare match signal CMF Figure 9.14 CMF Flag Setting Timing when Compare Match Occurs Timing of CMFB Flag Setting when Input Capture Occurs: On generation of an input capture signal, the CMFB flag is set to 1 and at the same time the 8TCNT value is transferred to TCORB. Figure 9.15 shows the timing in this case. 306 8TCNT TCORB N N Input capture signal CMFB Figure 9.15 CMFB Flag Setting Timing when Input Capture Occurs Timing of Overflow Flag (OVF) Setting: The OVF flag in 8TCSR is set to 1 by the overflow signal generated when 8TCNT overflows (from H'FF to H'00). Figure 9.16 shows the timing in this case. 8TCNT H'FF H'00 Overflow signal OVF Figure 9.16 Timing of OVF Setting 9.4.5 Operation with Cascaded Connection If bits CKS2 to CKS0 are set to (100) in either 8TCR0 or 8TCR1, the 8-bit timers of channels 0 and 1 are cascaded. With this configuration, the two timers can be used as a single 16-bit timer (16-bit timer mode), or channel 0 8-bit timer compare matches can be counted in channel 1 (compare match count mode). Similarly, if bits CKS2 to CKS0 are set to (100) in either 8TCR2 or 8TCR3, the 8-bit timers of channels 2 and 3 are cascaded. With this configuration, the two timers can be used as a single 16-bit timer (16-bit timer mode),or channel 2 8-bit timer compare matches can be counted in channel 3 (compare match count mode). In this case, the timer operates as below. 307 16-Bit Count Mode * Channels 0 and 1: When bits CKS2 to CKS0 are set to (100) in 8TCR0, the timer functions as a single 16-bit timer with channel 0 occupying the upper 8 bits and channel 1 occupying the lower 8 bits. Setting when Compare Match Occurs * The CMFA or CMFB flag is set to 1 in 8TCSR0 when a 16-bit compare match occurs. * The CMFA or CMFB flag is set to 1 in 8TCSR1 when a lower 8-bit compare match occurs. * TMO0 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR0 is in accordance with the 16-bit compare match conditions. * TMIO 1 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR1 is in accordance with the lower 8-bit compare match conditions. Setting when Input Capture Occurs * The CMFB flag is set to 1 in 8TCSR0 and 8TCSR1 when the ICE bit is 1 in TCSR1 and input capture occurs. * TMIO 1 pin input capture input signal edge detection is selected by bits OIS3 and OIS2 in 8TCSR0. Counter Clear Specification * If counter clear on compare match or input capture has been selected by the CCLR1 and CCLR0 bits in 8TCR0, the 16-bit counter (both 8TCNT0 and 8TCNT1) is cleared. * The settings of the CCLR1 and CCLR0 bits in 8TCR1 are ignored. The lower 8 bits cannot be cleared independently. OVF Flag Operation * The OVF flag is set to 1 in 8TCSR0 when the 16-bit counter (8TCNT0 and 8TCNT1) overflows (from H'FFFF to H'0000). * The OVF flag is set to 1 in 8TCSR1 when the 8-bit counter (8TCNT1) overflows (from H'FF to H'00). * Channels 2 and 3: When bits CKS2 to CKS0 are set to (100) in 8TCR2, the timer functions as a single 16-bit timer with channel 2 occupying the upper 8 bits and channel 3 occupying the lower 8 bits. Setting when Compare Match Occurs * The CMFA or CMFB flag is set to 1 in 8TCSR2 when a 16-bit compare match occurs. * The CMFA or CMFB flag is set to 1 in 8TCSR3 when a lower 8-bit compare match occurs. * TMO2 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR2 is in accordance with the 16-bit compare match conditions. * TMIO 3 pin output control by bits OIS3, OIS2, OS1, and OS0 in 8TCSR3 is in accordance with the lower 8-bit compare match conditions. 308 Setting when Input Capture Occurs * The CMFB flag is set to 1 in 8TCSR2 and 8TCSR3 when the ICE bit is 1 in TCSR3 and input capture occurs. * TMIO 3 pin input capture input signal edge detection is selected by bits OIS3 and OIS2 in 8TCSR2. Counter Clear Specification * If counter clear on compare match has been selected by the CCLR1 and CCLR0 bits in 8TCR2, the 16-bit counter (both 8TCNT2 and 8TCNT3) is cleared. * The settings of the CCLR1 and CCLR0 bits in 8TCR3 are ignored. The lower 8 bits cannot be cleared independently. OVF Flag Operation * The OVF flag is set to 1 in 8TCSR2 when the 16-bit counter (8TCNT2 and 8TCNT3) overflows (from H'FFFF to H'0000). * The OVF flag is set to 1 in 8TCSR3 when the 8-bit counter (8TCNT3) overflows (from H'FF to H'00). Compare Match Count Mode * Channels 0 and 1: When bits CKS2 to CKS0 are set to (100) in 8TCR1, 8TCNT1 counts channel 0 compare match A events. CMF flag setting, interrupt generation, TMO pin output, counter clearing, and so on, is in accordance with the settings for each channel. Note: When bit ICE = 1 in 8TCSR1, the compare match register function of TCORB0 in channel 0 cannot be used. * Channels 2 and 3: When bits CKS2 to CKS0 are set to (100) in 8TCR3, 8TCNT3 counts channel 2 compare match A events. CMF flag setting, interrupt generation, TMO pin output, counter clearing, and so on, is in accordance with the settings for each channel. Note: When bit ICE = 1 in 8TCSR3, the compare match register function of TCORB2 in channel 2 cannot be used. Caution Do not set 16-bit counter mode and compare match count mode simultaneously within the same group, as the 8TCNT input clock will not be generated and the counters will not operate. 309 9.4.6 Input Capture Setting The 8TCNT value can be transferred to TCORB on detection of an input edge on the input capture/output compare pin (TMIO1 or TMIO3). Rising edge, falling edge, or both edge detection can be selected. In 16-bit count mode, 16-bit input capture can be used. Setting Input Capture Operation in 8-Bit Timer Mode (Normal Operation) * Channel 1: Set TCORB1 as an 8-bit input capture register with the ICE bit in 8TCSR1. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO1) with bits OIS3 and OIS2 in 8TCSR1. Select the input clock with bits CKS2 to CKS0 in 8TCR1, and start the 8TCNT count. * Channel 3: Set TCORB3 as an 8-bit input capture register with the ICE bit in 8TCSR3. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO3) with bits OIS3 and OIS2 in 8TCSR3. Select the input clock with bits CKS2 to CKS0 in 8TCR3, and start the 8TCNT count. Note: When TCORB1 in channel 1 is used for input capture, TCORB0 in channel 0 cannot be used as a compare match register. Similarly, when TCORB3 in channel 3 is used for input capture, TCORB2 in channel 2 cannot be used as a compare match register. Setting Input Capture Operation in 16-Bit Count Mode * Channels 0 and 1: In 16-bit count mode, TCORB0 and TCORB1 function as a 16-bit input capture register when the ICE bit is set to 1 in 8TCSR1. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO1) with bits OIS3 and OIS2 in 8TCSR0. (In 16-bit count mode, the settings of bits OIS3 and OIS2 in 8TCSR1 are ignored.) Select the input clock with bits CKS2 to CKS0 in 8TCR1, and start the 8TCNT count. * Channels 2 and 3: In 16-bit count mode, TCORB2 and TCORB3 function as a 16-bit input capture register when the ICE bit is set to 1 in 8TCSR3. Select rising edge, falling edge, or both edges as the input edge(s) for the input capture signal (TMIO3) with bits OIS3 and OIS2 in 8TCSR2. (In 16-bit count mode, the settings of bits OIS3 and OIS2 in 8TCSR3 are ignored.) Select the input clock with bits CKS2 to CKS0 in 8TCR3, and start the 8TCNT count. 310 9.5 9.5.1 Interrupt Interrupt Sources The 8-bit timer unit can generate three types of interrupt: compare match A and B (CMIA and CMIB) and overflow (TOVI). Table 9.5 shows the interrupt sources and their priority order. Each interrupt source is enabled or disabled by the corresponding interrupt enable bit in 8TCR. A separate interrupt request signal is sent to the interrupt controller by each interrupt source. Table 9.5 Types of 8-Bit Timer Interrupt Sources and Priority Order Description Interrupt by CMFA Interrupt by CMFB Interrupt by OVF Low Priority High Interrupt Source CMIA CMIB TOVI For compare match interrupts CMIA1/CMIB1 and CMIA3/CMIB3 and the overflow interrupts (TOVI0/TOVI1 and TOVI2/TOVI3), one vector is shared by two interrupts. Table 9.6 lists the interrupt sources. Table 9.6 Channel 0 8-Bit Timer Interrupt Sources Interrupt Source CMIA0 CMIB0 Description TCORA0 compare match TCORB0 compare match/input capture TCORA1 compare match, or TCORB1 compare match/input capture Counter 0 or counter 1 overflow TCORA2 compare match TCORB2 compare match/input capture TCORA3 compare match, or TCORB3 compare match/input capture Counter 2 or counter 3 overflow 1 0, 1 2 CMIA1/CMIB1 TOVI0/TOVI1 CMIA2 CMIB2 3 2, 3 CMIA3/CMIB3 TOVI2/TOVI3 311 9.5.2 A/D Converter Activation The A/D converter can only be activated by channel 0 compare match A. If the ADTE bit setting is 1 when the CMFA flag in 8TCSR0 is set to 1 by generation of channel 0 compare match A, an A/D conversion start request will be issued to the A/D converter. If the TRGE bit in ADCR is 1 at this time, the A/D converter will be started. If the ADTE bit in 8TCSR0 is 1, A/D converter external trigger pin (ADTRG) input is disabled. 9.6 8-Bit Timer Application Example Figure 9.17 shows how the 8-bit timer module can be used to output pulses with any desired duty cycle. The settings for this example are as follows: * Clear the CCLR1 bit to 0 and set the CCLR0 bit to 1 in 8TCR so that 8TCNT is cleared by a TCORA compare match. * Set bits OIS3, OIS2, OS1, and OS0 to (0110) in 8TCSR so that 1 is output on a TCORA compare match and 0 is output on a TCORB compare match. The above settings enable a waveform with the cycle determined by TCORA and the pulse width detected by TCORB to be output without software intervention. 8TCNT H'FF TCORA TCORB H'00 Counter clear TMO Figure 9.17 Example of Pulse Output 312 9.7 Usage Notes Note that the following kinds of contention can occur in 8-bit timer operation. 9.7.1 Contention between 8TCNT Write and Clear If a timer counter clear signal occurs in the T3 state of a 8TCNT write cycle, clearing of the counter takes priority and the write is not performed. Figure 9.18 shows the timing in this case. 8TCNT write cycle T1 T2 T3 Address bus 8TCNT address Internal write signal Counter clear signal 8TCNT N H'00 Figure 9.18 Contention between 8TCNT Write and Clear 313 9.7.2 Contention between 8TCNT Write and Increment If an increment pulse occurs in the T3 state of a 8TCNT write cycle, writing takes priority and 8TCNT is not incremented. Figure 9.19 shows the timing in this case. 8TCNT write cycle T1 T2 T3 Address bus 8 TCNT address Internal write signal 8TCNT input clock 8TCNT N 8TCNT write data M Figure 9.19 Contention between 8TCNT Write and Increment 314 9.7.3 Contention between TCOR Write and Compare Match If a compare match occurs in the T3 state of a TCOR write cycle, writing takes priority and the compare match signal is inhibited. Figure 9.20 shows the timing in this case. TCOR write cycle T1 T2 T3 Address bus TCOR address Internal write signal 8TCNT N N+1 TCOR N TCOR write data M Compare match signal Inhibited Figure 9.20 Contention between TCOR Write and Compare Match 315 9.7.4 Contention between TCOR Read and Input Capture If an input capture signal occurs in the T3 state of a TCOR read cycle, the value before input capture is read. Figure 9.21 shows the timing in this case. TCORB read cycle T1 T2 T3 Address bus TCORB address Internal read signal Input capture signal TCORB N M Internal data bus N Figure 9.21 Contention between TCOR Read and Input Capture 316 9.7.5 Contention between Counter Clearing by Input Capture and Counter Increment If an input capture signal and counter increment signal occur simultaneously, counter clearing by the input capture signal takes priority and the counter is not incremented. The value before the counter is cleared is transferred to TCORB. Figure 9.22 shows the timing in this case. T1 T2 T3 Input capture signal Counter clear signal 8TCNT internal clock 8TCNT N H'00 TCORB X N Figure 9.22 Contention between Counter Clearing by Input Capture and Counter Increment 317 9.7.6 Contention between TCOR Write and Input Capture If an input capture signal occurs in the T3 state of a TCOR write cycle, input capture takes priority and the write to TCOR is not performed. Figure 9.23 shows the timing in this case. TCOR write cycle T1 T2 T3 Address bus TCOR address Internal write signal Input capture signal 8TCNT M TCOR X M Figure 9.23 Contention between TCOR Write and Input Capture 318 9.7.7 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode (Cascaded Connection) If an increment pulse occurs in the T3 state of an 8TCNT byte write cycle in 16-bit count mode, the counter write takes priority and the byte data for which the write was performed is not incremented. The byte data for which a write was not performed is incremented. Figure 9.24 shows the timing when an increment pulse occurs in the T2 state of a byte write to 8TCNT (upper byte). If an increment pulse occurs in the T2 state, on the other hand, the increment takes priority. 8TCNT (upper byte) byte write cycle T1 T2 T3 Address bus 8TCNTH address Internal write signal 8TCNT input clock 8TCNT (upper byte) N N+1 8TCNT write data 8TCNT (lower byte) X X+1 Figure 9.24 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode 319 9.7.8 Contention between Compare Matches A and B If compare matches A and B occur at the same time, the 8-bit timer operates according to the relative priority of the output states set for compare match A and compare match B, as shown in Table 9.7. Table 9.7 Timer Output Priority Order Priority High Output Setting Toggle output 1 output 0 output No change Low 9.7.9 8TCNT Operation and Internal Clock Source Switchover Switching internal clock sources may cause 8TCNT to increment, depending on the switchover timing. Table 9.8 shows the relation between the time of the switchover (by writing to bits CKS1 and CKS0) and the operation of 8TCNT. The 8TCNT input clock is generated from the internal clock source by detecting the rising edge of the internal clock. If a switchover is made from a low clock source to a high clock source, as in case No. 3 in Table 9.8, the switchover will be regarded as a falling edge, a 8TCNT clock pulse will be generated, and 8TCNT will be incremented. 8TCNT may also be incremented when switching between internal and external clocks. 320 Table 9.8 No. 1 Internal Clock Switchover and 8TCNT Operation 8TCNT Operation 1 CKS1 and CKS0 Write Timing High high switchover * Old clock source New clock source 8TCNT clock 8TCNT N CKS bits rewritten N+1 2 High low switchover* 2 Old clock source New clock source 8TCNT clock 8TCNT N N+1 N+2 CKS bits rewritten 3 Low high switchover * 3 Old clock source New clock source *4 8TCNT clock 8TCNT N N+1 CKS bits rewritten N+2 321 No. 4 CKS1 and CKS0 Write Timing Low low switchover* 4 8TCNT Operation Old clock source New clock source 8TCNT clock 8TCNT N N+1 N+2 CKS bits rewritten Notes: *1 Including switchovers from the high level to the halted state, and from the halted state to the high level. *2 Including switchover from the halted state to the low level. *3 Including switchover from the low level to the halted state. *4 The switchover is regarded as a rising edge, causing 8TCNT to increment. 322 Section 10 Programmable Timing Pattern Controller (TPC) 10.1 Overview The H8/3062 Series has a built-in programmable timing pattern controller (TPC) that provides pulse outputs by using the 16-bit timer as a time base. The TPC pulse outputs are divided into 4bit groups (group 3 to group 0) that can operate simultaneously and independently. 10.1.1 Features TPC features are listed below. * 16-bit output data Maximum 16-bit data can be output. TPC output can be enabled on a bit-by-bit basis. * Four output groups Output trigger signals can be selected in 4-bit groups to provide up to four different 4-bit outputs. * Selectable output trigger signals * Output trigger signals can be selected for each group from the compare match signals of three 16-bit timer channels. * Non-overlap mode A non-overlap margin can be provided between pulse outputs. 323 10.1.2 Block Diagram Figure 10.1 shows a block diagram of the TPC. 16-bit timer compare match signals PADDR Control logic NDERA TPMR PBDDR NDERB TPCR TP15 TP14 TP13 TP12 TP11 TP10 TP 9 TP 8 TP 7 TP 6 TP 5 TP 4 TP 3 TP 2 TP 1 TP 0 Legend: TPMR : TPCR : NDERB : NDERA : PBDDR : PADDR : NDRB : NDRA : PBDR : PADR : Pulse output pins, group 3 PBDR Pulse output pins, group 2 NDRB Internal data bus Pulse output pins, group 1 PADR Pulse output pins, group 0 NDRA TPC output mode register TPC output control register Next data enable register B Next data enable register A Port B data direction register Port A data direction register Next data register B Next data register A Port B data register Port A data register Figure 10.1 TPC Block Diagram 324 10.1.3 Pin Configuration Table 10.1 summarizes the TPC output pins. Table 10.1 TPC Pins Name TPC output 0 TPC output 1 TPC output 2 TPC output 3 TPC output 4 TPC output 5 TPC output 6 TPC output 7 TPC output 8 TPC output 9 TPC output 10 TPC output 11 TPC output 12 TPC output 13 TPC output 14 TPC output 15 Symbol TP 0 TP 1 TP 2 TP 3 TP 4 TP 5 TP 6 TP 7 TP 8 TP 9 TP 10 TP 11 TP 12 TP 13 TP 14 TP 15 I/O Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Group 3 pulse output Group 2 pulse output Group 1 pulse output Function Group 0 pulse output 325 10.1.4 Register Configuration Table 10.2 summarizes the TPC registers. Table 10.2 TPC Registers Address* 1 H'EE009 H'FFFD9 H'EE00A H'FFFDA H'FFFA0 H'FFFA1 H'FFFA2 H'FFFA3 H'FFFA5/ H'FFFA7 * 3 H'FFFA4/ H'FFFA6 * 3 Name Port A data direction register Port A data register Port B data direction register Port B data register TPC output mode register TPC output control register Next data enable register B Next data enable register A Next data register A Next data register B Abbreviation PADDR PADR PBDDR PBDR TPMR TPCR NDERB NDERA NDRA NDRB R/W W R/(W)* W R/(W)* R/W R/W R/W R/W R/W R/W 2 2 Initial Value H'00 H'00 H'00 H'00 H'F0 H'FF H'00 H'00 H'00 H'00 Notes: *1 Lower 20 bits of the address in advanced mode. *2 Bits used for TPC output cannot be written. *3 The NDRA address is H'FFFA5 when the same output trigger is selected for TPC output groups 0 and 1 by settings in TPCR. When the output triggers are different, the NDRA address is H'FFFA7 for group 0 and H'FFFA5 for group 1. Similarly, the address of NDRB is H'FFFA4 when the same output trigger is selected for TPC output groups 2 and 3 by settings in TPCR. When the output triggers are different, the NDRB address is H'FFFA6 for group 2 and H'FFFA4 for group 3. 326 10.2 10.2.1 Register Descriptions Port A Data Direction Register (PADDR) PADDR is an 8-bit write-only register that selects input or output for each pin in port A. Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W PA 7 DDR PA 6 DDR PA 5 DDR PA 4 DDR PA 3 DDR PA 2 DDR PA 1 DDR PA 0 DDR Port A data direction 7 to 0 These bits select input or output for port A pins Port A is multiplexed with pins TP7 to TP0. Bits corresponding to pins used for TPC output must be set to 1. For further information about PADDR, see section 7.11, Port A. 10.2.2 Port A Data Register (PADR) PADR is an 8-bit readable/writable register that stores TPC output data for groups 0 and 1, when these TPC output groups are used. Bit Initial value Read/Write 7 PA 0 R/(W) * 7 6 PA 0 R/(W) * 6 5 PA 0 R/(W) * 5 4 PA 0 R/(W) * 4 3 PA 0 R/(W) * 3 2 PA 0 R/(W) * 2 1 PA 0 R/(W) * 1 0 PA 0 R/(W) * 0 Port A data 7 to 0 These bits store output data for TPC output groups 0 and 1 Note: * Bits selected for TPC output by NDERA settings become read-only bits. For further information about PADR, see section 7.11, Port A. 327 10.2.3 Port B Data Direction Register (PBDDR) PBDDR is an 8-bit write-only register that selects input or output for each pin in port B. Bit Initial value Read/Write 7 0 W 6 0 W 5 0 W 4 0 W 3 0 W 2 0 W 1 0 W 0 0 W PB7 DDR PB6 DDR PB5 DDR PB4 DDR PB3 DDR PB2 DDR PB1 DDR PB0 DDR Port B data direction 7 to 0 These bits select input or output for port B pins Port B is multiplexed with pins TP15 to TP8. Bits corresponding to pins used for TPC output must be set to 1. For further information about PBDDR, see section 7.12, Port B. 10.2.4 Port B Data Register (PBDR) PBDR is an 8-bit readable/writable register that stores TPC output data for groups 2 and 3, when these TPC output groups are used. Bit Initial value Read/Write 7 PB 0 R/(W) * 7 6 PB 0 R/(W) * 6 5 PB 0 R/(W) * 5 4 PB 0 R/(W) * 4 3 PB 0 R/(W) * 3 2 PB 0 R/(W) * 2 1 PB 0 R/(W) * 1 0 PB 0 R/(W) * 0 Port B data 7 to 0 These bits store output data for TPC output groups 2 and 3 Note: * Bits selected for TPC output by NDERB settings become read-only bits. For further information about PBDR, see section 7.12, Port B. 328 10.2.5 Next Data Register A (NDRA) NDRA is an 8-bit readable/writable register that stores the next output data for TPC output groups 1 and 0 (pins TP7 to TP0). During TPC output, when an 16-bit timer compare match event specified in TPCR occurs, NDRA contents are transferred to the corresponding bits in PADR. The address of NDRA differs depending on whether TPC output groups 0 and 1 have the same output trigger or different output triggers. NDRA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Same Trigger for TPC Output Groups 0 and 1: If TPC output groups 0 and 1 are triggered by the same compare match event, the NDRA address is H'FFFA5. The upper 4 bits belong to group 1 and the lower 4 bits to group 0. Address H'FFFA7 consists entirely of reserved bits that cannot be modified and always read 1. Address H'FFFA5 Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 NDR3 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W Next data 7 to 4 These bits store the next output data for TPC output group 1 Next data 3 to 0 These bits store the next output data for TPC output group 0 Address H'FFFA7 Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Reserved bits 329 Different Triggers for TPC Output Groups 0 and 1: If TPC output groups 0 and 1 are triggered by different compare match events, the address of the upper 4 bits of NDRA (group 1) is H'FFFA5 and the address of the lower 4 bits (group 0) is H'FFFA7. Bits 3 to 0 of address H'FFFA5 and bits 7 to 4 of address H'FFFA7 are reserved bits that cannot be modified and always read 1. Address H'FFFA5 Bit Initial value Read/Write 7 NDR7 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Next data 7 to 4 These bits store the next output data for TPC output group 1 Reserved bits Address H'FFFA7 Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 NDR3 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W Reserved bits Next data 3 to 0 These bits store the next output data for TPC output group 0 330 10.2.6 Next Data Register B (NDRB) NDRB is an 8-bit readable/writable register that stores the next output data for TPC output groups 3 and 2 (pins TP15 to TP8). During TPC output, when an 16-bit timer compare match event specified in TPCR occurs, NDRB contents are transferred to the corresponding bits in PBDR. The address of NDRB differs depending on whether TPC output groups 2 and 3 have the same output trigger or different output triggers. NDRB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Same Trigger for TPC Output Groups 2 and 3: If TPC output groups 2 and 3 are triggered by the same compare match event, the NDRB address is H'FFFA4. The upper 4 bits belong to group 3 and the lower 4 bits to group 2. Address H'FFFA6 consists entirely of reserved bits that cannot be modified and always read 1. Address H'FFFA4 Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 NDR11 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W Next data 15 to 12 These bits store the next output data for TPC output group 3 Next data 11 to 8 These bits store the next output data for TPC output group 2 Address H'FFFA6 Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Reserved bits 331 Different Triggers for TPC Output Groups 2 and 3: If TPC output groups 2 and 3 are triggered by different compare match events, the address of the upper 4 bits of NDRB (group 3) is H'FFFA4 and the address of the lower 4 bits (group 2) is H'FFFA6. Bits 3 to 0 of address H'FFFA4 and bits 7 to 4 of address H'FFFA6 are reserved bits that cannot be modified and always read 1. Address H'FFFA4 Bit Initial value Read/Write 7 NDR15 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Next data 15 to 12 These bits store the next output data for TPC output group 3 Reserved bits Address H'FFFA6 Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 NDR11 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W Reserved bits Next data 11 to 8 These bits store the next output data for TPC output group 2 332 10.2.7 Next Data Enable Register A (NDERA) NDERA is an 8-bit readable/writable register that enables or disables TPC output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis. Bit Initial value Read/Write 7 NDER7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 NDER2 0 R/W 1 0 R/W 0 0 R/W NDER6 NDER5 NDER4 NDER3 NDER1 NDER0 Next data enable 7 to 0 These bits enable or disable TPC output groups 1 and 0 If a bit is enabled for TPC output by NDERA, then when the 16-bit timer compare match event selected in the TPC output control register (TPCR) occurs, the NDRA value is automatically transferred to the corresponding PADR bit, updating the output value. If TPC output is disabled, the bit value is not transferred from NDRA to PADR and the output value does not change. NDERA is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Next Data Enable 7 to 0 (NDER7 to NDER0): These bits enable or disable TPC output groups 1 and 0 (TP7 to TP0) on a bit-by-bit basis. Bits 7 to 0 NDER7 to NDER0 0 1 Description TPC outputs TP7 to TP0 are disabled (NDR7 to NDR0 are not transferred to PA 7 to PA 0) TPC outputs TP7 to TP0 are enabled (NDR7 to NDR0 are transferred to PA 7 to PA 0) (Initial value) 333 10.2.8 Next Data Enable Register B (NDERB) NDERB is an 8-bit readable/writable register that enables or disables TPC output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis. Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER8 Next data enable 15 to 8 These bits enable or disable TPC output groups 3 and 2 If a bit is enabled for TPC output by NDERB, then when the 16-bit timer compare match event selected in the TPC output control register (TPCR) occurs, the NDRB value is automatically transferred to the corresponding PBDR bit, updating the output value. If TPC output is disabled, the bit value is not transferred from NDRB to PBDR and the output value does not change. NDERB is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 0--Next Data Enable 15 to 8 (NDER15 to NDER8): These bits enable or disable TPC output groups 3 and 2 (TP15 to TP8) on a bit-by-bit basis. Bits 7 to 0 NDER15 to NDER8 0 1 Description TPC outputs TP15 to TP8 are disabled (NDR15 to NDR8 are not transferred to PB 7 to PB 0) TPC outputs TP15 to TP8 are enabled (NDR15 to NDR8 are transferred to PB 7 to PB 0) (Initial value) 334 10.2.9 TPC Output Control Register (TPCR) TPCR is an 8-bit readable/writable register that selects output trigger signals for TPC outputs on a group-by-group basis. Bit Initial value Read/Write 7 1 R/W 6 1 R/W 5 1 R/W 4 1 R/W 3 1 R/W 2 1 R/W 1 1 R/W 0 1 R/W G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 Group 3 compare match select 1 and 0 These bits select the compare match Group 2 compare event that triggers match select 1 and 0 TPC output group 3 These bits select (TP15 to TP12) the compare match event that triggers TPC output group 2 (TP11 to TP8) Group 1 compare match select 1 and 0 These bits select the compare match Group 0 compare event that triggers match select 1 and 0 TPC output group 1 These bits select (TP7 to TP4) the compare match event that triggers TPC output group 0 (TP3 to TP0) TPCR is initialized to H'FF by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 and 6--Group 3 Compare Match Select 1 and 0 (G3CMS1, G3CMS0): These bits select the compare match event that triggers TPC output group 3 (TP15 to TP12). Bit 7 G3CMS1 0 Bit 6 G3CMS0 0 1 1 0 1 Description TPC output group 3 (TP 15 to TP12 ) is triggered by compare match in 16-bit timer channel 0 TPC output group 3 (TP 15 to TP12 ) is triggered by compare match in 16-bit timer channel 1 TPC output group 3 (TP 15 to TP12 ) is triggered by compare match in 16-bit timer channel 2 TPC output group 3 (TP 15 to TP12 ) is triggered by compare match in 16-bit timer channel 2 (Initial value) 335 Bits 5 and 4--Group 2 Compare Match Select 1 and 0 (G2CMS1, G2CMS0): These bits select the compare match event that triggers TPC output group 2 (TP11 to TP8). Bit 5 G2CMS1 0 Bit 4 G2CMS0 0 1 1 0 1 Description TPC output group 2 (TP 11 to TP8) is triggered by compare match in 16-bit timer channel 0 TPC output group 2 (TP 11 to TP8) is triggered by compare match in 16-bit timer channel 1 TPC output group 2 (TP 11 to TP8) is triggered by compare match in 16-bit timer channel 2 TPC output group 2 (TP 11 to TP8) is triggered by compare match in 16-bit timer channel 2 (Initial value) Bits 3 and 2--Group 1 Compare Match Select 1 and 0 (G1CMS1, G1CMS0): These bits select the compare match event that triggers TPC output group 1 (TP7 to TP4). Bit 3 G1CMS1 0 Bit 2 G1CMS0 0 1 1 0 1 Description TPC output group 1 (TP 7 to TP4) is triggered by compare match in 16-bit timer channel 0 TPC output group 1 (TP 7 to TP4) is triggered by compare match in 16-bit timer channel 1 TPC output group 1 (TP 7 to TP4) is triggered by compare match in 16-bit timer channel 2 TPC output group 1 (TP 7 to TP4) is triggered by compare match in 16-bit timer channel 2 (Initial value) Bits 1 and 0--Group 0 Compare Match Select 1 and 0 (G0CMS1, G0CMS0): These bits select the compare match event that triggers TPC output group 0 (TP3 to TP0). Bit 1 G0CMS1 0 Bit 0 G0CMS0 0 1 1 0 1 Description TPC output group 0 (TP 3 to TP0) is triggered by compare match in 16-bit timer channel 0 TPC output group 0 (TP 3 to TP0) is triggered by compare match in 16-bit timer channel 1 TPC output group 0 (TP 3 to TP0) is triggered by compare match in 16-bit timer channel 2 TPC output group 0 (TP 3 to TP0) is triggered by compare match in 16-bit timer channel 2 (Initial value) 336 10.2.10 TPC Output Mode Register (TPMR) TPMR is an 8-bit readable/writable register that selects normal or non-overlapping TPC output for each group. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W G3NOV G2NOV G1NOV G0NOV Reserved bits Group 3 non-overlap Selects non-overlapping TPC output for group 3 (TP15 to TP12 ) Group 2 non-overlap Selects non-overlapping TPC output for group 2 (TP11 to TP8 ) Group 1 non-overlap Selects non-overlapping TPC output for group 1 (TP7 to TP4 ) Group 0 non-overlap Selects non-overlapping TPC output for group 0 (TP3 to TP0 ) The output trigger period of a non-overlapping TPC output waveform is set in general register B (GRB) in the 16-bit timer channel selected for output triggering. The non-overlap margin is set in general register A (GRA). The output values change at compare match A and B. For details see section 10.3.4, Non-Overlapping TPC Output. TPMR is initialized to H'F0 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 1. 337 Bit 3--Group 3 Non-Overlap (G3NOV): Selects normal or non-overlapping TPC output for group 3 (TP15 to TP12). Bit 3 G3NOV 0 1 Description Normal TPC output in group 3 (output values change at compare match A in the selected 16-bit timer channel) Non-overlapping TPC output in group 3 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Bit 2--Group 2 Non-Overlap (G2NOV): Selects normal or non-overlapping TPC output for group 2 (TP11 to TP8). Bit 2 G2NOV 0 1 Description Normal TPC output in group 2 (output values change at compare match A in the selected 16-bit timer channel) Non-overlapping TPC output in group 2 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Bit 1--Group 1 Non-Overlap (G1NOV): Selects normal or non-overlapping TPC output for group 1 (TP7 to TP4). Bit 1 G1NOV 0 1 Description Normal TPC output in group 1 (output values change at compare match A in the selected 16-bit timer channel) Non-overlapping TPC output in group 1 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) Bit 0--Group 0 Non-Overlap (G0NOV): Selects normal or non-overlapping TPC output for group 0 (TP3 to TP0). Bit 0 G0NOV 0 1 Description Normal TPC output in group 0 (output values change at compare match A in the selected 16-bit timer channel) Non-overlapping TPC output in group 0 (independent 1 and 0 output at compare match A and B in the selected 16-bit timer channel) (Initial value) 338 10.3 10.3.1 Operation Overview When corresponding bits in PADDR or PBDDR and NDERA or NDERB are set to 1, TPC output is enabled. The TPC output initially consists of the corresponding PADR or PBDR contents. When a compare-match event selected in TPCR occurs, the corresponding NDRA or NDRB bit contents are transferred to PADR or PBDR to update the output values. Figure 10.2 illustrates the TPC output operation. Table 10.3 summarizes the TPC operating conditions. DDR Q NDER Q Output trigger signal C Q TPC output pin DR D Q NDR D Internal data bus Figure 10.2 TPC Output Operation Table 10.3 TPC Operating Conditions NDER 0 DDR 0 1 1 0 1 Pin Function Generic input port Generic output port Generic input port (but the DR bit is a read-only bit, and when compare match occurs, the NDR bit value is transferred to the DR bit) TPC pulse output Sequential output of up to 16-bit patterns is possible by writing new output data to NDRA and NDRB before the next compare match. For information on non-overlapping operation, see section 10.3.4, Non-Overlapping TPC Output. 339 10.3.2 Output Timing If TPC output is enabled, NDRA/NDRB contents are transferred to PADR/PBDR and output when the selected compare match event occurs. Figure 10.3 shows the timing of these operations for the case of normal output in groups 2 and 3, triggered by compare match A. TCNT N N+1 GRA Compare match A signal N NDRB n PBDR TP8 to TP15 m m n n Figure 10.3 Timing of Transfer of Next Data Register Contents and Output (Example) 340 10.3.3 Normal TPC Output Sample Setup Procedure for Normal TPC Output: Figure 10.4 shows a sample procedure for setting up normal TPC output. Normal TPC output Select GR functions Set GRA value Select counting operation Select interrupt request 1 2 3 4 1. 2. 3. Set TIOR to make GRA an output compare register (with output inhibited). Set the TPC output trigger period. Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. Enable the IMFA interrupt in TISRA. Set the initial output values in the DR bits of the input/output port pins to be used for TPC output. Set the DDR bits of the input/output port pins to be used for TPC output to 1. Set the NDER bits of the pins to be used for TPC output to 1. Select the 16-bit timer compare match event to be used as the TPC output trigger in TPCR. Set the next TPC output values in the NDR bits. 16-bit timer setup 4. Set initial output data Select port output Port and TPC setup Enable TPC output Select TPC output trigger Set next TPC output data 16-bit timer setup 5 6 7 8 9 6. 7. 8. 5. Start counter 10 9. No Compare match? Yes Set next TPC output data 10. Set the STR bit to 1 in TSTR to start the timer counter. 11. At each IMFA interrupt, set the next output values in the NDR bits. 11 Figure 10.4 Setup Procedure for Normal TPC Output (Example) 341 Example of Normal TPC Output (Example of Five-Phase Pulse Output): Figure 10.5 shows an example in which the TPC is used for cyclic five-phase pulse output. TCNT value TCNT GRA Compare match H'0000 NDRB 80 C0 40 60 20 30 10 18 08 88 80 C0 40 Time PBDR 00 80 C0 40 60 20 30 10 18 08 88 80 C0 TP15 TP14 TP13 TP12 TP11 1. The 16-bit timer channel to be used as the output trigger channel is set up so that GRA is an output compare register and the counter will be cleared by compare match A. The trigger period is set in GRA. The IMIEA bit is set to 1 in TISRA to enable the compare match A interrupt. 2. H'F8 is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in TPCR to select compare match in the 16-bit timer channel set up in step 1 as the output trigger. Output data H'80 is written in NDRB. 3. The timer counter in this 16-bit timer channel is started. When compare match A occurs, the NDRB contents are transferred to PBDR and output. The compare match/input capture A (IMFA) interrupt service routine writes the next output data (H'C0) in NDRB. 4. Five-phase overlapping pulse output (one or two phases active at a time) can be obtained by writing H'40, H'60, H'20, H'30, H'10, H'18, H'08, H'88... at successive IMFA interrupts. Figure 10.5 Normal TPC Output Example (Five-Phase Pulse Output) 342 10.3.4 Non-Overlapping TPC Output Sample Setup Procedure for Non-Overlapping TPC Output: Figure 10.6 shows a sample procedure for setting up non-overlapping TPC output. Non-overlapping TPC output Select GR functions Set GR values Select counting operation Select interrupt requests 1 2 3 4 1. Set TIOR to make GRA and GRB output compare registers (with output inhibited). 2. Set the TPC output trigger period in GRB and the non-overlap margin in GRA. 3. Select the counter clock source with bits TPSC2 to TPSC0 in TCR. Select the counter clear source with bits CCLR1 and CCLR0. 4. Enable the IMFA interrupt in TISRA. Set initial output data Set up TPC output Enable TPC transfer Port and TPC setup Select TPC transfer trigger Select non-overlapping groups Set next TPC output data 5 6 7 8 9 10 5. Set the initial output values in the DR bits of the input/output port pins to be used for TPC output. 6. Set the DDR bits of the input/output port pins to be used for TPC output to 1. 7. Set the NDER bits of the pins to be used for TPC output to 1. 8. In TPCR, select the 16-bit timer compare match event to be used as the TPC output trigger. 9. In TPMR, select the groups that will operate in non-overlap mode. Start counter 11 10. Set the next TPC output values in the NDR bits. 11. Set the STR bit to 1 in TSTR to start the timer counter. 12. At each IMFA interrupt, write the next output value in the NDR bits. 12 16-bit timer setup 16-bit timer setup Compare match A? Yes Set next TPC output data No Figure 10.6 Setup Procedure for Non-Overlapping TPC Output (Example) 343 Example of Non-Overlapping TPC Output (Example of Four-Phase Complementary NonOverlapping Output): Figure 10.7 shows an example of the use of TPC output for four-phase complementary non-overlapping pulse output. TCNT value GRB GRA H'0000 NDRB 95 65 59 56 95 65 Time TCNT PBDR 00 95 05 65 41 59 50 56 14 95 05 65 Non-overlap margin TP15 TP14 TP13 TP12 TP11 TP10 TP9 TP8 1. The 16-bit timer channel to be used as the output trigger channel is set up so that GRA and GRB are output compare registers and the counter will be cleared by compare match B. The TPC output trigger period is set in GRB. The non-overlap margin is set in GRA. The IMIEA bit is set to 1 in TISRA to enable IMFA interrupts. 2. H'FF is written in PBDDR and NDERB, and bits G3CMS1, G3CMS0, G2CMS1, and G2CMS0 are set in TPCR to select compare match in the 16-bit timer channel set up in step 1 as the output trigger. Bits G3NOV and G2NOV are set to 1 in TPMR to select non-overlapping output. Output data H'95 is written in NDRB. 3. The timer counter in this 16-bit timer channel is started. When GRB occurs, outputs change from 1 to 0. When GRA occurs, outputs change from 0 to 1 (the change from 0 to 1 is delayed by the value of GRA). The IMFA interrupt service routine writes the next output data (H'65) in NDRB. 4. Four-phase complementary non-overlapping pulse output can be obtained by writing H'59, H'56, H'95... at successive IMFA interrupts. Figure 10.7 Non-Overlapping TPC Output Example (Four-Phase Complementary Non-Overlapping Pulse Output) 344 10.3.5 TPC Output Triggering by Input Capture TPC output can be triggered by 16-bit timer input capture as well as by compare match. If GRA functions as an input capture register in the 16-bit timer channel selected in TPCR, TPC output will be triggered by the input capture signal. Figure 10.8 shows the timing. TIOC pin Input capture signal NDR N DR M N Figure 10.8 TPC Output Triggering by Input Capture (Example) 345 10.4 10.4.1 Usage Notes Operation of TPC Output Pins TP 0 to TP15 are multiplexed with 16-bit timer, address bus, and other pin functions. When 16-bit timer, or address bus output is enabled, the corresponding pins cannot be used for TPC output. The data transfer from NDR bits to DR bits takes place, however, regardless of the status of the pin. Pin functions should be changed only under conditions in which the output trigger event will not occur. 10.4.2 Note on Non-Overlapping Output During non-overlapping operation, the transfer of NDR bit values to DR bits takes place as follows. 1. NDR bits are always transferred to DR bits at compare match A. 2. At compare match B, NDR bits are transferred only if their value is 0. Bits are not transferred if their value is 1. Figure 10.9 illustrates the non-overlapping TPC output operation. DDR Q NDER Q Compare match A Compare match B C Q TPC output pin DR D Q NDR D Figure 10.9 Non-Overlapping TPC Output 346 Therefore, 0 data can be transferred ahead of 1 data by making compare match B occur before compare match A. NDR contents should not be altered during the interval from compare match B to compare match A (the non-overlap margin). This can be accomplished by having the IMFA interrupt service routine write the next data in NDR. The next data must be written before the next compare match B occurs. Figure 10.10 shows the timing relationships. Compare match A Compare match B NDR write NDR write NDR DR 0 output 0/1 output Write to NDR in this interval Do not write to NDR in this interval Do not write to NDR in this interval 0 output 0/1 output Write to NDR in this interval Figure 10.10 Non-Overlapping Operation and NDR Write Timing 347 348 Section 11 Watchdog Timer 11.1 Overview The H8/3062 Series has an on-chip watchdog timer (WDT). The WDT has two selectable functions: it can operate as a watchdog timer to supervise system operation, or it can operate as an interval timer. As a watchdog timer, it generates a reset signal for the H8/3062 chip if a system crash allows the timer counter (TCNT) to overflow before being rewritten. In interval timer operation, an interval timer interrupt is requested at each TCNT overflow. 11.1.1 Features WDT features are listed below. * Selection of eight counter clock sources /2, /32, /64, /128, /256, /512, /2048, or /4096 * Interval timer option * Timer counter overflow generates a reset signal or interrupt. The reset signal is generated in watchdog timer operation. An interval timer interrupt is generated in interval timer operation. * Watchdog timer reset signal resets the entire H8/3062 internally, and can also be output externally. The reset signal generated by timer counter overflow during watchdog timer operation resets the entire H8/3062 internally. An external reset signal can be output from the RESO pin to reset other system devices simultaneously. In the versions with on-chip flash memory, the RESO pin functions as the FWE pin, and therefore there is no function for outputting a reset signal externally. 349 11.1.2 Block Diagram Figure 11.1 shows a block diagram of the WDT. Overflow TCNT Interrupt signal Interrupt (interval timer) control TCSR Read/ write control Internal data bus RSTCSR Internal clock sources /2 /32 /64 Clock Clock selector /128 /256 /512 /2048 /4096 Reset (internal, external) Reset control Legend: TCNT : Timer counter TCSR : Timer control/status register RSTCSR : Reset control/status register Figure 11.1 WDT Block Diagram 11.1.3 Pin Configuration Table 11.1 describes the WDT output pin*. Note: * Not present in the versions with on-chip flash memory. Table 11.1 WDT Pin Name Reset output Abbreviation RESO I/O Output* Function External output of the watchdog timer reset signal Note: * Open-drain output 350 11.1.4 Register Configuration Table 11.2 summarizes the WDT registers. Table 11.2 WDT Registers Address* 1 Write*2 Read Name Abbreviation TCSR TCNT RSTCSR R/W R/(W)* R/W R/(W)* 3 3 Initial Value H'18 H'00 H'3F H'FFF8C H'FFF8C Timer control/status register H'FFF8D Timer counter H'FFF8E H'FFF8F Reset control/status register Notes: *1 Lower 20 bits of the address in advanced mode *2 Write word data starting at this address. *3 Only 0 can be written in bit 7, to clear the flag. 11.2 11.2.1 Register Descriptions Timer Counter (TCNT) TCNT is an 8-bit readable and writable up-counter. Bit Initial value Read/Write 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W Note: The method for writing to TCNT is different from that for general registers to prevent inadvertent overwriting. For details see section 11.2.4, Notes on Register Access. When the TME bit is set to 1 in TCSR, TCNT starts counting pulses generated from an internal clock source selected by bits CKS2 to CKS0 in TCSR. When the count overflows (changes from H'FF to H'00), the OVF bit is set to 1 in TCSR. TCNT is initialized to H'00 by a reset and when the TME bit is cleared to 0. 351 11.2.2 Timer Control/Status Register (TCSR) TCSR is an 8-bit readable and writable register. Its functions include selecting the timer mode and clock source. Bit Initial value Read/Write 7 OVF 0 R/(W)* 6 WT/IT 0 R/W 5 TME 0 R/W 4 -- 1 -- 3 -- 1 -- 2 CKS2 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Clock select These bits select the TCNT clock source Reserved bits Timer enable Selects whether TCNT runs or halts Timer mode select Selects the mode Overflow flag Status flag indicating overflow Notes: The method for writing to TCSR is different from that for general registers to prevent inadvertent overwriting. For details see section 11.2.4, Notes on Register Access. * Only 0 can be written, to clear the flag. Bits 7 to 5 are initialized to 0 by a reset and in standby mode. Bits 2 to 0 are initialized to 0 by a reset. In software standby mode bits 2 to 0 are not initialized, but retain their previous values. Bit 7--Overflow Flag (OVF): This status flag indicates that the timer counter has overflowed from H'FF to H'00. Bit 7 OVF 0 1 Description [Clearing condition] Cleared by reading OVF when OVF = 1, then writing 0 in OVF [Setting condition] Set when TCNT changes from H'FF to H'00 (Initial value) 352 Bit 6--Timer Mode Select (WT/IT): Selects whether to use the WDT as a watchdog timer or interval timer. If used as an interval timer, the WDT generates an interval timer interrupt request when TCNT overflows. If used as a watchdog timer, the WDT generates a reset signal when TCNT overflows. Bit 6 WT/IT 0 1 Description Interval timer: requests interval timer interrupts Watchdog timer: generates a reset signal (Initial value) Bit 5--Timer Enable (TME): Selects whether TCNT runs or is halted. When WT/IT = 1, clear the software standby bit (SSBY) to 0 in SYSCR before setting TME. When setting SSBY to 1, TME should be cleared to 0. Bit 5 TME 0 1 Description TCNT is initialized to H'00 and halted TCNT is counting (Initial value) Bits 4 and 3--Reserved: These bits cannot be modified and are always read as 1. Bits 2 to 0--Clock Select 2 to 0 (CKS2 to CKS0): These bits select one of eight internal clock sources, obtained by prescaling the system clock (), for input to TCNT. Bit 2 CKS2 0 Bit 1 CKS1 0 Bit 0 CKS0 0 1 1 0 1 1 0 0 1 1 0 1 Description /2 /32 /64 /128 /256 /512 /2048 /4096 (Initial value) 353 11.2.3 Reset Control/Status Register (RSTCSR) RSTCSR is an 8-bit readable and writable register that indicates when a reset signal has been generated by watchdog timer overflow, and controls external output of the reset signal. Bit Initial value Read/Write 7 WRST 0 R/(W)* 6 RSTOE 0 R/W 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Reserved bits Reset output enable Enables or disables external output of the reset signal Watchdog timer reset Indicates that a reset signal has been generated Notes: The method for writing to RSTCSR is different from that for general registers to prevent inadvertent overwriting. For details see section 11.2.4, Notes on Register Access. * Only 0 can be written in bit 7, to clear the flag. Bits 7 and 6 are initialized by input of a reset signal at the RES pin. They are not initialized by reset signals generated by watchdog timer overflow. Bit 7--Watchdog Timer Reset (WRST): During watchdog timer operation, this bit indicates that TCNT has overflowed and generated a reset signal. This reset signal resets the entire H8/3062 chip internally. If bit RSTOE is set to 1, this reset signal is also output (low) at the RESO pin to initialize external system devices. Note that there is no RESO pin in the versions with on-chip flash memory. Bit 7 WRST 0 Description [Clearing conditions] * * 1 Reset signal at RES pin. Read WRST when WRST =1, then write 0 in WRST. (Initial value) [Setting condition] Set when TCNT overflow generates a reset signal during watchdog timer operation 354 Bit 6--Reset Output Enable (RSTOE): Enables or disables external output at the RESO pin of the reset signal generated if TCNT overflows during watchdog timer operation. Note that there is no RESO pin in the versions with on-chip flash memory. Bit 6 RSTOE Description 0 1 Reset signal is not output externally Reset signal is output externally (Initial value) Bits 5 to 0--Reserved: These bits cannot be modified and are always read as 1. 11.2.4 Notes on Register Rewriting The watchdog timer's TCNT, TCSR, and RSTCSR registers differ from other registers in being more difficult to write. The procedures for writing and reading these registers are given below. Writing to TCNT and TCSR: These registers must be written by a word transfer instruction. They cannot be written by byte instructions. Figure 11.2 shows the format of data written to TCNT and TCSR. TCNT and TCSR both have the same write address. The write data must be contained in the lower byte of the written word. The upper byte must contain H'5A (password for TCNT) or H'A5 (password for TCSR). This transfers the write data from the lower byte to TCNT or TCSR. TCNT write Address H'FFF8C* 15 H'5A 87 Write data 0 TCSR write Address H'FFF8C* 15 H'A5 87 Write data 0 Note: * Lower 20 bits of the address in advanced mode Figure 11.2 Format of Data Written to TCNT and TCSR 355 Writing to RSTCSR: RSTCSR must be written by a word transfer instruction. It cannot be written by byte transfer instructions. Figure 11.3 shows the format of data written to RSTCSR. To write 0 in the WRST bit, the write data must have H'A5 in the upper byte and H'00 in the lower byte. The data (H'00) in the lower byte is written to RSTCSR, clearing the WRST bit to 0. To write to the RSTOE bit, the upper byte must contain H'5A and the lower byte must contain the write data. Writing this word transfers a write data value into the RSTOE bit. Writing 0 in WRST bit Address H'FFF8E* 15 H'A5 87 H'00 0 Writing to RSTOE bit Address H'FFF8E* 15 H'5A 87 Write data 0 Note: * Lower 20 bits of the address in advanced mode Figure 11.3 Format of Data Written to RSTCSR Reading TCNT, TCSR, and RSTCSR: For reads of TCNT, TCSR, and RSTCSR, address H'FFF8C is assigned to TCSR, address H'FFF8D to TCNT, and address H'FFF8F to RSTCSR. These registers are therefore read like other registers. Byte transfer instructions can be used for reading. Table 11.3 lists the read addresses of TCNT, TCSR, and RSTCSR. Table 11.3 Read Addresses of TCNT, TCSR, and RSTCSR Address* H'FFF8C H'FFF8D H'FFF8F Register TCSR TCNT RSTCSR Note: * Lower 20 bits of the address in advanced mode 356 11.3 Operation Operations when the WDT is used as a watchdog timer and as an interval timer are described below. 11.3.1 Watchdog Timer Operation Figure 11.4 illustrates watchdog timer operation. To use the WDT as a watchdog timer, set the WT/IT and TME bits to 1 in TCSR. Software must prevent TCNT overflow by rewriting the TCNT value (normally by writing H'00) before overflow occurs. If TCNT fails to be rewritten and overflows due to a system crash etc., the H8/3062 is internally reset for a duration of 518 states. The watchdog reset signal can be externally output from the RESO pin to reset external system devices. The reset signal is output externally for 132 states. External output can be enabled or disabled by the RSTOE bit in RSTCSR. Note that there is no RESO pin in the versions with onchip flash memory. A watchdog reset has the same vector as a reset generated by input at the RES pin. Software can distinguish a RES reset from a watchdog reset by checking the WRST bit in RSTCSR. If a RES reset and a watchdog reset occur simultaneously, the RES reset takes priority. WDT overflow H'FF TCNT count value H'00 TME set to 1 OVF = 1 Start Internal reset signal H'00 written in TCNT Reset H'00 written in TCNT 518 states RESO 132 states Figure 11.4 Operation in Watchdog Timer Mode 357 11.3.2 Interval Timer Operation Figure 11.5 illustrates interval timer operation. To use the WDT as an interval timer, clear bit WT/IT to 0 and set bit TME to 1 in TCSR. An interval timer interrupt request is generated at each TCNT overflow. This function can be used to generate interval timer interrupts at regular intervals. H'FF TCNT count value Time t H'00 WT/ IT = 0 TME = 1 Interval timer interrupt Interval timer interrupt Interval timer interrupt Interval timer interrupt Figure 11.5 Interval Timer Operation 11.3.3 Timing of Setting of Overflow Flag (OVF) Figure 11.6 shows the timing of setting of the OVF flag. The OVF flag is set to 1 when TCNT overflows. At the same time, a reset signal is generated in watchdog timer operation, or an interval timer interrupt is generated in interval timer operation. TCNT H'FF H'00 Overflow signal OVF Figure 11.6 Timing of Setting of OVF 358 11.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) The WRST bit in RSTCSR is valid when bits WT/IT and TME are both set to 1 in TCSR. Figure 11.7 shows the timing of setting of WRST and the internal reset timing. The WRST bit is set to 1 when TCNT overflows and OVF is set to 1. At the same time an internal reset signal is generated for the entire H8/3062 chip. This internal reset signal clears OVF to 0, but the WRST bit remains set to 1. The reset routine must therefore clear the WRST bit. TCNT H'FF H'00 Overflow signal OVF WDT internal reset WRST Figure 11.7 Timing of Setting of WRST Bit and Internal Reset 359 11.4 Interrupts During interval timer operation, an overflow generates an interval timer interrupt (WOVI). The interval timer interrupt is requested whenever the OVF flag is set to 1 in TCSR. 11.5 Usage Notes Contention between TCNT Write and Increment: If a timer counter clock pulse is generated during the T3 state of a write cycle to TCNT, the write takes priority and the timer count is not incremented. See figure 11.8. CPU: TCNT write cycle T1 T2 T3 TCNT Internal write signal TCNT input clock TCNT N M Counter write data Figure 11.8 Contention between TCNT Write and Count up Changing CKS2 to CKS0 Bit: Halt TCNT by clearing the TME bit to 0 in TCSR before changing the values of bits CKS2 to CKS0. 360 Section 12 Serial Communication Interface 12.1 Overview The H8/3062 Series has a serial communication interface (SCI) with two independent channels. The two channels have identical functions. The SCI can communicate in both asynchronous and synchronous mode. It also has a multiprocessor communication function for serial communication among two or more processors. When the SCI is not used, it can be halted to conserve power. Each SCI channel can be halted independently. For details, see section 21.6, Module Standby Function. The SCI also has a smart card interface function conforming to the ISO/IEC 7816-3 (Identification Card) standard. This function supports serial communication with a smart card. Switching between the normal serial communication interface and the smart card interface is carried out by means of a register setting. 12.1.1 Features SCI features are listed below. * Selection of synchronous or asynchronous mode for serial communication Asynchronous mode Serial data communication is synchronized one character at a time. The SCI can communicate with a universal asynchronous receiver/transmitter (UART), asynchronous communication interface adapter (ACIA), or other chip that employs standard asynchronous communication. It can also communicate with two or more other processors using the multiprocessor communication function. There are 12 selectable serial data transfer formats. Data length: 7 or 8 bits Stop bit length: Parity: Multiprocessor bit: Receive error detection: Break detection: 1 or 2 bits even/odd/none 1 or 0 parity, overrun, and framing errors by reading the RxD level directly when a framing error occurs Synchronous mode Serial data communication is synchronized with a clock signal. The SCI can communicate with other chips having a synchronous communication function. There is a single serial data communication format. Data length: 8 bits Receive error detection: overrun errors 361 * Full-duplex communication The transmitting and receiving sections are independent, so the SCI can transmit and receive simultaneously. The transmitting and receiving sections are both double-buffered, so serial data can be transmitted and received continuously. * The following settings can be made for the serial data to be transferred: LSB-first or MSB-first transfer Inversion of data logic level * Built-in baud rate generator with selectable bit rates * Selectable transmit/receive clock sources: internal clock from baud rate generator, or external clock from the SCK pin * Four types of interrupts Transmit-data-empty, transmit-end, receive-data-full, and receive-error interrupts are requested independently. Features of the smart card interface are listed below. * Asynchronous communication Data length: 8 bits Parity bits generated and checked Error signal output in receive mode (parity error) Error signal detect and automatic data retransmit in transmit mode Supports both direct convention and inverse convention * Built-in baud rate generator with selectable bit rates * Three types of interrupts Transmit-data-empty, receive-data-full, and transmit/receive-error interrupts are requested independently. 362 12.1.2 Block Diagram Figure 12.1 shows a block diagram of the SCI. Module data bus Bus interface Internal data bus RDR TDR SSR SCR SMR SCMR Transmit/receive control BRR Baud rate generator / 4 /16 /64 RxD RSR TSR TxD Parity generate Parity check Clock External clock TEI TXI RXI ERI SCK Legend: RSR : RDR : TSR : TDR : SMR : SCR : SSR : BRR : SCMR : Receive shift register Receive data register Transmit shift register Transmit data register Serial mode register Serial control register Serial status register Bit rate register Smart card mode register Figure 12.1 SCI Block Diagram 363 12.1.3 Pin Configuration The SCI has serial pins for each channel as listed in table 12.1. Table 12.1 SCI Pins Channel Name 0 Serial clock pin Receive data pin Transmit data pin 1 Serial clock pin Receive data pin Transmit data pin Abbreviation SCK 0 RxD0 TxD0 SCK 1 RxD1 TxD1 I/O Input/output Input Output Input/output Input Output Function SCI0 clock input/output SCI0 receive data input SCI0 transmit data output SCI1 clock input/output SCI1 receive data input SCI1 transmit data output 364 12.1.4 Register Configuration The SCI has internal registers as listed in table 12.2. These registers select asynchronous or synchronous mode, specify the data format and bit rate, control the transmitter and receiver sections, and specify switching between the serial communication interface and smart card interface. Table 12.2 SCI Registers Channel 0 Address* 1 H'FFFB0 H'FFFB1 H'FFFB2 H'FFFB3 H'FFFB4 H'FFFB5 H'FFFB6 1 H'FFFB8 H'FFFB9 H'FFFBA H'FFFBB H'FFFBC H'FFFBD H'FFFBE Name Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register Smart card mode register Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register Smart card mode register Abbreviation SMR BRR SCR TDR SSR RDR SCMR SMR BRR SCR TDR SSR RDR SCMR R/W R/W R/W R/W R/W R/(W)* R R/W R/W R/W R/W R/W R/(W)* R R/W 2 2 Initial Value H'00 H'FF H'00 H'FF H'84 H'00 H'F2 H'00 H'FF H'00 H'FF H'84 H'00 H'F2 Notes: *1 Indicates the lower 20 bits of the address in advanced mode. *2 Only 0 can be written, to clear flags. 365 12.2 12.2.1 Register Descriptions Receive Shift Register (RSR) RSR is the register that receives serial data. Bit 7 6 5 4 3 2 1 0 Read/Write -- -- -- -- -- -- -- -- The SCI loads serial data input at the RxD pin into RSR in the order received, LSB (bit 0) first, thereby converting the data to parallel data. When one byte of data has been received, it is automatically transferred to RDR. The CPU cannot read or write RSR directly. 12.2.2 Receive Data Register (RDR) RDR is the register that stores received serial data. Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R When the SCI has received one byte of serial data, it transfers the received data from RSR into RDR for storage, completing the receive operation. RSR is then ready to receive the next data. This double-buffering allows data to be received continuously. RDR is a read-only register. Its contents cannot be modified by the CPU. RDR is initialized to H'00 by a reset and in standby mode. 366 12.2.3 Transmit Shift Register (TSR) TSR is the register that transmits serial data. Bit 7 6 5 4 3 2 1 0 Read/Write -- -- -- -- -- -- -- -- The SCI loads transmit data from TDR to TSR, then transmits the data serially from the TxD pin, LSB (bit 0) first. After transmitting one data byte, the SCI automatically loads the next transmit data from TDR into TSR and starts transmitting it. If the TDRE flag is set to 1 in SSR, however, the SCI does not load the TDR contents into TSR. The CPU cannot read or write RSR directly. 12.2.4 Transmit Data Register (TDR) TDR is an 8-bit register that stores data for serial transmission. Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W When the SCI detects that TSR is empty, it moves transmit data written in TDR from TDR into TSR and starts serial transmission. Continuous serial transmission is possible by writing the next transmit data in TDR during serial transmission from TSR. The CPU can always read and write TDR. TDR is initialized to H'FF by a reset and in standby mode. 367 12.2.5 Serial Mode Register (SMR) SMR is an 8-bit register that specifies the SCI's serial communication format and selects the clock source for the baud rate generator. Bit 7 C/A Initial value Read/Write 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Clock select 1/0 These bits select the baud rate generator's clock source Multiprocessor mode Selects the multiprocessor function Stop bit length Selects the stop bit length Parity mode Selects even or odd parity Parity enable Selects whether a parity bit is added Character length Selects character length in asynchronous mode Communication mode Selects asynchronous or synchronous mode The CPU can always read and write SMR. SMR is initialized to H'00 by a reset and in standby mode. Bit 7--Communication Mode (C/A)/GSM Mode (GM): The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR. For Serial Communication Interface (SMIF Bit in SCMR Cleared to 0): Selects whether the SCI operates in asynchronous or synchronous mode. 368 Bit 7 C/A 0 1 Description Asynchronous mode Synchronous mode (Initial value) For Smart Card Interface (SMIF Bit in SCMR Set to 1): Selects GSM mode for the smart card interface. Bit 7 GM 0 1 Description The TEND flag is set 12.5 etu after the start bit The TEND flag is set 11.0 etu after the start bit (Initial value) Note: etu: Elementary time unit (time required to transmit one bit) Bit 6--Character Length (CHR): Selects 7-bit or 8-bits data length in asynchronous mode. In synchronous mode, the data length is 8 bits regardless of the CHR setting. Bit 6 CHR 0 1 Description 8-bit data 7-bit data * (Initial value) Note: * When 7-bit data is selected, the MSB (bit 7) of TDR is not transmitted. Bit 5--Parity Enable (PE): In asynchronous mode, this bit enables or disables the addition of a parity bit to transmit data, and the checking of the parity bit in receive data. In synchronous mode, the parity bit is neither added nor checked, regardless of the PE bit setting. Bit 5 PE 0 1 Description Parity bit not added or checked Parity bit added and checked* (Initial value) Note: * When PE bit is set to 1, an even or odd parity bit is added to transmit data according to the even or odd parity mode selection by the O/E bit, and the parity bit in receive data is checked to see that it matches the even or odd mode selected by the O/E bit. Bit 4--Parity Mode (O/E): Specifies whether even parity or odd parity is used for parity addition and checking. The O/E bit setting is only valid when the PE bit is set to 1, enabling parity bit addition and checking, in asynchronous mode. The O/E bit setting is ignored in synchronous mode, or when parity addition and checking is disabled in asynchronous mode. 369 Bit 4 O/E 0 1 Description Even parity* 1 Odd parity * 2 (Initial value) Notes: *1 When even parity is selected, the parity bit added to transmit data makes an even number of 1s in the transmitted character and parity bit combined. Receive data must have an even number of 1s in the received character and parity bit combined. *2 When odd parity is selected, the parity bit added to transmit data makes an odd number of 1s in the transmitted character and parity bit combined. Receive data must have an odd number of 1s in the received character and parity bit combined. Bit 3--Stop Bit Length (STOP): Selects one or two stop bits in asynchronous mode. This setting is used only in asynchronous mode. In synchronous mod no stop bit is added, so the STOP bit setting is ignored. Bit 3 STOP 0 1 Description 1 stop bit * 1 2 stop bits* 2 (Initial value) Notes: *1 One stop bit (with value 1) is added to the end of each transmitted character. *2 Two stop bits (with value 1) are added to the end of each transmitted character. In receiving, only the first stop bit is checked, regardless of the STOP bit setting. If the second stop bit is 1, it is treated as a stop bit. If the second stop bit is 0, it is treated as the start bit of the next incoming character. Bit 2--Multiprocessor Mode (MP): Selects a multiprocessor format. When a multiprocessor format is selected, parity settings made by the PE and O/E bits are ignored. The MP bit setting is valid only in asynchronous mode. It is ignored in synchronous mode. For further information on the multiprocessor communication function, see section 12.3.3, Multiprocessor Communication. Bit 2 MP 0 1 Description Multiprocessor function disabled Multiprocessor format selected (Initial value) Bits 1 and 0--Clock Select 1 and 0 (CKS1, CKS0): These bits select the clock source for the onchip baud rate generator. Four clock sources can be selected by the CKS1 and CKS0 bits: o, o/4, o/16, and o/64. 370 For the relationship between the clock source, bit rate register setting, and baud rate, see section 12.2.8, Bit Rate Register (BRR). Bit 1 CKS1 0 0 1 1 Bit 0 CKS0 0 1 0 1 Description /4 /16 /64 (Initial value) 12.2.6 Serial Control Register (SCR) SCR register enables or disables the SCI transmitter and receiver, enables or disables serial clock output in asynchronous mode, enables or disables interrupts, and selects the transmit/receive clock source. Bit 7 TIE Initial value Read/Write 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W Clock enable 1/0 These bits select the SCI clock source Transmit-end interrupt enable Enables or disables transmit-end interrupts (TEI) Multiprocessor interrupt enable Enables or disables multiprocessor interrupts Receive enable Enables or disables the receiver Transmit enable Enables or disables the transmitter Receive interrupt enable Enables or disables receive-data-full interrupts (RxI) and receive-error interrupts (ERI) Transmit interrupt enable Enables or disables transmit-data-empty interrupts (TxI) 371 The CPU can always read and write SCR. SCR is initialized to H'00 by a reset and in standby mode. Bit 7--Transmit Interrupt Enable (TIE): Enables or disables the transmit-data-empty interrupt (TXI) requested when the TDRE flag in SSR is set to 1 due to transfer of serial transmit data from TDR to TSR. Bit 7 TIE 0 1 Description Transmit-data-empty interrupt request (TXI) is disabled * Transmit-data-empty interrupt request (TXI) is enabled (Initial value) Note: * TXI interrupt requests can be cleared by reading the value 1 from the TDRE flag, then clearing it to 0; or by clearing the TIE bit to 0. Bit 6--Receive Interrupt Enable (RIE): Enables or disables the receive-data-full interrupt (RXI) requested when the RDRF flag in SSR is set to 1 due to transfer of serial receive data from RSR to RDR; also enables or disables the receive-error interrupt (ERI). Bit 6 RIE 0 1 Description Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled * (Initial value) Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled Note: * RXI and ERI interrupt requests can be cleared by reading the value 1 from the RDRF, FER, PER, or ORER flag, then clearing the flag to 0; or by clearing the RIE bit to 0. Bit 5--Transmit Enable (TE): Enables or disables the start of SCI serial transmitting operations. Bit 5 TE 0 1 Description Transmitting disabled * 1 Transmitting enabled* 2 (Initial value) Notes: *1 The TDRE flag is fixed at 1 in SSR. *2 In the enabled state, serial transmission starts when the TDRE flag in SSR is cleared to 0 after writing of transmit data into TDR. Select the transmit format in SMR before setting the TE bit to 1. Bit 4--Receive Enable (RE): Enables or disables the start of SCI serial receiving operations. 372 Bit 4 RE 0 1 Description Receiving disabled * 1 Receiving enabled* 2 (Initial value) Notes: *1 Clearing the RE bit to 0 does not affect the RDRF, FER, PER, and ORER flags. These flags retain their previous values. *2 In the enabled state, serial receiving starts when a start bit is detected in asynchronous mode, or serial clock input is detected in synchronous mode. Select the receive format in SMR before setting the RE bit to 1. Bit 3--Multiprocessor Interrupt Enable (MPIE): Enables or disables multiprocessor interrupts. The MPIE bit setting is valid only in asynchronous mode, and only if the MP bit is set to 1 in SMR. The MPIE bit setting is ignored in synchronous mode or when the MP bit is cleared to 0. Bit 3 MPIE 0 Description Multiprocessor interrupts are disabled (normal receive operation) (Initial value) [Clearing conditions] * The MPIE bit is cleared to 0 * MPB = 1 in received data Multiprocessor interrupts are enabled * Receive-data-full interrupts (RXI), receive-error interrupts (ERI), and setting of the RDRF, FER, and ORER status flags in SSR are disabled until data with the multiprocessor bit set to 1 is received. 1 Note: * The SCI does not transfer receive data from RSR to RDR, does not detect receive errors, and does not set the RDRF, FER, and ORER flags in SSR. When it receives data in which MPB = 1, the SCI sets the MPB bit to 1 in SSR, automatically clears the MPIE bit to 0, enables RXI and ERI interrupts (if the TIE and RIE bits in SCR are set to 1), and allows the FER and ORER flags to be set. Bit 2--Transmit-End interrupt Enable (TEIE): Enables or disables the transmit-end interrupt (TEI) requested if TDR does not contain valid transmit data when the MSB is transmitted. Bit 2 TEIE 0 1 Description Transmit-end interrupt requests (TEI) are disabled * Transmit-end interrupt requests (TEI) are enabled* (Initial value) Note: * TEI interrupt requests can be cleared by reading the value 1 from the TDRE flag in SSR, then clearing the TDRE flag to 0, thereby also clearing the TEND flag to 0; or by clearing the TEIE bit to 0. Bits 1 and 0--Clock Enable 1 and 0 (CKE1, CKE0): The function of these bits differs for the normal serial communication interface and for the smart card interface. Their function is switched with the SMIF bit in SCMR. 373 For serial communication interface (SMIF bit in SCMR cleared to 0): These bits select the SCI clock source and enable or disable clock output from the SCK pin. Depending on the settings of CKE1 and CKE0, the SCK pin can be used for generic input/output, serial clock output, or serial clock input. The CKE0 setting is valid only in asynchronous mode, and only when the SCI is internally clocked (CKE1 = 0). The CKE0 setting is ignored in synchronous mode, or when an external clock source is selected (CKE1 = 1). Select the SCI operating mode in SMR before setting the CKE1 and CKE0 bits . For further details on selection of the SCI clock source, see table 12.9 in section 12.3, Operation. Bit 1 Bit 0 CKE1 CKE0 Description 0 0 Asynchronous mode Synchronous mode 0 1 Asynchronous mode Synchronous mode 1 0 Asynchronous mode Synchronous mode 1 1 Asynchronous mode Synchronous mode Internal clock, SCK pin available for generic input/output * 1 Internal clock, SCK pin used for serial clock output * 1 Internal clock, SCK pin used for clock output * 2 Internal clock, SCK pin used for serial clock output External clock, SCK pin used for clock input* 3 External clock, SCK pin used for serial clock input External clock, SCK pin used for clock input* 3 External clock, SCK pin used for serial clock input Notes: *1 Initial value *2 The output clock frequency is the same as the bit rate. *3 The input clock frequency is 16 times the bit rate. For smart card interface (SMIF bit in SCMR set to 1): These bits, together with the GM bit in SMR, determine whether the SCK pin is used for generic input/output or as the serial clock output pin. SMR GM 0 0 1 1 1 1 Bit 1 Bit 0 CKE1 CKE0 Description 0 0 0 0 1 1 0 1 0 1 0 1 SCK pin available for generic input/output SCK pin used for clock output SCK pin output fixed low SCK pin used for clock output SCK pin output fixed high SCK pin used for clock output (Initial value) 374 12.2.7 Serial Status Register (SSR) SSR is an 8-bit register containing multiprocessor bit values, and status flags that indicate the operating status of the SCI. Bit 7 TDRE Initial value Read/Write 1 R/(W) *1 6 RDRF 0 R/(W) *1 5 4 3 PER 0 *1 2 TEND 1 *1 1 MPB 0 R 0 MPBT 0 R/W Multiprocessor bit transfer Value of multiprocessor bit to be transmitted Multiprocessor bit Stores the received multiprocessor bit value ORER FER/ERS 0 R/(W) *1 0 R/(W) R/(W) R Transmit end*2 Status flag indicating end of transmission Parity error Status flag indicating detection of a receive parity error Framing error (FER)/Error signal status (ERS)*2 Status flag indicating detection of a receive framing error, or flag indicating detection of an error signal Overrun error Status flag indicating detection of a receive overrun error Receive data register full Status flag indicating that data has been received and stored in RDR Transmit data register empty Status flag indicating that transmit data has been transferred from TDR into TSR and new data can be written in TDR Notes: *1 Only 0 can be written, to clear the flag. *2 Function differs between the normal serial communication interface and the smart card interface. The CPU can always read and write SSR, but cannot write 1 in the TDRE, RDRF, ORER, PER, and FER flags. These flags can be cleared to 0 only if they have first been read while set to 1. The TEND and MPB flags are read-only bits that cannot be written. SSR is initialized to H'84 by a reset and in standby mode. 375 Bit 7--Transmit Data Register Empty (TDRE): Indicates that the SCI has loaded transmit data from TDR into TSR and the next serial data can be written in TDR. Bit 7 TDRE 0 Description TDR contains valid transmit data [Clearing condition] Read TDRE when TDRE = 1, then write 0 in TDRE TDR does not contain valid transmit data (Initial value) [Setting conditions] * The chip is reset or enters standby mode * The TE bit in SCR is cleared to 0 * TDR contents are loaded into TSR, so new data can be written in TDR 1 Bit 6--Receive Data Register Full (RDRF): Indicates that RDR contains new receive data. Bit 6 RDRF 0 Description RDR does not contain new receive data [Clearing conditions] * The chip is reset or enters standby mode * Read RDRF when RDRF = 1, then write 0 in RDRF (Initial value) 1 RDR contains new receive data [Setting condition] Serial data is received normally and transferred from RSR to RDR Note: The RDR contents and the RDRF flag are not affected by detection of receive errors or by clearing of the RE bit to 0 in SCR. They retain their previous values. If the RDRF flag is still set to 1 when reception of the next data ends, an overrun error will occur and the receive data will be lost. 376 Bit 5--Overrun Error (ORER): Indicates that data reception ended abnormally due to an overrun error. Bit 5 ORER 0 Description Receiving is in progress or has ended normally* 1 [Clearing conditions] * The chip is reset or enters standby mode * Read ORER when ORER = 1, then write 0 in ORER A receive overrun error occurred * 2 [Setting condition] Reception of the next serial data ends when RDRF = 1 (Initial value) 1 Notes: *1 Clearing the RE bit to 0 in SCR does not affect the ORER flag, which retains its previous value. *2 RDR continues to hold the receive data prior to the overrun error, so subsequent receive data is lost. Serial receiving cannot continue while the ORER flag is set to 1. In synchronous mode, serial transmitting is also disabled. Bit 4--Framing Error (FER)/Error Signal Status (ERS): The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR. For serial communication interface (SMIF bit in SCMR cleared to 0): Indicates that data reception ended abnormally due to a framing error in asynchronous mode. Bit 4 FER 0 Description Receiving is in progress or has ended normally* 1 [Clearing conditions] * The chip is reset or enters standby mode * Read FER when FER = 1, then write 0 in FER (Initial value) 1 A receive framing error occurred [Setting condition] The stop bit at the end of the receive data is checked for a value of 1, and is found to be 0.* 2 Notes: *1 Clearing the RE bit to 0 in SCR does not affect the FER flag, which retains its previous value. *2 When the stop bit length is 2 bits, only the first bit is checked for a value of 1. The second stop bit is not checked. When a framing error occurs the SCI transfers the receive data into RDR but does not set the RDRF flag. Serial receiving cannot continue while the FER flag is set to 1. In synchronous mode, serial transmitting is also disabled. 377 For Smart Card Interface (SMIF Bit in SCMR Set to 1): Indicates the status of the error signal sent back from the receiving side during transmission. Framing errors are not detected in smart card interface mode. Bit 4 ERS 0 Description Normal reception, no error signal* [Clearing conditions] * The chip is reset or enters standby mode * Read ERS when ERS = 1, then write 0 in ERS (Initial value) 1 An error signal has been sent from the receiving side indicating detection of a parity error [Setting condition] The error signal is low when sampled Note: * Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous value. Bit 3--Parity Error (PER): Indicates that reception of data with parity added ended abnormally due to a parity error in asynchronous mode. Bit 3 PER 0 Description Receiving is in progress or has ended normally* 1 [Clearing conditions] * The chip is reset or enters standby mode * Read PER when PER = 1, then write 0 in PER (Initial value) 1 A receive parity error occurred* 2 [Setting condition] The number of 1s in receive data, including the parity bit, does not match the even or odd parity setting of O/E in SMR Notes: *1 Clearing the RE bit to 0 in SCR does not affect the PER flag, which retains its previous value. *2 When a parity error occurs the SCI transfers the receive data into RDR but does not set the RDRF flag. Serial receiving cannot continue while the PER flag is set to 1. In synchronous mode, serial transmitting is also disabled. Bit 2--Transmit End (TEND): The function of this bit differs for the normal serial communication interface and for the smart card interface. Its function is switched with the SMIF bit in SCMR. For Serial Communication Interface (SMIF Bit in SCMR Cleared to 0): Indicates that when the last bit of a serial character was transmitted TDR did not contain valid transmit data, so transmission has ended. The TEND flag is a read-only bit and cannot be written. 378 Bit 2 TEND 0 Description Transmission is in progress [Clearing condition] Read TDRE when TDRE = 1, then write 0 in TDRE End of transmission (Initial value) [Setting conditions] * The chip is reset or enters standby mode * The TE bit in SCR is cleared to 0 * TDRE is 1 when the last bit of a 1-byte serial transmit character is transmitted 1 For Smart Card Interface (SMIF Bit in SCMR Set to 1): Indicates that when the last bit of a serial character was transmitted TDR did not contain valid transmit data, so transmission has ended. The TEND flag is a read-only bit and cannot be written. Bit 2 TEND 0 Description Transmission is in progress [Clearing condition] Read TDRE when TDRE = 1, then write 0 in TDRE End of transmission (Initial value) [Setting conditions] * The chip is reset or enters standby mode * The TE bit is cleared to 0 in SCR and the FER/ERS bit is also cleared to 0 * TDRE is 1 and FER/ERS is 0 (normal transmission) 2.5 etu (when GM = 0) or 1.0 etu (when GM = 1) after a 1-byte serial character is transmitted 1 Note: etu: Elementary time unit (time required to transmit one bit) Bit 1--Multiprocessor bit (MPB): Stores the value of the multiprocessor bit in the receive data when a multiprocessor format is used in asynchronous mode. MPB is a read-only bit, and cannot be written. Bit 1 MPB 0 1 Description Multiprocessor bit value in receive data is 0* Multiprocessor bit value in receive data is 1 (Initial value) Note: * If the RE bit in SCR is cleared to 0 when a multiprocessor format is selected, MPB retains its previous value. 379 Bit 0--Multiprocessor Bit Transfer (MPBT): Stores the value of the multiprocessor bit added to transmit data when a multiprocessor format in selected for transmitting in asynchronous mode. The MPBT bit setting is ignored in synchronous mode, when a multiprocessor format is not selected, or when the SCI cannot transmit. Bit 0 MPBT 0 1 Description Multiprocessor bit value in transmit data is 0 Multiprocessor bit value in transmit data is 1 (Initial value) 12.2.8 Bit Rate Register (BRR) BRR is an 8-bit register that sets the serial transmit/receive bit rate in accordance with the baud rate generator operating clock selected by bits CKS0 and CKS1 in SMR. Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W BRR can be read or written to by the CPU at all times. BRR is initialized to H'FF by a reset and in standby mode. As baud rate generator control is performed independently for each channel, different values can be set for each channel. Table 12.3 shows examples of BRR settings in asynchronous mode. Table 12.4 shows examples of BRR settings in synchronous mode. 380 Table 12.3 Examples of Bit Rates and BRR Settings in Asynchronous Mode (MHz) Bit Rate (bit/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 2 n 1 1 0 0 0 0 0 0 0 0 0 N Error (%) n 1 1 0 0 0 0 0 0 0 0 0 2.097152 N Error (%) n 1 1 0 0 0 0 0 0 0 0 0 (MHz) Bit Rate (bit/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 3.6864 n 2 1 1 0 0 0 0 0 0 -- 0 N 64 Error (%) n 0.70 2 1 1 0 0 0 0 0 0 0 0 N 70 4 Error (%) n 0.03 2 1 1 0 0 0 0 0 0 0 0 4.9152 N 86 Error (%) n 0.31 2 2 1 1 0 0 0 0 0 0 0 N 88 64 5 Error (%) -0.25 0.16 2.4576 N Error (%) n 1 1 1 0 0 0 0 0 0 0 -- N 3 Error (%) 141 0.03 103 0.16 207 0.16 103 0.16 51 25 12 6 2 1 1 0.16 0.16 0.16 -6.99 8.51 0.00 -18.62 148 -0.04 108 0.21 217 0.21 108 0.21 54 26 13 6 2 1 1 -0.70 1.14 -2.48 -2.48 13.78 4.86 -14.67 174 -0.26 127 0.00 255 0.00 127 0.00 63 31 15 7 3 1 1 0.00 0.00 0.00 0.00 0.00 22.88 0.00 212 0.03 155 0.16 77 0.16 155 0.16 77 38 19 9 4 2 -- 0.16 0.16 -2.34 -2.34 -2.34 0.00 -- 191 0.00 95 0.00 207 0.16 103 0.16 207 0.16 103 0.16 51 25 12 6 3 2 0.16 0.16 0.16 -6.99 0.00 8.51 255 0.00 127 0.00 255 0.00 127 0.00 63 31 15 7 4 3 0.00 0.00 0.00 0.00 -1.70 0.00 129 0.16 64 0.16 191 0.00 95 47 23 11 5 -- 2 0.00 0.00 0.00 0.00 0.00 -- 0.00 129 0.16 64 32 15 7 4 3 0.16 -1.36 1.73 1.73 0.00 1.73 381 (MHz) Bit Rate (bit/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 6 n 2 2 1 1 0 0 0 0 0 0 0 N Error (%) n 2 2 1 1 0 0 0 0 0 0 0 N 6.144 Error (%) n 2 2 1 1 0 0 0 0 0 0 0 7.3728 N Error (%) n 2 2 1 1 0 0 0 0 0 0 0 N 8 Error (%) 106 -0.44 77 0.16 108 0.08 79 0.00 130 -0.07 95 0.00 141 0.03 103 0.16 207 0.16 103 0.16 207 0.16 103 0.16 51 25 12 7 6 0.16 0.16 0.16 0.00 -6.99 155 0.16 77 0.16 159 0.00 79 0.00 191 0.00 95 0.00 155 0.16 77 38 19 9 5 4 0.16 0.16 -2.34 -2.34 0.00 -2.34 159 0.00 79 39 19 9 5 4 0.00 0.00 0.00 0.00 2.40 0.00 191 0.00 95 47 23 11 6 5 0.00 0.00 0.00 0.00 5.33 0.00 (MHz) Bit Rate (bit/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 9.8304 n 2 2 1 1 0 0 0 0 0 0 0 N Error (%) n 2 2 2 1 1 0 0 0 0 0 0 N 10 Error (%) n 2 2 2 1 1 0 0 0 0 0 0 N 12 Error (%) n 2 2 2 1 1 0 0 0 0 0 0 N 12.288 Error (%) 174 -0.26 127 0.00 255 0.00 127 0.00 255 0.00 127 0.00 63 31 15 9 7 0.00 0.00 0.00 -1.70 0.00 177 -0.25 129 0.16 64 0.16 212 0.03 155 0.16 77 0.16 217 0.08 159 0.00 79 0.00 129 0.16 64 0.16 155 0.16 77 0.16 159 0.00 79 0.00 129 0.16 64 32 15 9 7 0.16 -1.36 1.73 0.00 1.73 155 0.16 77 38 19 11 9 0.16 0.16 -2.34 0.00 -2.34 159 0.00 79 39 19 11 9 0.00 0.00 0.00 2.40 0.00 382 (MHz) Bit Rate (bit/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 13 n 2 2 2 1 1 0 0 0 0 0 0 N Error (%) n 2 2 2 1 1 0 0 0 0 0 0 N 14 Error (%) n 3 2 2 1 1 0 0 0 0 0 0 14.7456 N 64 Error (%) n 0.70 3 2 2 1 1 0 0 0 0 0 0 N 70 16 Error (%) 0.03 230 -0.08 168 0.16 84 -0.43 248 -0.17 181 0.16 90 0.16 191 0.00 95 0.00 207 0.16 103 0.16 207 0.16 103 0.16 207 0.16 103 0.16 51 25 15 12 0.16 0.16 0.00 0.16 168 0.16 84 -0.43 181 0.16 90 0.16 191 0.00 95 0.00 168 0.16 84 41 20 12 10 -0.43 0.76 0.76 0.00 -3.82 181 0.16 90 45 22 13 10 0.16 -0.93 -0.93 0.00 3.57 191 0.00 95 47 23 14 11 0.00 0.00 0.00 -1.70 0.00 (MHz) Bit Rate (bit/s) 110 150 300 600 1200 2400 4800 9600 19200 31250 38400 18 n 3 2 2 1 1 0 0 0 0 0 0 N 79 Error (%) n -0.12 3 3 2 2 1 1 0 0 0 0 0 N 88 64 20 Error (%) n -0.25 0.16 3 3 2 2 1 1 0 0 0 0 0 N 25 Error (%) 110 -0.02 80 -0.47 233 0.16 116 0.16 233 0.16 116 0.16 233 0.16 116 0.16 58 28 17 14 -0.69 1.02 0.00 -2.34 129 0.16 64 0.16 162 0.15 80 -0.47 129 0.16 64 0.16 162 0.15 80 -0.47 129 0.16 64 32 19 15 0.16 -1.36 0.00 1.73 162 0.15 80 40 24 19 -0.47 -0.76 0.00 1.73 383 Table 12.4 Examples of Bit Rates and BRR Settings in Synchronous Mode Bit Rate (MHz) 2 N 70 4 n -- N -- 8 n -- N -- 10 n -- N -- -- -- -- 13 n -- 3 3 2 N -- 16 n -- N -- 18 n -- N -- -- 20 n -- -- N -- -- 25 n -- -- N -- -- -- 97 155 77 155 249 124 62 24 -- -- -- -- -- (bit/s) n 110 250 500 1k 2.5k 5k 10k 25k 50k 3 2 1 1 0 0 0 0 0 124 2 249 2 124 1 199 1 99 49 19 9 4 1 0* 0 0 0 0 0 0 0 0 249 3 124 2 249 2 99 1 124 -- 249 -- 124 -- 199 1 99 1 202 3 101 3 202 2 80 2 249 -- 124 3 249 3 99 2 140 3 69 3 155 -- 77 3 249 2 124 1 249 1 99 49 24 9 4 -- -- 0* 0 0 -- 0 -- -- -- -- 112 2 224 1 112 1 179 0 89 44 17 8 4 -- -- -- 0 0 0 0 0 -- -- -- 124 2 249 2 124 1 199 0 99 49 19 9 4 -- -- -- 0 0 0 -- -- -- -- -- 199 1 99 39 19 9 3 1 0* 0 0 0 0 0 0 0 0 -- 162 1 80 1 199 1 99 1 199 0 79 39 19 7 3 1 0* -- 0 0 0 0 0 -- -- 0 129 0 64 -- 12 -- -- -- -- 0 0 0 0 0 0 -- 0 159 0 79 39 15 7 3 1 -- 0* 0 0 0 0 0 -- -- -- 100k 0 250k 0 500k 0 1M 2M 2.5M 4M Note: Settings with an error of 1% or less are recommended. Legend: Blank : No setting available -- : Setting possible, but error occurs * : Continuous transmission/reception not possible 384 The BRR setting is calculated as follows: Asynchronous mode: N= 64 x 22n-1 xB x 106 - 1 Synchronous mode: N= 8x 22n-1 xB x 106 - 1 B: N: : n: Bit rate (bit/s) BRR setting for baud rate generator (0 N 255) System clock frequency (MHz) Baud rate generator input clock (n = 0, 1, 2, 3) (For the clock sources and values of n, see the following table.) SMR Settings n 0 1 2 3 Clock Source /4 /16 /64 CKS1 0 0 1 1 CKS0 0 1 0 1 The bit rate error in asynchronous mode is calculated as follows: Error (%) = x 106 (N + 1) x B x 64 x 22n-1 - 1 x 100 385 Table 12.5 shows the maximum bit rates in asynchronous mode for various system clock frequencies. Tables 12.6 and 12.7 show the maximum bit rates with external clock input. Table 12.5 Maximum Bit Rates for Various Frequencies (Asynchronous Mode) Settings (MHz) 2 2.097152 2.4576 3 3.6864 4 4.9152 5 6 6.144 7.3728 8 9.8304 10 12 12.288 14 14.7456 16 17.2032 18 20 25 Maximum Bit Rate (bit/s) 62500 65536 76800 93750 115200 125000 153600 156250 187500 192000 230400 250000 307200 312500 375000 384000 437500 460800 500000 537600 562500 625000 781250 n 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 N 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 386 Table 12.6 Maximum Bit Rates with External Clock Input (Asynchronous Mode) (MHz) 2 2.097152 2.4576 3 3.6864 4 4.9152 5 6 6.144 7.3728 8 9.8304 10 12 12.288 14 14.7456 16 17.2032 18 20 25 External Input Clock (MHz) 0.5000 0.5243 0.6144 0.7500 0.9216 1.0000 1.2288 1.2500 1.5000 1.5360 1.8432 2.0000 2.4576 2.5000 3.0000 3.0720 3.5000 3.6864 4.0000 4.3008 4.5000 5.0000 6.2500 Maximum Bit Rate (bit/s) 31250 32768 38400 46875 57600 62500 76800 78125 93750 96000 115200 125000 153600 156250 187500 192000 218750 230400 250000 268800 281250 312500 390625 387 Table 12.7 Maximum Bit Rates with External Clock Input (Synchronous Mode) (MHz) 2 4 6 8 10 12 14 16 18 20 25 External Input Clock (MHz) 0.3333 0.6667 1.0000 1.3333 1.6667 2.0000 2.3333 2.6667 3.0000 3.3333 4.1667 Maximum Bit Rate (bit/s) 333333.3 666666.7 1000000.0 1333333.3 1666666.7 2000000.0 2333333.3 2666666.7 3000000.0 3333333.3 4166666.7 12.3 12.3.1 Operation Overview The SCI can carry out serial communication in two modes: asynchronous mode in which synchronization is achieved character by character, and synchronous mode in which synchronization is achieved with clock pulses. A smart card interface is also supported as a serial communication function for an IC card interface. Selection of asynchronous or synchronous mode and the transmission format for the normal serial communication interface is made in SMR, as shown in table 12.8. The SCI clock source is selected by the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 12.9. For details of the procedures for switching between LSB-first and MSB-first mode and inverting the data logic level, see section 13.2.1, Smart Card Mode Register (SCMR). For selection of the smart card interface format, see section 13.3.3, Data Format. 388 Asynchronous Mode * Data length is selectable: 7 or 8 bits * Parity and multiprocessor bits are selectable, and so is the stop bit length (1 or 2 bits). These selections determine the communication format and character length. * In receiving, it is possible to detect framing errors, parity errors, overrun errors, and the break state. * An internal or external clock can be selected as the SCI clock source. When an internal clock is selected, the SCI operates using the on-chip baud rate generator, and can output a serial clock signal with a frequency matching the bit rate. When an external clock is selected, the external clock input must have a frequency 16 times the bit rate (The on-chip baud rate generator is not used). Synchronous Mode * The communication format has a fixed 8-bit data length. * In receiving, it is possible to detect overrun errors. * An internal or external clock can be selected as the SCI clock source. When an internal clock is selected, the SCI operates using the on-chip baud rate generator, and can output a serial clock signal to external devices. When an external clock is selected, the SCI operates on the input serial clock. The on-chip baud rate generator is not used. Smart Card Interface * One frame consists of 8-bit data and a parity bit. * In transmitting, a guard time of at least two elementary time units (2 etu) is provided between the end of the parity bit and the start of he next frame (An elementary time unit is the time required to transmit one bit). * In receiving, if a parity error is detected, a low error signal level is output for 1 etu, beginning 10.5 etu after the start bit. * In transmitting, if an error signal is received, the same data is automatically transmitted again after at least 2 etu. * Only asynchronous communication is supported. There is no synchronous communication function. For details of smart card interface operation, see section 13, Smart Card Interface. 389 Table 12.8 SMR Settings and Serial Communication Formats SMR Settings SCI Communication Format Multiprocessor Bit Absent Bit 7 C/A 0 Bit 6 CHR 0 Bit 2 MP 0 Bit 5 PE 0 Bit 3 STOP 0 1 Mode Asynchronous mode Data Length 8-bit data Parity Bit Absent Stop Bit Length 1 bit 2 bits 1 0 1 Present 1 bit 2 bits 1 0 0 1 7-bit data Absent 1 bit 2 bits 1 0 1 Present 1 bit 2 bits 0 1 -- -- 0 1 0 1 -- 1 -- -- Asyn8-bit data chronous mode (multiprocessor 7-bit data format) Synchronous mode 8-bit data Present Absent 1 bit 2 bits 1 bit 2 bits 1 -- -- -- Absent None Table 12.9 SMR and SCR Settings and SCI Clock Source Selection SMR Bit 7 C/A 0 SCR Setting Bit 1 Bit 0 CKE1 CKE0 Mode 0 0 1 1 0 1 1 0 0 1 1 0 1 390 Synchronous mode Internal Asynchronous mode SCI Transmit/Receive clock Clock Source SCK Pin Function Internal SCI does not use the SCK pin Outputs clock with frequency matching the bit rate External Inputs clock with frequency 16 times the bit rate Outputs the serial clock External Inputs the serial clock 12.3.2 Operation in Asynchronous Mode In asynchronous mode, each transmitted or received character begins with a start bit and ends with one or two stop bits. Serial communication is synchronized one character at a time. The transmitting and receiving sections of the SCI are independent, so full-duplex communication is possible. The transmitter and the receiver are both double-buffered, so data can be written and read while transmitting and receiving are in progress, enabling continuous transmitting and receiving. Figure 12.2 shows the general format of asynchronous serial communication. In asynchronous serial communication the communication line is normally held in the mark (high) state. The SCI monitors the line and starts serial communication when the line goes to the space (low) state, indicating a start bit. One serial character consists of a start bit (low), data (LSB first), parity bit (high or low), and one or two stop bits (high), in that order. When receiving in asynchronous mode, the SCI synchronizes at the falling edge of the start bit. The SCI samples each data bit on the eighth pulse of a clock with a frequency 16 times the bit rate. Receive data is latched at the center of each bit. Idle (mark) state 1 (LSB) 0 D0 D1 D2 D3 D4 D5 D6 (MSB) D7 0/1 1 1 1 Serial data Start bit 1 bit Transmit or receive data 7 or 8 bits One unit of data (character or frame) Parity bit 1 bit, or none Stop bit(s) 1 or 2 bits Figure 12.2 Data Format in Asynchronous Communication (Example: 8-Bit Data with Parity and 2 Stop Bits) Communication Formats: Table 12.10 shows the 12 communication formats that can be selected in asynchronous mode. The format is selected by settings in SMR. 391 Table 12.10 Serial Communication Formats (Asynchronous Mode) SMR Settings CHR 0 PE 0 MP 0 STOP 0 Serial Communication Format and Frame Length 1 S 2 3 4 5 6 7 8 9 10 STOP 11 12 8-bit data 0 0 0 1 S 8-bit data STOP STOP 0 1 0 0 S 8-bit data P STOP 0 1 0 1 S 8-bit data P STOP STOP 1 0 0 0 S 7-bit data STOP 1 0 0 1 S 7-bit data STOP STOP 1 1 0 0 S 7-bit data P STOP 1 1 0 1 S 7-bit data P STOP STOP 0 -- 1 0 S 8-bit data MPB STOP 0 -- 1 1 S 8-bit data MPB STOP STOP 1 -- 1 0 S 7-bit data MPB STOP 1 -- 1 1 S 7-bit data MPB STOP STOP Legend: S : STOP : P : MPB : Start bit Stop bit Parity bit Multiprocessor bit 392 Clock: An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected as the SCI transmit/receive clock. The clock source is selected by the C/A bit in SMR and bits CKE1 and CKE0 in SCR. For details of SCI clock source selection, see table 12.9. When an external clock is input at the SCK pin, it must have a frequency 16 times the desired bit rate. When the SCI is operated on an internal clock, it can output a clock signal at the SCK pin. The frequency of this output clock is equal to the bit rate. The phase is aligned as shown in figure 12.3 so that the rising edge of the clock occurs at the center of each transmit data bit. 0 D0 D1 D2 D3 D4 1frame D5 D6 D7 0/1 1 1 Figure 12.3 Phase Relationship between Output Clock and Serial Data (Asynchronous Mode) Transmitting and Receiving Data: * SCI Initialization (Asynchronous Mode): Before transmitting or receiving data, clear the TE and RE bits to 0 in SCR, then initialize the SCI as follows. When changing the communication mode or format, always clear the TE and RE bits to 0 before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and initializes TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and ORER flags, or RDR, which retain their previous contents. When an external clock is used the clock should not be stopped during initialization or subsequent operation, since operation will be unreliable in this case. 393 Figure 12.4 shows a sample flowchart for initializing the SCI. Start of initialization (1) Set the clock source in SCR. Clear the RIE, TIE, TEIE, MPIE, TE, and RE bits to 0*. If clock output is selected in asynchronous mode, clock output starts immediately after the setting is made in SCR. (2) Select the communication format in SMR. Select communication format in SMR Set value in BRR Wait No 1-bit interval elapsed? Yes Set TE or RE bit to 1 in SCR Set the RIE, TIE, TEIE, and MPIE bits (4) (2) (3) (3) Write the value corresponding to the bit rate in BRR. This step is not necessary when an external clock is used. (4) Wait for at least the interval required to transmit or receive one bit, then set the TE or RE bit to 1 in SCR*. Set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the SCI to use the TxD or RxD pin. Clear TE and RE bits to 0 in SCR Set CKE1 and CKE0 bits in SCR (leaving TE and RE bits cleared to 0) (1) Figure 12.4 Sample Flowchart for SCI Initialization 394 * Transmitting Serial Data (Asynchronous Mode): Figure 12.5 shows a sample flowchart for transmitting serial data and indicates the procedure to follow. Initialize Start transmitting (1) Read TDRE flag in SSR No (2) (1) SCI initialization: the transmit data output function of the TxD pin is selected automatically. After the TE bit is set to 1, one frame of 1s is output, then transmission is possible. (2) SCI status check and transmit data write: read SSR and check that the TDRE flag is set to 1, then write transmit data in TDR and clear the TDRE flag to 0. (3) To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. TDRE= 1 Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR No All data transmitted? Yes Read TEND flag in SSR No (3) (4) To output a break signal at the end of serial transmission: set the DDR bit to 1 and clear the DR bit to 0, then clear the TE bit to 0 in SCR. TEND= 1 Yes Output break signal? Yes Clear DR bit to 0 and set DDR bit to 1 No (4) Clear TE bit to 0 in SCR Figure 12.5 Sample Flowchart for Transmitting Serial Data 395 In transmitting serial data, the SCI operates as follows: * The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. * After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. Serial transmit data is transmitted in the following order from the TxD pin: Start bit: One 0 bit is output. Transmit data: 7 or 8 bits are output, LSB first. Parity bit or multiprocessor bit: One parity bit (even or odd parity), or one multiprocessor bit is output. Formats in which neither a parity bit nor a multiprocessor bit is output can also be selected. Stop bit(s): One or two 1 bits (stop bits) are output. Mark state: Output of 1 bits continues until the start bit of the next transmit data. * The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. Figure 12.6 shows an example of SCI transmit operation in asynchronous mode. Parity Stop Start bit bit bit Data Parity Stop bit bit 1 Start bit Data 1 0 D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 1 Idle (mark) state TDRE TEND 1 frame TXI interrupt request TXI interrupt handler writes data in TDR and clears TDRE flag to 0 TXI interrupt request TEI interrupt request Figure 12.6 Example of SCI Transmit Operation in Asynchronous Mode (8-Bit Data with Parity and One Stop Bit) 396 * Receiving Serial Data (Asynchronous Mode): Figure 12.7 shows a sample flowchart for receiving serial data and indicates the procedure to follow. Initialize Start receiving (1) (1) SCI initialization: the receive data input function of the RxD pin is selected automatically. (2)(3) Receive error handling and break detection: if a receive error occurs, read the ORER, PER, and FER flags in SSR to identify the error. After executing the necessary error handling, clear the ORER, PER, and FER flags all to 0. Receiving cannot resume if any of these flags remains set to 1. When a framing error occurs, the RxD pin can be read to detect the break state. Read ORER, PER, and FER flags in SSR (2) PERFEROPER= 1 Yes (3) No Error handling (continued on next page) Read RDRF flag in SSR No (4) (4) SCI status check and receive data read: read SSR, check that the RDRF flag is set to 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. To continue receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the stop bit of the current frame is received. RDRF= 1 Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR (5) No All data received? Yes Clear RE bit to 0 in SCR (5) Figure 12.7 Sample Flowchart for Receiving Serial Data 397 (3) Error handling No ORER= 1 Yes Overrun error handling No FER= 1 Yes Break? No Framing error handling Clear RE bit to 0 in SCR Yes No PER= 1 Yes Parity error handling Clear ORER, PER, and FER flags to 0 in SSR Figure 12.7 Sample Flowchart for Receiving Serial Data (cont) 398 In receiving, the SCI operates as follows: * The SCI monitors the communication line. When it detects a start bit (0 bit), the SCI synchronizes internally and starts receiving. * Receive data is stored in RSR in order from LSB to MSB. * The parity bit and stop bit are received. After receiving these bits, the SCI carries out the following checks: Parity check: The number of 1s in the receive data must match the even or odd parity setting of in the O/E bit in SMR. Stop bit check: The stop bit value must be 1. If there are two stop bits, only the first is checked. Status check: The RDRF flag must be 0, indicating that the receive data can be transferred from RSR into RDR. If these all checks pass, the RDRF flag is set to 1 and the received data is stored in RDR. If one of the checks fails (receive error*), the SCI operates as shown in table 12.11. Note: * When a receive error occurs, further receiving is disabled. In receiving, the RDRF flag is not set to 1. Be sure to clear the error flags to 0. * When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt (RXI) is requested. If the ORER, PER, or FER flag is set to 1 and the RIE bit in SCR is also set to 1, a receive-error interrupt (ERI) is requested. Table 12.11 Receive Error Conditions Receive Error Abbreviation Condition Overrun error ORER Framing error FER Parity error PER Data Transfer Receiving of next data ends while Receive data is not transferred RDRF flag is still set to 1 in SSR from RSR to RDR Stop bit is 0 Receive data is transferred from RSR to RDR Parity of received data differs from Receive data is transferred from even/odd parity setting in SMR RSR to RDR 399 Figure 12.8 shows an example of SCI receive operation in asynchronous mode. Start bit Parity Stop bit bit Start bit Parity Stop bit bit 1 Data Data 1 0 D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 1 Idle (mark) state RDRF FER RXI interrupt request 1 frame RXI interrupt handler reads data in RDR and clears RDRF flag to 0 Framing error, ERI interrupt request Figure 12.8 Example of SCI Receive Operation (8-Bit Data with Parity and One Stop Bit) 12.3.3 Multiprocessor Communication The multiprocessor communication function enables several processors to share a single serial communication line. The processors communicate in asynchronous mode using a format with an additional multiprocessor bit (multiprocessor format). In multiprocessor communication, each receiving processor is addressed by an ID. A serial communication cycle consists of an ID-sending cycle that identifies the receiving processor, and a data-sending cycle. The multiprocessor bit distinguishes ID-sending cycles from data-sending cycles. The transmitting processor starts by sending the ID of the receiving processor with which it wants to communicate as data with the multiprocessor bit set to 1. Next the transmitting processor sends transmit data with the multiprocessor bit cleared to 0. Receiving processors skip incoming data until they receive data with the multiprocessor bit set to 1. When they receive data with the multiprocessor bit set to 1, receiving processors compare the data with their IDs. Processors with IDs not matching the received data skip further incoming data until they again receive data with the multiprocessor bit set to 1. Multiple processors can send and receive data in this way. Figure 12.9 shows an example of communication among different processors using a multiprocessor format. 400 Communication Formats: Four formats are available. Parity bit settings are ignored when a multiprocessor format is selected. For details see table 12.10. Clock: See the description of asynchronous mode. Transmitting processor Serial communication line Receiving processor A (ID=01) Receiving processor B (ID=02) Receiving processor C (ID=03) Receiving processor D (ID=04) Serial data H'01 (MPB=1) ID-sending cycle: receiving processor address H'AA (MPB=0) Data-sending cycle: data sent to receiving processor specified by ID Legend: MPB : Multiprocessor bit Figure 12.9 Example of Communication among Processors using Multiprocessor Format (Sending Data H'AA to Receiving Processor A) Transmitting and Receiving Data: * Transmitting Multiprocessor Serial Data: Figure 12.10 shows a sample flowchart for transmitting multiprocessor serial data and indicates the procedure to follow. 401 Initialize Start transmitting (1) (1) SCI initialization: the transmit data output function of the TxD pin is selected automatically. (2) SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR. Also set the MPBT flag to 0 or 1 in SSR. Finally, clear the TDRE flag to 0. (3) To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. (4) To output a break signal at the end of serial transmission: set the DDR bit to 1 and clear the DR bit to 0, then clear the TE bit to 0 in SCR. Read TDRE flag in SSR (2) TDRE= 1 Yes Write transmit data in TDR and set MPBT bit in SSR Clear TDRE flag to 0 No All data transmitted? Yes No (3) Read TEND flag in SSR No TEND= 1 Yes Output break signal? Yes No (4) Clear DR bit to 0 and set DDR to 1 Clear TE bit to 0 in SCR Figure 12.10 Sample Flowchart for Transmitting Multiprocessor Serial Data 402 In transmitting serial data, the SCI operates as follows: * The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. * After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. Serial transmit data is transmitted in the following order from the TxD pin: Start bit: One 0 bit is output. Transmit data: 7 or 8 bits are output, LSB first. Multiprocessor bit: One multiprocessor bit (MPBT value) is output. Stop bit(s): One or two 1 bits (stop bits) are output. Mark state: Output of 1 bits continues until the start bit of the next transmit data. * The SCI checks the TDRE flag when it outputs the stop bit. If the TDRE flag is 0, the SCI loads new data from TDR into TSR, outputs the stop bit, then begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, outputs the stop bit, then continues output of 1 bits in the mark state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. Figure 12.11 shows an example of SCI transmit operation using a multiprocessor format. Multiprocessor Stop Start bit bit bit Multiprocessor Stop bit bit 1 Start bit Data Data 0 TDRE TEND D0 D1 D7 0/1 1 0 D0 D1 D7 0/1 1 Idle (mark) state TXI interrupt TXI interrupt handler writes data in TDR and request clears TDRE flag to 0 1 frame TXI interrupt request TEI interrupt request Figure 12.11 Example of SCI Transmit Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) * Receiving Multiprocessor Serial Data: Figure 12.12 shows a sample flowchart for receiving multiprocessor serial data and indicates the procedure to follow. 403 Initialize Start receiving (1) (1) SCI initialization: the receive data input function of the RxD pin is selected automatically. (2) ID receive cycle: set the MPIE bit to 1 in SCR. (3) SCI status check and ID check: read SSR, check that the RDRF flag is set to 1, then read data from RDR and compare it with the processor's own ID. If the ID does not match, set the MPIE bit to 1 again and clear the RDRF flag to 0. If the ID matches, clear the RDRF flag to 0. (4) SCI status check and data receiving: read SSR, check that the RDRF flag is set to 1, then read data from RDR. (5) Receive error handling and break detection: if a receive error occurs, read the ORER and FER flags in SSR to identify the error. After executing the necessary error handling, clear the ORER and FER flags both to 0. Receiving cannot resume while either the ORER or FER flag remains set to 1. When a framing error occurs, the RxD pin can be read to detect the break state. Set MPIE bit to 1 in SCR Read ORER and FER flags in SSR (2) FERORER= 1 No Read RDRF flag in SSR Yes (3) No RDRF= 1 Yes Read RDRF flag in SSR No Own ID? Yes Read ORER and FER flags in SSR FERORER= 1 No Read RDRF flag in SSR No (4) Yes RDRF= 1 Yes Read receive data from RDR No Finished receiving? Yes Clear RE bit to 0 in SCR (5) Error handling (continued on next page) Figure 12.12 Sample Flowchart for Receiving Multiprocessor Serial Data 404 (5) Error handling No ORER= 1 Yes Overrun error handling No FER= 1 Yes Break? No Clear RE bit to 0 in SCR Framing error handling Yes Clear ORER, PER, and FER flags to 0 in SSR Figure 12.12 Sample Flowchart for Receiving Multiprocessor Serial Data (cont) 405 Figure 12.13 shows an example of SCI receive operation using a multiprocessor format. Start bit Stop Start bit Stop 1 Data (ID1) MPB bit D7 1 Data (data1) MPB bit D7 0 1 0 D0 D1 1 0 D0 D1 1 Idle (mark) state MPIE RDRF RDR value MPB detection MPIE = 0 RXI interrupt request (multiprocessor interrupt) RXI interrupt handler reads RDR data and clears RDRF flag to 0 ID1 Not own ID, so MPIE bit is set to 1 again No RXI interrupt request, RDR not updated a. Own ID does not match data 1 Start bit Data (ID2) MPB D7 1 Stop bit Start bit Data (data2) MPB D7 0 Stop bit 1 0 D0 D1 1 0 D0 D1 1 Idle (mark) state MPIE RDRF RDR value MPB detection MPIE = 0 ID1 ID2 Data2 RXI interrupt request (multiprocessor interrupt) RXI interrupt handler reads RDR data and clears RDRF flag to 0 Own ID, so receiving MPIE bit is set to continues, with data 1 again received by RXI interrupt handler b. Own ID matches data Figure 12.13 Example of SCI Receive Operation (8-Bit Data with Multiprocessor Bit and One Stop Bit) 406 12.3.4 Synchronous Operation In synchronous mode, the SCI transmits and receives data in synchronization with clock pulses. This mode is suitable for high-speed serial communication. The SCI transmitter and receiver share the same clock but are otherwise independent, so fullduplex communication is possible. The transmitter and the receiver are also double-buffered, so continuous transmitting or receiving is possible by reading or writing data while transmitting or receiving is in progress. Figure 12.14 shows the general format in synchronous serial communication. One unit (character or frame) of transfer data * Serial clock LSB MSB * Serial data Don't care Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 Don't care Note: * High except in continuous transmitting or receiving Figure 12.14 Data Format in Synchronous Communication In synchronous serial communication, each data bit is placed on the communication line from one falling edge of the serial clock to the next. Data is guaranteed valid at the rise of the serial clock. In each character, the serial data bits are transferred in order from LSB (first) to MSB (last). After output of the MSB, the communication line remains in the state of the MSB. In synchronous mode the SCI receives data by synchronizing with the rise of the serial clock. Communication Format: The data length is fixed at 8 bits. No parity bit or multiprocessor bit can be added. Clock: An internal clock generated by the on-chip baud rate generator or an external clock input from the SCK pin can be selected by means of the C/A bit in SMR and the CKE1 and CKE0 bits in SCR. See table 12.6 for details of SCI clock source selection. When the SCI operates on an internal clock, it outputs the clock source at the SCK pin. Eight clock pulses are output per transmitted or received character. When the SCI is not transmitting or receiving, the clock signal remains in the high state. If receiving in single-character units is required, an external clock should be selected. 407 Transmitting and Receiving Data: * SCI Initialization (Synchronous Mode): Before transmitting or receiving data, clear the TE and RE bits to 0 in SCR, then initialize the SCI as follows. When changing the communication mode or format, always clear the TE and RE bits to 0 before following the procedure given below. Clearing TE to 0 sets the TDRE flag to 1 and initializes TSR. Clearing RE to 0, however, does not initialize the RDRF, PER, FER, and ORER flags, or RDR, which retain their previous contents. Figure 12.15 shows a sample flowchart for initializing the SCI. Start of initialization (1) Set the clock source in SCR. Clear the RIE, TIE, TEIE, MPIE, TE, and RE bits to 0*. (2) Set the communication format in SMR. (3) Write the value corresponding to the bit rate in BRR. This step is not necessary when an external clock is used. (4) Wait for at least the interval required to transmit or receive one bit, then set the TE or RE bit to 1 in SCR*. Set the RIE, TIE, TEIE, and MPIE bits as necessary. Setting the TE or RE bit enables the SCI to use the TxD or RxD pin. Clear TE and RE bits to 0 in SCR Set RIE, TIE, MPIE, CKE1 and CKE0 bits in SCR (leaving TE and (1) RE bits cleared to 0) Select communication format in SMR Set value in BRR Wait 1-bit interval elapsed? Yes Set TE or RE bit to 1 in SCR Set RIE, TIE, TEIE, and MPIE bits as necessary (4) (2) (3) Yes Figure 12.15 Sample Flowchart for SCI Initialization 408 * Transmitting Serial Data (Synchronous Mode): Figure 12.16 shows a sample flowchart for transmitting serial data and indicates the procedure to follow. Initialize Start transmitting (1) (1) SCI initialization: the transmit data output function of the TxD pin is selected automatically. (2) SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. (3) To continue transmitting serial data: after checking that the TDRE flag is 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0. Read TDRE flag in SSR (2) TDRE= 1 Yes No Write transmit data in TDR and clear TDRE flag to 0 in SSR All data transmitted? Yes Read TEND flag in SSR No (3) No TEND= 1 Yes Clear TE bit to 0 in SCR Figure 12.16 Sample Flowchart for Serial Transmitting 409 In transmitting serial data, the SCI operates as follows. * The SCI monitors the TDRE flag in SSR. When the TDRE flag is cleared to 0, the SCI recognizes that TDR contains new data, and loads this data from TDR into TSR. * After loading the data from TDR to TSR, the SCI sets the TDRE flag to 1 and starts transmitting. If the TIE bit is set to 1 in SCR, the SCI requests a transmit-data-empty interrupt (TXI) at this time. If clock output is selected, the SCI outputs eight serial clock pulses. If an external clock source is selected, the SCI outputs data in synchronization with the input clock. Data is output from the TxD pin in order from LSB (bit 0) to MSB (bit 7). * The SCI checks the TDRE flag when it outputs the MSB (bit 7). If the TDRE flag is 0, the SCI loads data from TDR into TSR and begins serial transmission of the next frame. If the TDRE flag is 1, the SCI sets the TEND flag to 1 in SSR, and after transmitting the MSB, holds the TxD pin in the MSB state. If the TEIE bit is set to 1 in SCR, a transmit-end interrupt (TEI) is requested at this time. * After the end of serial transmission, the SCK pin is held in a constant state. Figure 12.17 shows an example of SCI transmit operation. Transmit direction Serial clock Serial data TDRE TEND TXI interrupt request Bit 0 Bit 1 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 TXI interrupt handler TXI interrupt writes data in TDR request and clears TDRE flag to 0 1 frame TEI interrupt request Figure 12.17 Example of SCI Transmit Operation * Receiving Serial Data (Synchronous Mode): Figure 12.18 shows a sample flowchart for receiving serial data and indicates the procedure to follow. When switching from asynchronous to synchronous mode. make sure that the ORER, PER, and FER flags are cleared to 0. If the FER or PER flag is set to 1 the RDRF flag will not be set and both transmitting and receiving will be disabled. 410 Initialize Start receiving (1) (1) SCI initialization: the receive data input function of the RxD pin is selected automatically. Read ORER flag in SSR (2) ORER= 1 No Yes (3) Error handling (continued on next page) (2)(3) Receive error handling: if a receive error occurs, read the ORER flag in SSR, then after executing the necessary error handling, clear the ORER flag to 0. Neither transmitting nor receiving can resume while the ORER flag remains set to 1. (4) SCI status check and receive data read: read SSR, check that the RDRF flag is set to 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. To continue receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the MSB (bit 7) of the current frame is received. Read RDRF flag in SSR No (4) RDRF= 1 Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR (5) No Finished receiving? Yes Clear RE bit to 0 in SCR (5) Figure 12.18 Sample Flowchart for Serial Receiving 411 (3) Error handling Overrun error handling Clear ORER flag to 0 in SSR Figure 12.18 Sample Flowchart for Serial Receiving (cont) In receiving, the SCI operates as follows: * The SCI synchronizes with serial clock input or output and synchronizes internally. * Receive data is stored in RSR in order from LSB to MSB. After receiving the data, the SCI checks that the RDRF flag is 0, so that receive data can be transferred from RSR to RDR. If this check passes, the RDRF flag is set to 1 and the received data is stored in RDR. If the checks fails (receive error), the SCI operates as shown in table 12.11. When a receive error has been identified in the error check, subsequent transmit and receive operations are disabled. * When the RDRF flag is set to 1, if the RIE bit is set to 1 in SCR, a receive-data-full interrupt (RXI) is requested. If the ORER flag is set to 1 and the RIE bit in SCR is also set to 1, a receive-error interrupt (ERI) is requested. 412 Figure 12.19 shows an example of SCI receive operation. Serial clock Serial data Bit 7 Bit 0 Bit 7 Bit 0 Bit 1 Bit 6 Bit 7 RDRF ORER RXI interrupt request RXI interrupt handler reads data in RDR and clears RDRF flag to 0 1 frame RXI interrupt request Overrun error, ERI interrupt request Figure 12.19 Example of SCI Receive Operation 413 * Transmitting and Receiving Data Simultaneously (Synchronous Mode): Figure 12.20 shows a sample flowchart for transmitting and receiving serial data simultaneously and indicates the procedure to follow. (1) SCI initialization: the transmit data output function of the TxD pin and the read data input function of the TxD pin are selected, enabling simultaneous transmitting and receiving. (2) SCI status check and transmit data write: read SSR, check that the TDRE flag is 1, then write transmit data in TDR and clear the TDRE flag to 0. Notification that the TDRE flag has changed from 0 to 1 can also be given by the TXI interrupt. (3) Receive error handling: if a receive error occurs, read the ORER flag in SSR, then after executing the necessary error handling, clear the ORER flag to 0. Neither transmitting nor receiving can resume while the ORER flag remains set to 1. (4) SCI status check and receive data read: read SSR, check that the RDRF flag is 1, then read receive data from RDR and clear the RDRF flag to 0. Notification that the RDRF flag has changed from 0 to 1 can also be given by the RXI interrupt. (3) No Error handling (4) (5) To continue transmitting and receiving serial data: check the RDRF flag, read RDR, and clear the RDRF flag to 0 before the MSB (bit 7) of the current frame is received. Also check that the TDRE flag is set to 1, indicating that data can be written, write data in TDR, then clear the TDRE flag to 0 before the MSB (bit 7) of the current frame is transmitted. Initialize Start of transmitting and receiving (1) Read TDRE flag in SSR (2) No TDRE= 1 Yes Write transmit data in TDR and clear TDRE flag to 0 in SSR Read ORER flag in SSR Yes ORER= 1 Read RDRF flag in SSR No RDRF= 1 Yes Read receive data from RDR, and clear RDRF flag to 0 in SSR No End of transmitting and receiving? Yes (5) Clear TE and RE bits to 0 in SCR Figure 12.20 Sample Flowchart for Simultaneous Serial Transmitting and Receiving 414 12.4 SCI Interrupts The SCI has four interrupt request sources: transmit-end interrupt (TEI), receive-error (ERI), receive-data-full (RXI), and transmit-data-empty interrupt (TXI). Table 12.12 lists the interrupt sources and indicates their priority. These interrupts can be enabled or disabled by the TIE, RIE, and TEIE bits in SCR. Each interrupt request is sent separately to the interrupt controller. A TXI interrupt is requested when the TDRE flag is set to 1 in SSR. A TEI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or FER flag is set to 1 in SSR. Table 12.12 SCI Interrupt Sources Interrupt Source ERI RXI TXI TEI Description Receive error (ORER, FER, or PER) Receive data register full (RDRF) Transmit data register empty (TDRE) Transmit end (TEND) Priority High Low 415 12.5 12.5.1 Usage Notes Notes on Use of SCI Note the following points when using the SCI. TDR Write and TDRE Flag: The TDRE flag in SSR is a status flag indicating the loading of transmit data from TDR to TSR. The SCI sets the TDRE flag to 1 when it transfers data from TDR to TSR. Data can be written into TDR regardless of the state of the TDRE flag. If new data is written in TDR when the TDRE flag is 0, the old data stored in TDR will be lost because this data has not yet been transferred to TSR. Before writing transmit data in TDR, be sure to check that the TDRE flag is set to 1. Simultaneous Multiple Receive Errors: Table 12.13 shows the state of the SSR status flags when multiple receive errors occur simultaneously. When an overrun error occurs the RSR contents are not transferred to RDR, so receive data is lost. Table 12.13 SSR Status Flags and Transfer of Receive Data SSR Status Flags RDRF 1 0 0 1 1 0 1 ORER 1 0 0 1 1 0 1 FER 0 1 0 1 0 1 1 PER 0 0 1 0 1 1 1 x x x Receive Data Transfer RSR RDR x Receive Errors Overrun error Framing error Parity error Overrun error + framing error Overrun error + parity error Framing error + parity error Overrun error + framing error + parity error Note: : Receive data is transferred from RSR to RDR. x : Receive data is not transferred from RSR to RDR. 416 Break Detection and Processing: Break signals can be detected by reading the RxD pin directly when a framing error (FER) is detected. In the break state the input from the RxD pin consists of all 0s, so the FER flag is set and the parity error flag (PER) may also be set. In the break state the SCI receiver continues to operate, so if the FER flag is cleared to 0 it will be set to 1 again. Sending a Break Signal: The input/output condition and level of the TxD pin are determined by DR and DDR bits. This feature can be used to send a break signal. After the serial transmitter is initialized, the DR value substitutes for the mark state until the TE bit is set to 1 (the TxD pin function is not selected until the TE bit is set to 1). The DDR and DR bits should therefore be set to 1 beforehand. To send a break signal during serial transmission, clear the DR bit to 0 , then clear the TE bit to 0. When the TE bit is cleared to 0 the transmitter is initialized, regardless of its current state, so the TxD pin becomes an input/output outputting the value 0. Receive Error Flags and Transmitter Operation (Synchronous Mode Only): When a receive error flag (ORER, PER, or FER) is set to 1 the SCI will not start transmitting, even if the TDRE flag is cleared to 0. Be sure to clear the receive error flags to 0 when starting to transmit. Note that clearing the RE bit to 0 does not clear the receive error flags to 0. Receive Data Sampling Timing in Asynchronous Mode and Receive Margin: In asynchronous mode the SCI operates on a base clock with 16 times the bit rate frequency. In receiving, the SCI synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the eighth base clock pulse. See figure 12.21. 16 clocks 8 clocks 0 7 15 0 7 15 0 Internal base clock Receive data (RxD) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 12.21 Receive Data Sampling Timing in Asynchronous Mode 417 The receive margin in asynchronous mode can therefore be expressed as shown in equation (1). 1 2N D - 0.5 N (1 + F) x 100% M = (0.5 - ) - (L - 0.5) F - . . . . . . . . (1) M: N: D: L: F: Receive margin (%) Ratio of clock frequency to bit rate (N = 16) Clock duty cycle (D = 0 to 1.0) Frame length (L = 9 to 12) Absolute deviation of clock frequency From equation (1), if F = 0 and D = 0.5, the receive margin is 46.875%, as given by equation (2). When D = 0.5 and F = 0: M = (0.5 - 1 ) x 100% . . . . . . . . (2) 2 x 16 = 46.875% This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%. Restrictions on Use of an External Clock Source: * When an external clock source is used for the serial clock, after updates TDR, allow an inversion of at least five system clock () cycles before input of the serial clock to start transmitting. If the serial clock is input within four states of the TDR update, a malfunction may occur (See figure 12.22). SCK t TDRE D0 D1 D2 D3 D4 D5 D6 D7 Note: In operation with an external clock source, be sure that t >4 states. Figure 12.22 Example of Synchronous Transmission 418 Switching from SCK Pin Function to Port Pin Function: * Problem in Operation: When switching the SCK pin function to the output port function (highlevel output) by making the following settings while DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1 (synchronous mode), low-level output occurs for one half-cycle. 1. End of serial data transmission 2. TE bit = 0 3. C/A bit = 0 ... switchover to port output 4. Occurrence of low-level output (see figure 12.23) Half-cycle low-level output SCK/port 1. End of transmission Data TE C/A CKE1 CKE0 Bit 6 Bit 7 2.TE= 0 4. Low-level output 3.C/A= 0 Figure 12.23 Operation when Switching from SCK Pin Function to Port Pin Function 419 * Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an external circuit. With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following settings in the order shown. 1. End of serial data transmission 2. TE bit = 0 3. CKE1 bit = 1 4. C/A bit = 0 ... switchover to port output 5. CKE1 bit = 0 High-level outputTE SCK/port 1. End of transmission Data TE C/A 3.CKE1= 1 CKE1 CKE0 5.CKE1= 0 Bit 6 Bit 7 2.TE= 0 4.C/A= 0 Figure 12.24 Operation when Switching from SCK Pin Function to Port Pin Function (Example of Preventing Low-Level Output) 420 Section 13 Smart Card Interface 13.1 Overview The SCI supports an IC card (smart card) interface handling ISO/IEC7816-3 (Identification Card) character transmission as a serial communication interface expansion function. Switchover between the normal serial communication interface and the smart card interface is controlled by a register setting. 13.1.1 Features Features of the smart card interface supported by the H8/3062 Series are listed below. * Asynchronous communication Data length: 8 bits Parity bit generation and checking Transmission of error signal (parity error) in receive mode Error signal detection and automatic data retransmission in transmit mode Direct convention and inverse convention both supported * Built-in baud rate generator allows any bit rate to be selected * Three interrupt sources There are three interrupt sources--transmit-data-empty, receive-data-full, and transmit/receive error--that can issue requests independently. 421 13.1.2 Block Diagram Figure 13.1 shows a block diagram of the smart card interface. Bus interface Module data bus Internal data bus RDR TDR RxD RSR TSR TxD Parity generation Parity check SCK Legend SCMR : RSR : RDR : TSR : TDR : SMR : SCR : SSR : BRR : SCMR SSR SCR SMR Transmission/ reception control BRR Baud rate generator /4 /16 /64 Clock External clock Smart card mode register Receive shift register Receive data register Transmit shift register Transmit data register Serial mode register Serial control register Serial status register Bit rate register TXI RXI ERI Figure 13.1 Block Diagram of Smart Card Interface 13.1.3 Pin Configuration Table 13.1 shows the smart card interface pins. Table 13.1 Smart Card Interface Pins Pin Name Serial clock pin Receive data pin Transmit data pin Abbreviation SCK RxD TxD I/O I/O Input Output Function Clock input/output Receive data input Transmit data output 422 13.1.4 Register Configuration The smart card interface has the internal registers listed in table 13.2. The BRR, TDR, and RDR registers have their normal serial communication interface functions, as described in section 12, Serial Communication Interface. Table 13.2 Smart Card Interface Registers Channel 0 Address* 1 Name H'FFFB0 H'FFFB1 H'FFFB2 H'FFFB3 H'FFFB4 H'FFFB5 H'FFFB6 1 H'FFFB8 H'FFFB9 H'FFFBA H'FFFBB H'FFFBC H'FFFBD H'FFFBE Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register Smart card mode register Serial mode register Bit rate register Serial control register Transmit data register Serial status register Receive data register Smart card mode register Abbreviation SMR BRR SCR TDR SSR RDR SCMR SMR BRR SCR TDR SSR RDR SCMR R/W R/W R/W R/W R/W R/(W)* R R/W R/W R/W R/W R/W R/(W)* R R/W 2 2 Initial Value H'00 H'FF H'00 H'FF H'84 H'00 H'F2 H'00 H'FF H'00 H'FF H'84 H'00 H'F2 Notes: *1 Lower 20 bits of the address in advanced mode *2 Only 0 can be written in bits 7 to 3, to clear the flags. 423 13.2 Register Descriptions This section describes the new or modified registers and bit functions in the smart card interface. 13.2.1 Smart Card Mode Register (SCMR) SCMR is an 8-bit readable/writable register that selects smart card interface functions. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 SDIR 0 R/W 2 SINV 0 R/W 1 -- 1 -- 0 SMIF 0 R/W Reserved bits Reserved bit Smart card interface mode select Enables or disables the smart card interface function Smart card data invert Inverts data logic levels Smart card data transfer direction Selects the serial/parallel conversion format SCMR is initialized to H'F2 by a reset and in standby mode. Bits 7 to 4--Reserved: Read-only bits, always read as 1. Bit 3--Smart Card Data Transfer Direction (SDIR): Selects the serial/parallel conversion format *1. Bit 3 SDIR 0 Description TDR contents are transmitted LSB-first Receive data is stored LSB-first in RDR 1 TDR contents are transmitted MSB-first Receive data is stored MSB-first in RDR (Initial value) 424 Bit 2--Smart Card Data Invert (SINV): Specifies inversion of the data logic level. This function is used in combination with the SDIR bit to communicate with inverse-convention cards*2. The SINV bit does not affect the logic level of the parity bit. For parity settings, see section 13.3.4, Register Settings. Bit 2 SINV 0 Description Unmodified TDR contents are transmitted Receive data is stored unmodified in RDR 1 Inverted TDR contents are transmitted Receive data is inverted before storage in RDR (Initial value) Bit 1--Reserved: Read-only bit, always read as 1. Bit 0--Smart Card Interface Mode Select (SMIF): Enables the smart card interface function. Bit 0 SMIF 0 1 Description Smart card interface function is disabled Smart card interface function is enabled (Initial value) Notes: *1 The function for switching between LSB-first and MSB-first mode can also be used with the normal serial communication interface. Note that when the communication format data length is set to 7 bits and MSB-first mode is selected for the serial data to be transferred, bit 0 of TDR is not transmitted, and only bits 7 to 1 of the received data are valid. *2 The data logic level inversion function can also be used with the normal serial communication interface. Note that, when inverting the serial data to be transferred, parity transmission and parity checking is based on the number of high-level periods at the serial data I/O pin, and not on the register value. 425 13.2.2 Serial Status Register (SSR) The function of SSR bit 4 is modified in smart card interface mode. This change also causes a modification to the setting conditions for bit 2 (TEND). Bit Initial value Read/Write 7 TDRE 1 R/(W)* 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 ERS 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R 1 MPB 0 R 0 MPBT 0 R/W Transmit end Status flag indicating end of transmission Error signal status (ERS) Status flag indicating that an error signal has been received Note: * Only 0 can be written, to clear the flag. Bits 7 to 5: These bits operate as in normal serial communication. For details see section 12.2.7, Serial Status Register (SSR). Bit 4--Error Signal Status (ERS): In smart card interface mode, this flag indicates the status of the error signal sent from the receiving device to the transmitting device. The smart card interface does not detect framing errors. Bit 4 ERS 0 Description Indicates normal transmission, with no error signal returned [Clearing conditions] * * 1 The chip is reset, or enters standby mode or module stop mode Software reads ERS while it is set to 1, then writes 0. (Initial value) Indicates that the receiving device sent an error signal reporting a parity error [Setting condition] A low error signal was sampled. Note: Clearing the TE bit to 0 in SCR does not affect the ERS flag, which retains its previous value. 426 Bits 3 to 0: These bits operate as in normal serial communication. For details see section 12.2.7, Serial Status Register (SSR). The setting conditions for transmit end (TEND), however, are modified as follows. Bit 2 TEND 0 Description Transmission is in progress [Clearing condition] Software reads TDRE while it is set to 1, then writes 0 in the TDRE flag. 1 End of transmission [Setting conditions] * * * The chip is reset or enters standby mode. The TE bit and FER/ERS bit are both cleared to 0 in SCR. TDRE is 1 and FER/ERS is 0 at a time 2.5 etu after the last bit of a 1-byte serial character is transmitted (normal transmission). (Initial value) Note: An etu (elementary time unit) is the time needed to transmit one bit. 13.2.3 Serial Mode Register (SMR) The function of SMR bit 7 is modified in smart card interface mode. This change also causes a modification to the function of bits 1 and 0 in the serial control register (SCR). Bit Initial value Read/Write 7 GM 0 R/W 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Bit 7--GSM Mode (GM): With the normal smart card interface, this bit is cleared to 0. Setting this bit to 1 selects GSM mode, an additional mode for controlling the timing for setting the TEND flag that indicates completion of transmission, and the type of clock output used. The details of the additional clock output control mode are specified by the CKE1 and CKE0 bits in the serial control register (SCR). 427 Bit 7 GM 0 Description Normal smart card interface mode operation * * The TEND flag is set 12.5 etu after the beginning of the start bit. Clock output on/off control only. (Initial value) 1 GSM mode smart card interface mode operation * * The TEND flag is set 11.0 etu after the beginning of the start bit. Clock output on/off and fixed-high/fixed-low control. Bits 6 to 0: These bits operate as in normal serial communication. For details see section 12.2.5, Serial Mode Register (SMR). 13.2.4 Serial Control Register (SCR) The function of SCR bits 1 and 0 is modified in smart card interface mode. Bit Initial value Read/Write 7 TIE 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W Bits 7 to 2: These bits operate as in normal serial communication. For details see section 12.2.6, Serial Control Register (SCR). Bits 1 and 0--Clock Enable 1 and 0 (CKE1, CKE0): These bits select the SCI clock source and enable or disable clock output from the SCK pin. In smart card interface mode, it is possible to specify a fixed high level or fixed low level for the clock output, in addition to the usual switching between enabling and disabling of the clock output. Bit 7 GM 0 Bit 1 CKE1 0 Bit 0 CKE0 0 1 1 0 1 1 0 1 Description Internal clock/SCK pin is I/O port Internal clock/SCK pin is clock output Internal clock/SCK pin is fixed at low output Internal clock/SCK pin is clock output Internal clock/SCK pin is fixed at high output Internal clock/SCK pin is clock output (Initial value) 428 13.3 13.3.1 Operation Overview The main features of the smart card interface are as follows. * One frame consists of 8-bit data plus a parity bit. * In transmission, a guard time of at least 2 etu (elementary time units: the time for transfer of one bit) is provided between the end of the parity bit and the start of the next frame. * If a parity error is detected during reception, a low error signal level is output for 1 etu period 10.5 etu after the start bit. * If an error signal is detected during transmission, the same data is transmitted automatically after the elapse of 2 etu or longer. * Only asynchronous communication is supported; there is no synchronous communication function. 13.3.2 Pin Connections Figure 13.2 shows a pin connection diagram for the smart card interface. In communication with a smart card, since both transmission and reception are carried out on a single data transmission line, the TxD pin and RxD pin should both be connected to this line. The data transmission line should be pulled up to VCC with a resistor. When the smart card uses the clock generated on the smart card interface, the SCK pin output is input to the CLK pin of the smart card. If the smart card uses an internal clock, this connection is unnecessary. The reset signal should be output from one of the H8/3062 Series' generic ports. In addition to these pin connections. power and ground connections will normally also be necessary. 429 VCC TxD RxD SCK H8/3062 Series Px (port) chip Clock line Reset line Data line I/O CLK RST Smart card Card-processing device Figure 13.2 Smart Card Interface Connection Diagram Note: Setting both TE and RE to 1 without connecting a smart card enables closed transmission/reception, allowing self-diagnosis to be carried out. 13.3.3 Data Format Figure 13.3 shows the smart card interface data format. In reception in this mode, a parity check is carried out on each frame, and if an error is detected an error signal is sent back to the transmitting device to request retransmission of the data. In transmission, the error signal is sampled and the same data is retransmitted. 430 No parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp Output from transmitting device Parity error Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Output from transmitting device Output from receiving device Legend: Ds D0 to D7 Dp DE : : : : Start bit Data bits Parity bit Error signal Figure 13.3 Smart Card Interface Data Format The operating sequence is as follows. 1. When the data line is not in use it is in the high-impedance state, and is fixed high with a pullup resistor. 2. The transmitting device starts transfer of one frame of data. The data frame starts with a start bit (Ds, low-level), followed by 8 data bits (D0 to D7) and a parity bit (Dp). 3. With the smart card interface, the data line then returns to the high-impedance state. The data line is pulled high with a pull-up resistor. 4. The receiving device carries out a parity check. If there is no parity error and the data is received normally, the receiving device waits for reception of the next data. If a parity error occurs, however, the receiving device outputs an error signal (DE, low-level) to request retransmission of the data. After outputting the error signal for the prescribed length of time, the receiving device places the signal line in the high-impedance state again. The signal line is pulled high again by a pull-up resistor. 5. If the transmitting device does not receive an error signal, it proceeds to transmit the next data frame. If it receives an error signal, however, it returns to step 2 and transmits the same data again. 431 13.3.4 Register Settings Table 13.3 shows a bit map of the registers used in the smart card interface. Bits indicated as 0 or 1 must be set to the value shown. The setting of other bits is described in this section. Table 13.3 Smart Card Interface Register Settings Bit Register Address* 1 Bit 7 SMR BRR SCR TDR SSR RDR SCMR H'FFFB0 H'FFFB1 H'FFFB2 H'FFFB3 H'FFFB4 H'FFFB5 H'FFFB6 GM BRR7 TIE TDR7 TDRE RDR7 -- Bit 6 0 BRR6 RIE TDR6 RDRF RDR6 -- Bit 5 1 BRR5 TE TDR5 ORER RDR5 -- Bit 4 O/E BRR4 RE TDR4 ERS RDR4 -- Bit 3 1 BRR3 0 TDR3 PER RDR3 SDIR Bit 2 0 BRR2 0 TDR2 TEND RDR2 SINV Bit 1 CKS1 BRR1 Bit 0 CKS0 BRR0 CKE1 * 2 CKE0 TDR1 0 RDR1 -- TDR0 0 RDR0 SMIF Notes: --: Unused bit. *1 Lower 20 bits of the address in advanced mode *2 When GM is cleared to 0 in SMR, the CKE1 bit must also be cleared to 0. Serial Mode Register (SMR) Settings: Clear the GM bit to 0 when using the normal smart card interface mode, or set to 1 when using GSM mode. Clear the O/E bit to 0 if the smart card is of the direct convention type, or set to 1 if of the inverse convention type. Bits CKS1 and CKS0 select the clock source of the built-in baud rate generator. See section 13.3.5, Clock. Bit Rate Register (BRR) Settings: BRR is used to set the bit rate. See section 13.3.5, Clock, for the method of calculating the value to be set. Serial Control Register (SCR) Settings: The TIE, RIE, TE, and RE bits have their normal serial communication functions. See section 12, Serial Communication Interface, for details. The CKE1 and CKE0 bits specify clock output. To disable clock output, clear these bits to 00; to enable clock output, set these bits to 01. Clock output is performed when the GM bit is set to 1 in SMR. Clock output can also be fixed low or high. Smart Card Mode Register (SCMR) Settings: Clear both the SDIR bit and SINV bit cleared to 0 if the smart card is of the direct convention type, and set both to 1 if of the inverse convention type. To use the smart card interface, set the SMIF bit to 1. 432 The register settings and examples of starting character waveforms are shown below for two smart cards, one following the direct convention and one the inverse convention. 1. Direct Convention (SDIR = SINV = O/E = 0) (Z) A Ds Z D0 Z D1 A D2 Z D3 Z D4 Z D5 A D6 A D7 Z Dp (Z) State With the direct convention type, the logic 1 level corresponds to state Z and the logic 0 level to state A, and transfer is performed in LSB-first order. In the example above, the first character data is H'3B. The parity bit is 1, following the even parity rule designated for smart cards. 2. Inverse Convention (SDIR = SINV = O/E = 1) (Z) A Ds Z D7 Z D6 A D5 A D4 A D3 A D2 A D1 A D0 Z Dp (Z) State With the inverse convention type, the logic 1 level corresponds to state A and the logic 0 level to state Z, and transfer is performed in MSB-first order. In the example above, the first character data is H'3F. The parity bit is 0, corresponding to state Z, following the even parity rule designated for smart cards. In the H8/3062 Series, inversion specified by the SINV bit applies only to the data bits, D7 to D0. For parity bit inversion, the O/E bit in SMR must be set to odd parity mode. This applies to both transmission and reception. 433 13.3.5 Clock Only an internal clock generated by the on-chip baud rate generator can be used as the transmit/receive clock for the smart card interface. The bit rate is set with the bit rate register (BRR) and the CKS1 and CKS0 bits in the serial mode register (SMR). The equation for calculating the bit rate is shown below. Table 13.5 shows some sample bit rates. If clock output is selected with CKE0 set to 1, a clock with a frequency of 372 times the bit rate is output from the SCK pin. B= 1488 x 22n-1 x (N + 1) x 106 where, N: BRR setting (0 N 255) B: Bit rate (bit/s) : Operating frequency (MHz) n: See table 13.4 Table 13.4 n-Values of CKS1 and CKS0 Settings n 0 1 2 3 1 CKS1 0 CKS0 0 1 0 1 Note: If the gear function is used to divide the clock frequency, use the divided frequency to calculate the bit rate. The equation above applies directly to 1/1 frequency division. Table 13.5 Bit Rates (bits/s) for Various BRR Settings (When n = 0) (MHz) N 0 1 2 7.1424 9600.0 4800.0 3200.0 10.00 13440.9 6720.4 4480.3 10.7136 14400.0 7200.0 4800.0 13.00 17473.1 8736.6 5824.4 14.2848 19200.0 9600.0 6400.0 16.00 21505.4 10752.7 7168.5 18.00 24193.5 12096.8 8064.5 25.00 33602.2 16801.1 11200.7 Note: Bit rates are rounded off to two decimal places. 434 The following equation calculates the bit rate register (BRR) setting from the operating frequency and bit rate. N is an integer from 0 to 255, specifying the value with the smaller error. N= 1488 x 22n-1 x B x 106 - 1 Table 13.6 BRR Settings for Typical Bit Rates (bits/s) (When n = 0) (MHz) 7.1424 bit/s 9600 N Error 0 0.00 10.00 N Error 1 30 10.7136 N Error 1 25 13.00 N Error 1 8.99 14.2848 N Error 1 0.00 16.00 N Error 1 12.01 18.00 N Error 2 15.99 25.0 N Error 3 12.49 Table 13.7 Maximum Bit Rates for Various Frequencies (Smart Card Interface Mode) (MHz) 7.1424 10.00 10.7136 13.00 14.2848 16.00 18.00 20.00 25.00 Maximum Bit Rate (bits/s) 9600 13441 14400 17473 19200 21505 24194 26882 33602 N 0 0 0 0 0 0 0 0 0 n 0 0 0 0 0 0 0 0 0 The bit rate error is given by the following equation: Error (%) = 1488 x 22n-1 x B x (N + 1) x 106 - 1 x 100 435 13.3.6 Transmitting and Receiving Data Initialization: Before transmitting or receiving data, the smart card interface must be initialized as described below. Initialization is also necessary when switching from transmit mode to receive mode, or vice versa. 1. Clear the TE and RE bits to 0 in the serial control register (SCR). 2. Clear error flags ERS, PER, and ORER to 0 in the serial status register (SSR). 3. Set the parity bit (O/E) and baud rate generator select bits (CKS1 and CKS0) in the serial mode register (SMR). Clear the C/A, CHR, and MP bits to 0, and set the STOP and PE bits to 1. 4. Set the SMIF, SDIR, and SINV bits in the smart card mode register (SCMR). When the SMIF bit is set to 1, the TxD pin and RxD pin are both switched from port to SCI pin functions and go to the high-impedance state. 5. Set a value corresponding to the desired bit rate in the bit rate register (BRR). 6. Set the CKE0 bit in SCR. Clear the TIE, RIE, TE, RE, MPIE, TEIE, and CKE1 bits to 0. If the CKE0 bit is set to 1, the clock is output from the SCK pin. 7. Wait at least one bit interval, then set the TIE, RIE, TE, and RE bits in SCR. Do not set the TE bit and RE bit at the same time, except for self-diagnosis. Transmitting Serial Data: As data transmission in smart card mode involves error signal sampling and retransmission processing, the processing procedure is different from that for the normal SCI. Figure 13.5 shows a sample transmission processing flowchart. 1. 2. 3. 4. Perform smart card interface mode initialization as described in Initialization above. Check that the ERS error flag is cleared to 0 in SSR. Repeat steps 2 and 3 until it can be confirmed that the TEND flag is set to 1 in SSR. Write the transmit data in TDR, clear the TDRE flag to 0, and perform the transmit operation. The TEND flag is cleared to 0. 5. To continue transmitting data, go back to step 2. 6. To end transmission, clear the TE bit to 0. The above processing may include interrupt handling. If transmission ends and the TEND flag is set to 1 while the TIE bit is set to 1 and interrupt requests are enabled, a transmit-data-empty interrupt (TXI) will be requested. If an error occurs in transmission and the ERS flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a transmit/receive-error interrupt (ERI) will be requested. The timing of TEND flag setting depends on the GM bit in SMR. Figure 13.4 shows timing of TEND flag setting. 436 For details, see Interrupt Operations in this section. Serial data Ds Dp DE Guard time (1) GM = 0 TEND 12.5 etu (2) GM = 1 TEND 11.0 etu Figure 13.4 Timing of TEND Flag Setting 437 Start Initialization Start transmitting No FER/ERS = 0? Yes Error handling No TEND = 1? Yes Write transmit data in TDR, and clear TDRE flag to 0 in SSR No All data transmitted? Yes No FER/ERS = 0? Yes Error handling No TEND = 1? Yes Clear TE bit to 0 End Figure 13.5 Sample Transmission Processing Flowchart 438 TDR 1. Data write 2. Transfer from TDR to TSR 3. Serial data output Data 1 Data 1 Data 1 TSR (shift register) Data 1 Data remains in TDR. Data 1 I/O signal output In case of normal transmission : TEND flag is set. In case of transmit error : ERS flag is set. Steps 2 and 3 above are repeated until the TEND flag is set. Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first transmission, D0 in MSB-first transmission) of the retransmit data to be transmitted next has been completed. Figure 13.6 Relation Between Transmit Operation and Internal Registers I/O data Ds Da Db Dc Dd De Df Dg Dh Dp DE Guard time TXI (TEND interrupt) 12.5 etu When GM = 0 11.0 etu When GM = 1 Figure 13.7 Timing of TEND Flag Setting Receiving Serial Data: Data reception in smart card mode uses the same processing procedure as for the normal SCI. Figure 13.8 shows a sample reception processing flowchart. 1. Perform smart card interface mode initialization as described in Initialization above. 2. Check that the ORER flag and PER flag are cleared to 0 in SSR. If either is set, perform the appropriate receive error handling, then clear both the ORER and the PER flag to 0. 3. Repeat steps 2 and 3 until it can be confirmed that the RDRF flag is set to 1. 4. Read the receive data from RDR. 5. To continue receiving data, clear the RDRF flag to 0 and go back to step 2. 6. To end reception, clear the RE bit to 0. 439 Start Initialization Start receiving ORER = 0 and PER = 0? Yes No Error handling No RDRF = 1? Yes Read RDR and clear RDRF flag to 0 in SSR No All data received? Yes Clear RE bit to 0 Figure 13.8 Sample Reception Processing Flowchart The above procedure may include interrupt handling. If reception ends and the RDRF flag is set to 1 while the RIE bit is set to 1 and interrupt requests are enabled, a receive-data-full interrupt (RXI) will be requested. If an error occurs in reception and either the ORER flag or the PER flag is set to 1, a transmit/receive-error interrupt (ERI) will be requested. For details, see Interrupt Operations in this section. If a parity error occurs during reception and the PER flag is set to 1, the received data is transferred to RDR, so the erroneous data can be read. Switching Modes: When switching from receive mode to transmit mode, first confirm that the receive operation has been completed, then start from initialization, clearing RE to 0 and setting TE to 1. The RDRF, PER, or ORER flag can be used to check that the receive operation has been completed. 440 When switching from transmit mode to receive mode, first confirm that the transmit operation has been completed, then start from initialization, clearing TE to 0 and setting RE to 1. The TEND flag can be used to check that the transmit operation has been completed. Fixing Clock Output: When the GM bit is set to 1 in SMR, clock output can be fixed by means of the CKE1 and CKE0 bits in SCR. The minimum clock pulse width can be set to the specified width in this case. Figure 13.9 shows the timing for fixing clock output. In this example, GM = 1, CKE1 = 0, and the CKE0 bit is controlled. Specified pulse width CKE1 value SCK Specified pulse width SCR write (CKE0 = 0) SCR write (CKE0 = 1) Figure 13.9 Timing for Fixing Cock Output Interrupt Operations: The smart card interface has three interrupt sources: transmit-data-empty (TXI), transmit/receive-error (ERI), and receive-data-full (RXI). The transmit-end interrupt request (TEI) is not available in smart card mode. A TXI interrupt is requested when the TEND flag is set to 1 in SSR. An RXI interrupt is requested when the RDRF flag is set to 1 in SSR. An ERI interrupt is requested when the ORER, PER, or ERS flag is set to 1 in SSR. These relationships are shown in table 13.8. Table 13.8 Smart Card Interface Mode Operating States and Interrupt Sources Operating State Transmit Mode Normal operation Error Receive Mode Normal operation Error Flag TEND ERS RDRF PER, ORER Enable Bit TIE RIE RIE RIE Interrupt Source TXI ERI RXI ERI 441 Examples of Operation in GSM Mode: When switching between smart card interface mode and software standby mode, use the following procedures to maintain the clock duty cycle. * Switching from smart card interface mode to software standby mode 1. Set the P9 4 data register (DR) and data direction register (DDR) to the values for the fixed output state in software standby mode. 2. Write 0 in the TE and RE bits in the serial control register (SCR) to stop transmit/receive operations. At the same time, set the CKE1 bit to the value for the fixed output state in software standby mode. 3. Write 0 in the CKE0 bit in SCR to stop the clock. 4. Wait for one serial clock cycle. During this period, the duty cycle is preserved and clock output is fixed at the specified level. 5. Write H'00 in the serial mode register (SMR) and smart card mode register (SCMR). 6. Make the transition to the software standby state. * Returning from software standby mode to smart card interface mode 1'. Clear the software standby state. 2'. Set the CKE1 bit in SCR to the value for the fixed output state at the start of software standby (the current P94 pin state). 3'. Set smart card interface mode and output the clock. Clock signal generation is started with the normal duty cycle. Software standby Normal operation Normal operation 123 4 56 1' 2' 3' Figure 13.10 Procedure for Stopping and Restarting the Clock Use the following procedure to secure the clock duty cycle after powering on. 1. The initial state is port input and high impedance. Use pull-up or pull-down resistors to fix the potential. 2. Fix at the output specified by the CKE1 bit in SCR. 3. Set SMR and SCMR, and switch to smart card interface mode operation. 4. Set the CKE0 bit to 1 in SCR to start clock output. 442 13.4 Usage Notes The following points should be noted when using the SCI as a smart card interface. Receive Data Sampling Timing and Receive Margin in Smart Card Interface Mode: In smart card interface mode, the SCI operates on a base clock with a frequency of 372 times the transfer rate. In reception, the SCI synchronizes internally with the fall of the start bit, which it samples on the base clock. Receive data is latched at the rising edge of the 186th base clock pulse. The timing is shown in figure 13.11. 372 clocks 186 clocks 0 185 371 0 185 371 0 Internal base clock Receive data (RxD) Start bit D0 D1 Synchronization sampling timing Data sampling timing Figure 13.11 Receive Data Sampling Timing in Smart Card Interface Mode 443 The receive margin can therefore be expressed as follows. Receive margin in smart card interface mode: M = (0.5 - 1 2N ) - (L - 0.5) F - D - 0.5 N (1 + F) x 100% M: N: D: L: F: Receive margin (%) Ratio of clock frequency to bit rate (N = 372) Clock duty cycle (L = 0 to 1.0) Frame length (L =10) Absolute deviation of clock frequency From the above equation, if F = 0 and D = 0.5, the receive margin is as follows. When D = 0.5 and F = 0: M = (0.5 - 1/2 x 372) x 100% = 49.866% Retransmission: Retransmission is performed by the SCI in receive mode and transmit mode as described below. * Retransmission when SCI is in Receive Mode Figure 13.12 illustrates retransmission when the SCI is in receive mode. 1. If an error is found when the received parity bit is checked, the PER bit is automatically set to 1. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The PER bit should be cleared to 0 in SSR before the next parity bit sampling timing. 2. The RDRF bit in SSR is not set for the frame in which the error has occurred. 3. If an error is found when the received parity bit is checked, the PER bit is not set to 1 in SSR. 4. If no error is found when the received parity bit is checked, the receive operation is assumed to have been completed normally, and the RDRF bit is automatically set to 1 in SSR. If the RIE bit in SCR is set to the enable state, an RXI interrupt is requested. 5. When a normal frame is received, the data pin is held in three-state at the error signal transmission timing. 444 Frame n Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Retransmitted frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Frame n+1 Ds D0 D1 D2 D3 D4 RDRF [2] PER [1] [3] [4] Figure 13.12 Retransmission in SCI Receive Mode * Retransmission when SCI is in Transmit Mode Figure 13.13 illustrates retransmission when the SCI is in transmit mode. 6. If an error signal is sent back from the receiving device after transmission of one frame is completed, the ERS bit is set to 1 in SSR. If the RIE bit in SCR is set to the enable state, an ERI interrupt is requested. The ERS bit should be cleared to 0 in SSR before the next parity bit sampling timing. 7. The TEND bit in SSR is not set for the frame for which the error signal was received. 8. If an error signal is not sent back from the receiving device, the ERS flag is not set in SSR. 9. If an error signal is not sent back from the receiving device, transmission of one frame, including retransmission, is assumed to have been completed, and the TEND bit is set to 1 in SSR. If the TIE bit in SCR is set to the enable state, a TXI interrupt is requested. Frame n Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp DE Retransmitted frame Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp (DE) Frame n+1 Ds D0 D1 D2 D3 D4 TDRE Transfer from TDR to TSR TEND [7] ERS [6] [8] [9] Transfer from TDR to TSR Transfer from TDR to TSR Figure 13.13 Retransmission in SCI Transmit Mode The smart card interface installed in the H8/3062 Series supports an IC card (smart card) interface with provision for ISO/IEC7816-3 T=0 (character transmission). Therefore, block transfer operations are not supported (error signal transmission, detection, and automatic data retransmission are not performed). 445 446 Section 14 A/D Converter 14.1 Overview The H8/3062 Series includes a 10-bit successive-approximations A/D converter with a selection of up to eight analog input channels. When the A/D converter is not used, it can be halted independently to conserve power. For details see section 21.6, Module Standby Function. The H8/3062 Series supports 70/134-state conversion as a high-speed conversion mode. Note that it differs in this respect from the H8/3048 Series, which supports 134/266-state conversion. 14.1.1 Features A/D converter features are listed below. * 10-bit resolution * Eight input channels * Selectable analog conversion voltage range The analog voltage conversion range can be programmed by input of an analog reference voltage at the V REF pin. * High-speed conversion Conversion time: minimum 5.36 s per channel * Two conversion modes Single mode: A/D conversion of one channel Scan mode: continuous A/D conversion on one to four channels * Four 16-bit data registers A/D conversion results are transferred for storage into data registers corresponding to the channels. * Sample-and-hold function * Three conversion start sources The A/D converter can be activated by software, an external trigger, or an 8-bit timer compare match. * A/D interrupt requested at end of conversion At the end of A/D conversion, an A/D end interrupt (ADI) can be requested. 447 14.1.2 Block Diagram Figure 14.1 shows a block diagram of the A/D converter. Module data bus Bus interface ADDRC ADDRD ADDRA ADDRB ADCSR + - Analog multiplexer Comparator Control circuit Sample-andhold circuit ADCR Internal data bus AVCC VREF AVSS 10-bit D/A AN 0 AN 1 AN 2 AN 3 AN 4 AN 5 AN 6 AN 7 ADTRG Compare match A0 ADTE 8-bit timer 8TCSR0 Legend: ADCR : ADCSR : ADDRA : ADDRB : ADDRC : ADDRD : Successiveapproximations register o/4 o/8 ADI interrupt signal A/D control register A/D control/status register A/D data register A A/D data register B A/D data register C A/D data register D Figure 14.1 A/D Converter Block Diagram 448 14.1.3 Pin Configuration Table 14.1 summarizes the A/D converter's input pins. The eight analog input pins are divided into two groups: group 0 (AN0 to AN3), and group 1 (AN4 to AN7). AVCC and AVSS are the power supply for the analog circuits in the A/D converter. VREF is the A/D conversion reference voltage. Table 14.1 A/D Converter Pins Pin Name Analog power supply pin Analog ground pin Reference voltage pin Analog input pin 0 Analog input pin 1 Analog input pin 2 Analog input pin 3 Analog input pin 4 Analog input pin 5 Analog input pin 6 Analog input pin 7 Abbreviation I/O AVCC AVSS VREF AN 0 AN 1 AN 2 AN 3 AN 4 AN 5 AN 6 AN 7 Input Input Input Input Input Input Input Input Input Input Input Input External trigger input for starting A/D conversion Group 1 analog inputs Function Analog power supply Analog ground and reference voltage Analog reference voltage Group 0 analog inputs A/D external trigger input pin ADTRG 449 14.1.4 Register Configuration Table 14.2 summarizes the A/D converter's registers. Table 14.2 A/D Converter Registers Address* 1 H'FFFE0 H'FFFE1 H'FFFE2 H'FFFE3 H'FFFE4 H'FFFE5 H'FFFE6 H'FFFE7 H'FFFE8 H'FFFE9 Name A/D data register A H A/D data register A L A/D data register B H A/D data register B L A/D data register C H A/D data register C L A/D data register D H A/D data register D L A/D control/status register A/D control register Abbreviation ADDRAH ADDRAL ADDRBH ADDRBL ADDRCH ADDRCL ADDRDH ADDRDL ADCSR ADCR R/W R R R R R R R R R/(W)* R/W 2 Initial Value H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'00 H'7E Notes: *1 Lower 20 bits of the address in advanced mode *2 Only 0 can be written in bit 7, to clear the flag. 14.2 14.2.1 Bit ADDRn Register Descriptions A/D Data Registers A to D (ADDRA to ADDRD) 15 0 R 14 0 R 13 0 R 12 0 R 11 0 R 10 0 R 9 0 R 8 0 R 7 0 R 6 0 R 5 0 R 4 -- 0 R 3 -- 0 R 2 -- 0 R 1 -- 0 R 0 -- 0 R AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 -- Initial value Read/Write (n = A to D) A/D conversion data 10-bit data giving an A/D conversion result Reserved bits The four A/D data registers (ADDRA to ADDRD) are 16-bit read-only registers that store the results of A/D conversion. An A/D conversion produces 10-bit data, which is transferred for storage into the A/D data register corresponding to the selected channel. The upper 8 bits of the result are stored in the upper byte of the A/D data register. The lower 2 bits are stored in the lower byte. Bits 5 to 0 of an A/D 450 data register are reserved bits that are always read as 0. Table 14.3 indicates the pairings of analog input channels and A/D data registers. The CPU can always read and write the A/D data registers. The upper byte can be read directly, but the lower byte is read through a temporary register (TEMP). For details see section 14.3, CPU Interface. The A/D data registers are initialized to H'0000 by a reset and in standby mode. Table 14.3 Analog Input Channels and A/D Data Registers (ADDRA to ADDRD) Analog Input Channel Group 0 AN 0 AN 1 AN 2 AN 3 Group 1 AN 4 AN 5 AN 6 AN 7 A/D Data Register ADDRA ADDRB ADDRC ADDRD 14.2.2 Bit A/D Control/Status Register (ADCSR) 7 ADF 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W 3 CKS 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W 0 CH0 0 R/W Initial value Read/Write Channel select 2 to 0 These bits select analog input channels Clock select Selects the A/D conversion time Scan mode Selects single mode or scan mode A/D start Starts or stops A/D conversion A/D interrupt enable Enables and disables A/D end interrupts A/D end flag Indicates end of A/D conversion Note: * Only 0 can be written, to clear the flag. 451 ADCSR is an 8-bit readable/writable register that selects the mode and controls the A/D converter. ADCSR is initialized to H'00 by a reset and in standby mode. Bit 7--A/D End Flag (ADF): Indicates the end of A/D conversion. Bit 7 ADF 0 1 Description [Clearing condition] Read ADF when ADF =1, then write 0 in ADF. [Setting conditions] * Single mode: A/D conversion ends * Scan mode: A/D conversion ends in all selected channels (Initial value) Bit 6--A/D Interrupt Enable (ADIE): Enables or disables the interrupt (ADI) requested at the end of A/D conversion. Bit 6 ADIE 0 1 Description A/D end interrupt request (ADI) is disabled A/D end interrupt request (ADI) is enabled (Initial value) Bit 5--A/D Start (ADST): Starts or stops A/D conversion. The ADST bit remains set to 1 during A/D conversion. It can also be set to 1 by external trigger input at the ADTRG pin, or by an 8-bit timer compare match. Bit 5 ADST 0 1 Description A/D conversion is stopped (Initial value) Single mode: A/D conversion starts; ADST is automatically cleared to 0 when conversion ends. Scan mode: A/D conversion starts and continues, cycling among the selected channels, until ADST is cleared to 0 by software, by a reset, or by a transition to standby mode. Bit 4--Scan Mode (SCAN): Selects single mode or scan mode. For further information on operation in these modes, see section 14.4, Operation. Clear the ADST bit to 0 before switching the conversion mode. Bit 4 SCAN 0 1 Description Single mode Scan mode (Initial value) 452 Bit 3--Clock Select (CKS): Selects the A/D conversion time. Clear the ADST bit to 0 before switching the conversion time. Bit 3 CKS 0 1 Description Conversion time = 134 states (maximum) Conversion time = 70 states (maximum) (Initial value) Bits 2 to 0--Channel Select 2 to 0 (CH2 to CH0): These bits and the SCAN bit select the analog input channels. Clear the ADST bit to 0 before changing the channel selection. Group Selection CH2 0 CH1 0 Channel Selection CH0 0 1 1 0 1 1 0 0 1 1 0 1 Single Mode AN 0 (Initial value) AN 1 AN 2 AN 3 AN 4 AN 5 AN 6 AN 7 Description Scan Mode AN 0 AN 0, AN 1 AN 0 to AN2 AN 0 to AN3 AN 4 AN 4, AN 5 AN 4 to AN6 AN 4 to AN7 14.2.3 Bit A/D Control Register (ADCR) 7 TRGE 0 R/W 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- Reserved bits Trigger enable Enables or disables starting of A/D conversion by an external trigger or 8-bit timer compare match 2 -- 1 -- 1 -- 1 -- 0 -- 0 R/W Initial value Read/Write ADCR is an 8-bit readable/writable register that enables or disables starting of A/D conversion by external trigger input or an 8-bit timer compare match signal. ADCR is initialized to H'7F by a reset and in standby mode. 453 Bit 7--Trigger Enable (TRGE): Enables or disables starting of A/D conversion by an external trigger or 8-bit timer compare match. Bit 7 TRGE 0 1 Description Starting of A/D conversion by an external trigger or 8-bit timer compare match is disabled A/D conversion is started at the falling edge of the external trigger signal (ADTRG) or by an 8-bit timer compare match (Initial value) External trigger pin and 8-bit timer selection is performed by the 8-bit timer. For details, see section 9, 8-Bit Timers. Bits 6 to 1--Reserved: These bits cannot be modified and are always read as 1. Bit 0--Reserved: This bit can be read or written, but must not be set to 1. 14.3 CPU Interface ADDRA to ADDRD are 16-bit registers, but they are connected to the CPU by an 8-bit data bus. Therefore, although the upper byte can be be accessed directly by the CPU, the lower byte is read through an 8-bit temporary register (TEMP). An A/D data register is read as follows. When the upper byte is read, the upper-byte value is transferred directly to the CPU and the lower-byte value is transferred into TEMP. Next, when the lower byte is read, the TEMP contents are transferred to the CPU. When reading an A/D data register, always read the upper byte before the lower byte. It is possible to read only the upper byte, but if only the lower byte is read, incorrect data may be obtained. Figure 14.2 shows the data flow for access to an A/D data register. 454 Upper-byte read CPU (H'AA) Module data bus Bus interface TEMP (H'40) ADDRnH (H'AA) ADDRnL (H'40) (n = A to D) Lower-byte read CPU (H'40) Module data bus Bus interface TEMP (H'40) ADDRnH (H'AA) ADDRnL (H'40) (n = A to D) Figure 14.2 A/D Data Register Access Operation (Reading H'AA40) 455 14.4 Operation The A/D converter operates by successive approximations with 10-bit resolution. It has two operating modes: single mode and scan mode. 14.4.1 Single Mode (SCAN = 0) Single mode should be selected when only one A/D conversion on one channel is required. A/D conversion starts when the ADST bit is set to 1 by software, or by external trigger input. The ADST bit remains set to 1 during A/D conversion and is automatically cleared to 0 when conversion ends. When conversion ends the ADF flag is set to 1. If the ADIE bit is also set to 1, an ADI interrupt is requested at this time. To clear the ADF flag to 0, first read ADCSR, then write 0 in ADF. When the mode or analog input channel must be switched during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1 to start A/D conversion again. The ADST bit can be set at the same time as the mode or channel is changed. Typical operations when channel 1 (AN1) is selected in single mode are described next. Figure 14.3 shows a timing diagram for this example. 1. Single mode is selected (SCAN = 0), input channel AN1 is selected (CH2 = CH1 = 0, CH0 = 1), the A/D interrupt is enabled (ADIE = 1), and A/D conversion is started (ADST = 1). 2. When A/D conversion is completed, the result is transferred into ADDRB. At the same time the ADF flag is set to 1, the ADST bit is cleared to 0, and the A/D converter becomes idle. 3. Since ADF = 1 and ADIE = 1, an ADI interrupt is requested. 4. The A/D interrupt handling routine starts. 5. The routine reads ADCSR, then writes 0 in the ADF flag. 6. The routine reads and processes the conversion result (ADDRB). 7. Execution of the A/D interrupt handling routine ends. After that, if the ADST bit is set to 1, A/D conversion starts again and steps 2 to 7 are repeated. 456 * Set ADIE A/D conversion starts * Clear * Set * Set ADST * Clear ADF Idle State of channel 0 (AN 0) Idle A/D conversion (1) State of channel 1 (AN 1) Idle Idle A/D conversion (2) Idle State of channel 2 (AN 2) Idle State of channel 3 (AN 3) ADDRA * Read conversion result A/D conversion result (1) * Read conversion result A/D conversion result (2) ADDRB ADDRC ADDRD Figure 14.3 Example of A/D Converter Operation (Single Mode, Channel 1 Selected) Note: * Vertical arrows ( ) indicate instructions executed by software. 457 14.4.2 Scan Mode (SCAN = 1) Scan mode is useful for monitoring analog inputs in a group of one or more channels. When the ADST bit is set to 1 by software or external trigger input, A/D conversion starts on the first channel in the group (AN0 when CH2 = 0, AN4 when CH2 = 1). When two or more channels are selected, after conversion of the first channel ends, conversion of the second channel (AN1 or AN5) starts immediately. A/D conversion continues cyclically on the selected channels until the ADST bit is cleared to 0. The conversion results are transferred for storage into the A/D data registers corresponding to the channels. When the mode or analog input channel selection must be changed during analog conversion, to prevent incorrect operation, first clear the ADST bit to 0 in ADCSR to halt A/D conversion. After making the necessary changes, set the ADST bit to 1. A/D conversion will start again from the first channel in the group. The ADST bit can be set at the same time as the mode or channel selection is changed. Typical operations when three channels in group 0 (AN0 to AN2) are selected in scan mode are described next. Figure 14.4 shows a timing diagram for this example. 1. Scan mode is selected (SCAN = 1), scan group 0 is selected (CH2 = 0), analog input channels AN0 to AN2 are selected (CH1 = 1, CH0 = 0), and A/D conversion is started (ADST = 1). 2. When A/D conversion of the first channel (AN0) is completed, the result is transferred into ADDRA. Next, conversion of the second channel (AN 1) starts automatically. 3. Conversion proceeds in the same way through the third channel (AN2). 4. When conversion of all selected channels (AN0 to AN2) is completed, the ADF flag is set to 1 and conversion of the first channel (AN0) starts again. If the ADIE bit is set to 1, an ADI interrupt is requested when A/D conversion ends. 5. Steps 2 to 4 are repeated as long as the ADST bit remains set to 1. When the ADST bit is cleared to 0, A/D conversion stops. After that, if the ADST bit is set to 1, A/D conversion starts again from the first channel (AN0). 458 Continuous A/D conversion *1 Set *1 Clear *1 ADST Clear ADF A/D conversion time Idle Idle A/D conversion (1) State of channel 0 (AN 0) A/D conversion (4) Idle A/D conversion (2) Idle Idle State of channel 1 (AN 1) Idle A/D conversion (3) A/D conversion (5)*2 Idle State of channel 2 (AN 2) Idle Transfer Idle State of channel 3 (AN 3) ADDRA A/D conversion result (1) A/D conversion result (4) ADDRB A/D conversion result (2) ADDRC A/D conversion result (3) Figure 14.4 Example of A/D Converter Operation (Scan Mode, Channels AN0 to AN2 Selected) ADDRD Notes: *1 Vertical arrows ( ) indicate instructions executed by software. *2 Data currently being converted is ignored. 459 14.4.3 Input Sampling and A/D Conversion Time The A/D converter has a built-in sample-and-hold circuit. The A/D converter samples the analog input at a time tD after the ADST bit is set to 1, then starts conversion. Figure 14.5 shows the A/D conversion timing. Table 14.4 indicates the A/D conversion time. As indicated in figure 14.5, the A/D conversion time includes tD and the input sampling time. The length of tD varies depending on the timing of the write access to ADCSR. The total conversion time therefore varies within the ranges indicated in table 14.4. In scan mode, the values given in table 14.4 apply to the first conversion. In the second and subsequent conversions the conversion time is fixed at 128 states when CKS = 0 or 66 states when CKS = 1. (1) Address bus (2) Write signal Input sampling timing ADF tD t SPL t CONV Legend: (1) : ADCSR write cycle (2) : ADCSR address tD : Synchronization delay t SPL : Input sampling time t CONV : A/D conversion time Figure 14.5 A/D Conversion Timing 460 Table 14.4 A/D Conversion Time (Single Mode) CKS = 0 Symbol Synchronization delay Input sampling time A/D conversion time tD t SPL t CONV Min 6 -- 131 Typ -- 31 -- Max 9 -- 134 Min 4 -- 69 CKS = 1 Typ -- 15 -- Max 5 -- 70 Note: Values in the table are numbers of states. 14.4.4 External Trigger Input Timing A/D conversion can be externally triggered When the TRGE bit is set to 1 in ADCR and the 8-bit timer's ADTE bit is cleared to 0, external trigger input is enabled at the ADTRG pin. A high-tolow transition at the ADTRG pin sets the ADST bit to 1 in ADCSR, starting A/D conversion. Other operations, in both single and scan modes, are the same as if the ADST bit had been set to 1 by software. Figure 14.6 shows the timing. ADTRG Internal trigger signal ADST A/D conversion Figure 14.6 External Trigger Input Timing 461 14.5 Interrupts The A/D converter generates an interrupt (ADI) at the end of A/D conversion. The ADI interrupt request can be enabled or disabled by the ADIE bit in ADCSR. 14.6 Usage Notes When using the A/D converter, note the following points: 1. Analog Input Voltage Range During A/D conversion, the voltages input to the analog input pins ANn should be in the range AVSS ANn VREF. 2. Relationships of AVCC and AVSS to VCC and V SS AVCC, AVSS, VCC, and VSS should be related as follows: AVSS = VSS . AVCC and AVSS must not be left open, even if the A/D converter is not used. 3. VREF Programming Range The reference voltage input at the VREF pin should be in the range VREF AVCC. 4. Note on Board Design In board layout, separate the digital circuits from the analog circuits as much as possible. Particularly avoid layouts in which the signal lines of digital circuits cross or closely approach the signal lines of analog circuits. Induction and other effects may cause the analog circuits to operate incorrectly, or may adversely affect the accuracy of A/D conversion. The analog input signals (AN0 to AN7), analog reference voltage (VREF), and analog supply voltage (AVCC) must be separated from digital circuits by the analog ground (AVSS ). The analog ground (AVSS ) should be connected to a stable digital ground (VSS) at one point on the board. 5. Note on Noise To prevent damage from surges and other abnormal voltages at the analog input pins (AN0 to AN7) and analog reference voltage pin (VREF), connect a protection circuit like the one in figure 14.7 between AVCC and AVSS . The bypass capacitors connected to AV CC and V REF and the filter capacitors connected to AN0 to AN7 must be connected to AVSS. If filter capacitors like the ones in figure 14.7 are connected, the voltage values input to the analog input pins (AN0 to AN7) will be smoothed, which may give rise to error. Error can also occur if A/D conversion is frequently performed in scan mode so that the current that charges and discharges the capacitor in the sample-and-hold circuit of the A/D converter becomes greater than that input to the analog input pins via input impedance (Rin). The circuit constants should therefore be selected carefully. 462 AV CC VREF Rin*2 *1 *1 100 AN0 to AN7 0.1 F AV SS Notes: *1 10 F 0.01 F *2 Rin: input impedance Figure 14.7 Example of Analog Input Protection Circuit Table 14.5 Analog Input Pin Ratings Item Analog input capacitance Allowable signal-source impedance Min -- -- Max 20 10* Unit pF k Note: * When conversion time = 134 states, VCC = 4.0 V to 5.5 V, and 13 MHz. For details, see section 22. Electrical Characteristics. 10 k AN0 to AN 7 To A/D converter 20 pF Figure 14.8 Analog Input Pin Equivalent Circuit Note: Numeric values are approximate, except in table 14.5. 463 6. A/D Conversion Accuracy Definitions A/D conversion accuracy in the H8/3062 Series is defined as follows: * Resolution Digital output code length of A/D converter * Offset error Deviation from ideal A/D conversion characteristic of analog input voltage required to raise digital output from minimum voltage value 0000000000 to 0000000001 (figure 14.10) * Full-scale error Deviation from ideal A/D conversion characteristic of analog input voltage required to raise digital output from 1111111110 to 1111111111 (figure 14.10) * Quantization error Intrinsic error of the A/D converter; 1/2 LSB (figure 14.9) * Nonlinearity error Deviation from ideal A/D conversion characteristic in range from zero volts to full scale, exclusive of offset error, full-scale error, and quantization error. * Absolute accuracy Deviation of digital value from analog input value, including offset error, full-scale error, quantization error, and nonlinearity error. Digital output 111 110 101 100 011 010 001 000 Ideal A/D conversion characteristic Quantization error 1/8 2/8 3/8 4/8 5/8 6/8 7/8 FS Analog input voltage Figure 14.9 A/D Converter Accuracy Definitions (1) 464 Digital output Full-scale error Ideal A/D conversion characteristic Nonlinearity error Actual A/D conversion characteristic FS Offset error Analog input voltage Figure 14.10 A/D Converter Accuracy Definitions (2) 7. Allowable Signal-Source Impedance The analog inputs of the H8/3062 Series are designed to assure accurate conversion of input signals with a signal-source impedance not exceeding 10 k. The reason for this rating is that it enables the input capacitor in the sample-and-hold circuit in the A/D converter to charge within the sampling time. If the sensor output impedance exceeds 10 k, charging may be inadequate and the accuracy of A/D conversion cannot be guaranteed. If a large external capacitor is provided in single mode, then the internal 10-k input resistance becomes the only significant load on the input. In this case the impedance of the signal source is not a problem. A large external capacitor, however, acts as a low-pass filter. This may make it impossible to track analog signals with high dv/dt (e.g. a variation of 5 mV/s) (figure 14.11). To convert high-speed analog signals or to use scan mode, insert a low-impedance buffer. 8. Effect on Absolute Accuracy Attaching an external capacitor creates a coupling with ground, so if there is noise on the ground line, it may degrade absolute accuracy. The capacitor must be connected to an electrically stable ground, such as AVSS. If a filter circuit is used, be careful of interference with digital signals on the same board, and make sure the circuit does not act as an antenna. 465 H8/3062 Series Sensor output impedance Sensor input Up to 10 k Cin = 15 pF Equivalent circuit of A/D converter 10 k Low-pass filter C up to 0.1 F 20 pF Figure 14.11 Analog Input Circuit (Example) 466 Section 15 D/A Converter 15.1 Overview The H8/3062 Series includes a D/A converter with two channels. 15.1.1 Features D/A converter features are listed below. * * * * * Eight-bit resolution Two output channels Conversion time: maximum 10 s (with 20-pF capacitive load) Output voltage: 0 V to VREF D/A outputs can be sustained in software standby mode 467 15.1.2 Block Diagram Figure 15.1 shows a block diagram of the D/A converter. Module data bus VREF DASTCR AVCC DADR0 DADR1 DA 0 DA 1 AVSS 8-bit D/A DACR Control circuit Legend: DACR DADR0 DADR1 DASTCR : : : : D/A control register D/A data register 0 D/A data register 1 D/A standby control register Figure 15.1 D/A Converter Block Diagram 468 Bus interface Internal data bus 15.1.3 Pin Configuration Table 15.1 summarizes the D/A converter's input and output pins. Table 15.1 D/A Converter Pins Pin Name Analog power supply pin Analog ground pin Analog output pin 0 Analog output pin 1 Reference voltage input pin Abbreviation I/O AVSS AVSS DA 0 DA 1 VREF Input Input Output Output Input Function Analog power supply and reference voltage Analog ground and reference voltage Analog output, channel 0 Analog output, channel 1 Analog reference voltage 15.1.4 Register Configuration Table 15.2 summarizes the D/A converter's registers. Table 15.2 D/A Converter Registers Address* H'FFF9C H'FFF9D H'FFF9E H'EE01A Name D/A data register 0 D/A data register 1 D/A control register D/A standby control register Abbreviation DADR0 DADR1 DACR DASTCR R/W R/W R/W R/W R/W Initial Value H'00 H'00 H'1F H'FE Note: * Lower 20 bits of the address in advanced mode 469 15.2 15.2.1 Bit Register Descriptions D/A Data Registers 0 and 1 (DADR0, DADR1) 7 0 R/W 6 0 R/W 5 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 0 R/W 0 0 R/W Initial value Read/Write The D/A data registers (DADR0 and DADR1) are 8-bit readable/writable registers that store the data to be converted. When analog output is enabled, the D/A data register values are constantly converted and output at the analog output pins. The D/A data registers are initialized to H'00 by a reset and in standby mode. When the DASTE bit is set to 1 in the D/A standby control register (DASTCR), the D/A registers are not initialized in software standby mode. 15.2.2 Bit Initial value Read/Write D/A Control Register (DACR) 7 DAOE1 0 R/W 6 DAOE0 0 R/W 5 DAE 0 R/W 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- D/A enable Controls D/A conversion D/A output enable 0 Controls D/A conversion and analog output D/A output enable 1 Controls D/A conversion and analog output DACR is an 8-bit readable/writable register that controls the operation of the D/A converter. DACR is initialized to H'1F by a reset and in standby mode. When the DASTE bit is set to 1 in the D/A standby control register (DASTCR), the D/A registers are not initialized in software standby mode. 470 Bit 7--D/A Output Enable 1 (DAOE1): Controls D/A conversion and analog output. Bit 7 DAOE1 0 1 Description DA 1 analog output is disabled Channel-1 D/A conversion and DA 1 analog output are enabled Bit 6--D/A Output Enable 0 (DAOE0): Controls D/A conversion and analog output. Bit 6 DAOE0 0 1 Description DA 0 analog output is disabled Channel-0 D/A conversion and DA 0 analog output are enabled Bit 5--D/A Enable (DAE): Controls D/A conversion, together with bits DAOE0 and DAOE1. When the DAE bit is cleared to 0, analog conversion is controlled independently in channels 0 and 1. When the DAE bit is set to 1, analog conversion is controlled together in channels 0 and 1. Output of the conversion results is always controlled independently by DAOE0 and DAOE1. Bit 7 Bit 6 Bit 5 DAOE1 DAOE0 DAE 0 0 0 1 -- 0 Description D/A conversion is disabled in channels 0 and 1 D/A conversion is enabled in channel 0 D/A conversion is disabled in channel 1 0 1 1 0 1 0 D/A conversion is enabled in channels 0 and 1 D/A conversion is disabled in channel 0 D/A conversion is enabled in channel 1 1 1 0 1 1 -- D/A conversion is enabled in channels 0 and 1 D/A conversion is enabled in channels 0 and 1 When the DAE bit is set to 1, even if bits DAOE0 and DAOE1 in DACR and the ADST bit in ADCSR are cleared to 0, the same current is drawn from the analog power supply as during A/D and D/A conversion. Bits 4 to 0--Reserved: These bits cannot be modified and are always read as 1. 471 15.2.3 D/A Standby Control Register (DASTCR) DASTCR is an 8-bit readable/writable register that enables or disables D/A output in software standby mode. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- Reserved bits D/A standby enable Enables or disables D/A output in software standby mode 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 DASTE 0 R/W DASTCR is initialized to H'FE by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 1--Reserved: These bits cannot be modified and are always read as 1. Bit 0--D/A Standby Enable (DASTE): Enables or disables D/A output in software standby mode. Bit 0 DASTE 0 1 Description D/A output is disabled in software standby mode D/A output is enabled in software standby mode (Initial value) 15.3 Operation The D/A converter has two built-in D/A conversion circuits that can perform conversion independently. D/A conversion is performed constantly while enabled in DACR. If the DADR0 or DADR1 value is modified, conversion of the new data begins immediately. The conversion results are output when bits DAOE0 and DAOE1 are set to 1. 472 An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 15.2. 1. Data to be converted is written in DADR0. 2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA0 becomes an output pin. The converted result is output after the conversion time. The output value is DADR contents x VREF 256 Output of this conversion result continues until the value in DADR0 is modified or the DAOE0 bit is cleared to 0. 3. If the DADR0 value is modified, conversion starts immediately, and the result is output after the conversion time. 4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin. DADR0 write cycle DACR write cycle DADR0 write cycle DACR write cycle Address DADR0 DAOE0 DA 0 Conversion data 1 Conversion data 2 High-impedance state t DCONV Legend: t DCONV : D/A conversion time Conversion result 1 t DCONV Conversion result 2 Figure 15.2 Example of D/A Converter Operation 473 15.4 D/A Output Control In the H8/3062 Series, D/A converter output can be enabled or disabled in software standby mode. When the DASTE bit is set to 1 in DASTCR, D/A converter output is enabled in software standby mode. The D/A converter registers retain the values they held prior to the transition to software standby mode. When D/A output is enabled in software standby mode, the reference supply current is the same as during normal operation. 474 Section 16 RAM 16.1 Overview The H8/3062 Series has high-speed static RAM on-chip. The RAM is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, making the RAM useful for rapid data transfer. The on-chip RAM can be enabled or disabled with the RAM enable bit (RAME) in the system control register (SYSCR). When the on-chip RAM is disabled, that area is assigned to external space in the expanded modes. The on-chip RAM specifications for the product lineup are shown in table 16.1. Table 16.1 H8/3062 Series On-Chip RAM Specifications H8/3062 F-ZTAT H8/3062 F-ZTAT R-Mask Version H8/3062 F-ZTAT B-Mask Version H8/3062 Mask ROM Version, H8/3062 Mask ROM B-Mask Version H8/3061 Mask ROM Version, H8/3061 Mask ROM B-Mask Version H8/3060 Mask ROM Version, H8/3060 Mask ROM B-Mask Version 2 kbytes H'FF720 to H'FFF1F H'FFF720 to H'FFFF1F H'F720 to H'FF1F H8/3064 F-ZTAT B-Mask Version H8/3064 Mask ROM B-Mask Version RAM size Address Modes assign- 1, 2, 7 ment Modes 3, 4, 5 4 kbytes H'FEF20 to H'FFF1F 8 kbytes H'FDF20 to H'FFF1F H'FFDF20 to H'FFFF1F H'FD20 to H'FF1F H'FEF20 to H'FFF1F Mode 6 H'FEF20 to H'FFF1F 475 16.1.1 Block Diagram Figure 16.1 shows a block diagram of the on-chip RAM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) Bus interface SYSCR H'FEF20* H'FEF22* H'FEF21* H'FEF23* On-chip RAM H'FFF1E* Even addresses Legend: SYSCR: System control register H'FFF1F* Odd addresses Note: * This example is of the H8/3062 mask ROM version operating in mode 7. The lower 20 bits of the address are shown. Figure 16.1 RAM Block Diagram 16.1.2 Register Configuration The on-chip RAM is controlled by SYSCR. Table 16.2 gives the address and initial value of SYSCR. Table 16.2 System Control Register Address* H'EE012 Name System control register Abbreviation SYSCR R/W R/W Initial Value H'09 Note: * Lower 20 bits of the address in advanced mode 476 16.2 Bit System Control Register (SYSCR) 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 SSOE 0 R/W 0 RAME 1 R/W Initial value Read/Write RAM enable bit Enables or disables on-chip RAM Software standby output port enable NMI edge select User bit enable Standby timer select 2 to 0 Software standby One function of SYSCR is to enable or disable access to the on-chip RAM. The on-chip RAM is enabled or disabled by the RAME bit in SYSCR. For details about the other bits, see section 3.3, System Control Register (SYSCR). Bit 0--RAM Enable (RAME): Enables or disables the on-chip RAM. The RAME bit is initialized at the rising edge of the input at the RES pin. It is not initialized in software standby mode. Bit 0 RAME 0 1 Description On-chip RAM is disabled On-chip RAM is enabled (Initial value) 477 16.3 Operation When the RAME bit is set to 1, the on-chip RAM is enabled. Accesses to the addresses shown in table 16.1 are directed to the on-chip RAM. In modes 1 to 5 (expanded modes), when the RAME bit is cleared to 0, the off-chip address space is accessed. In mode 6, 7 (single-chip mode), when the RAME bit is cleared to 0, the on-chip RAM is not accessed: read access always results in H'FF data, and write access is ignored. Since the on-chip RAM is connected to the CPU by an internal 16-bit data bus, it can be written and read by word access. It can also be written and read by byte access. Byte data is accessed in two states using the upper 8 bits of the data bus. Word data starting at an even address is accessed in two states using all 16 bits of the data bus. 478 Section 17 ROM [H8/3062F-ZTAT, H8/3062F-ZTAT ROM Version, On-Chip Mask ROM Models] 17.1 Overview The H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version have 128 kbytes of on-chip flash memory. The H8/3062 (mask ROM version) has 128 kbytes of on-chip mask ROM, the H8/3061 (mask ROM version) has 96 kbytes, and the H8/3060 (mask ROM version) has 64 kbytes. The ROM is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, enabling rapid data transfer. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) as shown in table 17.1. The on-chip flash memory product (H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version) can be erased and programmed on-board, as well as with a special-purpose PROM programmer. Table 17.1 Operating Modes and ROM Mode Pins Mode Mode 1 (expanded 1-Mbyte mode with on-chip ROM disabled) Mode 2 (expanded 1-Mbyte mode with on-chip ROM disabled) Mode 3 (expanded 16-Mbyte mode with on-chip ROM disabled) Mode 4 (expanded 16-Mbyte mode with on-chip ROM disabled) Mode 5 (expanded 16-Mbyte mode with on-chip ROM enabled) Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) MD2 0 0 0 1 1 1 1 MD1 0 1 1 0 0 1 1 MD0 1 0 1 0 1 0 1 Enabled On-Chip ROM Disabled (external address area) 479 17.2 Overview of Flash Memory (H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version) Features 17.2.1 The features of the flash memory in the H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 32 bytes at a time. Erasing is performed in block units, with the blocks to be erased specified by setting the corresponding register bits. The flash memory is divided into three 32-kbyte blocks, one 28-kbyte block, and four 1-kbyte blocks. * Programming/erase times The flash memory programming time is 10 ms (typ) for simultaneous 32-byte programming, equivalent approximately to 300 s (typ) per byte, and the erase time is 100 ms (typ) per block. * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode * Automatic bit rate adjustment For data transfer in boot mode, the chip's bit rate can be automatically adjusted to match the transfer bit rate of the host (9600 or 4800 bps). * Protect modes There are three protect modes--hardware, software, and error--which allow protected status to be designated for flash memory program/erase/verify operations. * Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 480 17.2.2 Block Diagram Figure 17.1 shows a block diagram of the flash memory. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) FLMCR EBR RAMCR FLMSR H'00000 H'00002 H'00001 H'00003 Bus interface/controller Operating mode FWE pin*1 Mode pins On-chip Flash memory (128 kbytes) H'1FFFC H'1FFFD Legend: FLMCR EBR RAMCR FLMSR H'1FFFE H'1FFFF even address odd address : : : : Flash memory control register*2 Erase block register*2 RAM control register*2 Flash memory status register*2 Notes: *1 Functions as the FWE pin in the versions with on-chip flash memory, and as the RESO pin in the versions with on-chip mask ROM. *2 The registers that control the flash memory (FLMCR, EBR, RAMCR, and FLMSR) are used only in the versions with on-chip flash memory. They are not provided in the versions with on-chip mask ROM. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are disabled. Figure 17.1 Block Diagram of Flash Memory 481 17.2.3 Pin Configuration The flash memory is controlled by means of the pins shown in table 17.2. Table 17.2 Flash Memory Pins Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Transmit data Receive data Abbreviation RES FWE* MD2 MD1 MD0 TxD1 RxD1 I/O Input Input Input Input Input Output Input Function Reset Flash program/erase protection by hardware Sets operating mode of H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Sets operating mode of H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Sets operating mode of H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Serial transmit data output Serial receive data input Note: The transmit data pin and receive data pin are used in boot mode. * In the versions with on-chip mask ROM, the FWE pin functions as the RESO pin. 17.2.4 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 17.3. Table 17.3 Flash Memory Registers Register Name Flash memory control register Erase block register RAM control register Flash memory status register Abbreviation FLMCR EBR RAMCR FLMSR R/W R/W R/W R/W R Initial Value H'00* 2 H'00 H'F1 H'7F Address* 1 H'EE030 H'EE032 H'EE077 H'EE07D Notes: FLMCR, EBR, RAMCR, and FLMSR are 8-bit registers, and should be accessed by byte access. These registers are used only in the versions with on-chip flash memory. Reading the corresponding addresses in a version with on-chip mask ROM will always return 1s, and writes to these addresses are disabled. *1 Lower 20 bits of address in advanced mode *2 When a high level is input to the FWE pin, the initial value is H'80. 482 17.3 17.3.1 Flash Memory Register Descriptions Flash Memory Control Register (FLMCR) FLMCR is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode is entered by setting SWE to 1 when FWE = 1, then setting the corresponding bit. Program mode is entered by setting SWE to 1 when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode is entered by setting SWE to 1 when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. In mode 6 the FWE pin must be fixed low, as flash memory on-board programming is not supported. Therefore, bits in this register cannot be set to 1 in mode 6. When on-chip flash memory is disabled, a read will return H'00, and writes are invalid. When setting bits 6 to 0 in this register to 1, each bit should be set individually. Writes to bits ESU, PSU, EV, and PV in FLMCR are enabled only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1. Bit Modes 1 to 4, and 6 Modes 5 and 7 Initial value Read/Write Initial value Read/Write 7 FWE 0 R 1/0 R 6 SWE 0 R 0 R/W 5 ESU 0 R 0 R/W 4 PSU 0 R 0 R/W 3 EV 0 R 0 R/W 2 PV 0 R 0 R/W 1 E 0 R 0 R/W 0 P 0 R 0 R/W Program mode Selects program mode transition or clearing Erase mode Selects erase mode transition or clearing Program-verify mode Selects program-verify mode transition or clearing Erase-verify mode Selects erase-verify mode transition or clearing Program setup Prepares for a transition to program mode Erase setup Prepares for a transition to erase mode Software write enable Enables or disables programming/erasing Flash write enable Sets hardware protection against flash memory programming/erasing 483 Bit 7--Flash Write Enable (FWE): Sets hardware protection against flash memory programming/erasing. See section 17.9, Flash Memory Programming and Erasing Precautions, for more information on the use of this bit. Bit 7 FWE 0 1 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin Bit 6--Software Write Enable (SWE)*1 *2: Enables or disables flash memory programming and erasing. This bit should be set before setting FLMCR bits 5 to 0 and EBR bits 7 to 0 (Do not set the ESU, PSU, EV, PV, E, or P bit at the same time). Bit 6 SWE 0 1 Description Programming/erasing disabled Programming/erasing enabled [Setting condition] When FWE = 1 (Initial value) Bit 5--Erase Setup (ESU)*1: Prepares for a transition to erase mode (Do not set the SWE, PSU, EV, PV, E, or P bit at the same time). Bit 5 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 4--Program Setup (PSU) *1: Prepares for a transition to program mode (Do not set the SWE, ESU, EV, PV, E, or P bit at the same time). Bit 4 PSU 0 1 Description Program setup cleared Program setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value) 484 Bit 3--Erase-Verify Mode (EV)*1: Selects erase-verify mode transition or clearing (Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time). Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 2--Program-Verify Mode (PV) *1: Selects program-verify mode transition or clearing (Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time). Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 1--Erase Mode (E)*1 *3: Selects erase mode transition or clearing (Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time). Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 (Initial value) Bit 0--Program 1 (P)*1 *3: Selects program mode transition or clearing (Do not set the SWE, ESU, PSU, EV, PV, or E bit at the same time). Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 (Initial value) 485 Notes: *1 Do not set multiple bits simultaneously. Do not cut VCC when a bit is set. *2 The SWE bit must not be set or cleared at the same time as other bits (ESU, PSU, EV, PV, E, or P). *3 P bit and E bit setting should be carried out in accordance with the program/erase algorithm shown in section 17.5, Flash Memory Programming/Erasing. See section 17.9, Flash Memory Programming and Erasing Precautions, for more information on the use of these bits. 17.3.2 Erase Block Register (EBR) EBR is an 8-bit register that designates the flash memory block for erasure. EBR is initialized to H'00 by a reset, in hardware standby mode or software standby mode, when a high level is not input to the FWE pin, or when the SWE bit in FLMCR is 0 when a high level is applied to the FWE pin. When a bit is set in EBR, the corresponding block can be erased. Other blocks are eraseprotected. The blocks are erased block by block. Therefore, set only one bit in EBR; do not set bits in EBR to erase two or more blocks at the same time. Each bit in EBR cannot be set until the SWE bit in FLMCR is set. The flash memory block configuration is shown in table 17.4. To erase all the blocks, erase each block sequentially. The H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version do not support the on-board programming mode in mode 6, so bits in this register cannot be set to 1 in mode 6. Bit Modes 1 Initial value 7 EB7 0 R 0 R/W to 4, and 6 Read/Write Modes 5 and 7 Initial value Read/Write 6 EB6 0 R 0 R/W 5 EB5 0 R 0 R/W 4 EB4 0 R 0 R/W 3 EB3 0 R 0 R/W 2 EB2 0 R 0 R/W 1 EB1 0 R 0 R/W 0 EB0 0 R 0 R/W Bits 7 to 0--Block 7 to Block 0 (EB7 to EB0): Setting one of these bits specifies the corresponding block (EB7 to EB0) for erasure. Bits 7-0 EB7-EB0 0 1 Description Corresponding block (EB7 to EB0) not selected Corresponding block (EB7 to EB0) selected (Initial value) Note: When not performing an erase, clear all EBR bits to 0. 486 Table 17.4 Flash Memory Erase Blocks Block (Size) EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (32 kbytes) EB6 (32 kbytes) EB7 (32 kbytes) Address H'000000-H'0003FF H'000400-H'0007FF H'000800-H'000BFF H'000C00-H'000FFF H'001000-H'007FFF H'008000-H'00FFFF H'010000-H'017FFF H'018000-H'01FFFF 17.3.3 RAM Control Register (RAMCR) RAMCR selects the RAM area to be used when emulating real-time flash memory programming. Bit Modes 1 to 4 Modes 5 to 7 Initial value Read/Write Initial value Read/Write 7 -- 1 -- 1 -- 6 -- 1 -- 1 -- 5 -- 1 -- 1 -- 4 -- 1 -- 1 -- 3 RAMS 0 R 0 R/W* 2 RAM2 0 R 0 R/W* 1 RAM1 0 R 0 R/W* 0 -- 1 -- 1 -- Reserved bit RAM2, RAM1 Used together with bit 3 to select a flash memory area RAM select Used together with bits 2 and 1 to select a flash memory area Reserved bits Note: * Cannot be set to 1 in mode 6. Bits 7 to 4--Reserved: Read-only bits, always read as 1. Bit 3--RAM Select (RAMS): Used with bits 2 to 1 to reassign an area to RAM (see table 17.5). The initial setting for this bit is 0 in modes 5, 6, and 7 (internal flash memory enabled) and programming is enabled*. In modes other than 5 to 7, 0 is always read and writing is disabled. This bit is initialized by a reset and in hardware standby mode. It is not initialized in software standby mode. When bit 3 is set, all flash-memory blocks are protected from programming and erasing. 487 Bits 2 and 1--RAM2 and RAM1: These bits are used with bit 3 to reassign an area to RAM (see table 17.5). The initial setting for this bit is 0 in modes 5, 6, and 7 (internal flash memory enabled) and programming is enabled*. In modes other than 5 to 7, 0 is always read and writing is disabled. These bits are initialized by a reset and in hardware standby mode. They are not initialized in software standby mode. Bit 0--Reserved: This bit cannot be modified and is always read as 1. Note: * Flash memory emulation by RAM is not supported for mode 6 (single chip normal mode), so programming is possible, but do not set 1. When performing flash memory emulation by RAM, the RAME bit in SYSCR must be set to 1. Table 17.5 RAM Area Setting Bit 3 RAM Area H'FFF000-H'FFF3FF H'000000-H'0003FF H'000400-H'0007FF H'000800-H'000BFF H'000C00-H'000FFF RAMS 0 1 1 1 1 Bit 2 RAM2 0/1 0 0 1 1 Bit 1 RAM1 0/1 0 1 0 1 RAM Emulation Status No emulation Mapping RAM ROM area H'000000 EB0 ROM blocks EB0-EB3 (H'000000- H'000FFF) H'0003FF H'000400 EB1 H'0007FF H'000800 H'000BFF H'000C00 H'000FFF Mapping RAM EB2 EB3 ROM selection area RAM selection area RAM area H'FFEF20 H'FFEFFF H'FFF000 Actual RAM H'FFF3FF H'FFF400 H'FFFF1F RAM overlap area (H'FFF000- H'FFF3FF) Figure 17.2 Example of ROM Area/RAM Area Overlap 488 17.3.4 Flash Memory Status Register (FLMSR) FLMSR is used to detect flash memory errors. Bit Initial value Read/Write 7 FLER 0 R 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Reserved bits Flash memory error (FLER) Status flag indicating detection of an error during flash memory programming or erasing Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during flash memory programming or erasing. When FLER is set to 1, flash memory is placed in the error-protection state. Bit 7 FLER 0 Description Flash memory program/erase protection (error protection * 1) is disabled (Initial value) [Clearing condition] WDT reset, reset by RES pin, or hardware standby mode 1 An error has occurred during flash memory programming/erasing, and error protection * 1 has been enabled [Setting conditions] 1. When flash memory is read * 2 during programming/erasing (including a vector read or instruction fetch, but excluding a read in a RAM area overlapped onto flash memory space) 2. Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling)* 3 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the bus is released during programming/erasing Notes: *1 For details of error protection, see section 17.6.3, Error Protection. *2 An undefined value will be read in this case. *3 Before a stack or vector read is performed in exception handling. Bits 6 to 0--Reserved: Read-only bits, always read as 1. 489 17.4 On-Board Programming Mode When pins are set to on-board programming mode and a reset-start is executed, the chip enters the on-board programming state in which on-chip flash memory programming, erasing, and verifying can be carried out. There are two operating modes in this mode--boot mode and user program mode--set by the mode pins (MD2-MD0) and the FWE pin. The pin settings for entering each mode are shown in table 17.6. Boot mode and user program mode cannot be used in mode 6 (onchip ROM enabled) in the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version. For notes on FWE pin application and disconnection, see section 17.9, Flash Memory Programming and Erasing Precautions. Table 17.6 On-Board Programming Mode Settings Mode Boot mode Mode 5 Mode 7 User program mode Mode 5 Mode 7 FWE 1* 1 MD2 0* 0* 1 1 2 2 MD1 0 1 0 1 MD0 1 1 1 1 Notes 0: VIL 1: VIH Notes: *1 For the High level input timing, see items 6 and 7 of Notes on Using the Boot Mode. *2 In boot mode, the MD 2 setting should be the inverse of the input. In boot mode in the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version, the values in mode select bits 2 to 0 (MDS2 to MDS0) in the mode control register (MDCR) are the inverse of the levels at the mode pins (MD 2 to MD0). Note that this specification differs from that for H8/300H Series microcomputer H8/3039F-ZTAT. 490 On-Board Programming Modes * Boot mode 1. Initial state The flash memory is in the erased state when the device is shipped. The description here applies to the case where the old program version or data is being rewritten. The user should prepare the programming control program and new application program beforehand in the host. Host ;; ;; Programming control program 2. Programming control program transfer When boot mode is entered, the boot program in the H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version (originally incorporated in the chip) is started, an SCI communication check is carried out, and the boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host New application program New application program H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Boot program area Programming control program Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, entire flash memory erasure is performed, without regard to blocks. Host 4. Writing new application program The programming control program transferred from the host to RAM by SCI communication is executed, and the new application program in the host is written into the flash memory. Host New application program H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Boot program area Programming control program Boot program area Programming control program Flash memory prewrite-erase New application program Program execution state Figure 17.3 Boot Mode 491 * User program mode 1. Initial state (1) The program that will transfer the programming/ erase control program to on-chip RAM should be written into the flash memory by the user beforehand. (2) The programming/erase control program should be prepared in the host or in the flash memory. Host Programming/ erase control program New application program New application program 2. Programming/erase control program transfer When the FWE pin is driven high, user software confirms this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program Flash memory Transfer program RAM SCI H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program Flash memory Transfer program Programming/ erase control program SCI RAM Application program (old version) Application program (old version) 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. Host 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host ; New application program H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Transfer Program Transfer Program Programming/ erase control program Programming/ erase control program Flash memory erase New application program Program execution state Figure 17.4 User Program Mode (Example) 492 17.4.1 Boot Mode When boot mode is used, a flash memory programming control program must be prepared beforehand in the host, and SCI channel 1, which is to be used, must be set to asynchronous mode. When a reset-start is executed after setting the pins of the H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version to boot mode, the boot program already incorporated in the MCU is activated, the low period of the data sent from the host is first measured, and the bit rate register (BRR) value determined. It is then possible to receive a user program from off-chip using the on-chip serial communication interface (SCI) in the H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version, and the received user program is written into the on-chip RAM. Control then branches to the start address H'FFF400 of the on-chip RAM, the program written in RAM is executed, and flash memory programming/erasing can be carried out. Figure 17.5 shows a system configuration diagram when using boot mode, and figure 17.6 shows the boot program mode execution procedure. H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version Flash memory Host Reception of programming data Transmission of verify data RXD1 SCI1 TXD1 On-chip RAM Figure 17.5 System Configuration When Using Boot Mode 493 Start Set pins to boot mode and execute reset-start Host transmits data (H'00) continuously at prescribed bit rate MCU measures low period of H'00 data transmitted by host 1. Set the MCU to boot mode and execute reset-start. 2. Set the host to the prescribed bit rate (4800/9600) and have it transmit H'00 data continuously using a transfer data format of 8-bit data plus 1 stop bit. 3. The MCU repeatedly measures the low period at the RXD1 pin and calculates the asynchronous communication bit rate used by the host. 4. After SCI bit rate adjustment is completed, the MCU transmits one H'00 data byte to indicate the end of adjustment. 5. On receiving the one-byte data indicating completion of bit rate adjustment, the host should confirm normal reception of this indication and transmit one H'55 data byte. 6. After transmitting H'55, the host receives H'AA and transmits the number of user program bytes to be transferred. The number of bytes should be sent as two bytes, upper byte followed by lower byte. The host should then transmit sequentially the program set by the user. The MCU transmits the received byte count and user program sequentially to the host, one byte at a time, as verify data (echo-back). 7. The MCU sequentially writes the received user program to on-chip RAM area H'FFF400-H'FFFF1F. 8. Before executing the transferred user program, the MCU branches to the RAM boot program area (H'FFEF20-H'FFF3FF) and checks for the presence of data written in the flash memory. If data has been written in the flash memory, the MCU erases all blocks. 9. The MCU transmits H'AA, then branches to on-chip RAM area address H'FFF400 and executes the user program written in that area. Notes: *1 The size of the RAM area available to the user is 2.8 kbytes. The number of bytes to be transferred must not exceed 2.8 kbytes. The transfer byte count must be sent as two bytes, upper byte followed by lower byte. Example of transfer byte count: for 256 bytes (H'0100), upper byte = H'01, lower byte = H'00 *2 The part of the user program that controls the flash memory should be set in the program in accordance with the flash memory programming/erasing algorithm described later in this section. *3 If a memory cell does not operate normally and cannot be erased, the MCU will transmit one H'FF byte as an erase error and halt the erase operation and subsequent operations. 1 2 3 MCU calculates bit rate and sets value in bit rate register After bit rate adjustment, MCU transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, MCU transmits H'AA to host, and receives, as 2 bytes, number of program bytes (N) to be transferred to on-chip RAM*1 4 5 6 MCU transfers user program to RAM*2 MCU calculates remaining bytes to be transferred (N = N - 1) 7 Transfer end byte count N = 0? Yes MCU branches to RAM boot program area (H'FFEF20-H'FFF3FF), then checks flash memory user area data No 8 All data = H'FF? Yes No Delete all flash memory blocks*3 9 MCU transmits H'AA, then branches to RAM area address H'FFF400 and executes user program transferred to RAM Figure 17.6 Boot Mode Execution Procedure 494 Automatic SCI Bit Rate Adjustment: Start bit D0 D1 D2 D3 D4 D5 D6 D7 Stop bit Low period (9 bits) measured (H'00 data) High period (1 or more bits) Figure 17.7 Measurement of Low Period of Host's Transmit Data When boot mode is initiated, the MCU measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host (figure 17.7). The SCI transmit/receive format should be set as 8-bit data, 1 stop bit, no parity. The MCU calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the MCU. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and the MCU's system clock frequency, there will be a discrepancy between the bit rates of the host and the MCU. To ensure correct SCI operation, the host's transfer bit rate should be set to 4800 or 9600 bps*1. Table 17.7 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the MCU bit rate is possible. The boot program should be executed within this system clock range *2. Table 17.7 System Clock Frequencies for which Automatic Adjustment of MCU Bit Rate is Possible Host Bit Rate (bps) 9600 4800 System Clock Frequency for which Automatic Adjustment of MCU Bit Rate is Possible (MHz) 8 to 20 4 to 20 Notes: *1 Use a host bit rate setting of 4800, or 9600 bps only. No other setting should be used. *2 Although the MCU may also perform automatic bit rate adjustment with bit rate and system clock combinations other than those shown in table 17.7, a degree of error will arise between the bit rates of the host and the MCU, and subsequent transfer will not be performed normally. Therefore, only a combination of bit rate and system clock frequency within one of the ranges shown in table 17.7 can be used for boot mode execution. 495 On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the user program is transferred via the SCI, as shown in figure 17.8. The boot program area becomes available when a transition is made to the execution state for the user program transferred to RAM. H'FFEF20 Boot program area H'FFF3FF H'FFF400 User program transfer area H'FFFF1F Note: The boot program area cannot be used until a transition is made to the execution state for the user program transferred to RAM. Note also that the boot program remains in this area in RAM even after control branches to the user program. Figure 17.8 RAM Areas in Boot Mode Notes on Use of Boot Mode: 1. When the H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version MCU comes out of reset in boot mode, it measures the low period of the input at the SCI's RXD1 pin. 2. In boot mode, if any data has been programmed into the flash memory (if all data is not H'FF), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. 3. Interrupts cannot be used while the flash memory is being programmed or erased. 4. The RXD1 and TXD1 lines should be pulled up on the board. 5. Before branching to the user program the MCU terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits to 0 in the serial control register (SCR)), but the adjusted bit rate value remains set in the bit rate register (BRR). The transmit data output pin, TXD 1, goes to the high-level output state (P9 1DDR = 1 in P9DDR, P91DR = 1 in P9DR). The contents of the CPU's internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the user program. In particular, 496 since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the user program. The initial values of other on-chip registers are not changed. 6. Boot mode can be entered by setting pins MD0 to MD2 and FWE in accordance with the mode setting conditions shown in table 17.6, and then executing a reset-start. On reset release (a low-to-high transition)*1, the MCU latches the current mode pin states internally and maintains the boot mode state. Boot mode can be cleared by driving the FWE pin low, then executing reset release*1, but the following points must be noted. a. When switching from boot mode to normal mode, the boot mode state within the chip must first be cleared by reset input via the RES pin. The RES pin must be held low for at least 20 system clock cycles*3. b. Do not change the input levels at the mode pins (MD2 to MD0) or the FWE pin while in boot mode. When making a mode transition, first enter the reset state by inputting a low level to the RES pin. If a watchdog timer reset occurs in the boot mode state, the MCU's internal state will not be cleared, and the on-chip boot program will be restarted regardless of the mode pin settings. c. The FWE pin must not be driven low while the boot program is running or flash memory is being programmed or erased*2. 7. If the mode pin and FWE pin input levels are changed from 0 V to VCC or from VCC to 0 V during a reset (while a low level is being input to the RES pin), the microcomputer's operating mode will change. As a result, the state of ports with multiplexed address functions and bus control output pins (CSn, AS, RD, HWR, LWR) will also change. Therefore, care must be taken to make pin settings to prevent these pins from being used directly as output signal pins during a reset, or to prevent collision with signals outside the MCU. H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version CSn External memory, etc. MD2 MD1 MD0 FWE RES System control unit 497 Notes: *1 Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. *2 For further information on FWE application and disconnection, see section 17.9, Flash Memory Programming and Erasing Precautions. *3 See section 4.2.2, Reset Sequence, and section 17.9, Flash Memory Programming and Erasing Precautions. The reset period during operation is a minimum of 10 system clock cycles for the H8/3062, H8/3061, and H8/3060 (versions with on-chip mask ROM), but a minimum of 20 system clock cycles for the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version. 17.4.2 User Program Mode When the H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version is set to user program mode, its flash memory can be programmed and erased by executing a user program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip ROM (mode 5 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 5 and 7. Flash memory programming and erasing should not be carried out in mode 6. When mode 6 is set, the FWE pin must be driven low. The flash memory itself cannot be read while being programmed or erased, so the control program that performs programming should be placed in external memory or transferred to RAM and executed there. Figure 17.9 shows the execution procedure when user program mode is entered during program execution in RAM. It is also possible to start from user program mode in a reset-start. 498 1 MD2 to MD0 = 101, 111 Procedure: A program that executes operations 3 to 8 below must be written into flash memory by the user beforehand. 1. Set the mode pins to an on-chip ROM enabled mode (mode 5 or 7). 2 Reset-start 3 Transfer on-board programming program to RAM 2. Start the CPU with a reset. (The CPU can also be started from user program mode by applying a high level to the FWE pin during the reset, i.e. while the RES pin is low*.) 3. Transfer the on-board programming program to RAM. 4. Branch to the program in RAM. 4 Branch to program in RAM 5 FWE = high (user program mode) 5. Apply a high level to the FWE pin*. (Transition to user program mode) 6. Check that the FWE pin is high, then execute the on-board programming program in RAM. As a result, rewriting of the user application program in flash memory is performed. 7. After rewriting, clear the SWE bit. Drive the FWE pin from high to low, and clear user program mode*. 8. On completion of programming, branch to the user application program in flash memory and run the program. 6 Execute on-board programming program in RAM (flash memory rewriting) 7 Clear SWE bit, then release FWE (user program mode clearing) 8 Execute user application program in flash memory Note: * For further information on FWE application and disconnection, see section 17.9, Flash Memory Programming and Erasing Precautions. Figure 17.9 User Program Mode Execution Procedure (Example) Notes: 1. Do not apply a constant high level to the FWE pin. To prevent inadvertent programming or erasing due to program runaway, etc., apply a high level to the FWE pin only when the flash memory is programmed or erased (including execution of flash memory emulation using RAM). Memory cells may not operate normally if overprogrammed or overerased due to program runaway, etc. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 2. Flash memory rewriting should not be carried out in mode 6. When mode 6 is set, the FWE pin must be driven low. 499 17.5 Flash Memory Programming/Erasing A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR. The state transitions made by the various FLMCR bit settings are shown in figure 17.10. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in onchip RAM or external memory. See section 17.9, Flash Memory Programming and Erasing Precautions, for points to note concerning programming and erasing, and section 22.2.6, Flash Memory Characteristics, for the wait times after setting or clearing FLMCR bits. Notes: 1. Operation is not guaranteed if setting/clearing of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR is executed by a program in flash memory. 2. When programming or erasing, set the FWE pin input level to the high level, and set FWE to 1 (programming/erasing will not be executed if FWE = 0). 500 *3 E=1 Erase setup state E=0 Normal mode ESU = 1 *1 ESU = 0 Erase-verify mode Erase mode FWE = 1 FWE = 0 *2 EV = 1 EV = 0 PSU = 1 PSU = 0 On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state *4 P=1 Program setup state P=0 Program mode PV = 1 PV = 0 Program-verify mode Notes: *1 : Normal mode : On-board programming mode *2 Do not make a state transition by setting or clearing multiple bits simultaneously. *3 After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. *4 After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state. Figure 17.10 FLMCR Bit Settings and State Transitions 17.5.1 Program Mode When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 17.11 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 32 bytes at a time. The wait times (x, y, z, , , , , ) after bits are set or cleared in the flash memory control register (FLMCR) and the maximum number of programming operations (N) are shown in table 22.20 in section 22.2.6, Flash Memory Characteristics. 501 Following the elapse of (x) s or more after the SWE bit is set to 1 in FLMCR, 32-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00, H'20, H'40, H'60, H'80, H'A0, H'C0, or H'E0. Thirty-two consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 32-byte data transfer must be performed even if writing fewer than 32 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (y + z + + ) s as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR. The operating mode is then switched to program mode by setting the P bit in FLMCR after the elapse of at least (y) s. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (z) s. The wait time after P bit setting must be changed according to the number of reprogramming loops. For details, see section 22.2.6, Flash Memory Characteristics. 17.5.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. Clear the P bit in FLMCR, then wait for at least ( ) s before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of ( ) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 17.11) and transferred to RAM. After verification of 32 bytes of data has been completed, exit program-verify mode, wait for at least () s, then determine whether 32-byte programming has finished. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum number of programming operations (N). Note: A 32-byte area to store program data and a 32-byte area to store reprogram data are required in RAM. 502 Start *1 Set SWE bit in FLMCR Wait (x) s Store 32-byte write data in write data area and reprogram data area Programming operation counter n 1 Consecutively write 32-byte data in reprogram data area in RAM to flash memory Enable WDT Set PSU bit in FLMCR Wait (y) s Set P bit in FLMCR Wait (z) s Clear P bit in FLMCR Wait () s Clear PSU bit in FLMCR Wait () s Disable WDT Set PV bit in FLMCR Wait () s Set verify start address Programming end flag 0 *6 *2 *6 Start of programming *6 *7 End of programming *6 *6 *6 Notes: *1 Programming should be performed in the erased state (Perform 32-byte programming on memory after all 32 bytes have been erased). *2 Data transfer is performed by byte transfer (word transfer is not possible), with the write start address at a 32-byte boundary. The lower 8 bits of the first address written to must be H'00, H'20, H'40, H'60, H'80, H'A0, H'C0, or H'E0. A 32-byte data transfer must be performed even if writing fewer than 32 bytes; in this case, H'FF data must be written to the extra addresses. *3 Verify data is read in 16-bit (word) units (Byte-unit reading is also possible). *4 Reprogram data is determined by the computation shown in the table below (comparison of data stored in the program data area with verify data). Programming of reprogram data 0 bits is executed in the next programming loop. Therefore, even bits for which programming has been completed will be programmed again if the result of the subsequent verify operation is NG. *5 An area for storing write data (32 bytes) and an area for storing reprogram data (32 bytes) must be provided in RAM. The contents of the latter are rewritten in accordance with the reprogramming data computation. *6 The values of x, y, z, , , , , , and N are shown in section 22.2.6, Flash Memory Characteristics. *7 The value of z depends on the number of reprogramming loops (n). Details are given in section 20.2.6, Flash Memory Characteristics. H'FF dummy write to verify address Wait () s Read verify data *6 Write Data 0 0 Verify Data 0 1 0 1 Reprogram Data 1 0 1 1 *3 Comments Programming completed Programming incomplete; reprogram -- Still in erased state; no action Programming OK? OK Reprogram data computation NG Programming end flag 1 (unfinished) 1 1 *4 *5 RAM Transfer computation result to reprogram data area Increment verify address Program data storage area (32 bytes) No 32-byte data verification completed? Yes Clear PV bit in FLMCR Wait () s *6 Reprogram Programming end flag = 0? Yes Yes Clear SWE bit in FLMCR End of programming Clear SWE bit in FLMCR Programming failure No nn+1 *6 n > N? No Reprogram data storage area (32 bytes) Figure 17.11 Program/Program-Verify Flowchart (32-byte Programming) 503 17.5.3 Erase Mode When erasing flash memory, the single-block erase flowchart shown in figure 17.12 should be followed. The wait times (x, y, z, , , , , ) after bits are set or cleared in the flash memory control register (FLMCR) and the maximum number of erase operations (N) are shown in table 22.20 in section 22.2.6, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register (EBR) at least (x) s after setting the SWE bit to 1 in FLMCR. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value greater than ( z ) ms + (y + + ) s as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR. The operating mode is then switched to erase mode by setting the E bit in FLMCR after the elapse of at least (y) s. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (z) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. 17.5.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR, then wait for at least ( ) s before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (y) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least () s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/eraseverify sequence is indicated by the maximum number of erase operations (N). 504 Start *1 *2 Set SWE bit in FLMCR Wait (x) s Erase counter n 1 Set EBR Enable WDT Set ESU bit in FLMCR Wait (y) s Set E bit in FLMCR Wait (z) ms Clear E bit in FLMCR Wait () s Clear ESU bit in FLMCR Wait () s Disable WDT Set EV bit in FLMCR Wait () s Set block start address to verify address H'FF dummy write to verify address Wait () s Read verify data Increment verify address *4 *5 *2 Start of erase *2 End of erase *2 *2 *2 *2 *3 No Verify data = all 1s? YES No Last address of block? Yes Clear EV bit in FLMCR Wait () s Re-erase nn+1 *2 Clear EV bit in FLMCR Wait () s *2 n>N? Yes No *2 Clear SWE bit in FLMCR End of erasing Notes: *1 *2 *3 *4 *5 Clear SWE bit in FLMCR Erase failure Preprogramming (setting erase block data to all 0s) is not necessary. The values of x, y, z, , , , , , and N are shown in section 22.2.6, Flash Memory Characteristics. Verify data is read in 16-bit (word) units (Byte-unit reading is also possible). Set only one bit in EBR two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. Figure 17.12 Erase/Erase-Verify Flowchart (Single-Block Erasing) 505 17.6 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware, software, and error protection. 17.6.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. Hardware protection is reset by settings in the flash memory control register (FLMCR) and the erase block register (EBR). In the case of error protection, the P bit and E bit can be set, but a transition is not made to program mode or erase mode (See table 17.8). Table 17.8 Hardware Protection Function Item Description Program Erase Verify* 1 FWE pin protection * Not Not When a low level is input to the FWE pin, Not 2 3 FLMCR and EBR are initialized, and the possible* possible* possible program/erase-protected state is entered * 4. Not In a reset (including a WDT overflow reset) and in standby mode, FLMCR and possible EBR are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on (The minimum oscillation stabilization time is 20ms). In the case of a reset during operation, hold the RES pin low for at least 20 system clock cycles* 5. Not Not possible* 3 possible Reset/standby protection * * 506 Function Item Error protection Description * When a microcomputer operation error (error generation (FLER=1)) was detected while flash memory was being programmed/erased, error protection is enabled. At this time, the FLMCR and EBR settings are held, but programming/erasing is aborted at the time the error was generated. Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware standby mode. Program Not possible Erase Verify* 1 Not Possible possible* 3 Notes: *1 *2 *3 *4 Two modes: program-verify and erase-verify The RAM area that overlapped flash memory is deleted. All blocks become unerasable and specification by block is impossible. For more information, see section 17.9, Flash Memory Programming and Erasing Precautions. *5 See sections 4.2.2, Reset Sequence and 17.9, Flash Memory Programming and Erasing Precautions. The H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version require a minimum reset time during operation of 20 system clocks. 507 17.6.2 Software Protection Software protection can be implemented by setting the RAMS bit in the RAM control register (RAMCR) and the erase block register (EBR). With software protection, setting the P or E bit in the flash memory control register (FLMCR) does not cause a transition to program mode or erase mode (See table 17.9). Table 17.9 Software Protection Functions Item Emulation protection * 2 Block specification protection Description Program Erase Not possible* 3 Not possible Verify* 1 Possible Possible * Setting the RAMS bit 1 in RAMCR places all Not blocks in the program/erase-protected state. possible* 2 * Erase protection can be set for individual blocks by settings in EBR * 4. However, protection against programming is disabled. * Setting EBR to H'00 places all blocks in the erase-protected state. Notes: *1 *2 *3 *4 Two modes: program-verify and erase-verify A RAM area overlapping flash memory can be programmed. All blocks are unerasable and block-by-block specification is not possible. When not erasing, set EBR to H'00. -- 17.6.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing*1, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in the flash memory status register (FLMSR)*2 and the error protection state is entered. FLMCR and EBR settings *3 are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit in FLMCR. However, PV and EV bit setting is enabled, and a transition can be made to verify mode. Error protection is released only by a RES pin reset, and a WDT reset, or in hardware standby mode. Figure 17.13 shows the flash memory state transition diagram. Notes: *1 This is the state in which the P bit or E bit is set to 1 in FLMCR. Note that NMI input is disabled in this state. For details see section 17.6.4, NMI Input Disabling Conditions. 508 *2 For details of FLER bit setting conditions, see section 17.3.4, Flash Memory Status Register (FLMSR). *3 FLMCR and EBR can be written to. However, registers will be initialized if a transition is made to software standby mode in the error protection state. Memory read verify mode RD VF PR ER FLER = 0 P = 1 or E=1 P = 0 and E=0 Reset release and hardware standby release and software standby release Reset or hardware standby or software standby Program mode Erase mode RD VF PR ER FLER = 0 Reset or hardware standby Reset or standby (hardware protection) RD VF PR ER INIT FLER = 0 Error occurrence Error occurrence (software standby) Reset or hardware standby Reset or hardware standby Error protection mode RD VF PR ER FLER= 1 Software standby mode Software standby mode release Error protection mode (software standby) RD VF PR ER INIT FLER = 1 RD VF PR ER : : : : Memory read possible Verify-read possible Programming possible Erasing possible RD VF PR ER INIT : : : : : Memory read not possible Verify-read not possible Programming not possible Erasing not possible Register (FLMCR, EBR) initialization state Figure 17.13 Flash Memory State Transitions (Modes 5 and 7 (On-Chip ROM Enabled), High Level Applied to FWE Pin) The error protection function is invalid for abnormal operations other than the FLER bit setting conditions. Also, if a certain time has elapsed before this protection state is entered, damage may already have been caused to the flash memory. Consequently, this function cannot provide complete protection against damage to flash memory. 509 To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied, and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog timer or other means. There may also be cases where the flash memory is in an erroneous programming or erroneous erasing state at the point of transition to this protection mode, or where programming or erasing is not properly carried out because of an abort. In cases such as these, a forced recovery (program rewrite) must be executed using boot mode. However, it may also happen that boot mode cannot be normally initiated because of overprogramming or overerasing. 17.6.4 NMI Input Disabling Conditions NMI input is disabled when flash memory is being programmed or erased and while the boot program is executing in boot mode (until a branch is made to the on-chip RAM area)*1, to give priority to the program or erase operation. There are three reasons for this: 1. NMI input during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the NMI exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If NMI input occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling NMI input, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All requests (exception handling and bus release), including NMI, must therefore be restricted inside and outside the MCU during FWE application. NMI input is also disabled in the error protection state and while the P or E bit remains set in FLMCR during flash memory emulation in RAM. Notes: *1 This is the interval until a branch is made to the boot program area in the on-chip RAM H'FFEF20 to H'FFF3FF (This branch takes place immediately after transfer of the user program is completed). Consequently, after the branch to the RAM area, NMI input is enabled except during programming and erasing. Interrupt requests must therefore be disabled inside and outside the MCU until the user program has completed initial programming (including the vector table and the NMI interrupt handling routine). *2 The vector may not be read correctly in this case for the following two reasons: * If flash memory is read while being programmed or erased, correct read data will not be obtained (undetermined values will be returned). * If the NMI entry in the vector table has not been programmed yet, NMI exception handling will not be executed correctly. 510 17.7 Flash Memory Emulation in RAM As flash memory programming and erasing takes time, it may be difficult to carry out tuning by writing parameters and other data in real time. In this case, real-time programming of flash memory can be emulated by overlapping part of RAM (H'FFF000-H'FFF3FF) onto a small block area in flash memory. This RAM area change is executed by means of bits 3 to 1 in the RAM control register (RAMCR). After the RAM area change, access is possible both from the area overlapped onto flash memory and from the original area (H'FFF000-H'FFF3FF). For details of RAMCR and the RAM area setting method, see section 17.3.3, RAM Control Register (RAMCR). Example of Emulation of Real-Time Flash Memory Programming: In the following example, RAM area H'FFF000-H'FFF3FF is overlapped onto flash memory area EB2 (H'000800- H'000BFF). Procedure: 1. Part of RAM (H'FFF000-H'FFF3FF) is overlapped onto the area (EB2) requiring real-time programming (RAMCR bits 3-1 are set to 1, 1, 0, and the flash memory area to be overlapped (EB2) is selected). Overlapping ram EB2 H'000800 area H'000BFF H'000FFF * (Mapping RAM area) 2. Real-time programming is performed using the overlapping RAM. H'000000 Flash memory space Block area H'FFEF20 3. The programmed data is checked, then RAM overlapping is cleared (RAMS bit is cleared). On-chip RAM area 4. The data written in RAM area H'FFF000-H'FFF3FF is written to flash memory space. H'FFEFFF H'FFF000 H'FFF3FF H'FFF400 H'FFFF1F (Actual RAM area) Note: * When part of RAM (H'FFF000-H'FFF3FF) is overlapped onto a flash memory small block area, the flash memory in the overlapped area cannot be accessed. It can be accessed when the overlapping is cleared. Figure 17.14 Example of RAM Overlap Operation 511 Notes on Use of Emulation in RAM: 1. Flash write enable (FWE) application and releasing As in on-board program mode, care is required when applying and releasing FWE to prevent erroneous programming or erasing. To prevent erroneous programming and erasing due to program runaway during FWE application, in particular, the watchdog timer should be set when the PSU, P, ESU, or E bit is set to 1 in FLMCR1, even while the emulation function is being used. For details, see section 17.9, Flash Memory Programming and Erasing Precautions. 2. NMI input disabling conditions When the emulation function is used, NMI input is disabled when the P bit or E bit is set to 1 in FLMCR, in the same way as with normal programming and erasing. The P and E bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high level is not being input to the FWE pin, or when the SWE bit in FLMCR is 0 while a high level is being input to the FWE pin. 512 17.8 Flash Memory PROM Mode The H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version have a PROM mode as well as the on-board programming modes for programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose PROM writer that supports the Hitachi microcomputer device type with 128-kbyte on-chip flash memory. 17.8.1 Socket Adapters and Memory Map In PROM mode using a PROM writer, memory reading (verification) and writing and flash memory initialization (total erasure) can be performed. For these operations, a special socket adapter is mounted in the PROM writer. The socket adapter product codes are given in table 17.10. In the H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version PROM mode, only the socket adapters shown in this table should be used. Table 17.10 H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Socket Adapter Product Codes Product Code HD64F3062F, HD64F3062RF HD64F3062TE, HD64F3062RTE HD64F3062FP, HD64F3062RFP HD64F3062F, HD64F3062RF HD64F3062TE, HD64F3062RTE HD64F3062FP, HD64F3062RFP Package 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) Socket Adapter Product Code ME3067ESHF1H ME3067ESNF1H ME3067ESFF1H HF306BQ100D3201 HF306XT100D3201 HF306AQ100D3201 DATA I/O JAPAN CO. Manufacturer MINATO ELECTRONICS INC. 513 Figure 17.15 shows the memory map in PROM mode. H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version MCU mode H'000000 PROM mode H'00000 On-chip ROM H'01FFFF H'1FFFF Figure 17.15 Memory Map in PROM Mode 17.8.2 Notes on Use of PROM Mode 1. A write to a 128-byte programming unit in PROM mode should be performed once only. Erasing must be carried out before reprogramming an address that has already been programmed. 2. When using a PROM writer to reprogram a device on which on-board programming/erasing has been performed, it is recommended that erasing be carried out before executing programming. 3. The memory is initially in the erased state when the device is shipped by Hitachi. For samples for which the erasure history is unknown, it is recommended that erasing be executed to check and correct the initialization (erase) level. 4. The H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version do not support a product identification mode as used with general-purpose EPROMs, and therefore the device name cannot be set automatically in the PROM writer. 5. Refer to the instruction manual provided with the socket adapter, or other relevant documentation, for information on PROM writers and associated program versions that are compatible with the PROM mode of the H8/3062F-ZTAT and H8/3062F-ZTAT R-mask version. 514 17.9 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. 1. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Hitachi microcomputer device type with 128-kbyte on-chip flash memory. Do not select the HN28F101 setting for the PROM programmer. An incorrect setting will result in application of a high level to the FWE pin, damaging the device. 2. Powering on and off (see figures 17.16 to 17.18) Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Failure to do so may result in overprogramming or overerasing due to MCU runaway, and loss of normal memory cell operation. 3. FWE application/disconnection (see figures 17.16 to 17.18) FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: * Apply FWE when the VCC voltage has stabilized within its rated voltage range. If FWE is applied when the MCU's VCC power supply is not within its rated voltage range, MCU operation will be unstable and flash memory may be erroneously programmed or erased. * Apply FWE when oscillation has stabilized (after the elapse of the oscillation settling time). When V CC power is turned on, hold the RES pin low for the duration of the oscillation settling time (tOSC1 = 20 ms) before applying FWE. Do not apply FWE when oscillation has stopped or is unstable. * In boot mode, apply and disconnect FWE during a reset. In a transition to boot mode, FWE = 1 input and MD2 to MD0 setting should be performed while the RES input is low. FWE and MD2 to MD0 pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. When making a 515 transition from boot mode to another mode, also, a mode programming setup time is necessary with respect to the reset release timing. In a reset during operation, the RES pin must be held low for a minimum of 20 system clock cycles. * In user program mode, FWE can be switched between high and low level regardless of RES input. FWE input can also be switched during execution of a program in flash memory. * Do not apply FWE if program runaway has occurred. During FWE application, the program execution state must be monitored using the watchdog timer or some other means. * Disconnect FWE only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR are cleared. Make sure that the SWE, ESU, PSU, EV, PV, E, and P bits are not set by mistake when applying or disconnecting FWE. 4. Do not apply a constant high level to the FWE pin To prevent erroneous programming or erasing due to program runaway, etc., apply a high level to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation using RAM). A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 5. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the PSU or ESU bit in FLMCR, the watchdog timer should be set beforehand as a precaution against program runaway, etc. 6. Do not set or clear the SWE bit during execution of a program in flash memory. Clear the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash memory should only be accessed for verify operations (verification during programming/erasing). Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. 516 7. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations (including emulation in RAM). Bus release must also be disabled. 8. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 32-byte programming unit block. In PROM mode, too, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. * Use byte access on the registers that control the flash memory (FLMCR, EBR, FLMSR, and RAMCR). Wait time: Programming/ x erasing possible tOSC1 VCC tMDS Min 0 s Min 0 s FWE MD2 to MD0*1 tMDS RES SWE set SWE bit Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See 22.2.6 Flash Memory Characteristics. SWE cleared Figure 17.16 Power-On/Off Timing (Boot Mode) 517 Wait time: x Programming/ erasing possible tOSC1 VCC Min 0 s FWE MD2 to MD0*1 tMDS RES SWE set SWE bit SWE cleared Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See 22.2.6 Flash Memory Characteristics. Figure 17.17 Power-On/Off Timing (User Program Mode) 518 ProgramWait ming/ time: erasing x possible tOSC1 VCC Min 0s FWE tMDS tMDS *2 ProgramWait ming/ Wait time: erasing time: x possible x Programming/ erasing possible ProgramWait ming/ time: erasing x possible MD2 to MD0 tMDS tRESW RES SWE set SWE bit Mode change*1 Boot mode SWE cleared Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (CSn, AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. *2 When making a transition from boot mode to another mode, the mode programming setup time tMDS must be satisfied with respect to RES clearance timing. *3 See 22.2.6 Flash Memory Characteristics. Figure 17.18 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) 519 17.10 Mask ROM (H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version) Overview 17.10.1 Block Diagram Figure 17.19 shows a block diagram of the ROM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) H'00000 H'00002 H'00001 H'00003 On-chip ROM H'1FFFE Even addresses H'1FFFF Odd addresses Figure 17.19 ROM Block Diagram (H8/3062 Mask ROM Version) 520 17.11 Notes on Ordering Mask ROM Version Chips When ordering H8/3062, H8/3061, and H8/3060 with mask ROM, note the following. 1. When ordering by means of an EPROM, use a 128-kbyte one. 2. Fill all unused addresses with H'FF as shown in figure 17.20 to make the ROM data size 128kbytes for the H8/3062, H8/3061, and H8/3060 mask ROM versions, which incorporate different sizes of ROM. This applies to ordering by means of an EPROM and by means of data transmission. HD6433062 (ROM: 128 kbytes) Addresses: H'00000-1FFFF H'00000 HD6433061 (ROM: 96 kbytes) Addresses: H'00000-17FFF H'00000 HD6433060 (ROM: 64 kbytes) Addresses: H'00000-0FFFF H'00000 H'0FFFF H'10000 H'17FFF H'18000 Not used* H'1FFFF Note: * Write H'FF in all addresses in these areas. H'1FFFF Not used* H'1FFFF Figure 17.20 Mask ROM Addresses and Data 3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2, EBR1, and EBR2) used by the versions with on-chip flash memory are not provided in the mask ROM versions. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are disabled. This must be borne in mind when switching from a flash memory version to a mask ROM version. 4. 5 V operation models of the H8/3064F-ZTAT B-mask version and H8/3062F-ZTAT B-mask version with on-chip flash memory have a V CL pin that requires the connection of an external capacitor. Care is therefore necessary regarding board design when switching to a mask ROM version. 521 17.12 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Versions Please note the following when converting the F-ZTAT application software to the mask-ROM versions. The values read from the internal registers for the flash ROM in the mask-ROM version and FZTAT version differ as follows. Status Register FLMCR1 Bit FWE Value 0 1 F-ZTAT Version Application software running Programming Mask-ROM Version -- (Is not read out) Application software running (This bit is always read as 1) Note: This difference applies to all the F-ZTAT versions and all the mask-ROM versions that have different ROM size. 522 Section 18 H8/3064 Internal Voltage Step-Down Version ROM [H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version] 18.1 Overview The H8/3064F-ZTAT B-mask version has 256 kbytes of on-chip flash memory. The H8/3064 mask ROM B-mask version has 256 kbytes of on-chip mask ROM. The flash memory is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, enabling rapid data transfer. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) as shown in table 18.1. The on-chip flash memory product (H8/3064F-ZTAT B-mask version) can be erased and programmed on-board, as well as with a special-purpose PROM programmer. Table 18.1 Operating Modes and ROM Mode Pins Mode Mode 1 (expanded 1-Mbyte mode with on-chip ROM disabled) Mode 2 (expanded 1-Mbyte mode with on-chip ROM disabled) Mode 3 (expanded 16-Mbyte mode with on-chip ROM disabled) Mode 4 (expanded 16-Mbyte mode with on-chip ROM disabled) Mode 5 (expanded 16-Mbyte mode with on-chip ROM enabled) Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) MD2 0 0 0 1 1 1 1 MD1 0 1 1 0 0 1 1 MD0 1 0 1 0 1 0 1 Enabled On-Chip ROM Disabled (external address area) 523 18.1.1 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Table 18.2 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Item Size Operating frequency Program/erase voltage H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version 128 kbytes 1 to 20 MHz Supplied from VCC H8/3064F-ZTAT B-Mask Version 256 kbytes 2 to 25 MHz Supplied from VCC 128-byte simultaneous programming 30 s x 6 + 200 s x 994 (with 10 s additional programming)*1 12 blocks 4 kbytes x 8, 32 kbytes x 1, 64 kbytes x 3 EBR1: H'EE032 4 EB4 3 EB3 2 EB2 1 EB1 0 EB0 7 EB7 6 EB6 5 EB5 4 EB4 3 EB3 2 EB2 1 EB1 0 EB0 Programming Programming 32-byte simultaneous programming unit Write pulse application method Erasing Block configuration EBR configuration 150 s x 4 + 500 s x 399 8 blocks 1 kbyte x 4, 28 kbytes x 1, 32 kbytes x 3 EBR: H'EE032 7 EB7 6 EB6 5 EB5 EBR2: H'EE033 7 -- 6 -- 5 -- 4 -- 3 2 1 EB9 0 EB8 EB11 EB10 RAM emulation RAM area Applicable blocks RAMCR configuration 1 kbyte (H'FF000 to H'FF3FF) EB0 to EB3 RAMCR: H'EE077 7 -- 6 -- 5 -- 4 -- 3 2 1 0 -- RAMS RAM2 RAM1 4 kbytes (H'FE000 to H'FEFFF) EB0 to EB7 RAMCR: H'EE077 7 -- 6 -- 5 -- 4 -- 3 2 1 0 RAMS RAM2 RAM1 RAM0 Flash error FLER bit FLMSR: H'EE07D 7 FLER 6 -- 5 -- 4 -- 3 -- 2 -- 1 -- 0 -- FLMCR2: H'EE031 7 FLER 6 -- 5 -- 4 -- 3 -- 2 -- 1 -- 0 -- Flash Wait after -- memory SWE clearing characteristics Boot mode Bit rate Boot area User area PROM mode 9,600 bps, 4,800 bps H'FFEF20 to H'FFF3FF H'FFF400 to H'FFFF1F Use of PROM writer supporting Hitachi microcomputer device type with 128 kbytes on-chip flash memory tcswe specification must be met*2 19,200 bps, 9,600 bps, 4,800 bps H'FFDF20 to H'FFE71F H'FFE720 to H'FFFF1F Use of PROM writer supporting Hitachi microcomputer device type with 256 kbytes on-chip flash memory Notes: *1 See section 18.6, Flash Memory Programming/Erasing, for details of the H8/3064FZTAT B-mask version program/erase algorithms. *2 See section 22.3.6, Flash Memory Characteristics, for details of the H8/3064F-ZTAT Bmask version flash memory characteristics. 524 18.2 Features The H8/3064F-ZTAT B-mask version has 256 kbytes of on-chip flash memory. The features of the flash memory are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed in block units. To erase the entire flash memory, each block must be erased in turn. In block erasing, 4-kbyte, 32kbyte, and 64-kbyte blocks can be set arbitrarily. * Programming/erase times The flash memory programming time is 10 ms (typ) for simultaneous 128-byte programming, equivalent approximately to 80 s (typ) per byte, and the erase time is 100 ms (typ) per block. * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board: Boot mode User program mode * Automatic bit rate adjustment For data transfer in boot mode, the H8/3064F-ZTAT B-mask version chip's bit rate can be automatically adjusted to match the transfer bit rate of the host. * Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. * Protect modes There are three protect modes--hardware, software, and error--which allow protected status to be designated for flash memory program/erase/verify operations. * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 525 18.2.1 Block Diagram Internal address bus Internal data bus (16 bits) Module bus FLMCR1 FLMCR2 EBR1 EBR2 RAMCR Bus interface/controller Operating mode FWE pin Mode pins Flash memory (256 kbytes) Legend: FLMCR1 FLMCR2 EBR1 EBR2 RAMCR : : : : : Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM control register Figure 18.1 Block Diagram of Flash Memory 526 18.2.2 Pin Configuration The flash memory is controlled by means of the pins shown in table 18.3. Table 18.3 Flash Memory Pins Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Transmit data Receive data Abbreviation RES FWE MD2 MD1 MD0 TxD1 RxD1 I/O Input Input Input Input Input Output Input Function Reset Flash program/erase protection by hardware Sets H8/3064F-ZTAT B-mask version operating mode Sets H8/3064F-ZTAT B-mask version operating mode Sets H8/3064F-ZTAT B-mask version operating mode Serial transmit data output Serial receive data input 18.2.3 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 18.4. Table 18.4 Flash Memory Registers Register Name Flash memory control register 1 Flash memory control register 2 Erase block register 1 Erase block register 2 RAM control register Abbreviation FLMCR1 FLMCR2 EBR1 EBR2 RAMCR R/W R/W R R/W R/W R/W Initial Value H'00* 2 H'00 H'00 H'00 H'F0 Address* 1 H'EE030 H'EE031 H'EE032 H'EE033 H'EE077 Notes: FLMCR1, FLMCR2, EBR1, EBR2, and RAMCR are 8-bit registers, and should be accessed by byte access. These registers are used only in the versions with on-chip flash memory, and are not provided in the versions with on-chip mask ROM. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are invalid. *1 Lower 20 bits of address in advanced mode *2 When a high level is input to the FWE pin, the initial value is H'80. 527 18.3 18.3.1 Bit Register Descriptions Flash Memory Control Register 1 (FLMCR1) 7 FWE 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W Initial value Read/Write --* R Note: * Determined by the state of the FWE pin. FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'00000 to H'3FFFF is entered by setting the SWE bit when FWE = 1, then setting the PV or EV bit. Program mode for addresses H'00000 to H'3FFFF is entered by setting the SWE bit when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for addresses H'00000 to H'3FFFF is entered by setting the SWE bit when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. In mode 6 the FWE pin must be fixed low since flash memory on-board programming modes are not supported. When the on-chip flash memory is disabled, a read access to this register will return H'00, and writes are invalid. When setting bits 6 to 0 in this register, one bit must be set one at a time. Writes to the SWE bit in FLMCR1 are enabled only when FWE = 1; writes to bits ESU, PSU, EV, and PV only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1. Notes: 1. The programming and erase flowcharts must be followed when setting the bits in this register to prevent erroneous programming or erasing. 2. Transitions are made to program mode, erase mode, program-verify mode, and eraseverify mode according to the settings in this register. When reading flash memory as normal on-chip ROM, bits 6 to 0 in this register must be cleared. Bit 7--Flash Write Enable (FWE): Sets hardware protection against flash memory programming/erasing. Bit 7 FWE 0 1 528 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin Bit 6--Software Write Enable (SWE): Enables or disables flash memory programming and erasing (This bit should be set when setting bits 5 to 0, EBR1 bits 7 to 0, and EBR2 bits 3 to 0). Bit 6 SWE 0 1 Description Programming/erasing disabled Programming/erasing enabled [Setting condition] When FWE = 1 Note: Do not execute a SLEEP instruction while the SWE bit is set to 1. (Initial value) Bit 5--Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in FLMCR1 (Do not set the SWE, PSU, EV, PV, E, or P bit at the same time). Bit 5 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 4--Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in FLMCR1 (Do not set the SWE, ESU, EV, PV, E, or P bit at the same time). Bit 4 PSU 0 1 Description Program setup cleared Program setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 3--Erase-Verify Mode (EV): Selects erase-verify mode transition or clearing (Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time). Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 529 (Initial value) Bit 2--Program-Verify Mode (PV): Selects program-verify mode transition or clearing (Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time). Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 1--Erase Mode (E): Selects erase mode transition or clearing (Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time). Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Note: Do not access the flash memory while the E bit is set. (Initial value) Bit 0--Program (P): Selects program mode transition or clearing (Do not set the SWE, ESU, PSU, EV, PV, or E bit at the same time). Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Note: Do not access the flash memory while the P bit is set. (Initial value) 530 18.3.2 Bit Flash Memory Control Register 2 (FLMCR2) 7 FLER 6 -- 0 R 5 -- 0 R 4 -- 0 R 3 -- 0 R 2 -- 0 R 1 -- 0 R 0 -- 0 R Initial value Read/Write 0 R FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When the on-chip flash memory is disabled, a read will return H'00. Note: FLMCR2 is a read-only register, and should not be written to. Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER 0 Description Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset (RES pin or WDT reset) or hardware standby mode 1 An error occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting conditions] * When flash memory is read during programming/erasing (including a vector read or instruction fetch, but excluding a read of the RAM area overlapping flash memory space) Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) When a SLEEP instruction (including software standby) is executed during programming/erasing When the bus is released during programming/erasing (Initial value) * * * Bits 6 to 0--Reserved: These bits are always read as 0. 531 18.3.3 Bit Erase Block Register 1 (EBR1) 7 EB7 6 EB6 0 R/W 5 EB5 0 R/W 4 EB4 0 R/W 3 EB3 0 R/W 2 EB2 0 R/W 1 EB1 0 R/W 0 EB0 0 R/W Initial value Read/Write 0 R/W EBR1 is an 8-bit register that specifies the flash memory erase area block by block. EBR1 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, when a low level is input to the FWE pin, and when a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set. When a bit in EBR1 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one bit can be set in EBR1 and EBR2 together; do not set two or more bits at the same time. When the on-chip flash memory is disabled, a read access to this register will return H'00, and erasing is disabled. The flash memory block configuration is shown in table 18.5. To erase the entire flash memory, each block must be erased in turn. As the H8/3064F-ZTAT B-mask version does not support on-board programming modes in mode 6, EBR1 register bits cannot be set to 1 in this mode. 18.3.4 Bit Erase Block Register 2 (EBR2) 7 -- 6 -- 0 R 5 -- 0 R 4 -- 0 R 3 EB11 0 R/W 2 EB10 0 R/W 1 EB9 0 R/W 0 EB8 0 R/W Initial value Read/Write 0 R EBR2 is an 8-bit register that specifies the flash memory erase area block by block. EBR2 is initialized to H'00 by a reset, in hardware standby mode and software standby mode, and when a low level is input to the FWE pin. When a high level is input to the FWE pin and the SWE bit in FLMCR1 is not set, it is initialized to bit 0. When a bit in EBR2 is set to 1, the corresponding block can be erased. Other blocks are erase-protected. Only one bit can be set in EBR1 and EBR2 together; do not set two or more bits at the same time. When the on-chip flash memory is disabled, a read will return H'00, and erasing is disabled. The flash memory block configuration is shown in table 18.5. To erase the entire flash memory, each block must be erased in turn. As the H8/3064F-ZTAT B-mask version does not support on-board programming modes in mode 6, EBR2 register bits cannot be set to 1 in this mode. 532 Note: Bits 7 to 4 in this register are read-only. These bits must not be set to 1. If bits 7 to 4 are set when an EBR1/EBR2 bit is set, EBR1/EBR2 will be initialized to H'00. Table 18.5 Flash Memory Erase Blocks Block (Size) EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) EB8 (32 kbytes) EB9 (64 kbytes) EB10 (64 kbytes) EB11 (64 kbytes) Addresses H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF H'008000 to H'00FFFF H'010000 to H'01FFFF H'020000 to H'02FFFF H'030000 to H'03FFFF 18.3.5 Bit RAM Control Register (RAMCR) 7 -- 6 -- 1 R 5 -- 1 R 4 -- 1 R 3 RAMS 0 R/W 2 RAM2 0 R/W 1 RAM1 0 R/W 0 RAM0 0 R/W Initial value Read/Write 1 R RAMCR specifies the area of flash memory to be overlapped with part of RAM when emulating realtime flash memory programming. RAMCR is initialized to H'00 by a reset and in hardware standby mode. RAMCR settings should be made in user mode or user program mode. Flash memory area divisions are shown in table 18.6. To ensure correct operation of the emulation function, the ROM for which RAM emulation is performed should not be accessed immediately after this register has been modified. Normal execution of an access immediately after register modification is not guaranteed. Bits 7 to 4--Reserved: These bits cannot be modified and are always read as 1. 533 Bit 3--RAM Select (RAMS): Specifies selection or non-selection of flash memory emulation in RAM. When RAMS = 1, all flash memory blocks are program/erase-protected. Bit 3 RAMS 0 Description Emulation not selected Program/erase-protection of all flash memory blocks is disabled 1 Emulation selected Program/erase-protection of all flash memory blocks is enabled (Initial value) Bits 2 to 0--Flash Memory Area Selection (RAM2 to RAM0): These bits are used together with bit 3 to select the flash memory area to be overlapped with RAM (See table 18.6). Table 18.6 Flash Memory Area Divisions RAM Area H'FFE000 to H'FFEFFF H'000000 to H'000FFF H'001000 to H'001FFF H'002000 to H'002FFF H'003000 to H'003FFF H'004000 to H'004FFF H'005000 to H'005FFF H'006000 to H'006FFF H'007000 to H'007FFF Block Name 4-kbyte RAM area EB0 (4 kbytes) EB1 (4 kbytes) EB2 (4 kbytes) EB3 (4 kbytes) EB4 (4 kbytes) EB5 (4 kbytes) EB6 (4 kbytes) EB7 (4 kbytes) RAMS 0 1 1 1 1 1 1 1 1 RAM2 * 0 0 0 0 1 1 1 1 RAM1 * 0 0 1 1 0 0 1 1 RAM0 * 0 1 0 1 0 1 0 1 *: Don't care Note: Flash memory emulation by RAM is not supported in mode 6 (single-chip normal mode); therefore, although these bits can be written, they should not be set to 1. When performing flash memory emulation by RAM, the RAME bit in SYSCR must be set to 1. 534 18.4 18.4.1 Overview of Operation Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the H8/3064F-ZTAT B-mask version enters one of the operating modes shown in figure 18.2. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. Boot mode and user program mode cannot be used in the H8/3064F-ZTAT B-mask version's mode 6 (normal mode with on-chip ROM enabled). 535 *3 *1 Reset state RES = 0 RES = 0 *4 *2 User mode with on-chip ROM enabled FWE = 0 *4 RES = 0 *5 RES = 0 PROM mode User program mode *1 Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. *1 RAM emulation possible *2 The H8/3064F-ZTAT is placed in PROM mode by means of a dedicated PROM writer. *3 MD2, MD1, MD0 = (1, 0, 1) (1, 1, 0) (1, 1, 1) FWE = 0 *4 MD2, MD1, MD0 = (1, 0, 1) (1, 1, 1) FWE = 1 *5 MD2, MD1, MD0 (0, 0, 1) (0, 1, 1) FWE = 1 Figure 18.2 Flash Memory Related State Transitions State transitions between the normal and user modes and on-board programming mode are performed by changing the FWE pin level from high to low or from low to high. To prevent misoperation (erroneous programming or erasing) in these cases, the bits in the flash memory control register (FLMCR1) should be cleared to 0 before making such a transition. After the bits are cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is insufficient. 536 18.4.2 On-Board Programming Modes Example of Boot Mode Operation 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the H8/3064F-ZTAT B-mask version (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Host Programming control program ;; ; ; New application program New application program H8/3064F-ZTAT B-mask version Boot program H8/3064F-ZTAT B-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Boot program area Programming control program Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard to blocks. Host 4. Writing new application program The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program H8/3064F-ZTAT B-mask version Boot program H8/3064F-ZTAT B-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Boot program area Flash memory prewrite-erase Programming control program Boot program area New application program Programming control program Program execution state 537 Example of User Program Mode Operation 1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/ erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory. Host Programming/erase control program 2. Programming/erase control program transfer When user program mode is entered, user software recognizes this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host New application program H8/3064F-ZTAT B-mask version Boot program Flash memory FWE assessment program Transfer program New application program H8/3064F-ZTAT B-mask version SCI RAM Boot program Flash memory FWE assessment program Transfer program SCI RAM Programming/erase control program ;;A ; 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. Host 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host New application program H8/3064F-ZTAT B-mask version Boot program H8/3064F-ZTAT B-mask version Boot program SCI SCI Application program (old version) pplication program (old version) Flash memory RAM Flash memory RAM FWE assessment program Transfer program FWE assessment program Transfer program Programming/erase control program Programming/erase control program Flash memory erase New application program Program execution state 538 18.4.3 Flash Memory Emulation in RAM In the H8/3064F-ZTAT B-mask version, flash memory programming can be emulated in real time by overlapping the flash memory with part of RAM ("overlap RAM"). When the emulation block set in RAMCR is accessed while the emulation function is being executed, data written in the overlap RAM is read. Emulation should be performed in user mode or user program mode. SCI Flash memory Emulation block RAM Overlap RAM Application program Execution state (Emulation is performed on data written in RAM) Figure 18.3 Reading Overlap RAM Data in User Mode/User Program Mode When overlap RAM data is confirmed, clear the RAMS bit to cancel RAM overlap, and actually perform writes to the flash memory in user program mode. When the programming control program is transferred to RAM in on-board programming mode, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. 539 SCI Flash memory Program data RAM Application program Overlap RAM (program data) Programming control program Execution state Figure 18.4 Writing Overlap RAM Data in User Program Mode 18.4.4 Block Configuration The flash memory in the H8/3064F-ZTAT B-mask version is divided into three 64-kbyte blocks, one 32-kbyte block, and eight 4-kbyte blocks. Erasing can be carried out in block units. Address H'00000 4 kbytes x 8 32 kbytes 64 kbytes 256 kbytes 64 kbytes 64 kbytes Address H'3FFFF 540 18.5 On-Board Programming Mode When pins are set to on-board programming mode and a reset-start is executed, the chip enters the on-board programming state in which on-chip flash memory programming, erasing, and verifying can be carried out. There are two operating modes in this mode--boot mode and user program mode. The pin settings for entering each mode are shown in table 18.7. For a diagram of the transitions to the various flash memory modes, see figure 18.2. Boot mode and user program mode cannot be used in the H8/3064F-ZTAT B-mask version's mode 6 (on-chip ROM enabled). Table 18.7 On-Board Programming Mode Settings Mode Boot mode Mode 5 Mode 7 User program mode Mode 5 Mode 7 FWE 1* 1 MD2 0* 0* 1 1 2 2 MD1 0 1 0 1 MD0 1 1 1 1 Notes: *1 For the High level input timing, see items 6 and 7 of "Notes on Using the Boot Mode" in section 18.5.1. *2 In boot mode, the MD 2 setting should be the inverse of the input. In the boot mode in the H8/3064F-ZTAT B-mask version, the levels of the mode pins (MD2 to MD0) are reflected in mode select bits 2 to 0 (MDS2 to MDS0) in the mode control register (MDCR). 541 18.5.1 Boot Mode When boot mode is used, a flash memory programming control program must be prepared beforehand in the host, and SCI channel 1, which is to be used, must be set to asynchronous mode. When a reset-start is executed after setting the H8/3064F-ZTAT B-mask version's pins to boot mode, the boot program already incorporated in the MCU is activated, and the programming control program prepared beforehand in the host is transmitted sequentially to the H8/3064FZTAT B-mask version, using the SCI. In the H8/3064F-ZTAT B-mask version, the programming control program received via the SCI is written into the programming control program area in onchip RAM. After the transfer is completed, control branches to the start address (H'FFE720) of the programming control program area and the programming control program execution state is entered (flash memory programming/erasing can be performed). Figure 18.5 shows a system configuration diagram when using boot mode, and figure 18.6 shows the boot program mode execution procedure. H8/3064F-ZTAT B-mask version Flash memory Host Reception of programming data Transmission of verify data RxD1 SCI1 TxD1 On-chip RAM Figure 18.5 System Configuration When Using Boot Mode 542 Start Set pins to boot program mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate H8/3064F-ZTAT B-mask version measure low period of H'00 data transmitted by host H8/3064F-ZTAT B-mask version calculate bit rate and sets value in bit rate register After bit rate adjustment, H8/3064F-ZTAT B-mask version transmit one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, H8/3064F-ZTAT B-mask version transmit one H'AA byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte H8/3064F-ZTAT B-mask version transmit received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units H8/3064F-ZTAT B-mask version transmit received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks After confirming that all flash memory data has been erased, H8/3064F-ZTAT B-mask version transmit one H'AA byte to host Execute programming control program transferred to on-chip RAM Note: If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error indication, and the erase operation and subsequent operations are halted. No n+1n Figure 18.6 Boot Mode Execution Procedure 543 Automatic SCI Bit Rate Adjustment: Start bit D0 D1 D2 D3 D4 D5 D6 D7 Stop bit Low period (9 bits) measured (H'00 data) High period (1 or more bits) When boot mode is initiated, the H8/3064F-ZTAT B-mask version measure the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as 8-bit data, 1 stop bit, no parity. The H8/3064F-ZTAT Bmask version calculate the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the H8/3064F-ZTAT B-mask version. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and the H8/3064F-ZTAT B-mask version's system clock frequency, there will be a discrepancy between the bit rates of the host and the H8/3064F-ZTAT B-mask version. To ensure correct SCI operation, the host's transfer bit rate should be set to 4800, 9600, or 19,200 bps*. Table 18.8 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the H8/3064F-ZTAT B-mask version bit rate is possible. The boot program should be executed within this system clock range. Table 18.8 System Clock Frequencies for which Automatic Adjustment of H8/3064F-ZTAT B-mask version Bit Rate is Possible Host Bit Rate (bps) 19,200 9,600 4,800 System Clock Frequency for which Automatic Adjustment of H8/3064F-ZTAT B-Mask Version Bit Rate is Possible (MHz) 16 to 25 8 to 25 4 to 25 Note: * Only use a setting of 4800, 9600, or 19200 bps for the host's bit rate. No other settings can be used. Although the H8/3064F-ZTAT B-mask version may also perform automatic bit rate adjustment with bit rate and system clock combinations other than those shown in table 18.8, a degree of error will arise between the bit rates of the host and the H8/3064F-ZTAT B-mask version, and subsequent transfer will not be performed normally. Therefore, only 544 a combination of bit rate and system clock frequency within one of the ranges shown in table 18.8 can be used for boot mode execution. On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the user program is transferred via the SCI, as shown in figure 18.7. The boot program area becomes available when a transition is made to the execution state for the user program transferred to RAM. H'FFDF20 Boot program area H'FFE71F H'FFE720 User program transfer area H'FFFF1F Note: The boot program area cannot be used until a transition is made to the execution state for the user program transferred to RAM. Note also that the boot program remains in this area in RAM even after control branches to the user program. Figure 18.7 RAM Areas in Boot Mode Notes on Use of Boot Mode: 1. When the H8/3064F-ZTAT B-mask version chip comes out of reset in boot mode, it measures the low period of the input at the SCI's RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low period of the RxD 1 input. 2. In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. 3. Interrupts cannot be used while the flash memory is being programmed or erased. 4. The RxD1 and TxD1 lines should be pulled up on the board. 5. Before branching to the user program the H8/3064F-ZTAT B-mask version terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits to 0 in the serial control register (SCR)), but the adjusted bit rate value remains set in the bit rate 545 register (BRR). The transmit data output pin, TxD1, goes to the high-level output state (P91DDR = 1 in P9DDR, P91DR = 1 in P9DR). The contents of the CPU's internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the user program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the user program. The initial values of other on-chip registers are not changed. 6. Boot mode can be entered by setting pins MD0 to MD2 and FWE in accordance with the mode setting conditions shown in table 18.6, and then executing a reset-start. a. When switching from boot mode to normal mode, the boot mode state within the chip must first be cleared by reset input via the RES pin*1. The RES pin must be held low for at least 20 system clock cycles*3. b. Do not change the input levels of the mode pins (MD2 to MD0) or the FWE pin in boot mode. To change the mode, the RES pin must first be driven low to set the reset state. Also, if a watchdog timer reset occurs in the boot mode state, the MCU's internal state will not be cleared, and the on-chip boot program will be restarted regardless of the mode pin states. c. The FWE pin must not be driven low while the boot program is running or flash memory is being programmed or erased*2. 7. If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output signals (CSn, AS, RD, LWR, HWR) may also change according to the change in the MCU's operating mode. Therefore, care must be taken to make pin settings to prevent these pins from being used directly as output signal pins during a reset, or to prevent collision with signals outside the MCU. H8/3064F-ZTAT B-mask version CSn External memory, etc. MD2 MD1 MD0 FWE RES System control unit Notes: *1 Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. 546 *2 For further information on FWE application and disconnection, see section 18.11, Flash Memory Programming and Erasing Precautions. *3 See section 4.2.2, Reset Sequence, and section 18.11, Flash Memory Programming and Erasing Precautions. The H8/3064F-ZTAT B-mask version requires a minimum of 20 system clock cycles for a reset during operation. 18.5.2 User Program Mode When set to user program mode, the H8/3064F-ZTAT B-mask version can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip ROM (mode 5 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 5 and 7. Flash memory programming/erasing should not be carried out in mode 6. When mode 6 is set, the FWE pin must be driven low. The flash memory itself cannot be read while being programmed or erased, so the program that performs programming should be placed in external memory or transferred to RAM and executed there. Figure 18.8 shows the execution procedure when user program mode is entered during program execution in RAM. It is also possible to start from user program mode in a reset-start. 547 Write FWE assessment program and transfer program (and programming/erase control program if necessary) beforehand MD2 to MD0 = 101 or 111 Reset-start Transfer programming/erase control program to RAM Branch to programming/erase control program in RAM area FWE = High (user program mode) Execute programming/erase control program in RAM (flash memory rewriting) Clear SWE bit, then release FWE (user program mode clearing) Branch to application program in flash memory Notes: 1. Do not apply a constant high level to the FWE pin. A high level should be applied to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation by RAM). Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 2. For further information on FWE application and disconnection, see section 18.11, Flash Memory Programming and Erasing Precautions. 3. In order to execute a normal read of flash memory in user program mode, the programming/erase program must not be executing. It is thus necessary to ensure that bits 6 to 0 in FLMCR1 are cleared to 0. Figure 18.8 Example of User Program Mode Execution Procedure 548 18.6 Flash Memory Programming/Erasing A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes for addresses H'000000 to H'03FFFF are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. See section 18.11, Flash Memory Programming and Erasing Precautions, for points to be noted when programming or erasing the flash memory. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 22.3.6, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (programming/erasing will not be executed if FWE = 0). 3. Programming must be executed in the erased state. Do not perform additional programming on addresses that have already been programmed. 549 *3 E=1 Erase setup state E=0 Normal mode ESU = 1 *1 ESU = 0 Erase-verify mode Erase mode FWE = 1 FWE = 0 *2 EV = 1 EV = 0 PSU = 1 PSU = 0 On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state *4 P=1 Program setup state P=0 Program mode PV = 1 PV = 0 Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. *1 : Normal mode : On-board programming mode *2 Do not make a state transition by setting or clearing multiple bits simultaneously. *3 After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. *4 After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state. Figure 18.9 FLMCR1 Bit Settings and State Transitions 550 18.6.1 Program Mode When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 18.10 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in table 22.30 in section 22.3.6, Flash Memory Characteristics. Following the elapse of (tsswe ) s or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) s as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu ) s. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) s. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see "Notes on Program/Program-Verify Procedure" in section 18.6.2. 551 18.6.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) s before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (t spvr) s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 18.10) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) s, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) s after clearing SWE. Notes on Program/Program-Verify Procedure 1. The program/program-verify procedure for the H8/3064F-ZTAT B-mask version uses a 128byte-unit programming algorithm. Note that this is different from the procedure in the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version (32-byte-unit programming). In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the H8/3064F-ZTAT B-mask version, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the H8/3064F-ZTAT B-mask version, 552 the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N). b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 22.3.6, Flash Memory Characteristics. Item Wait time after P bit setting Symbol t sp Item When reprogramming loop count (n) is 1 to 6 When reprogramming loop count (n) is 7 or more In case of additional programming processing * Symbol t sp30 t sp200 t sp10 Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6. 6. The program/program-verify flowchart for the H8/3064F-ZTAT B-mask version is shown in figure 18.10. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM. 553 Reprogram Data Computation Table Result of Verify-Read after Write Pulse (X) Application (V) Result of Operation 0 1 0 1 1 0 1 1 (D) 0 0 1 1 Comments Programming completed: reprogramming processing not to be executed Programming incomplete: reprogramming processing to be executed Still in erased state: no action Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed Additional-Programming Data Computation Table Result of Verify-Read after Write Pulse (Y) (X') Application (V) Result of Operation 0 0 0 Comments Programming by write pulse application judged to be completed: additional programming processing to be executed Programming by write pulse application incomplete: additional programming processing not to be executed Programming already completed: additional programming processing not to be executed Still in erased state: no action 0 1 1 1 1 0 1 1 1 Legend: (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop (Y): Data of bits on which additional programming is executed 7. It is necessary to execute additional programming processing during the course of the H8/3064F-ZTAT B-mask version program/program-verify procedure. However, once 128byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished. 554 Write pulse application subroutine Start of programming START Set SWE bit in FLMCR1 Wait (tsswe) s Store 128-byte program data in program data area and reprogram data area Sub-Routine Write Pulse WDT enable Set PSU bit in FLMCR1 Wait (tspsu) s Set P bit in FLMCR1 Wait (tsp) s Clear P bit in FLMCR1 Wait (tcp) s Clear PSU bit in FLMCR1 Wait (tcpsu) s Disable WDT Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. *7 *4 *7 Start of programming *5*7 n= 1 m= 0 Consecutively write 128-byte data in reprogram data area in RAM to flash memory *1 Programming halted *7 Sub-Routine-Call Write pulse See Note *6 for pulse width Set PV bit in FLMCR1 Wait (tspv) s H'FF dummy write to verify address *7 *7 Wait (tspvr) s Read verify data Increment address *7 *2 nn+1 End Sub Note *6: Write Pulse Width Number of Writes (n) Write Time (tsp) s Write data = verify data? NG m=1 NG 1 2 3 4 5 6 7 8 9 10 11 12 13 30 30 30 30 30 30 200 200 200 200 200 200 200 OK 6n? OK Additional-programming data computation Transfer additional-programming data to additional-programming data area Reprogram data computation *4 *3 *4 Transfer reprogram data to reprogram data area 128-byte data verification completed? NG 998 999 1000 200 200 200 OK Clear PV bit in FLMCR1 Reprogram Wait (tcpv) s 6 n? NG *7 Note: Use a 10 s write pulse for additional programming. RAM Program data storage area (128 bytes) OK Consecutively write 128-byte data in additionalprogramming data area in RAM to flash memory Sub-Routine-Call Write Pulse (Additional programming) *1 Reprogram data storage area (128 bytes) m= 0 ? OK Clear SWE bit in FLMCR1 Wait (tcswe) s End of programming NG *7 n N? NG Additional-programming data storage area (128 bytes) OK Clear SWE bit in FLMCR1 Wait (tcswe) s Programming failure *7 Notes: *1 Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. *2 Verify data is read in 16-bit (word) units. *3 Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. *4 A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional-programming data must be provided in RAM. The contents of the reprogram data area and additional-programming data area are modified as programming proceeds. *5 A write pulse of 30 s or 200 s is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 s write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. *7 The wait times and value of N are shown in section 22.3.6, Flash Memory. Reprogram Data Computation Table Original Data Verify Data Reprogram Data Additional-Programming Data Computation Table (X) 1 0 1 1 Still in erased state; no action Comments Programming completed Programming incomplete; reprogram (D) 0 0 1 1 (V) 0 1 0 1 Reprogram Data (X') 0 0 1 1 Verify Data Additional(V) Programming Data (Y) 0 1 0 1 0 1 1 1 Comments Additional programming to be executed Additional programming not to be executed Additional programming not to be executed Additional programming not to be executed Figure 18.10 Program/Program-Verify Flowchart (128-Byte Programming) 555 18.6.3 Erase Mode When erasing flash memory, the single-block erase flowchart shown in figure 18.11 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in table 22.30 in section 22.3.6, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register 1 and 2 (EBR1, EBR2) at least (tsswe ) s after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value greater than (tse) ms + (tsesu + tce + tcesu) s as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) s. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. 18.6.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) s before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (t sevr) s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) s. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) s. If erasing multiple blocks, set a single bit in EBR1/EBR2 for the next block to be erased, and repeat the erase/erase-verify sequence as before. 556 Start *1 Perform erasing in block units. Set SWE bit in FLMCR1 Wait (tsswe) s n=1 Set EBR1 or EBR2 Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) s Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) s Clear ESU bit in FLMCR1 Wait (tcesu) s Disable WDT Set EV bit in FLMCR1 Wait (tsev) s Set block start address as verify address *5 *5 *5 *3, *4 *5 Start of erase *5 End of erase *5 nn+1 H'FF dummy write to verify address Wait (tsevr) s Increment address Read verify data Verify data = all 1s? Yes No Last address of block? Yes Clear EV bit in FLMCR1 Wait (tcev) s *5 *5 *2 No Re-erase Clear EV bit in FLMCR1 Wait (tcev) s *5 *5 n N? Clear SWE bit in FLMCR1 Wait (tcswe) s End of erasing *5 No Yes Clear SWE bit in FLMCR1 Wait (tcswe) s Erase failure *5 Notes: *1 *2 *3 *4 *5 Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block registers (EBR1 and EBR2). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 22.3.6, Flash Memory Characteristics. Figure 18.11 Erase/Erase-Verify Flowchart (Single-Block Erasing) 557 18.7 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware, software, and error protection. 18.7.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. In this state, the settings in flash memory control register 1 (FLMCR1) and erase block registers 1 and 2 (EBR1, EBR2) are reset. In the error protection state, the FLMCR1, EBR1, and EBR2 settings are retained; the P bit and E bit can be set, but a transition is not made to program mode or erase mode (See table 18.9). Table 18.9 Hardware Protection Function Item FWE pin protection Description * When a low level is input to the FWE pin, FLMCR1, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset (including a WDT overflow reset) and in standby mode, FLMCR1, FLMCR2, EBR1, and EBR2 are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section * 4. Not When a microcomputer operation error (error generation (FLER = 1)) was detected while flash possible memory was being programmed/erased, error protection is enabled. At this time, the FLMCR1, EBR1, and EBR2 settings are held, but programming/erasing is aborted at the time the error was generated. Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware standby mode. Not Possible* possible* 3 2 Program Erase Verify Not Not Not possible* 1 possible* 3 possible Reset/ standby protection * Not possible Not Not possible* 3 possible * Error protection * Notes: *1 The RAM area that overlapped flash memory is deleted. *2 It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify operation on the block being erased. 558 *3 All blocks are unerasable and block-by-block specification is not possible. *4 See section 4.2.2, Reset Sequence, and section 18.11, Flash Memory Programming and Erasing Precautions. The H8/3064F-ZTAT B-mask version requires a minimum of 20 system clock cycles for a reset during operation. 18.7.2 Software Protection Software protection can be implemented by setting the erase block register 1 (EBR1), erase block register 2 (EBR2), and the RAMS bit in the RAM control register (RAMCR). With software protection, setting the P or E bit in the flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode (See table 18.10). Table 18.10 Software Protection Functions Item Block protection Description * Erase protection can be set for individual blocks by settings in erase block register 1 (EBR1) and erase block register 2 (EBR2)*2. However, programming protection is disabled. Program -- Erase Not possible Verify Possible * Setting EBR1 and EBR2 to H'00 places all blocks in the erase-protected state. Emulation protection * Setting the RAMS bit 1 in RAMCR places all blocks in the program/erase-protected state. Not possible* 1 Not possible* 3 Possible Notes: *1 The RAM area overlapping flash memory can be written to. *2 When not erasing, set EBR1 and EBR2 to H'00. *3 All blocks are unerasable and block-by-block specification is not possible. 18.7.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing*1, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in the flash memory status register (FLMSR2) and the error protection state is entered. FLMCR1, FLMCR2, EBR1, and EBR2 settings*3 are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re559 setting the P or E bit in FLMCR. However, PV and EV bit setting is enabled, and a transition can be made to verify mode*2. FLER bit setting conditions are as follows: 1. When flash memory is read during programming/erasing (including a vector read or instruction fetch) 2. Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the bus is released during programming/erasing Error protection is released only by a RES pin or WDT reset, or in hardware standby mode. Notes: *1 State in which the P bit or E bit in FLMCR1 is set to 1. Note that NMI input is disabled in this state. *2 It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify on the block being erased. *3 FLMCR1, EBR1, and EBR2 can be written to. However, the registers are initialized if a transition is made to software standby mode while in the error protection state. Figure 18.12 shows the flash memory state transition diagram. 560 Program mode Erase mode RD VF PR ER FLER = 0 RES = 0 or STBY = 0 Reset or standby (hardware protection) RD VF PR ER INIT FLER = 0 Error occurrence (software standby) Error occurrence RES = 0 or STBY = 0 RES = 0 or STBY = 0 FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode RD VF PR ER FLER = 1 Software standby mode Software standby mode release Error protection mode (software standby) RD VF PR ER INIT FLER = 1 FLMCR1, EBR1, EBR2 initialization state RD VF PR ER : : : : Memory read possible Verify-read possible Programming possible Erasing possible RD VF PR ER INIT : : : : : Memory read not possible Verify-read not possible Programming not possible Erasing not possible Register initialization state Figure 18.12 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled)) The error protection function is invalid for abnormal operations other than the FLER bit setting conditions. Also, if a certain time has elapsed before this protection state is entered, damage may already have been caused to the flash memory. Consequently, this function cannot provide complete protection against damage to flash memory. To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied, and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog timer or other means. There may also be cases where the flash memory is in an erroneous programming or erroneous erasing state at the point of transition to this protection mode, or where programming or erasing is not properly carried out because of an abort. In cases such as these, a forced recovery (program rewrite) must be executed using boot mode. However, it may also happen that boot mode cannot be normally initiated because of overprogramming or overerasing. 561 18.8 Flash Memory Emulation in RAM Making a setting in the RAM control register (RAMCR) enables part of RAM to be overlapped onto the flash memory area so that data to be written to flash memory can be emulated in RAM in real time. After the RAMCR setting has been made, accesses can be made from the flash memory area or the RAM area overlapping flash memory. Emulation can be performed in user mode and user program mode. Figure 18.13 shows an example of emulation of realtime flash memory programming. Start of emulation program Set RAMCR Write tuning data to overlap RAM Execute application program No Tuning OK? Yes Clear RAMCR Write to flash memory emulation block End of emulation program Figure 18.13 Flowchart of Flash Memory Emulation in RAM 562 This area can be accessed from both the RAM area and flash memory area H'00000 EB0 H'01000 EB1 H'02000 EB2 H'03000 EB3 H'04000 EB4 H'05000 EB5 H'06000 EB6 H'07000 EB7 H'08000 H'FFE000 Flash memory EB8 to EB11 On-chip RAM H'FFFF1F H'3FFFF H'FFEFFF Figure 18.14 Example of RAM Overlap Operation Example of Flash Memory Block Area EB0 Overlapping 1. Set bits RAMS and RAM2 to RAM0 in RAMCR to 1,0, 0, 0, to overlap part of RAM onto the area (EB0) for which realtime programming is required. 2. Realtime programming is performed using the overlapping RAM. 3. After the program data has been confirmed, the RAMS bit is cleared, releasing RAM overlap. 4. The data written in the overlapping RAM is written into the flash memory space (EB0). Notes: 1. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in FLMCR1 will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 2. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 3. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM. 563 4. As in on-board programming mode, care is required when applying and releasing FWE to prevent erroneous programming or erasing. To prevent erroneous programming and erasing due to program runaway during FWE application, in particular, the watchdog timer should be set when the PSU, P, ESU, or E bit is set to 1 in FLMCR1, even while the emulation function is being used. 5. When the emulation function is used, NMI input is prohibited when the P bit or E bit is set to 1 in FLMCR1, in the same way as with normal programming and erasing. The P and E bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high level is not being input to the FWE pin, or when the SWE bit in FLMCR1 is 0 while a high level is being input to the FWE pin. 18.9 NMI Input Disabling Conditions All interrupts, including NMI input, should be disabled while flash memory is being programmed or erased (while the P bit or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. NMI input during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the NMI exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If NMI input occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling NMI input, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests (exception handling and bus release), including NMI, must therefore be restricted inside and outside the MCU during FWE application. NMI input is also disabled in the error protection state and while the P or E bit remains set in FLMCR1 during flash memory emulation in RAM. Notes: *1 This is the interval until a branch is made to the boot program area in the on-chip RAM (This branch takes place immediately after transfer of the user program is completed). Consequently, after the branch to the RAM area, NMI input is enabled except during programming and erasing. Interrupt requests must therefore be disabled inside and outside the MCU until the user program has completed initial programming (including the vector table and the NMI interrupt handling routine). *2 The vector may not be read correctly in this case for the following two reasons: * If flash memory is read while being programmed or erased (while the P bit or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). * If the entry in the interrupt vector table has not been programmed yet, interrupt exception handling will not be executed correctly. 564 18.10 Flash Memory PROM Mode The H8/3064F-ZTAT B-mask version have a PROM mode as well as the on-board programming modes for programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose PROM writer that supports the Hitachi microcomputer device type with 256-kbyte on-chip flash memory. 18.10.1 Socket Adapters and Memory Map In PROM mode using a PROM writer, memory reading (verification) and writing and flash memory initialization (total erasure) can be performed. For these operations, a special socket adapter is mounted in the PROM writer. The socket adapter product codes are given in table 18.11. In the H8/3064F-ZTAT B-mask version PROM mode, only the socket adapters shown in this table should be used. Table 18.11 Product Code HD64F3064BF H8/3064F-ZTAT B-Mask Version Socket Adapter Product Codes Package 100-pin QFP (FP-100B) Socket Adapter Product Code ME3064ESHF1H ME3064ESNF1H ME3064ESFF1H HF306BQ100D4001 HF306BT100D4001 HF306AQ100D4001 DATA I/O JAPAN CO. Manufacturer MINATO ELECTRONICS INC. HD64F3064BTE 100-pin TQFP (TFP-100B) HD64F3064BFP 100-pin QFP (FP-100A) HD64F3064BF 100-pin QFP (FP-100B) HD64F3064BTE 100-pin TQFP (TFP-100B) HD64F3064BFP 100-pin QFP (FP-100A) Figure 18.15 shows the memory map in PROM mode. H8/3064F-ZTAT B-mask version MCU mode H'000000 PROM mode H'00000 On-chip ROM H'03FFFF H'3FFFF Figure 18.15 Memory Map in PROM Mode 565 18.10.2 Notes on Use of PROM Mode 1. A write to a 128-byte programming unit in PROM mode should be performed once only. Erasing must be carried out before reprogramming an address that has already been programmed. 2. When using a PROM writer to reprogram a device on which on-board programming/erasing has been performed, it is recommended that erasing be carried out before executing programming. 3. The memory is initially in the erased state when the device is shipped by Hitachi. For samples for which the erasure history is unknown, it is recommended that erasing be executed to check and correct the initialization (erase) level. 4. The H8/3064F-ZTAT B-mask version does not support a product identification mode as used with general-purpose EPROMs, and therefore the device name cannot be set automatically in the PROM writer. 5. Refer to the instruction manual provided with the socket adapter, or other relevant documentation, for information on PROM writers and associated program versions that are compatible with the PROM mode of the H8/3064F-ZTAT B-mask version. 18.11 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. 1. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Hitachi microcomputer device type with 256-kbyte on-chip flash memory. 2. Powering on and off (See figures 18.16 to 18.18) Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Failure to do so may result in overprogramming or overerasing due to MCU runaway, and loss of normal memory cell operation. 3. FWE application/disconnection FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: 566 * * * * * * Apply FWE when the VCC voltage has stabilized within its rated voltage range. If FWE is applied when the MCU's VCC power supply is not within its rated voltage range, MCU operation will be unstable and flash memory may be erroneously programmed or erased. Apply FWE when oscillation has stabilized (after the elapse of the oscillation settling time). When V CC power is turned on, hold the RES pin low for the duration of the oscillation settling time before applying FWE. Do not apply FWE when oscillation has stopped or is unstable. In boot mode, apply and disconnect FWE during a reset. In a transition to boot mode, FWE = 1 input and MD2 to MD0 setting should be performed while the RES input is low. FWE and MD2 to MD0 pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. When making a transition from boot mode to another mode, also, a mode programming setup time is necessary with respect to the reset release timing. In a reset during operation, the RES pin must be held low for a minimum of 20 system clock cycles. In user program mode, FWE can be switched between high and low level regardless of RES input. FWE input can also be switched during execution of a program in flash memory. Do not apply FWE if program runaway has occurred. During FWE application, the program execution state must be monitored using the watchdog timer or some other means. Disconnect FWE only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, E, and P bits are not set by mistake when applying or disconnecting FWE. 4. Do not apply a constant high level to the FWE pin. T prevent erroneous programming or erasing due to program runaway, etc., apply a high level to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation using RAM). A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 5. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the PSU or ESU bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. 567 Also note that access to the flash memory space by means of a MOV instruction, etc., is not permitted while the P bit or E bit is set. 6. Do not set or clear the SWE bit during execution of a program in flash memory. Clear the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash memory should only be accessed for verify operations (verification during programming/erasing). Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. A wait time is necessary after the SWE bit is cleared. For details see table 22.30 in section 22.3.6, Flash Memory Characteristics. 7. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations (including emulation in RAM). Bus release must also be disabled. 8. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. 9. Before programming, check that the chip is correctly mounted in the PROM writer. Overcurrent damage to the device can result if the index marks on the PROM writer socket, socket adapter, and chip are not correctly aligned. 10. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors. 11. A wait time of 100 s or more is necessary when performing a read after a transition to normal mode from program, erase, or verify mode. 12. Use byte access on the registers that control the flash memory (FLMCR1, FLMCR2, EBR1, EBR2, and RAMCR). 568 Wait time: x Programming/ erasing possible Wait time: y tOSC1 VCC tMDS Min 0 s Min 0 s FWE MD2 to MD0*1 tMDS RES SWE set SWE bit SWE cleared Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See 22.3.6 Flash Memory Characteristics. Figure 18.16 Power-On/Off Timing (Boot Mode) 569 Wait time: x Programming/ erasing possible Wait time: y tOSC1 VCC Min 0 s FWE MD2 to MD0*1 tMDS RES SWE set SWE bit SWE cleared Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See 22.3.6 Flash Memory Characteristics. Figure 18.17 Power-On/Off Timing (User Program Mode) 570 Wait time: x Programming/ erasing possible Wait time: x Programming/ erasing possible Wait time: y Wait time: x Programming/ erasing possible Wait time: y tOSC1 VCC Min 0s FWE tMDS tMDS *2 MD2 to MD0 tMDS tRESW RES SWE set SWE bit Mode change*1 Boot mode SWE cleared Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (CSn, AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. *2 When making a transition from boot mode to another mode, the mode programming setup time tMDS must be satisfied with respect to RES clearance timing. *3 See 22.3.6 Flash Memory Characteristics. Figure 18.18 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) Programming/ erasing possible Wait time: y Wait time: x 571 18.12 Mask ROM (H8/3064 Mask ROM B-Mask Version) Overview 18.12.1 Block Diagram Figure 18.19 shows a block diagram of the ROM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) H'00000 H'00002 H'00001 H'00003 On-chip ROM H'3FFFE Even addresses H'3FFFF Odd addresses Figure 18.19 ROM Block Diagram (H8/3064 Mask ROM B-Mask Version) 572 18.13 Notes on Ordering Mask ROM Version Chips When ordering H8/3064 with mask ROM, note the following. 1. When ordering by means of an EPROM, use a 512-kbyte one. 2. Fill all unused addresses with H'FF as shown in figure 18.20 to make the ROM data size 512kbytes for the H8/3064 mask ROM version. This applies to ordering by means of an EPROM and by means of data transmission. HD6433064B (ROM: 256 kbytes) Addresses: H'00000-7FFFF H'00000 H'3FFFF H'40000 Not used* H'7FFFF Note: * Write H'FF in all addresses in this. Figure 18.20 Mask ROM Addresses and Data 3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2, EBR1, and EBR2) used by the versions with on-chip flash memory are not provided in the mask ROM version. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are disabled. This must be borne in mind when switching from a flash memory version to a mask ROM version. 573 18.14 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Version Please note the following when converting the F-ZTAT application software to the mask-ROM version. The values read from the internal registers for the flash ROM in the mask-ROM version and FZTAT version differ as follows. Status Register FLMCR1 Bit FWE Value 0 1 F-ZTAT Version Application software running Programming Mask-ROM Version -- (Is not read out) Application software running (This bit is always read as 1) Note: This difference applies to all the F-ZTAT versions and all the mask-ROM versions that have different ROM size. 574 Section 19 H8/3062 Internal Voltage Step-Down Version ROM [H8/3062F-ZTAT B-Mask Version, Mask ROM B-Mask Versions of H8/3062, H8/3061, and H8/3060] 19.1 Overview The H8/3062F-ZTAT B-mask version has 128 kbytes of on-chip flash memory. The mask ROM B-mask versions of H8/3062, H8/3061, H8/3060 have 128 kbytes, 96 kbytes, 64 kbytes of on-chip mask ROM, respectively. The flash memory is connected to the CPU by a 16-bit data bus. The CPU accesses both byte data and word data in two states, enabling rapid data transfer. The on-chip ROM is enabled and disabled by setting the mode pins (MD2 to MD0) as shown in table 19.1. The on-chip flash memory product (H8/3062F-ZTAT B-mask version) can be erased and programmed on-board, as well as with a special-purpose PROM programmer. Table 19.1 Operating Modes and ROM Mode Pins Mode Mode 1 (expanded 1-Mbyte mode with on-chip ROM disabled) Mode 2 (expanded 1-Mbyte mode with on-chip ROM disabled) Mode 3 (expanded 16-Mbyte mode with on-chip ROM disabled) Mode 4 (expanded 16-Mbyte mode with on-chip ROM disabled) Mode 5 (expanded 16-Mbyte mode with on-chip ROM enabled) Mode 6 (single-chip normal mode) Mode 7 (single-chip advanced mode) MD2 0 0 0 1 1 1 1 MD1 0 1 1 0 0 1 1 MD0 1 0 1 0 1 0 1 Enabled On-Chip ROM Disabled (external address area) 575 19.1.1 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Table 19.2 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Item Size Operating frequency Program/erase voltage H8/3062F-ZTAT H8/3062F-ZTAT R-Mask Version 128 kbytes 1 to 20 MHz Supplied from VCC H8/3062F-ZTAT B-Mask Version 128 kbytes 2 to 25 MHz Supplied from VCC 128-byte simultaneous programming 30 s x 6 + 200 s x 994 (with 10 s additional programming)*1 8 blocks 1 kbyte x 4, 28 kbytes x 1, 32 kbytes x 3 EBR: H'EE032 4 EB4 3 EB3 2 EB2 1 EB1 0 EB0 7 EB7 6 EB6 5 EB5 4 EB4 3 EB3 2 EB2 1 EB1 0 EB0 Programming Programming 32-byte simultaneous programming unit Write pulse application method Erasing Block configuration EBR configuration RAM emulation RAM area Applicable blocks RAMCR configuration Flash error FLER bit 150 s x 4 + 500 s x 399 8 blocks 1 kbyte x 4, 28 kbytes x 1, 32 kbytes x 3 EBR: H'EE032 7 EB7 6 EB6 5 EB5 1 kbyte (H'FF000 to H'FF3FF) EB0 to EB3 RAMCR: H'EE077 7 -- 6 -- 5 -- 4 -- 3 2 1 0 -- RAMS RAM2 RAM1 1 kbyte (H'FF000 to H'FF3FF) EB0 to EB3 RAMCR: H'EE077 7 -- 6 -- 5 -- 4 -- 3 2 1 0 -- RAMS RAM2 RAM1 FLMSR: H'EE07D 7 FLER 6 -- 5 -- 4 -- 3 -- 2 -- 1 -- 0 -- FLMCR2: H'EE031 7 FLER 6 -- 5 -- 4 -- 3 -- 2 -- 1 -- 0 -- Flash Wait after -- memory SWE clearing characteristics Boot mode Bit rate Boot area User area 9,600 bps, 4,800 bps H'FFEF20 to H'FFF3FF H'FFF400 to H'FFFF1F (2.8 kbytes) tcswe specification must be met*2 19,200 bps, 9,600 bps, 4,800 bps H'FFEF20 to H'FFF51F H'FFF520 to H'FFFF1F (2.5 kbytes) Yes Use of PROM writer supporting Hitachi microcomputer device type with 128 kbytes on-chip flash memory Programming control program No identification function PROM mode Use of PROM writer supporting Hitachi microcomputer device type with 128 kbytes on-chip flash memory Notes: *1 See section 19.6, Flash Memory Programming/Erasing, for details of the H8/3062F-ZTAT B-mask version program/erase algorithms. *2 See section 22.5.6, Flash Memory Characteristics, for details of the H8/3062F-ZTAT B-mask version flash memory characteristics. 576 19.2 Features The H8/3062F-ZTAT B-mask version has 128 kbytes of on-chip flash memory. The features of the flash memory are summarized below. * Four flash memory operating modes Program mode Erase mode Program-verify mode Erase-verify mode * Programming/erase methods The flash memory is programmed 128 bytes at a time. Erasing is performed in block units. To erase the entire flash memory, each block must be erased in turn. In block erasing, 1-kbyte, 28kbyte, and 32-kbyte blocks can be set arbitrarily. * Programming/erase times The flash memory programming time is 10 ms (typ) for simultaneous 128-byte programming, equivalent approximately to 80 s (typ) per byte, and the erase time is 100 ms (typ) per block. * Reprogramming capability The flash memory can be reprogrammed up to 100 times. * On-board programming modes There are two modes in which flash memory can be programmed/erased/verified on-board. A function is also provided specially in boot mode for identifying a program transferred from the host side.: Boot mode User program mode * Automatic bit rate adjustment For data transfer in boot mode, the H8/3062F-ZTAT B-mask version chip's bit rate can be automatically adjusted to match the transfer bit rate of the host. * Flash memory emulation in RAM Flash memory programming can be emulated in real time by overlapping a part of RAM onto flash memory. * Protect modes There are three protect modes--hardware, software, and error--which allow protected status to be designated for flash memory program/erase/verify operations. * PROM mode Flash memory can be programmed/erased in PROM mode, using a PROM programmer, as well as in on-board programming mode. 577 19.2.1 Block Diagram Internal address bus Internal data bus (16 bits) Module bus FLMCR1 FLMCR2 EBR RAMCR Bus interface/controller Operating mode FWE pin Mode pins Flash memory (128 kbytes) Legend: FLMCR1 FLMCR2 EBR RAMCR : : : : Flash memory control register 1 Flash memory control register 2 Erase block register RAM control register Figure 19.1 Block Diagram of Flash Memory 578 19.2.2 Pin Configuration The flash memory is controlled by means of the pins shown in table 19.3. Table 19.3 Flash Memory Pins Pin Name Reset Flash write enable Mode 2 Mode 1 Mode 0 Transmit data Receive data Abbreviation RES FWE MD2 MD1 MD0 TxD1 RxD1 I/O Input Input Input Input Input Output Input Function Reset Flash program/erase protection by hardware Sets H8/3062F-ZTAT B-mask version operating mode Sets H8/3062F-ZTAT B-mask version operating mode Sets H8/3062F-ZTAT B-mask version operating mode Serial transmit data output Serial receive data input 19.2.3 Register Configuration The registers used to control the on-chip flash memory when enabled are shown in table 19.4. Table 19.4 Flash Memory Registers Register Name Flash memory control register 1 Flash memory control register 2 Erase block register RAM control register Abbreviation FLMCR1 FLMCR2 EBR RAMCR R/W R/W R R/W R/W Initial Value H'00* 2 H'00 H'00 H'F1 Address* 1 H'EE030 H'EE031 H'EE032 H'EE077 Notes: FLMCR1, FLMCR2, EBR, and RAMCR are 8-bit registers, and should be accessed by byte access. These registers are used only in the versions with on-chip flash memory, and are not provided in the versions with on-chip mask ROM. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are invalid. *1 Lower 20 bits of address in advanced mode *2 When a high level is input to the FWE pin, the initial value is H'80. 579 19.3 19.3.1 Bit Register Descriptions Flash Memory Control Register 1 (FLMCR1) 7 FWE 6 SWE 0 R/W 5 ESU 0 R/W 4 PSU 0 R/W 3 EV 0 R/W 2 PV 0 R/W 1 E 0 R/W 0 P 0 R/W Initial value Read/Write --* R Note: * Determined by the state of the FWE pin. FLMCR1 is an 8-bit register used for flash memory operating mode control. Program-verify mode or erase-verify mode for addresses H'00000 to H'1FFFF is entered by setting the SWE bit when FWE = 1, then setting the PV or EV bit. Program mode for addresses H'00000 to H'1FFFF is entered by setting the SWE bit when FWE = 1, then setting the PSU bit, and finally setting the P bit. Erase mode for addresses H'00000 to H'1FFFF is entered by setting the SWE bit when FWE = 1, then setting the ESU bit, and finally setting the E bit. FLMCR1 is initialized by a reset, and in hardware standby mode and software standby mode. Its initial value is H'80 when a high level is input to the FWE pin, and H'00 when a low level is input. In mode 6 the FWE pin must be fixed low since flash memory on-board programming modes are not supported. When the on-chip flash memory is disabled, a read access to this register will return H'00, and writes are invalid. When setting bits 6 to 0 in this register, one bit must be set one at a time. Writes to the SWE bit in FLMCR1 are enabled only when FWE = 1; writes to bits ESU, PSU, EV, and PV only when FWE = 1 and SWE = 1; writes to the E bit only when FWE = 1, SWE = 1, and ESU = 1; and writes to the P bit only when FWE = 1, SWE = 1, and PSU = 1. Notes: 1. The programming and erase flowcharts must be followed when setting the bits in this register to prevent erroneous programming or erasing. 2. Transitions are made to program mode, erase mode, program-verify mode, and eraseverify mode according to the settings in this register. When reading flash memory as normal on-chip ROM, bits 6 to 0 in this register must be cleared. Bit 7--Flash Write Enable (FWE): Sets hardware protection against flash memory programming/erasing. Bit 7 FWE 0 1 580 Description When a low level is input to the FWE pin (hardware-protected state) When a high level is input to the FWE pin Bit 6--Software Write Enable (SWE): Enables or disables flash memory programming and erasing (This bit should be set when setting bits 5 to 0 and EBR bits 7 to 0). Bit 6 SWE 0 1 Description Programming/erasing disabled Programming/erasing enabled [Setting condition] When FWE = 1 Note: Do not execute a SLEEP instruction while the SWE bit is set to 1. (Initial value) Bit 5--Erase Setup (ESU): Prepares for a transition to erase mode. Set this bit to 1 before setting the E bit to 1 in FLMCR1 (Do not set the SWE, PSU, EV, PV, E, or P bit at the same time). Bit 5 ESU 0 1 Description Erase setup cleared Erase setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 4--Program Setup (PSU): Prepares for a transition to program mode. Set this bit to 1 before setting the P bit to 1 in FLMCR1 (Do not set the SWE, ESU, EV, PV, E, or P bit at the same time). Bit 4 PSU 0 1 Description Program setup cleared Program setup [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 3--Erase-Verify Mode (EV): Selects erase-verify mode transition or clearing (Do not set the SWE, ESU, PSU, PV, E, or P bit at the same time). Bit 3 EV 0 1 Description Erase-verify mode cleared Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 581 (Initial value) Bit 2--Program-Verify Mode (PV): Selects program-verify mode transition or clearing (Do not set the SWE, ESU, PSU, EV, E, or P bit at the same time). Bit 2 PV 0 1 Description Program-verify mode cleared Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 (Initial value) Bit 1--Erase Mode (E): Selects erase mode transition or clearing (Do not set the SWE, ESU, PSU, EV, PV, or P bit at the same time). Bit 1 E 0 1 Description Erase mode cleared Transition to erase mode [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Note: Do not access the flash memory while the E bit is set. (Initial value) Bit 0--Program (P): Selects program mode transition or clearing (Do not set the SWE, ESU, PSU, EV, PV, or E bit at the same time). Bit 0 P 0 1 Description Program mode cleared Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Note: Do not access the flash memory while the P bit is set. (Initial value) 582 19.3.2 Bit Flash Memory Control Register 2 (FLMCR2) 7 FLER 6 -- 0 R 5 -- 0 R 4 -- 0 R 3 -- 0 R 2 -- 0 R 1 -- 0 R 0 -- 0 R Initial value Read/Write 0 R FLMCR2 is an 8-bit register used for flash memory operating mode control. FLMCR2 is initialized to H'00 by a reset, and in hardware standby mode and software standby mode. When the on-chip flash memory is disabled, a read will return H'00. Note: FLMCR2 is a read-only register, and should not be written to. Bit 7--Flash Memory Error (FLER): Indicates that an error has occurred during an operation on flash memory (programming or erasing). When FLER is set to 1, flash memory goes to the errorprotection state. Bit 7 FLER 0 Description Flash memory is operating normally Flash memory program/erase protection (error protection) is disabled [Clearing condition] Reset (RES pin or WDT reset) or hardware standby mode 1 An error occurred during flash memory programming/erasing Flash memory program/erase protection (error protection) is enabled [Setting conditions] * When flash memory is read during programming/erasing (including a vector read or instruction fetch, but excluding a read of the RAM area overlapping flash memory space) Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) When a SLEEP instruction (including software standby) is executed during programming/erasing When the bus is released during programming/erasing (Initial value) * * * Bits 6 to 0--Reserved: These bits are always read as 0. 583 19.3.3 Erase Block Register (EBR) EBR is an 8-bit register that designates the flash memory block for erasure. EBR is initialized to H'00 by a reset, in hardware standby mode or software standby mode, when a high level is not input to the FWE pin, or when the SWE bit in FLMCR1 is 0 when a high level is applied to the FWE pin. When a bit is set in EBR, the corresponding block can be erased. Other blocks are eraseprotected. The blocks are erased block by block. Therefore, set only one bit in EBR; do not set bits in EBR to erase two or more blocks at the same time. Each bit in EBR cannot be set until the SWE bit in FLMCR1 is set. The flash memory block configuration is shown in table 19.5. To erase all the blocks, erase each block sequentially. The H8/3062F-ZTAT B-mask version does not support the on-board programming mode in mode 6, so bits in this register cannot be set to 1 in mode 6. Bit Modes 1 Initial value 7 EB7 0 R 0 R/W to 4, and 6 Read/Write Modes 5 and 7 Initial value Read/Write 6 EB6 0 R 0 R/W 5 EB5 0 R 0 R/W 4 EB4 0 R 0 R/W 3 EB3 0 R 0 R/W 2 EB2 0 R 0 R/W 1 EB1 0 R 0 R/W 0 EB0 0 R 0 R/W Bits 7 to 0--Block 7 to Block 0 (EB7 to EB0): Setting one of these bits specifies the corresponding block (EB7 to EB0) for erasure. Bits 7-0 EB7-EB0 0 1 Description Corresponding block (EB7 to EB0) not selected Corresponding block (EB7 to EB0) selected (Initial value) Note: When not performing an erase, clear all EBR bits to 0. 584 Table 19.5 Flash Memory Erase Blocks Block (Size) EB0 (1 kbyte) EB1 (1 kbyte) EB2 (1 kbyte) EB3 (1 kbyte) EB4 (28 kbytes) EB5 (32 kbytes) EB6 (32 kbytes) EB7 (32 kbytes) Address H'000000-H'0003FF H'000400-H'0007FF H'000800-H'000BFF H'000C00-H'000FFF H'001000-H'007FFF H'008000-H'00FFFF H'010000-H'017FFF H'018000-H'01FFFF 19.3.4 RAM Control Register (RAMCR) RAMCR selects the RAM area to be used when emulating real-time flash memory programming. Bit Modes 1 to 4 Modes 5 to 7 Initial value Read/Write Initial value Read/Write 7 -- 1 -- 1 -- 6 -- 1 -- 1 -- 5 -- 1 -- 1 -- 4 -- 1 -- 1 -- 3 RAMS 0 R 0 R/W* 2 RAM2 0 R 0 R/W* 1 RAM1 0 R 0 R/W* 0 -- 1 -- 1 -- Reserved bit RAM2, RAM1 Used together with bit 3 to select a flash memory area RAM select Used together with bits 2 and 1 to select a flash memory area Reserved bits Note: * Cannot be set to 1 in mode 6. Bits 7 to 4--Reserved: Read-only bits, always read as 1. Bit 3--RAM Select (RAMS): Used with bits 2 to 1 to reassign an area to RAM (see table 19.6). The initial setting for this bit is 0 in modes 5, 6, and 7 (internal flash memory enabled) and programming is enabled*. In modes other than 5 to 7, 0 is always read and writing is disabled. This bit is initialized by a reset and in hardware standby mode. It is not initialized in software standby mode. 585 When 1 is written to the RAMS bit, all flash memory blocks are protected from programming and erasing. Bits 2 and 1--RAM2 and RAM1: These bits are used with bit 3 to reassign an area to RAM (See table 19.6). The initial setting for this bit is 0 in modes 5, 6, and 7 (internal flash memory enabled) and programming is enabled*. In modes other than 5 to 7, 0 is always read and writing is disabled. These bits are initialized by a reset and in hardware standby mode. They are not initialized in software standby mode. Bit 0--Reserved: This bit cannot be modified and is always read as 1. Note: * Flash memory emulation by RAM is not supported for mode 6 (single chip normal mode), so programming is possible, but do not set 1. When performing flash memory emulation by RAM, the RAME bit in SYSCR must be set to 1. Table 19.6 RAM Area Setting Bit 3 RAM Area H'FFF000-H'FFF3FF H'000000-H'0003FF H'000400-H'0007FF H'000800-H'000BFF H'000C00-H'000FFF RAMS 0 1 1 1 1 Bit 2 RAM2 0/1 0 0 1 1 Bit 1 RAM1 0/1 0 1 0 1 RAM Emulation Status No emulation Mapping RAM ROM area H'000000 EB0 ROM blocks EB0-EB3 (H'000000- H'000FFF) H'0003FF H'000400 EB1 H'0007FF H'000800 H'000BFF H'000C00 H'000FFF Mapping RAM EB2 EB3 ROM selection area RAM selection area RAM area H'FFEF20 H'FFEFFF H'FFF000 Actual RAM H'FFF3FF H'FFF400 H'FFFF1F RAM overlap area (H'FFF000- H'FFF3FF) Figure 19.2 Example of ROM Area/RAM Area Overlap 586 19.4 19.4.1 Overview of Operation Mode Transitions When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the H8/3062F-ZTAT B-mask version enters one of the operating modes shown in figure 19.3. In user mode, flash memory can be read but not programmed or erased. Flash memory can be programmed and erased in boot mode, user program mode, and PROM mode. Boot mode and user program mode cannot be used in the H8/3062F-ZTAT B-mask version's mode 6 (normal mode with on-chip ROM enabled). 587 *3 *1 Reset state RES = 0 RES = 0 *4 *2 User mode with on-chip ROM enabled FWE = 0 *4 RES = 0 *5 RES = 0 PROM mode User program mode *1 Boot mode On-board programming mode Notes: Only make a transition between user mode and user program mode when the CPU is not accessing the flash memory. *1 RAM emulation possible *2 The H8/3062F-ZTAT B-mask version is placed in PROM mode by means of a dedicated PROM writer. *3 MD2, MD1, MD0 = (1, 0, 1) (1, 1, 0) (1, 1, 1) FWE = 0 *4 MD2, MD1, MD0 = (1, 0, 1) (1, 1, 1) FWE = 1 *5 MD2, MD1, MD0 (0, 0, 1) (0, 1, 1) FWE = 1 Figure 19.3 Flash Memory Related State Transitions State transitions between the normal and user modes and on-board programming mode are performed by changing the FWE pin level from high to low or from low to high. To prevent misoperation (erroneous programming or erasing) in these cases, the bits in the flash memory control register (FLMCR1) should be cleared to 0 before making such a transition. After the bits are cleared, a wait time is necessary. Normal operation is not guaranteed if this wait time is insufficient. 588 19.4.2 On-Board Programming Modes Example of Boot Mode Operation 1. Initial state The old program version or data remains written in the flash memory. The user should prepare the programming control program and new application program beforehand in the host. 2. Programming control program transfer When boot mode is entered, the boot program in the H8/3062F-ZTAT B-mask version (originally incorporated in the chip) is started and the programming control program in the host is transferred to RAM via SCI communication. The boot program required for flash memory erasing is automatically transferred to the RAM boot program area. Host Host Programming control program ;; ;; New application program New application program H8/3062F-ZTAT B-mask version Boot program H8/3062F-ZTAT B-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Boot program area Programming control program Application program (old version) Application program (old version) 3. Flash memory initialization The erase program in the boot program area (in RAM) is executed, and the flash memory is initialized (to H'FF). In boot mode, total flash memory erasure is performed, without regard to blocks. Host 4. Writing new application program An identification check is carried out to see if the programming control program is compatible with the H8/3062F-ZTAT B-mask version. The programming control program transferred from the host to RAM is executed, and the new application program in the host is written into the flash memory. Host New application program H8/3062F-ZTAT B-mask version Boot program H8/3062F-ZTAT B-mask version Boot program SCI SCI Flash memory RAM Flash memory RAM Boot program area Programming control program Boot program area Programming control program Flash memory prewrite-erase New application program Program execution state 589 Example of User Program Mode Operation 1. Initial state The FWE assessment program that confirms that user program mode has been entered, and the program that will transfer the programming/ erase control program from flash memory to on-chip RAM should be written into the flash memory by the user beforehand. The programming/erase control program should be prepared in the host or in the flash memory. Host Programming/erase control program 2. Programming/erase control program transfer When user program mode is entered, user software recognizes this fact, executes the transfer program in the flash memory, and transfers the programming/erase control program to RAM. Host New application program H8/3062F-ZTAT B-mask version Boot program Flash memory FWE assessment program Transfer program New application program H8/3062F-ZTAT B-mask version SCI RAM Boot program Flash memory FWE assessment program Transfer program SCI RAM Programming/erase control program ;;A ; 3. Flash memory initialization The programming/erase program in RAM is executed, and the flash memory is initialized (to H'FF). Erasing can be performed in block units, but not in byte units. Host 4. Writing new application program Next, the new application program in the host is written into the erased flash memory blocks. Do not write to unerased blocks. Host New application program H8/3062F-ZTAT B-mask version Boot program H8/3062F-ZTAT B-mask version Boot program SCI SCI Application program (old version) pplication program (old version) Flash memory RAM Flash memory RAM FWE assessment program Transfer program FWE assessment program Transfer program Programming/erase control program Programming/erase control program Flash memory erase New application program Program execution state 590 19.4.3 Flash Memory Emulation in RAM In the H8/3062F-ZTAT B-mask version, flash memory programming can be emulated in real time by overlapping the flash memory with part of RAM ("overlap RAM"). When the emulation block set in RAMCR is accessed while the emulation function is being executed, data written in the overlap RAM is read. Emulation should be performed in user mode or user program mode. SCI Flash memory Emulation block RAM Overlap RAM Application program Execution state (Emulation is performed on data written in RAM) Figure 19.4 Reading Overlap RAM Data in User Mode/User Program Mode When overlap RAM data is confirmed, clear the RAMS bit to cancel RAM overlap, and actually perform writes to the flash memory in user program mode. When the programming control program is transferred to RAM in on-board programming mode, ensure that the transfer destination and the overlap RAM do not overlap, as this will cause data in the overlap RAM to be rewritten. 591 SCI Flash memory Program data RAM Application program Overlap RAM (program data) Programming control program Execution state Figure 19.5 Writing Overlap RAM Data in User Program Mode 19.4.4 Block Configuration The flash memory in the H8/3062F-ZTAT B-mask version is divided into three 32-kbyte blocks, one 28-kbyte block, and four 1-kbyte blocks. Erasing can be carried out in block units. Address H'00000 1 kbyte x 4 28 kbytes 32 kbytes 128 kbytes 32 kbytes 32 kbytes Address H'1FFFF 592 19.5 On-Board Programming Mode When pins are set to on-board programming mode and a reset-start is executed, the chip enters the on-board programming state in which on-chip flash memory programming, erasing, and verifying can be carried out. There are two operating modes in this mode--boot mode and user program mode. The pin settings for entering each mode are shown in table 19.7. For a diagram of the transitions to the various flash memory modes, see figure 19.3. Boot mode and user program mode cannot be used in the H8/3062F-ZTAT B-mask version's mode 6 (on-chip ROM enabled). Table 19.7 On-Board Programming Mode Settings Mode Boot mode Mode 5 Mode 7 User program mode Mode 5 Mode 7 FWE 1* 1 MD2 0* 0* 1 1 2 2 MD1 0 1 0 1 MD0 1 1 1 1 Notes: *1 For the High level input timing, see items 6 and 7 of "Notes on Using the Boot Mode" in section 18.5.1. *2 In boot mode, the MD 2 setting should be the inverse of the input. In the boot mode in the H8/3062F-ZTAT B-mask version, the levels of the mode pins (MD2 to MD0) are reflected in mode select bits 2 to 0 (MDS2 to MDS0) in the mode control register (MDCR). 593 19.5.1 Boot Mode When boot mode is used, a flash memory programming control program must be prepared beforehand in the host, and SCI channel 1, which is to be used, must be set to asynchronous mode. When a reset-start is executed after setting the H8/3062F-ZTAT B-mask version' pins to boot mode, the boot program already incorporated in the MCU is activated, and the programming control program prepared beforehand in the host is transmitted sequentially to the H8/3062FZTAT B-mask version, using the SCI. In the H8/3062F-ZTAT B-mask version, the programming control program received via the SCI is written into the programming control program area in onchip RAM. After the transfer is completed, an identification check (ID code check) is carried out to see if the programming control program is compatible with the H8/3062F-ZTAT B-mask version. If the ID code matches, control branches to the start address (H'FFF520) of the programming control program area and the programming control program execution state is entered (flash memory programming/erasing can be performed). Figure 19.6 shows a system configuration diagram when using boot mode, and figure 19.7 shows the boot program mode execution procedure. H8/3062F-ZTAT B-mask version Flash memory Host Reception of programming data Transmission of verify data RxD1 SCI1 TxD1 On-chip RAM Figure 19.6 System Configuration When Using Boot Mode 594 Start Set pins to boot program mode and execute reset-start Host transfers data (H'00) continuously at prescribed bit rate H8/3062F-ZTAT B-mask version measures low period of H'00 data transmitted by host H8/3062F-ZTAT B-mask version calculates bit rate and sets value in bit rate register After bit rate adjustment, H8/3062F-ZTAT B-mask version transmits one H'00 data byte to host to indicate end of adjustment Host confirms normal reception of bit rate adjustment end indication (H'00), and transmits one H'55 data byte After receiving H'55, H8/3062F-ZTAT B-mask version transmits one H'AA byte to host Host transmits number of programming control program bytes (N), upper byte followed by lower byte H8/3062F-ZTAT B-mask version transmits received number of bytes to host as verify data (echo-back) n=1 Host transmits programming control program sequentially in byte units H8/3062F-ZTAT B-mask version transmits received programming control program to host as verify data (echo-back) Transfer received programming control program to on-chip RAM n = N? Yes End of transmission Check flash memory data, and if data has already been written, erase all blocks Confirm that all flash memory data has been erased Check ID code at beginning of user program transfer area (Match) Transmit one H'AA byte to host Execute programming control program transferred to on-chip RAM Notes: 1. If a memory cell does not operate normally and cannot be erased, one H'FF byte is transmitted as an erase error indication, and the erase operation and subsequent operations are halted. 2. Shading indicates a difference from the H8/3062F-ZTAT R-mask version. (Mismatch) No n+1n Transmit H'FF as error notification Figure 19.7 Boot Mode Execution Procedure 595 Automatic SCI Bit Rate Adjustment: Start bit D0 D1 D2 D3 D4 D5 D6 D7 Stop bit Low period (9 bits) measured (H'00 data) High period (1 or more bits) When boot mode is initiated, the H8/3062F-ZTAT B-mask version measures the low period of the asynchronous SCI communication data (H'00) transmitted continuously from the host. The SCI transmit/receive format should be set as 8-bit data, 1 stop bit, no parity. The H8/3062F-ZTAT Bmask version calculates the bit rate of the transmission from the host from the measured low period, and transmits one H'00 byte to the host to indicate the end of bit rate adjustment. The host should confirm that this adjustment end indication (H'00) has been received normally, and transmit one H'55 byte to the H8/3062F-ZTAT B-mask version. If reception cannot be performed normally, initiate boot mode again (reset), and repeat the above operations. Depending on the host's transmission bit rate and the H8/3062F-ZTAT B-mask version's system clock frequency, there will be a discrepancy between the bit rates of the host and the H8/3062F-ZTAT B-mask version. To ensure correct SCI operation, the host's transfer bit rate should be set to 4800, 9600, or 19,200 bps*. Table 19.8 shows typical host transfer bit rates and system clock frequencies for which automatic adjustment of the H8/3062F-ZTAT B-mask version bit rate is possible. The boot program should be executed within this system clock range. Table 19.8 System Clock Frequencies for which Automatic Adjustment of H8/3062F-ZTAT B-Mask Version Bit Rate is Possible Host Bit Rate (bps) 19,200 9,600 4,800 System Clock Frequency for which Automatic Adjustment of H8/3062F-ZTAT B-Mask Version Bit Rate is Possible (MHz) 16 to 25 8 to 25 4 to 25 Note: * Only use a setting of 4800, 9600, or 19200 for the host's bit rate. No other settings can be used. Although the H8/3062F-ZTAT B-mask version may also perform automatic bit rate adjustment with bit rate and system clock combinations other than those shown in table 19.8, a degree of error will arise between the bit rates of the host and the MCU, and subsequent transfer will not be performed normally. Therefore, only a combination of bit 596 rate and system clock frequency within one of the ranges shown in table 19.8 can be used for boot mode execution. On-Chip RAM Area Divisions in Boot Mode: In boot mode, the RAM area is divided into an area used by the boot program and an area to which the user program is transferred via the SCI, as shown in figure 19.8. The boot program area becomes available when a transition is made to the execution state for the user program transferred to RAM. H'FFEF20 Boot program area ID code area (8 bytes) H'FFF51F H'FFF520 User program transfer area H'FFFF1F Note: The boot program area cannot be used until a transition is made to the execution state for the user program transferred to RAM. Note also that the boot program remains in this area in RAM even after control branches to the user program. Figure 19.8 RAM Areas in Boot Mode In boot mode in the H8/3062F-ZTAT B-mask version, the contents of the 8-byte ID code area shown below are checked to determine whether the program is a programming control program compatible with the H8/3062F-ZTAT B-mask version. H'FFF520 40 FE 61 66 33 30 36 32 (Product ID code) H'FFF528... Programming control program instruction codes If an original programming control program is used in boot mode, the 8-byte ID code shown above should be added at the beginning of the program. 597 Notes on Use of Boot Mode: 1. When the H8/3062F-ZTAT B-mask version chip comes out of reset in boot mode, it measures the low period of the input at the SCI's RxD1 pin. The reset should end with RxD1 high. After the reset ends, it takes about 100 states for the chip to get ready to measure the low period of the RxD 1 input. 2. In boot mode, if any data has been programmed into the flash memory (if all data is not 1), all flash memory blocks are erased. Boot mode is for use when user program mode is unavailable, such as the first time on-board programming is performed, or if the program activated in user program mode is accidentally erased. 3. Interrupts cannot be used while the flash memory is being programmed or erased. 4. The RxD1 and TxD1 lines should be pulled up on the board. 5. Before branching to the user program the H8/3062F-ZTAT B-mask version terminates transmit and receive operations by the on-chip SCI (channel 1) (by clearing the RE and TE bits to 0 in the serial control register (SCR)), but the adjusted bit rate value remains set in the bit rate register (BRR). The transmit data output pin, TxD1, goes to the high-level output state (P91DDR = 1 in P9DDR, P91DR = 1 in P9DR). The contents of the CPU's internal general registers are undefined at this time, so these registers must be initialized immediately after branching to the user program. In particular, since the stack pointer (SP) is used implicitly in subroutine calls, etc., a stack area must be specified for use by the user program. The initial values of other on-chip registers are not changed. 6. Boot mode can be entered by setting pins MD0 to MD2 and FWE in accordance with the mode setting conditions shown in table 19.6, and then executing a reset-start. a. When switching from boot mode to normal mode, the boot mode state within the chip must first be cleared by reset input via the RES pin*1. The RES pin must be held low for at least 20 system clock cycles*2. b. Do not change the input levels of the mode pins (MD2 to MD0) or the FWE pin in boot mode. To change the mode, the RES pin must first be driven low to set the reset state. Also, if a watchdog timer reset occurs in the boot mode state, the MCU's internal state will not be cleared, and the on-chip boot program will be restarted regardless of the mode pin states. c. The FWE pin must not be driven low while the boot program is running or flash memory is being programmed or erased*3. 7. If the mode pin input levels are changed (for example, from low to high) during a reset, the state of ports with multiplexed address functions and bus control output signals (CSn, AS, RD, LWR, HWR) may also change according to the change in the MCU's operating mode. Therefore, care must be taken to make pin settings to prevent these pins from being used directly as output signal pins during a reset, or to prevent collision with signals outside the MCU. 598 H8/3062F-ZTAT B-mask version CSn External memory, etc. MD2 MD1 MD0 FWE RES System control unit Notes: *1 Mode pin and FWE pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. *2 See section 4.2.2, Reset Sequence, and section 19.11, Flash Memory Programming and Erasing Precautions. The H8/3062F-ZTAT B-mask version requires a minimum of 20 system clock cycles for a reset during operation. *3 For further information on FWE application and disconnection, see section 19.11, Flash Memory Programming and Erasing Precautions. 19.5.2 User Program Mode When set to user program mode, the H8/3062F-ZTAT B-mask version can program and erase its flash memory by executing a user program/erase control program. Therefore, on-board reprogramming of the on-chip flash memory can be carried out by providing on-board means of FWE control and supply of programming data, and storing a program/erase control program in part of the program area as necessary. To select user program mode, select a mode that enables the on-chip ROM (mode 5 or 7), and apply a high level to the FWE pin. In this mode, on-chip supporting modules other than flash memory operate as they normally would in modes 5 and 7. Flash memory programming/erasing should not be carried out in mode 6. When mode 6 is set, the FWE pin must be driven low. The flash memory itself cannot be read while being programmed or erased, so the program that performs programming should be placed in external memory or transferred to RAM and executed there. Figure 19.9 shows the execution procedure when user program mode is entered during program execution in RAM. It is also possible to start from user program mode in a reset-start. 599 Write FWE assessment program and transfer program (and programming/erase control program if necessary) beforehand MD2 to MD0 = 101 or 111 Reset-start Transfer programming/erase control program to RAM Branch to programming/erase control program in RAM area FWE = High (user program mode) Execute programming/erase control program in RAM (flash memory rewriting) Clear SWE bit, then release FWE (user program mode clearing) Branch to application program in flash memory Notes: 1. Do not apply a constant high level to the FWE pin. A high level should be applied to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation by RAM). Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 2. For further information on FWE application and disconnection, see section 19.11, Flash Memory Programming and Erasing Precautions. 3. In order to execute a normal read of flash memory in user program mode, the programming/erase program must not be executing. It is thus necessary to ensure that bits 6 to 0 in FLMCR1 are cleared to 0. Figure 19.9 Example of User Program Mode Execution Procedure 600 19.6 Flash Memory Programming/Erasing A software method, using the CPU, is employed to program and erase flash memory in the onboard programming modes. There are four flash memory operating modes: program mode, erase mode, program-verify mode, and erase-verify mode. Transitions to these modes for addresses H'000000 to H'01FFFF are made by setting the PSU, ESU, P, E, PV, and EV bits in FLMCR1. The flash memory cannot be read while being programmed or erased. Therefore, the program (user program) that controls flash memory programming/erasing should be located and executed in on-chip RAM or external memory. See section 19.11, Flash Memory Programming and Erasing Precautions, for points to be noted when programming or erasing the flash memory. In the following operation descriptions, wait times after setting or clearing individual bits in FLMCR1 are given as parameters; for details of the wait times, see section 22.5.6, Flash Memory Characteristics. Notes: 1. Operation is not guaranteed if setting/resetting of the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 is executed by a program in flash memory. 2. When programming or erasing, set FWE to 1 (Programming/erasing will not be executed if FWE = 0). 3. Programming must be executed in the erased state. Do not perform additional programming on addresses that have already been programmed. 601 *3 E=1 Erase setup state E=0 Normal mode ESU = 1 *1 ESU = 0 Erase-verify mode Erase mode FWE = 1 FWE = 0 *2 EV = 1 EV = 0 PSU = 1 PSU = 0 On-board SWE = 1 Software programming mode programming Software programming enable disable state SWE = 0 state *4 P=1 Program setup state P=0 Program mode PV = 1 PV = 0 Program-verify mode Notes: In order to perform a normal read of flash memory, SWE must be cleared to 0. Also note that verify-reads can be performed during the programming/erasing process. *1 : Normal mode : On-board programming mode *2 Do not make a state transition by setting or clearing multiple bits simultaneously. *3 After a transition from erase mode to the erase setup state, do not enter erase mode without passing through the software programming enable state. *4 After a transition from program mode to the program setup state, do not enter program mode without passing through the software programming enable state. Figure 19.10 FLMCR1 Bit Settings and State Transitions 602 19.6.1 Program Mode When writing data or programs to flash memory, the program/program-verify flowchart shown in figure 19.11 should be followed. Performing programming operations according to this flowchart will enable data or programs to be written to flash memory without subjecting the device to voltage stress or sacrificing program data reliability. Programming should be carried out 128 bytes at a time. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of programming operations (N) are shown in table 22.40 in section 22.5.6, Flash Memory Characteristics. Following the elapse of (tsswe ) s or more after the SWE bit is set to 1 in FLMCR1, 128-byte data is written consecutively to the write addresses. The lower 8 bits of the first address written to must be H'00 and H'80, 128 consecutive byte data transfers are performed. The program address and program data are latched in the flash memory. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. Next, the watchdog timer (WDT) is set to prevent overprogramming due to program runaway, etc. Set a value greater than (tspsu + tsp + tcp + tcpsu) s as the WDT overflow period. Preparation for entering program mode (program setup) is performed next by setting the PSU bit in FLMCR1. The operating mode is then switched to program mode by setting the P bit in FLMCR1 after the elapse of at least (tspsu ) s. The time during which the P bit is set is the flash memory programming time. Make a program setting so that the time for one programming operation is within the range of (tsp) s. The wait time after P bit setting must be changed according to the degree of progress through the programming operation. For details see "Notes on Program/Program-Verify Procedure" below. 603 19.6.2 Program-Verify Mode In program-verify mode, the data written in program mode is read to check whether it has been correctly written in the flash memory. After the elapse of the given programming time, clear the P bit in FLMCR1, then wait for at least (tcp) s before clearing the PSU bit to exit program mode. After exiting program mode, the watchdog timer setting is also cleared. The operating mode is then switched to program-verify mode by setting the PV bit in FLMCR1. Before reading in program-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tspv) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (t spvr) s after the dummy write before performing this read operation. Next, the originally written data is compared with the verify data, and reprogram data is computed (see figure 19.11) and transferred to RAM. After verification of 128 bytes of data has been completed, exit program-verify mode, wait for at least (tcpv) s, then clear the SWE bit in FLMCR1. If reprogramming is necessary, set program mode again, and repeat the program/program-verify sequence as before. The maximum number of repetitions of the program/program-verify sequence is indicated by the maximum programming count (N). Leave a wait time of at least (tcswe) s after clearing SWE. Notes on Program/Program-Verify Procedure 1. The program/program-verify procedure for the H8/3062F-ZTAT B-mask version uses a 128byte-unit programming algorithm. Note that this is different from the procedure in the H8/3062F-ZTAT and the H8/3062F-ZTAT R-mask version (32-byte-unit programming). In order to perform 128-byte-unit programming, the lower 8 bits of the write start address must be H'00 or H'80. 2. When performing continuous writing of 128-byte data to flash memory, byte-unit transfer should be used. 128-byte data transfer is necessary even when writing fewer than 128 bytes of data. Write H'FF data to the extra addresses. 3. Verify data is read in word units. 4. The write pulse is applied and a flash memory write executed while the P bit in FLMCR1 is set. In the H8/3062F-ZTAT B-mask version, write pulses should be applied as follows in the program/program-verify procedure to prevent voltage stress on the device and loss of write data reliability. a. After write pulse application, perform a verify-read in program-verify mode and apply a write pulse again for any bits read as 1 (reprogramming processing). When all the 0-write bits in the 128-byte write data are read as 0 in the verify-read operation, the program/program-verify procedure is completed. In the H8/3062F-ZTAT B-mask version, 604 the number of loops in reprogramming processing is guaranteed not to exceed the maximum value of the maximum programming count (N). b. After write pulse application, a verify-read is performed in program-verify mode, and programming is judged to have been completed for bits read as 0. The following processing is necessary for programmed bits. When programming is completed at an early stage in the program/program-verify procedure: If programming is completed in the 1st to 6th reprogramming processing loop, additional programming should be performed on the relevant bits. Additional programming should only be performed on bits which first return 0 in a verify-read in certain reprogramming processing. When programming is completed at a late stage in the program/program-verify procedure: If programming is completed in the 7th or later reprogramming processing loop, additional programming is not necessary for the relevant bits. c. If programming of other bits is incomplete in the 128 bytes, reprogramming processing should be executed. If a bit for which programming has been judged to be completed is read as 1 in a subsequent verify-read, a write pulse should again be applied to that bit. 5. The period for which the P bit in FLMCR1 is set (the write pulse width) should be changed according to the degree of progress through the program/program-verify procedure. For detailed wait time specifications, see section 22.5.6, Flash Memory Characteristics. Item Wait time after P bit setting Symbol t sp Item When reprogramming loop count (n) is 1 to 6 When reprogramming loop count (n) is 7 or more In case of additional programming processing * Symbol t sp30 t sp200 t sp10 Note: * Additional programming processing is necessary only when the reprogramming loop count (n) is 1 to 6. 6. The program/program-verify flowchart for the H8/3062F-ZTAT B-mask version is shown in figure 19.11. To cover the points noted above, bits on which reprogramming processing is to be executed, and bits on which additional programming is to be executed, must be determined as shown below. Since reprogram data and additional-programming data vary according to the progress of the programming procedure, it is recommended that the following data storage areas (128 bytes each) be provided in RAM. 605 Reprogram Data Computation Table Result of Verify-Read after Write Pulse (X) Application (V) Result of Operation 0 1 0 1 1 0 1 1 (D) 0 0 1 1 Comments Programming completed: reprogramming processing not to be executed Programming incomplete: reprogramming processing to be executed Still in erased state: no action Legend: (D): Source data of bits on which programming is executed (X): Source data of bits on which reprogramming is executed Additional-Programming Data Computation Table Result of Verify-Read after Write Pulse (Y) (X') Application (V) Result of Operation 0 0 0 Comments Programming by write pulse application judged to be completed: additional programming processing to be executed Programming by write pulse application incomplete: additional programming processing not to be executed Programming already completed: additional programming processing not to be executed Still in erased state: no action 0 1 1 1 1 0 1 1 1 Legend: (X'): Data of bits on which reprogramming is executed in a certain reprogramming loop (Y): Data of bits on which additional programming is executed 7. It is necessary to execute additional programming processing during the course of the H8/3062F-ZTAT B-mask version program/program-verify procedure. However, once 128byte-unit programming is finished, additional programming should not be carried out on the same address area. When executing reprogramming, an erase must be executed first. Note that normal operation of reads, etc., is not guaranteed if additional programming is performed on addresses for which a program/program-verify operation has finished. 606 Write pulse application subroutine Start of programming START Set SWE bit in FLMCR1 Wait (tsswe) s Store 128-byte program data in program data area and reprogram data area Sub-Routine Write Pulse WDT enable Set PSU in FLMCR1 Wait (tspsu) s Set P bit in FLMCR1 Wait (tsp) s Clear P bit in FLMCR1 Wait (tcp) s Clear PSU bit in FLMCR1 Wait (tcpsu) s Disable WDT Perform programming in the erased state. Do not perform additional programming on previously programmed addresses. *7 *4 *7 Start of programming *5 *7 n= 1 m= 0 Write 128-byte data in RAM reprogram data area consecutively to flash memory *1 Programming halted *7 Sub-Routine-Call Write pulse See Note *6 for pulse width Set PV bit in FLMCR1 Wait (tspv) s H'FF dummy write to verify address *7 *7 Wait (tspvr) s Read verify data Increment address *7 *2 nn+1 End Sub Note *6: Write Pulse Width Number of Writes n Write Time (tsp) s Write data = verify data? NG m=1 NG 1 2 3 4 5 6 7 8 9 10 11 12 13 30 30 30 30 30 30 200 200 200 200 200 200 200 OK 6n? OK Additional-programming data computation Transfer additional-programming data to additional-programming data area Reprogram data computation *4 *3 *4 Transfer reprogram data to reprogram data area 128-byte data verification completed? NG 998 999 1000 200 200 200 OK Clear PV bit in FLMCR1 Reprogram Wait (tcpv) s 6 n? NG *7 Note: Use a 10 s write pulse for additional programming. RAM Program data storage area (128 bytes) OK Successively write 128-byte data from additional*1 programming data area in RAM to flash memory Sub-Routine-Call Write Pulse (Additional programming) Reprogram data storage area (128 bytes) m= 0 ? OK Clear SWE bit in FLMCR1 Wait (tcswe) s End of programming NG *7 n N? NG Additional-programming data storage area (128 bytes) OK Clear SWE bit in FLMCR1 Wait (tcswe) s Programming failure *7 Notes: *1 Data transfer is performed by byte transfer. The lower 8 bits of the first address written to must be H'00 or H'80. A 128-byte data transfer must be performed even if writing fewer than 128 bytes; in this case, H'FF data must be written to the extra addresses. *2 Verify data is read in 16-bit (longword) units. *3 Reprogram data is determined by the operation shown in the table below (comparison between the data stored in the program data area and the verify data). Bits for which the reprogram data is 0 are programmed in the next reprogramming loop. Therefore, even bits for which programming has been completed will be subjected to programming once again if the result of the subsequent verify operation is NG. *4 A 128-byte area for storing program data, a 128-byte area for storing reprogram data, and a 128-byte area for storing additional data must be provided in RAM. The contents of the reprogram data area and additional data area are modified as programming proceeds. *5 A write pulse of 30 s or 200 s is applied according to the progress of the programming operation. See Note 6 for details of the pulse widths. When writing of additional-programming data is executed, a 10 s write pulse should be applied. Reprogram data X' means reprogram data when the write pulse is applied. *7 The wait times and value of N are shown in section 22.5.6, Flash Memory. Reprogram Data Computation Table Original Data Verify Data Reprogram Data Additional-Programming Data Computation Table (X) 1 0 1 1 Still in erased state; no action Comments Programming completed Programming incomplete; reprogram (D) 0 0 1 1 (V) 0 1 0 1 Reprogram Data (X') 0 0 1 1 Verify Data Additional(V) Programming Data (Y) 0 1 0 1 0 1 1 1 Comments Additional programming to be executed Additional programming not to be executed Additional programming not to be executed Additional programming not to be executed Figure 19.11 Program/Program-Verify Flowchart (128-Byte Programming) 607 19.6.3 Erase Mode When erasing flash memory, the single-block erase flowchart shown in figure 19.12 should be followed. The wait times after bits are set or cleared in the flash memory control register 1 (FLMCR1) and the maximum number of erase operations (N) are shown in table 22.40 in section 22.5.6, Flash Memory Characteristics. To erase flash memory contents, make a 1-bit setting for the flash memory area to be erased in erase block register (EBR) at least (tsswe) s after setting the SWE bit to 1 in FLMCR1. Next, the watchdog timer (WDT) is set to prevent overerasing due to program runaway, etc. Set a value greater than (tse) ms + (tsesu + tce + tcesu) s as the WDT overflow period. Preparation for entering erase mode (erase setup) is performed next by setting the ESU bit in FLMCR1. The operating mode is then switched to erase mode by setting the E bit in FLMCR1 after the elapse of at least (tsesu) s. The time during which the E bit is set is the flash memory erase time. Ensure that the erase time does not exceed (tse) ms. Note: With flash memory erasing, preprogramming (setting all memory data in the memory to be erased to all 0) is not necessary before starting the erase procedure. 19.6.4 Erase-Verify Mode In erase-verify mode, data is read after memory has been erased to check whether it has been correctly erased. After the elapse of the fixed erase time, clear the E bit in FLMCR1, then wait for at least (tce) s before clearing the ESU bit to exit erase mode. After exiting erase mode, the watchdog timer setting is also cleared. The operating mode is then switched to erase-verify mode by setting the EV bit in FLMCR1. Before reading in erase-verify mode, a dummy write of H'FF data should be made to the addresses to be read. The dummy write should be executed after the elapse of (tsev) s or more. When the flash memory is read in this state (verify data is read in 16-bit units), the data at the latched address is read. Wait at least (t sevr) s after the dummy write before performing this read operation. If the read data has been erased (all 1), a dummy write is performed to the next address, and erase-verify is performed. If the read data is unerased, set erase mode again, and repeat the erase/erase-verify sequence as before. The maximum number of repetitions of the erase/erase-verify sequence is indicated by the maximum erase count (N). When verification is completed, exit erase-verify mode, and wait for at least (tcev) s. If erasure has been completed on all the erase blocks, clear the SWE bit in FLMCR1, and leave a wait time of at least (tcswe) s. If erasing multiple blocks, set a single bit in EBR for the next block to be erased, and repeat the erase/erase-verify sequence as before. 608 Start *1 Perform erasing in block units. Set SWE bit in FLMCR1 Wait (tsswe) s n=1 Set EBR Enable WDT Set ESU bit in FLMCR1 Wait (tsesu) s Set E bit in FLMCR1 Wait (tse) ms Clear E bit in FLMCR1 Wait (tce) s Clear ESU bit in FLMCR1 Wait (tcesu) s Disable WDT Set EV bit in FLMCR1 Wait (tsev) s Set block start address as verify address *5 *5 *5 *3, *4 *5 Start of erase *5 Erase halted *5 nn+1 H'FF dummy write to verify address Wait (tsevr) s Increment address Read verify data Verify data = all 1s? Yes No Last address of block? Yes Clear EV bit in FLMCR1 Wait (tcev) s Clear EV bit in FLMCR1 Wait (tcev) s *5 *5 *2 No *5 *5 n N? Clear SWE bit in FLMCR1 Wait (tcswe) s End of erasing *5 No Yes Clear SWE bit in FLMCR1 Wait (tcswe) s Erase failure *5 Notes: *1 *2 *3 *4 *5 Prewriting (setting erase block data to all 0s) is not necessary. Verify data is read in 16-bit (word) units. Make only a single-bit specification in the erase block register (EBR). Two or more bits must not be set simultaneously. Erasing is performed in block units. To erase multiple blocks, each block must be erased in turn. The wait times and the value of N are shown in section 22.5.6, Flash Memory Characteristics. Figure 19.12 Erase/Erase-Verify Flowchart (Single-Block Erasing) 609 19.7 Flash Memory Protection There are three kinds of flash memory program/erase protection: hardware, software, and error protection. 19.7.1 Hardware Protection Hardware protection refers to a state in which programming/erasing of flash memory is forcibly disabled or aborted. In this state, the settings in flash memory control register 1 (FLMCR1) and erase block register (EBR) are reset. In the error protection state, the FLMCR1 and EBR settings are retained; the P bit and E bit can be set, but a transition is not made to program mode or erase mode (See table 19.9). Table 19.9 Hardware Protection Function Item FWE pin protection Description * When a low level is input to the FWE pin, FLMCR1 and EBR are initialized, and the program/erase-protected state is entered. In a reset (including a WDT overflow reset) and in standby mode, FLMCR1 and EBR are initialized, and the program/erase-protected state is entered. In a reset via the RES pin, the reset state is not entered unless the RES pin is held low until oscillation stabilizes after powering on. In the case of a reset during operation, hold the RES pin low for the RES pulse width specified in the AC Characteristics section * 4. Not When a microcomputer operation error (error generation (FLER = 1)) was detected while flash possible memory was being programmed/erased, error protection is enabled. At this time, the FLMCR1 and EBR settings are held, but programming/erasing is aborted at the time the error was generated. Error protection is released only by a reset via the RES pin or a WDT reset, or in the hardware standby mode. Not Possible* possible* 3 2 Program Erase Verify Not Not Not possible* 1 possible* 3 possible Reset/ standby protection * Not possible Not Not possible* 3 possible * Error protection * Notes: *1 The RAM area that overlapped flash memory is deleted. *2 It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify operation on the block being erased. 610 *3 All blocks are unerasable and block-by-block specification is not possible. *4 See section 4.2.2, Reset Sequence, and section 19.11, Flash Memory Programming and Erasing Precautions. The H8/3062F-ZTAT B-mask version requires a minimum of 20 system clock cycles for a reset during operation. 19.7.2 Software Protection Software protection can be implemented by setting the erase block register (EBR) and the RAMS bit in the RAM control register (RAMCR). With software protection, setting the P or E bit in the flash memory control register 1 (FLMCR1) does not cause a transition to program mode or erase mode (See table 19.10). Table 19.10 Software Protection Functions Item Block protection Description * Program Erase Not possible Verify Possible -- Erase protection can be set for individual blocks by settings in erase block register (EBR)*2. However, programming protection is disabled. * Setting EBR to H'00 places all blocks in the erase-protected state. Emulation protection * Setting the RAMS bit 1 in RAMCR places all blocks in the program/erase-protected state. Not possible* 1 Not possible* 3 Possible Notes: *1 The RAM area overlapping flash memory can be written to. *2 When not erasing, set EBR to H'00. *3 All blocks are unerasable and block-by-block specification is not possible. 19.7.3 Error Protection In error protection, an error is detected when MCU runaway occurs during flash memory programming/erasing*1, or operation is not performed in accordance with the program/erase algorithm, and the program/erase operation is aborted. Aborting the program/erase operation prevents damage to the flash memory due to overprogramming or overerasing. If the MCU malfunctions during flash memory programming/erasing, the FLER bit is set to 1 in the flash memory status register (FLMSR2) and the error protection state is entered. FLMCR1, FLMCR2, and EBR settings*3 are retained, but program mode or erase mode is aborted at the point at which the error occurred. Program mode or erase mode cannot be re-entered by re-setting the P or E bit in FLMCR. However, PV and EV bit setting is enabled, and a transition can be made to verify mode*2. 611 FLER bit setting conditions are as follows: 1. When flash memory is read during programming/erasing (including a vector read or instruction fetch) 2. Immediately after the start of exception handling during programming/erasing (excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling) 3. When a SLEEP instruction (including software standby) is executed during programming/erasing 4. When the bus is released during programming/erasing Error protection is released only by a RES pin or WDT reset, or in hardware standby mode. Notes: *1 State in which the P bit or E bit in FLMCR1 is set to 1. Note that NMI input is disabled in this state. *2 It is possible to perform a program-verify operation on the 128 bytes being programmed, or an erase-verify on the block being erased. *3 FLMCR1 and EBR can be written to. However, the registers are initialized if a transition is made to software standby mode while in the error protection state. Figure 19.13 shows the flash memory state transition diagram. 612 Program mode Erase mode RD VF PR ER FLER = 0 RES = 0 or STBY = 0 Reset or standby (hardware protection) RD VF PR ER INIT FLER = 0 Error occurrence (software standby) Error occurrence RES = 0 or STBY = 0 RES = 0 or STBY = 0 FLMCR1, FLMCR2, EBR1, EBR2 initialization state Error protection mode RD VF PR ER FLER = 1 Software standby mode Software standby mode release Error protection mode (software standby) RD VF PR ER INIT FLER = 1 FLMCR1, EBR initialization state RD VF PR ER : : : : Memory read possible Verify-read possible Programming possible Erasing possible RD VF PR ER INIT : : : : : Memory read not possible Verify-read not possible Programming not possible Erasing not possible Register initialization state Figure 19.13 Flash Memory State Transitions (When High Level is Applied to FWE Pin in Mode 5 or 7 (On-Chip ROM Enabled)) The error protection function is invalid for abnormal operations other than the FLER bit setting conditions. Also, if a certain time has elapsed before this protection state is entered, damage may already have been caused to the flash memory. Consequently, this function cannot provide complete protection against damage to flash memory. To prevent such abnormal operations, therefore, it is necessary to ensure correct operation in accordance with the program/erase algorithm, with the flash write enable (FWE) voltage applied, and to conduct constant monitoring for MCU errors, internally and externally, using the watchdog timer or other means. There may also be cases where the flash memory is in an erroneous programming or erroneous erasing state at the point of transition to this protection mode, or where programming or erasing is not properly carried out because of an abort. In cases such as these, a forced recovery (program rewrite) must be executed using boot mode. However, it may also happen that boot mode cannot be normally initiated because of overprogramming or overerasing. 613 19.8 Flash Memory Emulation in RAM As flash memory programming and erasing takes time, it may be difficult to carry out tuning by writing parameters and other data in real time. In this case, real-time programming of flash memory can be emulated by overlapping part of RAM (H'FFF000-H'FFF3FF) onto a small block area in flash memory. This RAM area change is executed by means of bits 3 to 1 in the RAM control register (RAMCR). After the RAM area change, access is possible both from the area overlapped onto flash memory and from the original area (H'FFF000-H'FFF3FF). For details of RAMCR and the RAM area setting method, see section 19.3.4, RAM Control Register (RAMCR). Example of Emulation of Real-Time Flash Memory Programming: In the following example, RAM area H'FFF000-H'FFF3FF is overlapped onto flash memory area EB2 (H'FFF000- H'FFF3FF). Procedure: 1. Part of RAM (H'FFF000-H'FFF3FF) is overlapped onto the area (EB2) requiring real-time programming (RAMCR bits 3 to 1 are set to 1, 1, 0, and the flash memory area to be overlapped (EB2) is selected). Overlapping ram EB2 H'000800 area H'000BFF H'000FFF * (Mapping RAM area) 2. Real-time programming is performed using the overlapping RAM. H'000000 Flash memory space Block area H'FFEF20 3. The programmed data is checked, then RAM overlapping is cleared (RAMS bit is cleared). On-chip RAM area 4. The data written in RAM area H'FFF000-H'FFF3FF is written to flash memory space. H'FFEFFF H'FFF000 H'FFF3FF H'FFF400 H'FFFF1F (Actual RAM area) Note: * When part of RAM (H'FFF000-H'FFF3FF) is overlapped onto a flash memory small block area, the flash memory in the overlapped area cannot be accessed. It can be accessed when the overlapping is cleared. Figure 19.14 Example of RAM Overlap Operation 614 Notes on Use of Emulation in RAM: 1. Flash write enable (FWE) application and releasing As in on-board program mode, care is required when applying and releasing FWE to prevent erroneous programming or erasing. To prevent erroneous programming and erasing due to program runaway during FWE application, in particular, the watchdog timer should be set when the PSU, P, ESU, or E bit is set to 1 in FLMCR1, even while the emulation function is being used. For details, see section 19.11, Flash Memory Programming and Erasing Precautions. 2. NMI input disabling conditions When the emulation function is used, NMI input is disabled when the P bit or E bit is set to 1 in FLMCR1, in the same way as with normal programming and erasing. The P and E bits are cleared by a reset (including a watchdog timer reset), in standby mode, when a high level is not being input to the FWE pin, or when the SWE bit in FLMCR1 is 0 while a high level is being input to the FWE pin. 3. When the RAMS bit is set to 1, program/erase protection is enabled for all blocks regardless of the value of RAM2 to RAM0 (emulation protection). In this state, setting the P or E bit in FLMCR1 will not cause a transition to program mode or erase mode. When actually programming or erasing a flash memory area, the RAMS bit should be cleared to 0. 4. A RAM area cannot be erased by execution of software in accordance with the erase algorithm while flash memory emulation in RAM is being used. 5. Block area EB0 contains the vector table. When performing RAM emulation, the vector table is needed in the overlap RAM. 19.9 NMI Input Disabling Conditions All interrupts, including NMI input, should be disabled while flash memory is being programmed or erased (while the P bit or E bit is set in FLMCR1), and while the boot program is executing in boot mode*1, to give priority to the program or erase operation. There are three reasons for this: 1. NMI input during programming or erasing might cause a violation of the programming or erasing algorithm, with the result that normal operation could not be assured. 2. In the NMI exception handling sequence during programming or erasing, the vector would not be read correctly*2, possibly resulting in MCU runaway. 3. If NMI input occurred during boot program execution, it would not be possible to execute the normal boot mode sequence. For these reasons, in on-board programming mode alone there are conditions for disabling NMI input, as an exception to the general rule. However, this provision does not guarantee normal erasing and programming or MCU operation. All interrupt requests (exception handling and bus release), including NMI, must therefore be restricted inside and outside the MCU during FWE 615 application. NMI input is also disabled in the error protection state and while the P or E bit remains set in FLMCR1 during flash memory emulation in RAM. Notes: *1 This is the interval until a branch is made to the boot program area in the on-chip RAM (This branch takes place immediately after transfer of the user program is completed). Consequently, after the branch to the RAM area, NMI input is enabled except during programming and erasing. Interrupt requests must therefore be disabled inside and outside the MCU until the user program has completed initial programming (including the vector table and the NMI interrupt handling routine). *2 The vector may not be read correctly in this case for the following two reasons: * If flash memory is read while being programmed or erased (while the P bit or E bit is set in FLMCR1), correct read data will not be obtained (undetermined values will be returned). * If the entry in the interrupt vector table has not been programmed yet, interrupt exception handling will not be executed correctly. 19.10 Flash Memory PROM Mode The H8/3062F-ZTAT B-mask version has a PROM mode as well as the on-board programming modes for programming and erasing flash memory. In PROM mode, the on-chip ROM can be freely programmed using a general-purpose PROM writer that supports the Hitachi microcomputer device type with 128-kbyte on-chip flash memory. 19.10.1 Socket Adapters and Memory Map In PROM mode using a PROM writer, memory reading (verification) and writing and flash memory initialization (total erasure) can be performed. For these operations, a special socket adapter is mounted in the PROM writer. The socket adapter product codes are given in table 19.11. In the H8/3062F-ZTAT B-mask version PROM mode, only the socket adapters shown in this table should be used. Table 19.11 Product Code HD64F3062BF H8/3062F-ZTAT B-Mask Version Socket Adapter Product Codes Package 100-pin QFP (FP-100B) Socket Adapter Product Code ME3064ESHF1H ME3064ESNF1H ME3064ESFF1H HF306BQ100D4001 HF306BT100D4001 HF306AQ100D4001 DATA I/O JAPAN CO. Manufacturer MINATO ELECTRONICS INC. HD64F3062BTE 100-pin TQFP (TFP-100B) HD64F3062BFP 100-pin QFP (FP-100A) HD64F3062BF 100-pin QFP (FP-100B) HD64F3062BTE 100-pin TQFP (TFP-100B) HD64F3062BFP 100-pin QFP (FP-100A) 616 Figure 19.15 shows the memory map in PROM mode. H8/3062F-ZTAT B-mask version MCU mode H'000000 PROM mode H'00000 On-chip ROM H'01FFFF H'1FFFF Figure 19.15 Memory Map in PROM Mode 19.10.2 Notes on Use of PROM Mode 1. A write to a 128-byte programming unit in PROM mode should be performed once only. Erasing must be carried out before reprogramming an address that has already been programmed. 2. When using a PROM writer to reprogram a device on which on-board programming/erasing has been performed, it is recommended that erasing be carried out before executing programming. 3. The memory is initially in the erased state when the device is shipped by Hitachi. For samples for which the erasure history is unknown, it is recommended that erasing be executed to check and correct the initialization (erase) level. 4. The H8/3062F-ZTAT B-mask version does not support a product identification mode as used with general-purpose EPROMs, and therefore the device name cannot be set automatically in the PROM writer. 5. Refer to the instruction manual provided with the socket adapter, or other relevant documentation, for information on PROM writers and associated program versions that are compatible with the PROM mode of the H8/3062F-ZTAT B-mask version. 617 19.11 Flash Memory Programming and Erasing Precautions Precautions concerning the use of on-board programming mode, the RAM emulation function, and PROM mode are summarized below. 1. Use the specified voltages and timing for programming and erasing. Applied voltages in excess of the rating can permanently damage the device. Use a PROM programmer that supports the Hitachi microcomputer device type with 128-kbyte on-chip flash memory. 2. Powering on and off (See figures 19.16 to 19.18) Do not apply a high level to the FWE pin until VCC has stabilized. Also, drive the FWE pin low before turning off VCC. When applying or disconnecting VCC power, fix the FWE pin low and place the flash memory in the hardware protection state. The power-on and power-off timing requirements should also be satisfied in the event of a power failure and subsequent recovery. Failure to do so may result in overprogramming or overerasing due to MCU runaway, and loss of normal memory cell operation. 3. FWE application/disconnection FWE application should be carried out when MCU operation is in a stable condition. If MCU operation is not stable, fix the FWE pin low and set the protection state. The following points must be observed concerning FWE application and disconnection to prevent unintentional programming or erasing of flash memory: * Apply FWE when the VCC voltage has stabilized within its rated voltage range. If FWE is applied when the MCU's VCC power supply is not within its rated voltage range, MCU operation will be unstable and flash memory may be erroneously programmed or erased. * Apply FWE when oscillation has stabilized (after the elapse of the oscillation settling time). When V CC power is turned on, hold the RES pin low for the duration of the oscillation settling time before applying FWE. Do not apply FWE when oscillation has stopped or is unstable. * In boot mode, apply and disconnect FWE during a reset. In a transition to boot mode, FWE = 1 input and MD2 to MD0 setting should be performed while the RES input is low. FWE and MD2 to MD0 pin input must satisfy the mode programming setup time (tMDS) with respect to the reset release timing. When making a transition from boot mode to another mode, also, a mode programming setup time is necessary with respect to the reset release timing. In a reset during operation, the RES pin must be held low for a minimum of 20 system clock cycles. 618 * * * In user program mode, FWE can be switched between high and low level regardless of RES input. FWE input can also be switched during execution of a program in flash memory. Do not apply FWE if program runaway has occurred. During FWE application, the program execution state must be monitored using the watchdog timer or some other means. Disconnect FWE only when the SWE, ESU, PSU, EV, PV, E, and P bits in FLMCR1 are cleared. Make sure that the SWE, ESU, PSU, EV, PV, E, and P bits are not set by mistake when applying or disconnecting FWE. 4. Do not apply a constant high level to the FWE pin. T prevent erroneous programming or erasing due to program runaway, etc., apply a high level to the FWE pin only when programming or erasing flash memory (including execution of flash memory emulation using RAM). A system configuration in which a high level is constantly applied to the FWE pin should be avoided. Also, while a high level is applied to the FWE pin, the watchdog timer should be activated to prevent overprogramming or overerasing due to program runaway, etc. 5. Use the recommended algorithm when programming and erasing flash memory. The recommended algorithm enables programming and erasing to be carried out without subjecting the device to voltage stress or sacrificing program data reliability. When setting the PSU or ESU bit in FLMCR1, the watchdog timer should be set beforehand as a precaution against program runaway, etc. Also note that access to the flash memory space by means of a MOV instruction, etc., is not permitted while the P bit or E bit is set. 6. Do not set or clear the SWE bit during execution of a program in flash memory. Clear the SWE bit before executing a program or reading data in flash memory. When the SWE bit is set, data in flash memory can be rewritten, but flash memory should only be accessed for verify operations (verification during programming/erasing). Similarly, when using the RAM emulation function while a high level is being input to the FWE pin, the SWE bit must be cleared before executing a program or reading data in flash memory. However, the RAM area overlapping flash memory space can be read and written to regardless of whether the SWE bit is set or cleared. A wait time is necessary after the SWE bit is cleared. For details see table 22.40 in section 22.5.6, Flash Memory Characteristics. 7. Do not use interrupts while flash memory is being programmed or erased. All interrupt requests, including NMI, should be disabled during FWE application to give priority to program/erase operations (including emulation in RAM). Bus release must also be disabled. 619 8. Do not perform additional programming. Erase the memory before reprogramming. In on-board programming, perform only one programming operation on a 128-byte programming unit block. Programming should be carried out with the entire programming unit block erased. 9. Before programming, check that the chip is correctly mounted in the PROM writer. Overcurrent damage to the device can result if the index marks on the PROM writer socket, socket adapter, and chip are not correctly aligned. 10. Do not touch the socket adapter or chip during programming. Touching either of these can cause contact faults and write errors. 11. A wait time of 100 s or more is necessary when performing a read after a transition to normal mode from program, erase, or verify mode. 12. Use byte access on the registers that control the flash memory (FLMCR1, FLMCR2, EBR, and RAMCR). 620 Wait time: x Programming/ erasing possible Wait time: y tOSC1 VCC tMDS Min 0 s Min 0 s FWE MD2 to MD0*1 tMDS RES SWE set SWE bit SWE cleared Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See 22.5.6 Flash Memory Characteristics. Figure 19.16 Power-On/Off Timing (Boot Mode) 621 Wait time: x Programming/ erasing possible Wait time: y tOSC1 VCC Min 0 s FWE MD2 to MD0*1 tMDS RES SWE set SWE bit SWE cleared Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*2 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until power-off by pulling the pins up or down. *2 See 22.5.6 Flash Memory Characteristics. Figure 19.17 Power-On/Off Timing (User Program Mode) 622 Wait time: x Programming/ erasing possible Wait time: x Programming/ erasing possible Wait time: y Wait time: x Programming/ erasing possible Wait time: y tOSC1 VCC Min 0s FWE tMDS tMDS *2 MD2 to MD0 tMDS tRESW RES SWE set SWE bit Mode change*1 Boot mode SWE cleared Mode User change*1 mode User program mode User mode User program mode Period during which flash memory access is prohibited (x: Wait time after setting SWE bit, y: Wait time after clearing SWE bit)*3 Period during which flash memory can be programmed (Execution of program in flash memory prohibited, and data reads other than verify operations prohibited) Notes: *1 When entering boot mode or making a transition from boot mode to another mode, mode switching must be carried out by means of RES input. The state of ports with multiplexed address functions and bus control output pins (CSn, AS, RD, WR) will change during this switchover interval (the interval during which the RES pin input is low), and therefore these pins should not be used as output signals during this time. *2 When making a transition from boot mode to another mode, the mode programming setup time tMDS must be satisfied with respect to RES clearance timing. *3 See 22.5.6 Flash Memory Characteristics. Figure 19.18 Mode Transition Timing (Example: Boot Mode User Mode User Program Mode) Programming/ erasing possible Wait time: y Wait time: x 623 19.12 Mask ROM (H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version) Overview 19.12.1 Block Diagram Figure 19.19 shows a block diagram of the ROM. Internal data bus (upper 8 bits) Internal data bus (lower 8 bits) H'00000 H'00002 H'00001 H'00003 On-chip ROM H'1FFFE Even addresses H'1FFFF Odd addresses Figure 19.19 ROM Block Diagram (H8/3062 Mask ROM B-Mask Version) 624 19.13 Notes on Ordering Mask ROM Version Chips When ordering H8/3062, H8/3061, and H8/3060 with mask ROM, note the following. 1. When ordering by means of an EPROM, use a 128-kbyte one. 2. Fill all unused addresses with H'FF as shown in figure 19.20 to make the ROM data size 128kbytes for the H8/3062, H8/3061, and H8/3060 mask ROM versions, which incorporate different sizes of ROM. This applies to ordering by means of an EPROM and by means of data transmission. HD6433062B (ROM: 128 kbytes) Addresses: H'00000-1FFFF H'00000 HD6433061B (ROM: 96 kbytes) Addresses: H'00000-17FFF H'00000 HD6433060B (ROM: 64 kbytes) Addresses: H'00000-0FFFF H'00000 H'0FFFF H'10000 H'17FFF H'18000 Not used* H'1FFFF Note: * Write H'FF in all addresses in these areas. H'1FFFF Not used* H'1FFFF Figure 19.20 Mask ROM Addresses and Data 3. The flash memory control registers (FLMCR, EBR, RAMCR, FLMSR, FLMCR1, FLMCR2, EBR1, and EBR2) used by the versions with on-chip flash memory are not provided in the mask ROM versions. Reading the corresponding addresses in a mask ROM version will always return 1s, and writes to these addresses are disabled. This must be borne in mind when switching from a flash memory version to a mask ROM version. 625 19.14 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Versions Please note the following when converting the F-ZTAT application software to the mask-ROM versions. The values read from the internal registers for the flash ROM in the mask-ROM version and FZTAT version differ as follows. Status Register FLMCR1 Bit FWE Value 0 1 F-ZTAT Version Application software running Programming Mask-ROM Version -- (Is not read out) Application software running (This bit is always read as 1) Note: This difference applies to all the F-ZTAT versions and all the mask-ROM versions that have different ROM size. 626 Section 20 Clock Pulse Generator 20.1 Overview The H8/3062 Series has a built-in clock pulse generator (CPG) that generates the system clock () and other internal clock signals (/2 to /4096). After duty adjustment, a frequency divider divides the clock frequency to generate the system clock (). The system clock is output at the pin*1 and furnished as a master clock to prescalers that supply clock signals to the on-chip supporting modules. Frequency division ratios of 1/1, 1/2, 1/4, and 1/8 can be selected for the frequency divider by settings in a division control register (DIVCR)*2. Power consumption in the chip is reduced in almost direct proportion to the frequency division ratio. Notes: *1 Usage of the pin differs depending on the chip operating mode and the PSTOP bit setting in the module standby control register (MSTCR). For details, see section 21.7, System Clock Output Disabling Function. *2 The division ratio of the frequency divider can be changed dynamically during operation. The clock output at the pin also changes when the division ratio is changed. The frequency output at the pin is shown below. = EXTAL x n where, EXTAL : Frequency of crystal resonator or external clock signal n : Frequency division ratio (n = 1/1, 1/2, 1/4, or 1/8) 20.1.1 Block Diagram Figure 20.1 shows a block diagram of the clock pulse generator. CPG XTAL Oscillator EXTAL Duty adjustment circuit Frequency divider Prescalers Division control register Data bus pin /2 to /4096 Figure 20.1 Block Diagram of Clock Pulse Generator 627 20.2 Oscillator Circuit Clock pulses can be supplied by connecting a crystal resonator, or by input of an external clock signal. 20.2.1 Connecting a Crystal Resonator Circuit Configuration: A crystal resonator can be connected as in the example in figure 20.2. Damping resistance Rd should be selected according to table 20.1 (1), and external capacitances C L1 and CL2 according to table 20.1 (2). An AT-cut parallel-resonance crystal should be used. CL1 EXTAL XTAL Rd CL2 Figure 20.2 Connection of Crystal Resonator (Example) If a crystal resonator with a frequency higher than 20 MHz is connected, the external load capacitance values in table 20.1 (2) should not exceed 10 [pF]. Also, in order to improve the accuracy of the oscillation frequency, a thorough study of oscillation matching evaluation, etc., should be carried out when deciding the circuit constants. Table 20.1 (1) Damping Resistance Value Damping Resistance Value 2 Rd () 1k Frequency f (MHz) 2 < f 4 4 < f 8 8 < f 10 10 < f 13 13 < f 16 16 < f 18 18 < f 25 500 200 0 0 0 0 0 Note: A crystal resonator between 2 MHz and 25 MHz can be used. If the chip is to be operated at less than 2 MHz, the on-chip frequency divider should be used (A crystal resonator of less than 2 MHz cannot be used). Table 20.1 (2) External Capacitance Values External Capacitance Value Frequency f (MHz) CL1 = CL2 (pF) 5 V Version 20 < f 25 10 2 f 20 10 to 22 Low-Voltage Version 2 f 13 10 to 22 Note: * Conditions for the H8/3064F-ZTAT B-mask version and H8/3062F-ZTAT B-mask version. 628 Crystal Resonator: Figure 20.3 shows an equivalent circuit of the crystal resonator. The crystal resonator should have the characteristics listed in table 20.2. CL L XTAL Rs EXTAL C AT-cut parallel-resonance type 0 Figure 20.3 Crystal Resonator Equivalent Circuit Table 20.2 Crystal Resonator Parameters Frequency (MHz) Rs max () Co (pF) 2 500 4 120 8 80 10 70 12 60 16 50 18 40 20 40 25 40 7 pF max Use a crystal resonator with a frequency equal to the system clock frequency (). Notes on Board Design: When a crystal resonator is connected, the following points should be noted: Other signal lines should be routed away from the oscillator circuit to prevent induction from interfering with correct oscillation. See figure 20.4. When the board is designed, the crystal resonator and its load capacitors should be placed as close as possible to the XTAL and EXTAL pins. Avoid C L2 Signal A Signal B H8/3062 Series XTAL EXTAL C L1 Figure 20.4 Oscillator Circuit Block Board Design Precautions 629 20.2.2 External Clock Input Circuit Configuration: An external clock signal can be input as shown in the examples in figure 20.5. If the XTAL pin is left open, the stray capacitance should not exceed 10 pF. If the stray capacitance at the XTAL pin exceeds 10 pF in configuration a, use the connection shown in configuration b instead, and hold the external clock high in standby mode. EXTAL External clock input XTAL Open a. XTAL pin left open EXTAL External clock input XTAL b. Complementary clock input at XTAL pin Figure 20.5 External Clock Input (Examples) External Clock: The external clock frequency should be equal to the system clock frequency when not divided by the on-chip frequency divider. Table 20.3 shows the clock timing, figure 20.6 shows the external clock input timing, and figure 20.7 shows the external clock output settling delay timing. When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the on-chip oscillator and duty adjustment circuit. When the appropriate external clock is input via the EXTAL pin, its waveform is corrected by the on-chip oscillator and duty adjustment circuit. The resulting stable clock is output to external devices after the external clock settling time (tDEXT) has passed after the clock input. The system must remain reset with the reset signal low during tDEXT, while the clock output is unstable. 630 Table 20.3 (1) Clock Timing for On-Chip Flash Memory Versions VCC = 3.0 V to 5.5 V Item External clock input low pulse width Symbol Min t EXL 30 30 30 30 -- -- 0.4 80 Clock high pulse width t CH t DEXT* 0.4 80 External clock output settling delay time 500 Max -- -- -- -- 8 8 0.6 -- 0.6 -- -- VCC = 5.0 V 10% Min Max Unit ns ns ns ns ns ns t cyc ns t cyc ns s 5 MHz < 5 MHz 5 MHz < 5 MHz Figure 20.7 Figure 22.17 Test Conditions > 8 MHz 8 MHz > 8 MHz 8 MHz Figure 20.6 t cyc / 2 - 5 -- 55 -- External clock input high t EXH pulse width External clock rise time External clock fall time Clock low pulse width t EXr t EXf t CL t cyc / 2 - 5 -- 55 -- -- 0.4 80 0.4 80 500 -- 5 5 0.6 -- 0.6 -- -- Note: * tDEXT includes a RES pulse width (t RESW). tRESW = 20 tcyc Table 20.3 (2) Clock Timing for On-Chip Mask ROM Versions VCC = 2.7 V to 5.5 V Item External clock input low pulse width External clock input high pulse width External clock rise time External clock fall time Clock low pulse width Clock high pulse width Symbol Min t EXL 40 40 t EXH 40 40 t EXr t EXf t CL -- -- 0.4 80 t CH 0.4 80 500 Max -- -- -- -- 10 10 0.6 -- 0.6 -- -- VCC = 3.0 V to 5.5 V Min 30 30 30 30 -- -- 0.4 80 0.4 80 500 Max -- -- -- -- 8 8 0.6 -- 0.6 -- -- VCC = 5.0 V 10% Min MaxUnit Test Conditions ns ns ns ns ns ns 5 MHz < 5 MHz 5 MHz < 5 MHz Figure 20.7 Figure 22.17 > 8 MHz Figure 20.6 8 MHz > 8 MHz 8 MHz t cyc / 2 - 5 -- 55 -- t cyc / 2 - 5 -- 55 -- -- 0.4 80 0.4 80 500 -- 5 5 0.6 t cyc -- ns 0.6 t cyc -- -- ns s External clock output t DEXT* settling delay time Note: * tDEXT includes the RES pulse width (t RESW). tRESW = 10 tcyc 631 tEXH VCC x 0.7 EXTAL 0.3 V tEXr tEXf tEXL VCC x 0.5 Figure 20.6 External Clock Input Timing VCC STBY EXTAL VIH (internal or external) RES tDEXT Figure 20.7 External Clock Output Settling Delay Timing 20.3 Duty Adjustment Circuit When the oscillator frequency is 5 MHz or higher, the duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to generate . 20.4 Prescalers The prescalers divide the system clock () to generate internal clocks (/2 to /4096). 20.5 Frequency Divider The frequency divider divides the duty-adjusted clock signal to generate the system clock (). The frequency division ratio can be changed dynamically by modifying the value in DIVCR, as described below. Power consumption in the chip is reduced in almost direct proportion to the 632 frequency division ratio. The system clock generated by the frequency divider can be output at the pin. 20.5.1 Register Configuration Table 20.4 summarizes the frequency division register. Table 20.4 Frequency Division Register Address* H'EE01B Name Division control register Abbreviation DIVCR R/W R/W Initial Value H'FC Note: * Lower 20 bits of the address in advanced mode. 20.5.2 Division Control Register (DIVCR) DIVCR is an 8-bit readable/writable register that selects the division ratio of the frequency divider. Bit Initial value Read/Write 7 -- 1 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 DIV1 0 R/W 0 DIV0 0 R/W Reserved bits Divide bits 1 and 0 These bits select the frequency division ratio DIVCR is initialized to H'FC by a reset and in hardware standby mode. It is not initialized in software standby mode. Bits 7 to 2--Reserved: These bits cannot be modified and are always read as 1. Bits 1 and 0--Divide (DIV1, DIV0): These bits select the frequency division ratio, as follows. Bit 1 DIV1 0 0 1 1 Bit 0 DIV0 0 1 0 1 Frequency Division Ratio 1/1 1/2 1/4 1/8 (Initial value) 633 20.5.3 Usage Notes The DIVCR setting changes the frequency, so note the following points. * Select a frequency division ratio that stays within the assured operation range specified for the clock cycle time tcyc in the AC electrical characteristics. Note that omin = lower limit of the operating frequency range. Ensure that o is not below this lower limit. Table 20.5 shows the operating frequency ranges of the various models in the H8/3062 Series. Table 20.5 Comparison of H8/3062 Series Operating Frequency Ranges H8/3062 F-ZTAT Guaranteed operating frequency range 4.5 to 5.5 V 3.0 to 5.5 V 2.7 to 5.5 V Crystal oscillation range H8/3062 F-ZTAT R-Mask Version H8/3062 F-ZTAT B-Mask Version 2M to 25 MHz -- H8/3062 Mask ROM Version H8/3061 Mask ROM Version H8/3060 Mask ROM Version H8/3064 F-ZTAT B-Mask Version 2M to 25 MHz -- -- 2M to 25 MHz 1M to 20 MHz -- 1M to 13 MHz -- 2M to 20 MHz 1M to 20 MHz 1M to 13 MHz 1M to 10 MHz 2M to 25 MHz 2M to 20 MHz * All on-chip module operations are based on . Note that the timing of timer operations, serial communication, and other time-dependent processing differs before and after any change in the division ratio. The waiting time for exit from software standby mode also changes when the division ratio is changed. For details, see section 21.4.3, Selection of Waiting Time for Exit from Software Standby Mode. 634 Section 21 Power-Down State 21.1 Overview The H8/3062 Series has a power-down state that greatly reduces power consumption by halting the CPU, and a module standby function that reduces power consumption by selectively halting on-chip modules. The power-down state includes the following three modes: * Sleep mode * Software standby mode * Hardware standby mode The module standby function can halt on-chip supporting modules independently of the powerdown state. The modules that can be halted are the 16-bit timer, 8-bit timer, SCI0, SCI1, and A/D converter. Table 21.1 indicates the methods of entering and exiting the power-down modes and module standby mode, and gives the status of the CPU and on-chip supporting modules in each mode. 635 636 State Clock SCI0 Active Active Active Active Held output Held SCI1 A/D RAM Active Active Halted Held Active CPU CPU Registers 8-Bit Timer I/O Ports Other Modules 16-Bit Timer clock Output*3 Exiting Conditions * Interrupt * RES * STBY Held * NMI * IRQ0 to IRQ2 * RES * STBY High output Held*2 High impedance -- High * STBY impedance * RES High -- impedance*1 * STBY * RES * Clear MSTCR bit to 0*4 Halted Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Halted and reset Held Halted Held Halted and reset Halted and reset Halted*1 Halted*1 Halted*1 Halted*1 Halted*1 Active and and and and and reset reset reset reset reset Halted Halted Undetermined -- Active Active Mode Entering Conditions Sleep mode SLEEP instruction executed while SSBY = 0 in SYSCR Software standby mode SLEEP instruction executed while SSBY = 1 in SYSCR Hardware standby mode Low input at STBY pin Table 21.1 Power-Down State and Module Standby Function Module standby Corresponding bit set to 1 in MSTCRH and MSTCRL Notes: *1 State in which the corresponding MSTCR bit was set to 1. For details see section 21.2.2, Module Standby Control Register H (MSTCRH) and section 21.2.3, Module Standby Control Register L (MSTCRL). *2 The RAME bit must be cleared to 0 in SYSCR before the transition from the program execution state to hardware standby mode. *3 When P67 is used as the output pin. *4 When a MSTCR bit is set to 1, the registers of the corresponding on-chip supporting module are initialized. To restart the module, first clear the MSTCR bit to 0, then set up the module registers again. Legend: SYSCR SSBY MSTCRH MSTCRL : : : : System control register Software standby bit Module standby control register H Module standby control register L 21.2 Register Configuration The H8/3062 Series has a system control register (SYSCR) that controls the power-down state, and module standby control registers H (MSTCRH) and L (MSTCRL) that control the module standby function. Table 21.2 summarizes these registers. Table 21.2 Control Register Address* H'EE012 H'EE01C H'EE01D Name System control register Module standby control register H Module standby control register L Abbreviation SYSCR MSTCRH MSTCRL R/W R/W R/W R/W Initial Value H'09 H'78 H'00 Note: * Lower 20 bits of the address in advanced mode 21.2.1 Bit System Control Register (SYSCR) 7 SSBY 0 R/W 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 SSOE 0 R/W 0 RAME 1 R/W RAM enable Software standby output port enable NMI edge select User bit enable Standby timer select 2 to 0 These bits select the waiting time of the CPU and peripheral functions Software standby Enables transition to software standby mode Initial value Read/Write SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY), bits 6 to 4 (STS2 to STS0), and bit 1 (SSOE) control the power-down state. For information on the other SYSCR bits, see section 3.3, System Control Register (SYSCR). 637 Bit 7--Software Standby (SSBY): Enables transition to software standby mode. When software standby mode is exited by an external interrupt, this bit remains set to 1 after the return to normal operation. To clear this bit, write 0. Bit 7 SSBY 0 1 Description SLEEP instruction causes transition to sleep mode SLEEP instruction causes transition to software standby mode (Initial value) Bits 6 to 4--Standby Timer Select (STS2 to STS0): These bits select the length of time the CPU and on-chip supporting modules wait for the clock to settle when software standby mode is exited by an external interrupt. If the clock is generated by a crystal resonator, set these bits according to the clock frequency so that the waiting time will be at least 7 ms. See table 21.3. If an external clock is used, the choice of settings depends on the H8/3062 Series version. 1. H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask ROM version: Any setting is permitted. 2. H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version: Choose a setting, according to the operating frequency, that gives a wait time of at least 100 s. Bit 6 STS2 0 Bit 5 STS1 0 Bit 4 STS0 0 1 1 0 1 1 1 1 1 0 0 1 1 0 1 0 1 Description Waiting time = 8,192 states Waiting time = 16,384 states Waiting time = 32,768 states Waiting time = 65,536 states Waiting time = 131,072 states Waiting time = 262,144 states Waiting time = 1,024 states Illegal setting (Initial value) 638 Bit 1--Software Standby Output Port Enable (SSOE): Specifies whether the address bus and bus control signals (CS0 to CS7, AS, RD, HWR, and LWR) are kept as outputs or fixed high, or placed in the high-impedance state in software standby mode. Bit 1 SSOE 0 1 Description In software standby mode, the address bus and bus control signals are all high-impedance In software standby mode, the address bus retains its output state and bus control signals are fixed high (Initial value) 21.2.2 Module Standby Control Register H (MSTCRH) MSTCRH is an 8-bit readable/writable register that controls output of the system clock (). It also controls the module standby function, which places individual on-chip supporting modules in the standby state. Module standby can be designated for the SCI0, SCI1. Bit Initial value Read/Write 7 PSTOP 0 R/W 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 0 R/W 1 0 R/W 0 0 R/W MSTPH1 MSTPH0 Reserved bits clock stop Enables or disables output of the system clock Module standby H1 to 0 These bits select modules to be placed in standby MSTCRH is initialized to H'78 by a reset and in hardware standby mode. It is not initialized in software standby mode. Bit 7-- Clock Stop (PSTOP): Enables or disables output of the system clock (). Bit 7 PSTOP 0 1 Description System clock output is enabled System clock output is disabled (Initial value) 639 Bits 6 to 3--Reserved: These bits cannot be modified and are always read as 1. Bit 2--Reserved: This bit can be written and read. Bit 1--Module Standby H1 (MSTPH1): Selects whether to place the SCI1 in standby. Bit 1 MSTPH1 0 1 Description SCI1 operates normally SCI1 is in standby state (Initial value) Bit 0--Module Standby H0 (MSTPH0): Selects whether to place the SCI0 in standby. Bit 0 MSTPH0 0 1 Description SCI0 operates normally SCI0 is in standby state (Initial value) 21.2.3 Module Standby Control Register L (MSTCRL) MSTCRL is an 8-bit readable/writable register that controls the module standby function, which places individual on-chip supporting modules in the standby state. Module standby can be designated for 16-bit timer, 8-bit timer, and A/D converter modules. Bit Initial value Read/Write 7 -- 0 R/W 6 -- 0 R/W 5 -- 0 R/W 4 0 R/W 3 0 R/W 2 0 R/W 1 -- 0 R/W 0 MSTPL0 0 R/W MSTPL4 MSTPL3 MSTPL2 Module standby L4 to L2, L0 These bits select modules to be placed in standby Reserved bits MSTCRL is initialized to H'00 by a reset and in hardware standby mode. It is not initialized in software standby mode. 640 Bits 7 to 5--Reserved: This bit can be written and read. Bit 4--Module Standby L4 (MSTPL4): Selects whether to place the 16-bit timer in standby. Bit 4 MSTPL4 0 1 Description 16-bit timer operates normally 16-bit timer is in standby state (Initial value) Bit 3--Module Standby L3 (MSTPL3): Selects whether to place 8-bit timer channels 0 and 1 in standby. Bit 3 MSTPL3 0 1 Description 8-bit timer channels 0 and 1 operate normally 8-bit timer channels 0 and 1 are in standby state (Initial value) Bit 2--Module Standby L2 (MSTPL2): Selects whether to place 8-bit timer channels 2 and 3 in standby. Bit 2 MSTPL2 0 1 Description 8-bit timer channels 2 and 3 operate normally 8-bit timer channels 2 and 3 are in standby state (Initial value) Bit 1--Reserved: This bit can be written and read. Bit 0--Module Standby L0 (MSTPL0): Selects whether to place the A/D converter in standby. Bit 0 MSTPL0 0 1 Description A/D converter operates normally A/D converter is in standby state (Initial value) 641 21.3 21.3.1 Sleep Mode Transition to Sleep Mode When the SSBY bit is cleared to 0 in SYSCR, execution of the SLEEP instruction causes a transition from the program execution state to sleep mode. Immediately after executing the SLEEP instruction the CPU halts, but the contents of its internal registers are retained. On-chip supporting modules do not halt in sleep mode. Modules which have been placed in standby by the module standby function, however, remain halted. 21.3.2 Exit from Sleep Mode Sleep mode is exited by an interrupt, or by input at the RES or STBY pin. Exit by Interrupt: An interrupt terminates sleep mode and causes a transition to the interrupt exception handling state. Sleep mode is not exited by an interrupt source in an on-chip supporting module if the interrupt is disabled in the on-chip supporting module. Sleep mode is not exited by an interrupt other than NMI if the interrupt is masked by interrupt priority settings and the settings of the I and UI bits in CCR, IPR. Exit by RES Input: Low input at the RES pin exits from sleep mode to the reset state. Exit by STBY Input: Low input at the STBY pin exits from sleep mode to hardware standby mode. 21.4 21.4.1 Software Standby Mode Transition to Software Standby Mode To enter software standby mode, execute the SLEEP instruction while the SSBY bit is set to 1 in SYSCR. In software standby mode, current dissipation is reduced to an extremely low level because the CPU, clock, and on-chip supporting modules all halt. On-chip supporting modules are reset and halted. As long as the specified voltage is supplied, however, CPU register contents and on-chip RAM data are retained. The settings of the I/O ports also held. When the WDT is used as a watchdog timer (WT/IT = 1), the TME bit must be cleared to 0 before setting SSBY. Also, when setting TME to 1, SSBY should be cleared to 0. Clear the BRLE bit in BRCR (inhibiting bus release) before making a transition to software standby mode. 642 21.4.2 Exit from Software Standby Mode Software standby mode can be exited by input of an external interrupt at the NMI, IRQ0, IRQ1, or IRQ2 pin, or by input at the RES or STBY pin. Exit by Interrupt: When an NMI, IRQ0, IRQ1, or IRQ2 interrupt request signal is received, the clock oscillator begins operating. After the oscillator settling time selected by bits STS2 to STS0 in SYSCR, stable clock signals are supplied to the entire chip, software standby mode ends, and interrupt exception handling begins. Software standby mode is not exited if the interrupt enable bits of interrupts IRQ0, IRQ1, and IRQ2 are cleared to 0, or if these interrupts are masked in the CPU. Exit by RES Input: When the RES input goes low, the clock oscillator starts and clock pulses are supplied immediately to the entire chip. The RES signal must be held low long enough for the clock oscillator to stabilize. When RES goes high, the CPU starts reset exception handling. Exit by STBY Input: Low input at the STBY pin causes a transition to hardware standby mode. 21.4.3 Selection of Waiting Time for Exit from Software Standby Mode Bits STS2 to STS0 in SYSCR and bits DIV1 and DIV0 in DIVCR should be set as follows. Crystal Resonator: Set STS2 to STS0, DIV1, and DIV0 so that the waiting time (for the clock to stabilize) is at least 7 ms. Table 21.3 indicates the waiting times that are selected by STS2 to STS0, DIV1, and DIV0 settings at various system clock frequencies. When Using an External Clock 1. H8/3062F-ZTAT, H8/3062F-ZTAT R-mask version, H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask ROM version: Any setting is permitted. 2. H8/3064F-ZTAT B-mask version, H8/3062F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version: Set bits STS2 to STS0 and bits DIV0 and DIV1 to give a wait time of at least 100 s. 643 Table 21.3 Clock Frequency and Waiting Time for Clock to Settle DIV1 DIV0 STS2 STS1 STS0 Waiting Time 0 0 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 0 1 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 1 0 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 1 1 0 0 0 8192 states 0 0 1 16384 states 0 1 0 32768 states 0 1 1 65536 states 1 0 0 131072 states 1 0 1 262144 states 1 1 0 1024 states 1 1 1 * : Recommended setting 25 MHz 0.3 0.7 1.3 2.6 5.2 10.5* 0.04 0.7 1.3 2.6 5.2 10.5* 21.0 0.08 1.3 2.6 5.2 10.5* 21.0 41.9 0.16 2.6 5.2 10.5 21.0* 41.9 83.9 0.33 20 MHz 0.4 0.8 1.6 3.3 6.6 13.1* 0.05 0.8 1.6 3.3 6.6 13.1* 26.2 0.10 1.6 3.3 6.6 13.1* 26.2 52.4 0.20 3.3 6.6 13.1* 26.2 52.4 104.9 0.41 18 MHz 0.46 0.91 1.8 3.6 7.3* 14.6 0.057 0.91 1.8 3.6 7.3* 14.6 29.1 0.11 1.8 3.6 7.3* 14.6 29.1 58.3 0.23 3.6 7.3* 14.6 29.1 58.3 116.5 0.46 16 MHz 0.51 1.0 2.0 4.1 8.2* 16.4 0.064 1.02 2.0 4.1 8.2* 16.4 32.8 0.13 2.0 4.1 8.2* 16.4 32.8 65.5 0.26 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 12 MHz 0.65 1.3 2.7 5.5 10.9* 10 MHz 0.8 1.6 3.3 6.6 13.1* 8 MHz 6 MHz 4 MHz 1.0 1.3 2.0 2.0 2.7 4.1 4.1 5.5 8.2* 8.2* 10.9* 16.4 16.4 21.8 32.8 32.8 43.7 65.5 0.13 0.17 0.26 2.0 4.1 8.2* 16.4 32.8 65.5 0.26 4.1 8.2* 16.4 32.8 65.5 131.1 0.51 8.2* 16.4 32.8 65.5 131.1 262.1 1.0 2.7 5.5 10.9* 21.8 43.7 87.4 0.34 5.5 10.9* 21.8 43.7 87.4 174.8 0.68 10.9* 21.8 43.7 87.4 174.8 349.5 1.4 4.0 8.2* 16.4 32.8 65.5 131.1 0.51 8.2* 16.4 32.8 65.5 131.1 262.1 1.02 16.4* 32.8 65.5 131.1 262.1 524.3 2.0 2 MHz 1MHz Unit 8.2* ms 4.1 8.2* 16.4 16.4 32.8 65.5 131.1 0.51 8.2* 16.4 32.8 65.5 131.1 262.1 1.0 16.4* 32.8 65.5 131.1 262.1 524.3 2.0 32.8 65.5 131.1 262.1 1.0 16.4* ms 32.8 65.5 131.1 262.1 524.3 2.0 32.8* ms 65.5 131.1 262.1 524.3 1048.6 4.1 21.8 26.2 0.085 0.10 Illegal setting 1.4 1.6 2.7 3.3 5.5 6.6 10.9* 13.1* 21.8 26.2 43.7 52.4 0.17 0.20 Illegal setting 2.7 3.3 5.5 6.6 10.9* 13.1* 21.8 26.2 43.7 52.4 87.4 104.9 0.34 0.41 Illegal setting 5.5 6.6 10.9* 13.1* 21.8 26.2 43.7 52.4 87.4 104.9 174.8 209.7 0.68 0.82 Illegal setting 32.8* 65.5 ms 65.5 131.1 131.1 262.1 262.1 524.3 524.3 1048.6 1048.6 2097.1 8.2* 4.1 644 21.4.4 Sample Application of Software Standby Mode Figure 21.1 shows an example in which software standby mode is entered at the fall of NMI and exited at the rise of NMI. With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit is set to 1; then the SLEEP instruction is executed to enter software standby mode. Software standby mode is exited at the next rising edge of the NMI signal. Clock oscillator NMI NMIEG SSBY NMI interrupt handler NMIEG = 1 SSBY = 1 Software standby mode (powerdown state) Oscillator settling time (tosc2) NMI exception handling SLEEP instruction Figure 21.1 NMI Timing for Software Standby Mode (Example) 21.4.5 Usage Note The I/O ports retain their existing states in software standby mode. If a port is in the high output state, its output current is not reduced. 645 21.4.6 Cautions on Clearing the software Standby Mode of F-ZTAT Version (1) Operation phenomena When using operating mode 5, 6, or 7* (on-chip flash memory enabled), the first read of onchip flash memory after exiting software standby mode may not be carried out correctly. Software standby mode is exited by means of an external interrupt (via the NMI, IRQ0, IRQ1, or IRQ2 pin), the RES pin, or the STBY pin. In the case of an external interrupt via the NMI, IRQ0, IRQ1, or IRQ2 pin, the first read after exiting software standby mode is a read of the vector corresponding to the respective exception handling interrupt source. This vector may not be read correctly, resulting in program runaway. Note: * Mode 5: expanded 16-Mbyte mode with on-chip ROM enabled Mode 6: single-chip normal mode Mode 7: single-chip advanced mode (2) Exemplary procedures to avoid program runaway This operation phenomenon can be avoided by writing or amending program code in accordance with the following procedures. (a) When using mode 5 or mode 7, assign addresses in the 64-kbyte space from H'00000 to H'0FFFF as the vector addresses for the external interrupts that clear software standby mode. (b) When using mode 6, change the mode to mode 7 in the program, and use change (a) above. Note that it is necessary to change vector address assignments and to extend addresses as follows. * Addresses H'DFFF and below (on-chip ROM area): H'xxxx H'0xxxx * Addresses H'E000 to H'E0FF (internal I/O registers-1): H'yyyy H'Eyyyy * Addresses H'EF20 and above (on-chip RAM area and internal I/O registers-2): H'zzzz H'Fzzzz (Where x, y and z are any hexadecimal numbers) (3) Comparison of products in H8/3062 Series H8/3062F-ZTAT Restriction (2) applies. Take measures to prevent program runaway. H8/3062F-ZTAT R-Mask Version Prior to week code "9k1" Restriction (2) applies. Take measures to prevent program runaway. On-Chip Mask H8/3062F-ZTAT H8/3064F-ZTAT ROM B-Mask B-Mask Version B-Mask Version Versions Restriction (2) does not apply. Restriction (2) does not apply. Week code "9k1" Restriction (2) onward does not apply. Restriction (2) does not apply. 646 21.5 21.5.1 Hardware Standby Mode Transition to Hardware Standby Mode Regardless of its current state, the chip enters hardware standby mode whenever the STBY pin goes low. Hardware standby mode reduces power consumption drastically by halting all functions of the CPU, and on-chip supporting modules. All modules are reset except the on-chip RAM. As long as the specified voltage is supplied, on-chip RAM data is retained. I/O ports are placed in the high-impedance state. Clear the RAME bit to 0 in SYSCR before STBY goes low to retain on-chip RAM data. The inputs at the mode pins (MD2 to MD0) should not be changed during hardware standby mode. 21.5.2 Exit from Hardware Standby Mode Hardware standby mode is exited by inputs at the STBY and RES pins. While RES is low, when STBY goes high, the clock oscillator starts running. RES should be held low long enough for the clock oscillator to settle. When RES goes high, reset exception handling begins, followed by a transition to the program execution state. 21.5.3 Timing for Hardware Standby Mode Figure 21.2 shows the timing relationships for hardware standby mode. To enter hardware standby mode, first drive RES low, then drive STBY low. To exit hardware standby mode, first drive STBY high, wait for the clock to settle, then bring RES from low to high. Clock oscillator RES STBY Oscillator settling time Reset exception handling Figure 21.2 Hardware Standby Mode Timing 647 21.6 21.6.1 Module Standby Function Module Standby Timing The module standby function can halt several of the on-chip supporting modules (SCI1, SCI0, 16bit timer, 8-bit timer, and A/D converter) independently in the power-down state. This standby function is controlled by bits MSTPH2 to MSTPH0 in MSTCRH and bits MSTPL7 to MSTPL0 in MSTCRL. When one of these bits is set to 1, the corresponding on-chip supporting module is placed in standby and halts at the beginning of the next bus cycle after the MSTCR write cycle. 21.6.2 Read/Write in Module Standby When an on-chip supporting module is in module standby, read/write access to its registers is disabled. Read access always results in H'FF data. Write access is ignored. 21.6.3 Usage Notes When using the module standby function, note the following points. On-chip Supporting Module Interrupts: Before setting a module standby bit, first disable interrupts by that module. When an on-chip supporting module is placed in standby by the module standby function, its registers are initialized, including registers with interrupt request flags. Pin States: Pins used by an on-chip supporting module lose their module functions when the module is placed in module standby. What happens after that depends on the particular pin. For details, see section 7, I/O Ports. Pins that change from the input to the output state require special care. For example, if SCI1 is placed in module standby, the receive data pin loses its receive data function and becomes a port pin. If its port DDR bit is set to 1, the pin becomes a data output pin, and its output may collide with external SCI transmit data. Data collision should be prevented by clearing the port DDR bit to 0 or taking other appropriate action. Register Resetting: When an on-chip supporting module is halted by the module standby function, all its registers are initialized. To restart the module, after its MSTCR bit is cleared to 0, its registers must be set up again. It is not possible to write to the registers while the MSTCR bit is set to 1. 648 21.7 System Clock Output Disabling Function Output of the system clock () can be controlled by the PSTOP bit in MSTCRH. When the PSTOP bit is set to 1, output of the system clock halts and the pin is placed in the highimpedance state. Figure 21.3 shows the timing of the stopping and starting of system clock output. When the PSTOP bit is cleared to 0, output of the system clock is enabled. Table 21.4 indicates the state of the pin in various operating states. MSTCRH write cycle (PSTOP = 1) T1 pin High impedance T2 T3 MSTCRH write cycle (PSTOP = 0) T1 T2 T3 Figure 21.3 Starting and Stopping of System Clock Output Table 21.4 Pin State in Various Operating States Operating State Hardware standby Software standby Sleep mode Normal operation PSTOP = 0 High impedance Always high System clock output System clock output PSTOP = 1 High impedance High impedance High impedance High impedance 649 650 Section 22 Electrical Characteristics Table 22.1 shows the electrical characteristics of the various products in the H8/3062 Series. Table 22.1 Electrical Characteristics of H8/3062 Series Products H8/3062 H8/3062, H8/3064 H8/3062 F-ZTAT H8/3061, F-ZTAT F-ZTAT R-Mask H8/3060 B-Mask Version Version 1 to 20 -- -- 1 to 13 1 to 10 H8/3062 F-ZTAT B-Mask Version H8/3064 Mask ROM B-Mask Version H8/3062, H8/3061, H8/3060 Mask ROM B-Mask Versions Item Symbol Unit Operating range V CC = 4.5 to 5.5 V V CC = 3.0 to 5.5 V V CC = 2.7 to 5.5 V MHz 2 to 25 -- -- Operating Regular temperature specifications range Wide-range specifications Absolute maximum ratings FWE pin rating V CL pin Topr C -20 * 1 to 75 -40 * 1 to 85 -20 to 75 -40 to 85 -- -20 * 1 to 75 -- Yes Cannot be connected to power supply * 2 [5 V operation model only] 5 V operation model: -0.3 to +7.0 V in Yes -- Power supply voltage DC characteristics RESO pin specification FWE pin specification Standby current (T a 50C) Standby current (50C < Ta) AC characteristics Clock cycle time RES pulse width RESO output delay time RESO output pulse width Flash memory characteristics* 4 Wait time after P bit setting Wait time after SWE bit clearing Other wait times Notes: *1 *2 *3 *4 V in V -0.3 to +7.0 -- Yes Yes -- Max 5 Max 20 -- Yes Max 10 Max 80 Max 500 ICC * 3 A tcyc tRESW tRESD tRESOW ns tcyc ns tcyc s s Max 1000 Min 20 -- -- 150/500 switchable Not necessary See table 22.20 Min 10 Max 50 Min 132 -- -- -- 30/200/10 switchable Necessary: min 100 Min 20 Min 10 -- -- -- -- -- See table See table 22.30 22.49 The lower limit of the operating temperature range for flash memory programming/erasing is 0C. Connect an external capacitor between the V CL pin and GND. See the DC Characteristics table for current dissipation during operation. Refer to the program/erase algorithms for details of flash memory characteristics. 651 22.1 Electrical Characteristics of H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, and H8/3060 Mask ROM Version Absolute Maximum Ratings 22.1.1 Table 22.2 lists the absolute maximum ratings. Table 22.2 Absolute Maximum Ratings Item Power supply voltage Input voltage (except for port 7) Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Symbol VCC Vin Vin VREF AVCC VAN Topr Value -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 -0.3 to +7.0 -0.3 to AVCC +0.3 Regular specifications: -20 to +75 Wide-range specifications: -40 to +85 Storage temperature Tstg -55 to +125 Unit V V V V V V C C C Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. 652 22.1.2 DC Characteristics Table 22.3 lists the DC characteristics. Table 22.4 lists the permissible output currents. Table 22.3 DC Characteristics (1) Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V - T Min 1.0 -- Typ -- -- -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions VT+ V -V + T - T 0.4 VCC - 0.7 Input high voltage RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, P83, P84, P90 to P95, port B VIH VCC x 0.7 2.0 2.0 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7, P83, P84, P90 to P95, port B VIL -0.3 -0.3 -- -- 0.5 0.8 V V Output high voltage Output low voltage All output pins VOH (except RESO) All output pins VOL (except RESO) Ports 1, 2, and 5 RESO VCC - 0.5 3.5 -- -- -- -- -- -- -- -- -- -- -- 0.4 1.0 0.4 1.0 V V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 10 mA I OL = 1.6 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V Input leakage STBY, NMI, current RES, MD2 to MD0 Port 7 |Iin| -- -- -- 1.0 A 653 Item Three-state leakage current Ports 1 to 6 Ports 8 to B RESO Input pull-up MOS current Input capacitance Ports 2, 4, and 5 NMI All input pins except NMI Normal operation Sleep mode Module standby mode Standby mode Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C f = 20 MHz f = 20 MHz f = 20 MHz Ta 50C 50C < Ta -- -I p Cin 50 -- -- I CC* 3 -- -- -- -- -- -- -- -- -- 10.0 300 50 15 A A pF pF mA mA mA A A mA mA Current dissipation * 2 49 100 (5.0 V) 36 73 (5.0 V) 19 51 (5.0 V) 0.01 -- 0.6 0.6 5.0 20.0 1.5 1.5 Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage AI CC -- -- -- AI CC -- -- 0.01 0.5 2.0 5.0 0.8 3.0 A mA mA DASTE = 0 -- VRAM 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 Do not open the pin connections of the AV CC, VREF and AVSS pins while the A/D converter is not in use. Connect the AVCC and VREF pins to the VCC and connect the AVSS pin to the VSS , respectively. *2 Given current consumption values are when all the output pins are made to unloaded state and, furthermore, when the on-chip pull-up MOS is turned off under conditions that V IH min = VCC - 0.5 V and VIL max = 0.5 V. Also, the aforesaid current consumption values are when V IH min = VCC x 0.9 and VIL max = 0.3 V under the condition of VRAM V CC < 4.5 V. 654 *3 I CC max (under normal operations) = 1.0 (mA) + 0.90 (mA/(MHz x V)) x V CC x f I CC max (when using the sleeve) = 1.0 (mA) + 0.65 (mA/(MHz x V)) x V CC x f I CC max (when the sleeve + module are standing by) = 1.0 (mA) + 0.45 (mA/(MHz x V)) x V CC x f Also, the typ values for current dissipation are reference values. 655 Table 22.3 DC Characteristics (2) Conditions: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V - T Min VCC x 0.2 -- Typ -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions VT+ V -V + T - T VCC x 0.07 -- VCC x 0.9 -- Input high voltage RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6 P83, P84, P90 to P95, port B VIH VCC x 0.7 VCC x 0.7 VCC x 0.7 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7 P83, P84, P90 to P95, port B VIL -0.3 -0.3 -- -- VCC x 0.1 VCC x 0.2 0.8 V V V VCC < 4.0 V VCC = 4.0 to 5.5 V I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 5 mA (VCC < 4.0 V) I OL = 10 mA (VCC = 4.0 to 5.5 V) Output high voltage All output pins VOH (except RESO) VCC - 0.5 VCC - 1.0 -- -- -- -- -- -- 0.4 1.0 V V V V Output low voltage All output pins VOL (except RESO) Ports 1, 2, and 5 -- -- RESO Input leakage STBY, NMI, current RES, MD2 to MD0 Port 7 |Iin| -- -- -- -- 0.4 1.0 V A I OL = 1.6 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A 656 Item Three-state leakage current Ports 1 to 6 Ports 8 to B RESO Input pull-up MOS current Input capacitance Ports 2, 4, and 5 NMI All input pins except NMI Normal operation Sleep mode Module standby mode Standby mode Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C f = 10 MHz f = 10 MHz f = 10 MHz Ta 50C 50C < Ta AVCC = 3.0 V AVCC = 3.0 V -- -I p Cin 10 -- -- I CC* 3 -- -- -- -- -- -- -- -- -- 10.0 300 50 15 A A pF pF mA mA mA A A mA mA Current dissipation * 2 14 51 (3.0 V) 11 37 (3.0 V) 6.5 26 (3.0 V) 0.01 -- 0.2 0.2 5.0 20.0 0.5 0.5 Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage AI CC -- -- -- AI CC -- -- 0.01 0.3 1.2 5.0 0.5 2.0 A mA mA DASTE = 0 VREF = 3.0 V VREF = 3.0 V -- VRAM 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 Do not open the pin connections of the AV CC, VREF and AVSS pins while the A/D converter is not in use. Connect the AVCC and VREF pins to the VCC and connect the AVSS pin to the VSS , respectively. *2 Given current consumption values are when all the output pins are made to unloaded state and, furthermore, when the on-chip pull-up MOS is turned off under conditions that V IH min = VCC - 0.5 V and VIL max = 0.5 V. Also, the aforesaid current consumption values are when VIH min = VCC x 0.9 and VIL max = 0.3 V under the condition of VRAM V CC < 2.7 V. 657 *3 I CC max (under normal operations) = 1.0 (mA) + 0.90 (mA/(MHz x V)) x V CC x f I CC max (when using the sleeve) = 1.0 (mA) + 0.65 (mA/(MHz x V)) x V CC x f I CC max (when the sleeve + module are standing by) = 1.0 (mA) + 0.45 (mA/(MHz x V)) x V CC x f Also, the typ values for current dissipation are reference values. 658 Table 22.3 DC Characteristics (3) Conditions: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V - T Min VCC x 0.2 -- Typ -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions VT+ V -V + T - T VCC x 0.07 -- VCC x 0.9 -- Input high voltage RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6 P83, P84, P90 to P95, port B VIH VCC x 0.7 VCC x 0.7 VCC x 0.7 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7 P83, P84, P90 to P95, port B VIL -0.3 -0.3 -- -- VCC x 0.1 VCC x 0.2 0.8 V V V VCC < 4.0 V VCC = 4.0 to 5.5 V I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 5 mA (VCC < 4.0 V) I OL = 10 mA (VCC = 4.0 to 5.5 V) Output high voltage All output pins VOH (except RESO) VCC - 0.5 VCC - 1.0 -- -- -- -- -- -- 0.4 1.0 V V V V Output low voltage All output pins VOL (except RESO) Ports 1, 2, and 5 -- -- RESO Input leakage STBY, RES, current NMI, MD2 to MD0 Port 7 |Iin| -- -- -- -- 0.4 1.0 V A I OL = 1.6 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A 659 Item Three-state leakage current Ports 1 to 6 Ports 8 to B RESO Input pull-up MOS current Input capacitance Ports 2, 4, and 5 NMI All input pins except NMI Normal operation Sleep mode Module standby mode Standby mode Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C f = 13 MHz f = 13 MHz f = 13 MHz Ta 50C 50C < Ta AVCC = 3.0 V AVCC = 3.0 V -- -I p Cin 10 -- -- I CC* 3 -- -- -- -- -- -- -- -- -- 10.0 300 50 15 A A pF pF mA mA mA A A mA mA Current dissipation * 2 21 66 (3.5 V) 16 48 (3.5 V) 9 34 (3.5 V) 0.01 -- 0.2 0.2 5.0 20.0 0.5 0.5 Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage AI CC -- -- -- AI CC -- -- 0.01 0.3 1.2 5.0 0.5 2.0 A mA mA DASTE = 0 VREF = 3.0 V VREF = 3.0 V -- VRAM 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 Do not open the pin connections of the AV CC, VREF and AVSS pins while the A/D converter is not in use. Connect the AVCC and VREF pins to the VCC and connect the AVSS pin to the VSS , respectively. *2 Given current consumption values are when all the output pins are made to unloaded state and, furthermore, when the on-chip pull-up MOS is turned off under conditions that V IH min = VCC - 0.5 V and VIL max = 0.5 V. Also, the aforesaid current consumption values are when VIH min = VCC x 0.9 and VIL max = 0.3 V under the condition of VRAM V CC < 3.0 V. 660 *3 I CC max (under normal operations) = 1.0 (mA) + 0.90 (mA/(MHz x V)) x V CC x f I CC max (when using the sleeve) = 1.0 (mA) + 0.65 (mA/(MHz x V)) x V CC x f I CC max (when the sleeve + module are standing by) = 1.0 (mA) + 0.45 (mA/(MHz x V)) x V CC x f Also, the typ values for current dissipation are reference values. 661 Table 22.4 Permissible Output Currents Conditions: VCC = 2.7 V to 5.5 V, AVCC = 2.7 V to 5.5 V, VREF = 2.7 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, and 5 Other output pins Total of 20 pins in Ports 1, 2, and 5 Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins |-IOH | |-IOH | IOL Symbol I OL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.4. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 22.1 and 22.4. H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version 2 k Port Darlington pair Figure 22.1 Darlington Pair Drive Circuit (Example) 662 H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version 600 Ports 1, 2, 5 LED Figure 22.2 Sample LED Circuit 663 22.1.3 AC Characteristics Clock timing parameters are listed in table 22.5, control signal timing parameters in table 22.6, and bus timing parameters in table 22.7. Timing parameters of the on-chip supporting modules are listed in table 22.8. Table 22.5 Clock Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 to AVCC, VSS = AVSS = 0 V Condition B: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V Condition C: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V Condition A Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Clock oscillator settling time at reset Clock oscillator settling time in software standby Symbol t cyc t CL t CH t Cr t Cf t OSC1 Min 100 30 30 -- -- 20 Max 1000 -- -- 20 20 -- Min 76.9 18 18 -- -- 20 B Max 1000 -- -- 15 15 -- Min 50 15 15 -- -- 20 C Max 1000 -- -- 10 10 -- Test Unit Conditions ns ns ns ns ns ms Figure 22.19 Figure 22.19 to figure 22.31 t OSC2 7 -- 7 -- 7 -- ms 664 Table 22.6 Control Signal Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 to AVCC, VSS = AVSS = 0 V Condition B: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V Condition C: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V Condition A Item RES setup time RES pulse width Mode programming setup time RESO output delay time RESO output pulse width NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width (in recovery from software standby mode) Symbol t RESS t RESW t MDS t RESD t RESOW t NMIS t NMIH t NMIW Min 200 10 200 -- 132 200 10 200 Max -- -- -- 100 -- -- -- -- Min 200 10 200 -- 132 200 10 200 B Max -- -- -- 100 -- -- -- -- Min 150 10 200 -- 132 150 10 200 C Max -- -- -- 50 -- -- -- -- Unit ns t cyc ns ns t cyc ns ns ns Figure 22.22 Figure 22.21 Test Conditions Figure 22.20 665 Table 22.7 Bus Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 to AVCC, VSS = AVSS = 0 V Condition B: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V Condition C: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V Condition A Item Symbol Min -- 0.5 t cyc - 45 -- -- -- -- 1.0 t cyc - 50 1.5 t cyc - 50 0.5 t cyc - 45 1.0 t cyc - 45 50 0 Max 50 -- 60 60 60 60 -- -- -- -- -- -- Min -- 0.5 t cyc - 35 -- -- -- -- 1.0 t cyc - 40 1.5 t cyc - 40 0.5 t cyc - 29 1.0 t cyc - 35 40 0 B Max 40 -- 50 50 50 50 -- -- -- -- -- -- Min -- 0.5 t cyc - 20 -- -- -- -- 1.0 t cyc - 25 1.5 t cyc - 25 0.5 t cyc - 20 1.0 t cyc - 20 25 0 C Test Max Unit Conditions 25 -- 25 25 25 25 -- -- -- -- -- -- ns ns ns ns ns ns ns ns ns ns ns ns Figure 22.23, figure 22.24 Address delay time t AD Address hold time t AH Read strobe delay t RSD time Address strobe delay time t ASD Write strobe delay t WSD time Strobe delay time t SD Write strobe pulse t WSW1 width 1 Write strobe pulse t WSW2 width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time t AS1 t AS2 t RDS t RDH 666 Condition A Item Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Symbol t WDD t WDS1 t WDS2 t WDH Min -- Max 60 Min -- B Max 50 Min -- C Max 35 Test Unit Conditions ns ns ns ns Figure 22.23, figure 22.24 1.0 t cyc -- - 50 2.0 t cyc -- - 50 0.5 t cyc -- - 30 -- -- -- -- 2.0 t cyc - 100 3.0 t cyc - 100 1.5 t cyc - 100 2.5 t cyc - 100 1.0 t cyc -- - 40 2.0 t cyc -- - 40 0.5 t cyc -- - 25 -- -- -- -- 2.0 t cyc - 80 3.0 t cyc - 80 1.5 t cyc - 80 2.5 t cyc - 80 1.0 t cyc -- - 30 2.0 t cyc -- - 30 0.5 t cyc -- - 15 -- -- -- -- Read data access t ACC1 time 1 Read data access t ACC2 time 2 Read data access t ACC3 time 3 Read data access t ACC4 time 4 Precharge time 1 Precharge time 2 Wait setup time Wait hold time t PCH1 t PCH2 t WTS t WTH 2.0 t cyc ns - 45 3.0 t cyc ns - 45 1.5 t cyc ns - 45 2.5 t cyc ns - 45 ns ns ns ns ns ns ns ns Figure 22.26 Figure 22.25 1.0 t cyc -- - 40 0.5 t cyc -- - 40 40 5 40 -- -- -- -- -- -- 60 60 60 1.0 t cyc -- - 30 0.5 t cyc -- - 30 40 5 40 -- -- -- -- -- -- 50 50 50 1.0 t cyc -- - 20 0.5 t cyc -- - 20 25 5 25 -- -- -- -- -- -- 30 30 30 Bus request setup t BRQS time Bus acknowledge delay time 1 Bus acknowledge delay time 2 Bus-floating time t BACD1 t BACD2 t BZD Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. 667 Table 22.8 Timing of On-Chip Supporting Modules Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 to AVCC, VSS = AVSS = 0 V Condition B: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V Condition C: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V Condition A Module Item Ports and TPC Output data delay time Symbol t PWD Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 Max 100 -- -- 100 -- -- -- -- 100 -- -- -- -- Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 B Max 100 -- -- 100 -- -- -- -- 100 -- -- -- -- Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 C Max 50 -- -- 50 -- -- -- -- 50 -- -- -- -- Unit ns ns ns ns ns ns t cyc t cyc ns ns ns t cyc t cyc Figure 22.29 Figure 22.28 Figure 22.29 Figure 22.28 Test Conditions Figure 22.27 Input data setup t PRS time Input data hold time t PRH t TOCD t TICS 16-bit timer Timer output delay time Timer input setup time Timer clock t TCKS input setup time Timer clock pulse width 8-bit timer Single edge Both edges t TCKWH t TCKWL t TOCD t TICS Timer output delay time Timer input setup time Timer clock t TCKS input setup time Timer clock pulse width Single edge Both edges t TCKWH t TCKWL 668 Condition A Module Item SCI Input clock cycle Symbol Min Asynt Scyc chronous Synchronous t SCKr t SCKf t SCKW t TXD t RXS 4 6 1.5 1.5 0.4 -- 100 Max -- -- -- -- 0.6 100 -- Min 4 6 1.5 1.5 0.4 -- 100 B Max -- -- -- -- 0.6 100 -- Min 4 6 1.5 1.5 0.4 -- 100 C Max -- -- -- -- 0.6 100 -- Unit t cyc t cyc t cyc t cyc t Scyc ns ns Figure 22.31 Test Conditions Figure 22.30 Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) Clock t RXH input Clock output 100 0 -- -- 100 0 -- -- 100 0 -- -- ns ns RL Chip output pin C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B, RESO R L = 2.4 k R H = 12 k C RH Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V Figure 22.3 Output Load Circuit 669 22.1.4 A/D Conversion Characteristics Table 22.9 lists the A/D conversion characteristics. Table 22.9 A/D Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 to AVCC, VSS = AVSS = 0 V, fmax = 10 MHz Condition B: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition C: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item ConverResolution sion time: Conversion time (single 134 states mode) Analog input capacitance Min Typ Max 10 -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 134 20 -- -- 10 5 7.5 7.5 7.5 0.5 8.0 B Min Typ Max 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 134 20 -- -- 10 5 7.5 7.5 7.5 0.5 8.0 C Min Typ Max 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 134 20 10 5 -- -- 3.5 3.5 3.5 0.5 4.0 Unit bits t cyc pF k k k k LSB LSB LSB LSB LSB Permissible 13 MHz -- signal-source > 13 MHz -- impedance 4.0 V AV CC -- 5.5 V 2.7 V AV CC -- < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy -- -- -- -- -- 670 Condition A Item Resolution Conversion time: Conversion time (single 70 states mode) Analog input capacitance Min Typ Max 10 -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 70 20 -- -- 5 3 B Min Typ Max 10 -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 70 20 -- -- 5 3 C Min Typ Max 10 -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- 10 70 20 5 3 -- -- 7.5 7.5 7.5 0.5 8.0 Unit bits t cyc pF k k k k LSB LSB LSB LSB LSB Permissible 13 MHz -- signal-source > 13 MHz -- impedance 4.0 V AV CC -- 5.5 V 2.7 V AV CC -- < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy -- -- -- -- -- 15.5 -- 15.5 -- 15.5 -- 0.5 16 -- -- 15.5 -- 15.5 -- 15.5 -- 0.5 16 -- -- 671 22.1.5 D/A Conversion Characteristics Table 22.10 lists the D/A conversion characteristics. Table 22.10 D/A Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 2.7 to 5.5 V, AVCC = 2.7 to 5.5 V, VREF = 2.7 to AVCC, VSS = AVSS = 0 V, fmax = 10 MHz Condition B: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition C: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item Resolution Conversion time (centering time) Absolute accuracy Min Typ Max 8 -- 8 -- 8 10 B Min Typ Max 8 -- 8 -- 8 10 C Min Typ Max 8 -- 8 -- 8 10 Test Unit Conditions bits s 20 pF capacitive load -- -- 2.0 3.0 -- 2.0 -- -- 2.0 3.0 -- 2.0 -- -- 1.5 2.0 -- 1.5 LSB 2 M resistive load LSB 4 M resistive load 672 22.2 Electrical Characteristics of H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version Absolute Maximum Ratings 22.2.1 Table 22.11 lists the absolute maximum ratings. Table 22.11 Absolute Maximum Ratings Item Power supply voltage Input voltage (FWE)* 1 1 Symbol VCC Vin Vin Vin VREF AVCC VAN Topr Value -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 -0.3 to +7.0 -0.3 to AVCC +0.3 Regular specifications: -20 to +75* 2 2 Unit V V V V V V V C C C Input voltage (except for port 7)* Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Wide-range specifications: -40 to +85* Storage temperature Tstg -55 to +125 Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: *1 12 V must not be applied to any pin, as this may cause permanent damage to the device. *2 The operating temperature range when programming and erasing the flash memory is: Ta = 0 to + 75C (regular specifications), Ta = 0 to + 85C (wide-range specifications). 673 22.2.2 DC Characteristics Tables 22.12 lists the DC characteristics. Table 22.13 lists the permissible output currents. Table 22.12 DC Characteristics (1) Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) [Programming/erasing conditions: T a = 0 to +75C (regular specifications), Ta = 0 to +85C (wide-range specifications)] Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V V - T + T + T - T Min 1.0 -- 0.4 VCC - 0.7 Typ -- -- -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions V -V Input high voltage RES, STBY, NMI, MD2 to MD0, FWE EXTAL Port 7 Ports 1 to 6, P83, P84, P90 to P95, port B Input low voltage RES, STBY, FWE, MD2 to MD0 NMI, EXTAL, ports 1 to 7, P83, P84, P90 to P95, port B Output high voltage Output low voltage All output pins All output pins Ports 1, 2, and 5 Input leakage STBY, RES, current NMI, FWE MD2 to MD0 Port 7 |Iin| VOH VOL VIL VIH VCC x 0.7 2.0 2.0 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V -0.3 -- 0.5 V -0.3 -- 0.8 V VCC - 0.5 3.5 -- -- -- -- -- -- -- -- -- -- 0.4 1.0 1.0 V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 10 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A 674 Item Three-state leakage current Input pull-up MOS current Input capacitance Ports 1 to 6 Ports 8 to B Ports 2, 4, and 5 FWE NMI All input pins except NMI, and FWE Current dissipation * 2 Normal operation Sleep mode Module standby mode Standby mode Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C -I p Cin 50 -- -- -- -- -- -- -- 300 80 50 15 A pF pF pF I CC* 3 -- -- -- -- -- 55 100 (5.0 V) 40 73 (5.0 V) 24 51 (5.0 V) 0.01 -- 60 5.0 20.0 110 mA mA mA A A mA f = 20 MHz f = 20 MHz f = 20 MHz Ta 50C 50C < Ta f = 20 MHz Flash memory programming/ erasing * 4 Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage VRAM AI CC AI CC -- -- -- 0.6 0.6 1.5 1.5 mA mA -- -- -- 0.01 0.5 2.0 5.0 0.8 3.0 A mA mA DASTE = 0 -- 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open. Connect AVCC and VREF to VCC, and connect AVSS to V SS . *2 Current dissipation values are for V IH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip MOS pull-up transistors in the off state. The values are for VRAM V CC < 4.5 V, VIH min = VCC x 0.9, and V IL max = 0.3 V. 675 *3 I CC max (normal operation) = 1.0 (mA) + 0.90 (mA/(MHz x V)) x V CC x f I CC max (sleep mode) = 1.0 (mA) + 0.65 (mA/(MHz x V)) x V CC x f I CC max (sleep mode + module standby mode) = 1.0 (mA) + 0.45 (mA/(MHz x V)) x V CC x f The Typ values for power consumption are reference values. *4 Sum of current dissipation in normal operation and current dissipation in program/erase operations. 676 Table 22.12 DC Characteristics (2) Conditions: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) [Programming/erasing conditions: V CC = 3.0 to 3.6 V, Ta = 0 to +75C (regular specifications), T a = 0 to +85C (wide-range specifications)] Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V V - T + T + T - T Min VCC x 0.2 -- VCC x 0.9 Typ -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions V -V Input high voltage STBY, RES, NMI, MD2 to MD0, FWE EXTAL Port 7 Ports 1 to 6 P83, P84, P90 to P95, port B Input low voltage STBY, RES, FWE, MD2 to MD0 NMI, EXTAL, ports 1 to 7 P83, P84, P90 to P95, port B Output high voltage All output pins VOH VIL VIH VCC x 0.07 -- -- VCC x 0.7 VCC x 0.7 VCC x 0.7 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V -0.3 -- VCC x 0.1 V -0.3 -- VCC x 0.2 0.8 V VCC < 4.0 V VCC = 4.0 to 5.5 V VCC - 0.5 VCC - 1.0 -- -- -- -- -- -- -- 0.4 1.0 1.0 V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 5 mA (VCC < 4.0 V) Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V Output low voltage All output pins Ports 1, 2, and 5 VOL -- -- Input leakage STBY, RES, current NMI, FWE, MD2 to MD0 Port 7 |Iin| -- -- -- 1.0 A 677 Item Three-state leakage current Input pull-up MOS current Input capacitance Ports 1 to 6 Ports 8 to B Ports 2, 4, and 5 FWE NMI All input pins except NMI, and FWE Current dissipation * 2 Normal operation Sleep mode Module standby mode Standby mode Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C -I p Cin 10 -- -- -- -- -- -- -- 300 80 50 15 A pF pF pF I CC* 3 -- -- -- -- -- 28 66 (3.5 V) 20 48 (3.5 V) 13 34 (3.5 V) 0.01 -- 5.0 20.0 mA mA mA A A mA f = 13 MHz f = 13 MHz f = 13 MHz Ta 50C 50C < Ta f = 13 MHz Flash memory programming/ erasing * 4 Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage VRAM AI CC AI CC -- 33 76 (3.5 V) 0.2 0.2 0.5 0.5 -- -- mA mA AVCC = 3.0 AVCC = 3.0 V -- -- -- 0.01 0.3 1.2 5.0 0.5 2.0 A mA mA DASTE = 0 VREF = 3.0 V VREF = 3.0 V -- 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open. Connect AVCC and VREF to VCC, and connect AVSS to V SS . *2 Current dissipation values are for V IH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip MOS pull-up transistors in the off state. The values are for VRAM V CC < 4.5 V, VIH min = VCC x 0.9, and V IL max = 0.3 V. 678 *3 I CC max (normal operation) = 1.0 (mA) + 0.90 (mA/(MHz x V)) x V CC x f I CC max (sleep mode) = 1.0 (mA) + 0.65 (mA/(MHz x V)) x V CC x f I CC max (sleep mode + module standby mode) = 1.0 (mA) + 0.45 (mA/(MHz x V)) x V CC x f The Typ values for power consumption are reference values. *4 Sum of current dissipation in normal operation and current dissipation in program/erase operations. 679 Table 22.13 Permissible Output Currents Conditions: VCC = 3.0 V to 5.5 V, AVCC = 3.0 V to 5.5 V, VREF = 3.0 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, and 5 Other output pins Sum of 20 pins in ports 1, 2, and 5 Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins |-IOH | |-IOH | IOL Symbol I OL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.13. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 22.4 and 22.5. H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version 2 k Port Darlington pair Figure 22.4 Darlington Pair Drive Circuit (Example) 680 H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version 600 Ports 1, 2, 5 LED Figure 22.5 Sample LED Circuit 681 22.2.3 AC Characteristics Clock timing parameters are listed in table 22.14, control signal timing parameters in table 22.15, and bus timing parameters in table 22.16. Timing parameters of the on-chip supporting modules are listed in table 22.17. Table 22.14 Clock Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Symbol t cyc t CL t CH t Cr t Cf Min 76.9 18 18 -- -- 20 7 Max 1000 -- -- 15 15 -- -- Min 50 15 15 -- -- 20 7 B Max 1000 -- -- 10 10 -- -- Unit ns ns ns ns ns ms ms Figure 22.19 Test Conditions Figure 22.19 to figure 22.31 Clock oscillator settling time at t OSC1 reset Clock oscillator settling time in t OSC2 software standby 682 Table 22.15 Control Signal Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item RES setup time RES pulse width Symbol t RESS t RESW Min 200 20 200 200 10 200 Max -- -- -- -- -- -- Min 150 20 200 150 10 200 B Max -- -- -- -- -- -- Unit ns t cyc ns ns ns ns Figure 22.22 Test Conditions Figure 22.20 Mode programming setup time t MDS NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width (in recovery from software standby mode) t NMIS t NMIH t NMIW 683 Table 22.16 Bus Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item Address delay time Address hold time Read strobe delay time Address strobe delay time Write strobe delay time Strobe delay time Write strobe pulse width 1 Write strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time Symbol t AD t AH t RSD t ASD t WSD t SD t WSW1 t WSW2 t AS1 t AS2 t RDS t RDH Min -- 0.5 t cyc - 35 -- -- -- -- 1.0 t cyc - 40 1.5 t cyc - 40 0.5 t cyc - 29 1.0 t cyc - 35 40 0 Max 40 -- 50 50 50 50 -- -- -- -- -- -- Min -- 0.5 t cyc - 20 -- -- -- -- 1.0 t cyc - 25 1.5 t cyc - 25 0.5 t cyc - 20 1.0 t cyc - 20 25 0 B Max Unit 25 -- 25 25 25 25 -- -- -- -- -- -- ns ns ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 22.23, figure 22.24 684 Condition A Item Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time 1 Precharge time 2 Wait setup time Wait hold time Bus request setup time Symbol t WDD t WDS1 t WDS2 t WDH t ACC1 t ACC2 t ACC3 t ACC4 t PCH1 t PCH2 t WTS t WTH t BRQS Min -- Max 50 Min -- B Max 35 Unit ns ns ns ns Test Conditions Figure 22.23, figure 22.24 1.0 t cyc -- - 40 2.0 t cyc -- - 40 0.5 t cyc -- - 25 -- -- -- -- 2.0 t cyc - 80 3.0 t cyc - 80 1.5 t cyc - 80 2.5 t cyc - 80 1.0 t cyc -- - 30 2.0 t cyc -- - 30 0.5 t cyc -- - 15 -- -- -- -- 2.0 t cyc ns - 45 3.0 t cyc ns - 45 1.5 t cyc ns - 45 2.5 t cyc ns - 45 ns ns ns ns ns ns ns Figure 22.26 Figure 22.25 1.0 t cyc -- - 30 0.5 t cyc -- - 30 40 5 40 -- -- -- -- -- 50 50 1.0 t cyc -- - 20 0.5 t cyc -- - 20 25 5 25 -- -- -- -- -- 30 30 Bus acknowledge delay time 1 t BACD1 Bus acknowledge delay time 2 t BACD2 Bus-floating time t BZD -- 50 -- 30 ns Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. 685 Table 22.17 Timing of On-Chip Supporting Modules Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Module Item Port/ TPC Symbol Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 Max 100 -- -- 100 -- -- -- -- 100 -- -- -- -- Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 B Max 50 -- -- 50 -- -- -- -- 50 -- -- -- -- Unit ns ns ns ns ns ns t cyc t cyc ns ns ns t cyc t cyc Figure 22.29 Figure 22.28 Figure 22.29 Figure 22.28 Test Conditions Figure 22.27 Output data delay time t PWD Input data setup time Input data hold time t PRS t PRH t TOCD 16-bit timer Timer output delay time Timer input setup time t TICS Timer clock input setup time Timer clock pulse width Single edge Both edges 8-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges t TCKS t TCKWH t TCKWL t TOCD t TICS t TCKS t TCKWH t TCKWL 686 Condition A Module Item SCI Symbol Min 4 6 1.5 1.5 0.4 -- 100 100 0 Max -- -- -- -- 0.6 100 -- -- -- Min 4 6 1.5 1.5 0.4 -- 100 100 0 B Max -- -- -- -- 0.6 100 -- -- -- Unit t cyc t cyc t cyc t cyc t Scyc ns ns ns ns Figure 22.31 Test Conditions Figure 22.30 Input clock Asynt Scyc cycle chronous Synt Scyc chronous Input clock rise time Input clock fall time t SCKr t SCKf Input clock pulse width t SCKW Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) Clock input Clock output t TXD t RXS t RXH RL H8/3062F-ZTAT or H8/3062F-ZTAT R-mask version output pin C RH C = 90 pF: ports 1 to 6, and 8 C = 30 pF: ports 9, A, B R L = 2.4 k R H = 12 k Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V Figure 22.6 Output Load Circuit 687 22.2.4 A/D Conversion Characteristics Table 22.18 lists the A/D conversion characteristics. Table 22.18 A/D Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item Conversion time: Resolution 134 states Conversion time (single mode) Analog input capacitance Permissible signal-source impedance 13 MHz > 13 MHz Min 10 -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 134 20 -- -- 10 5 7.5 7.5 7.5 0.5 8.0 Min 10 -- -- -- -- -- -- -- -- -- -- -- B Typ 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 134 20 10 5 -- -- 3.5 3.5 3.5 0.5 4.0 Unit bits t cyc pF k k k k LSB LSB LSB LSB LSB 4.0 V AV CC -- 5.5 V 3.0 V AV CC -- < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy -- -- -- -- -- 688 Condition A Item Conversion time: Resolution 70 states Conversion time (single mode) Analog input capacitance Permissible signal-source impedance 13 MHz > 13 MHz Min 10 -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 70 20 -- -- 5 3 15.5 15.5 15.5 0.5 16 Min 10 -- -- -- -- -- -- -- -- -- -- -- B Typ 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 70 20 5 3 -- -- 7.5 7.5 7.5 0.5 8.0 Unit bits t cyc pF k k k k LSB LSB LSB LSB LSB 4.0 V AV CC -- 5.5 V 3.0 V AV CC -- < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy -- -- -- -- -- 689 22.2.5 D/A Conversion Characteristics Table 22.19 lists the D/A conversion characteristics. Table 22.19 D/A Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Condition A: VCC = 3.0 to 5.5 V, AVCC = 3.0 to 5.5 V, VREF = 3.0 to AVCC, VSS = AVSS = 0 V, fmax = 13 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition A Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 2.0 -- Max 8 10 3.0 2.0 Min 8 -- -- -- B Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20 pF capacitive load 2 M resistive load 4 M resistive load Test Conditions 690 22.2.6 Flash Memory Characteristics Table 22.20 shows the flash memory characteristics. Table 22.20 Flash Memory Characteristics (1) Conditions: VCC = 4.5 to 5.5 V, AVCC = 4.5 to 5.5 V, VSS = AVSS = 0 V Ta = 0 to +75C (Programming/erasing operating temperature range: regular specification) Ta = 0 to +85C (Programming/erasing operating temperature range: wide-range specification) Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting * Wait time after P bit setting * * Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting* Wait time after H'FF dummy write*1 Wait time after PV bit clear *1 1 4 1 1 4 1 Symbol tP tE NWEC x y z Min -- -- -- 10 50 150 10 10 4 2 4 -- 10 200 5 10 10 20 2 5 120 Typ 10 100 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 200 1200 100 -- -- 500 -- -- -- -- -- 403 -- -- 10 -- -- -- -- -- 240 Unit ms/ 32 bytes ms/block Times s s s s s s s s Times s s ms s s s s s Times Test Condition Maximum programming count* * N Erase Wait time after SWE bit setting*1 Wait time after ESU bit setting *1 Wait time after E bit setting *1 *5 Wait time after E bit clear* 1 x y z N Wait time after ESU bit clear*1 Wait time after EV bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV bit clear *1 Maximum erase count * * 1 5 Notes: *1 Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. *2 Programming time per 32 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR) is set. It does not include the programming verification time) 691 *3 Block erase time (Shows the total period for which the E-bit in FLMCR is set. It does not include the erase verification time) *4 To specify the maximum programming time (tP(max)) in the 32-byte programming flowchart, set the maximum value (403) for the maximum programming count (N). The wait time after P bit setting (z) should be changed as follows according to the programming counter value. Programming counter value of 1 to 4 : z = 150 s Programming counter value of 5 to 403 : z = 500 s *5 For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (z) and the maximum erase count (N): t E(max) = Wait time after E bit setting (z) x maximum erase count (N) To set the maximum erase time, the values of z and N should be set so as to satisfy the above formula. Examples: When z = 5 [ms], N = 240 times When z = 10 [ms], N = 120 times 692 Table 22.20 Flash Memory Characteristics (2) Conditions: VCC = 3.0 to 3.6 V, AVCC = 3.0 to 3.6 V, VSS = AVSS = 0 V Ta = 0 to +75C (Programming/erasing operating temperature range: regular specification) Ta = 0 to +85C (Programming/erasing operating temperature range: wide-range specification) Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting * Wait time after P bit setting * * Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting* Wait time after H'FF dummy write*1 Wait time after PV bit clear *1 1 4 1 1 1 Symbol tP tE NWEC x y z Min -- -- -- 10 50 150 10 10 4 2 4 -- 10 200 5 10 10 20 2 5 120 Typ 10 100 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max 200 1200 100 -- -- 500 -- -- -- -- -- 403 -- -- 10 -- -- -- -- -- 240 Unit ms/ 32 bytes ms/block Times s s s s s s s s Times s s ms s s s s s Times Test Condition 4 Maximum programming count* * N Erase Wait time after SWE bit setting*1 Wait time after ESU bit setting *1 Wait time after E bit setting *1 *5 Wait time after E bit clear* 1 x y z N Wait time after ESU bit clear*1 Wait time after EV bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV bit clear *1 Maximum erase count * * 1 5 Notes: *1 Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. *2 Programming time per 32 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR) is set. It does not include the programming verification time) *3 Block erase time (Shows the total period for which the E-bit in FLMCR is set. It does not include the erase verification time) 693 *4 To specify the maximum programming time (tP(max)) in the 32-byte programming flowchart, set the maximum value (403) for the maximum programming count (N). The wait time after P bit setting (z) should be changed as follows according to the programming counter value. Programming counter value of 1 to 4 : z = 150 s Programming counter value of 5 to 403 : z = 500 s *5 For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (z) and the maximum erase count (N): t E(max) = Wait time after E bit setting (z) x maximum erase count (N) To set the maximum erase time, the values of z and N should be set so as to satisfy the above formula. Examples: When z = 5 [ms], N = 240 times When z = 10 [ms], N = 120 times 694 22.3 22.3.1 Electrical Characteristics of H8/3064F-ZTAT B-Mask Version Absolute Maximum Ratings Table 22.21 lists the absolute maximum ratings. Table 22.21 Absolute Maximum Ratings Item Power supply voltage Input voltage (FWE)* 2 Input voltage (except for port 7)* 2 Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Symbol VCC* 1 Vin Vin Vin VREF AVCC VAN Topr Value 5 V operation model: -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 5 V operation model: -0.3 to +7.0 -0.3 to AVCC +0.3 Regular specifications: -20 to +75 Wide-range specifications: -40 to 85 Storage temperature Tstg -55 to +125 Unit V V V V V V V C C C Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: The operating temperature range for flash memory programming/erasing is 0C to +75C. *1 Do not apply the power supply voltage to the VCL pin in 5 V operation models. Connect an external capacitor between this pin and GND. *2 12 V must not be applied to any pin, as this may cause permanent damage to the device. 695 22.3.2 DC Characteristics Table 22.22 lists the DC characteristics. Table 22.23 lists the permissible output currents. Table 22.22 DC Characteristics Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) [Programming/erasing conditions: T a = 0C to +75C] Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V V - T + T + T - T Min 1.0 -- 0.4 VCC - 0.7 Typ -- -- -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions V -V Input high voltage STBY, RES, NMI, MD2 to MD0, FWE EXTAL Port 7 Ports 1 to 6, P83, P84, P90 to P95, port B Input low voltage STBY, RES, FWE, MD2 to MD0 NMI, EXTAL, ports 1 to 7, P83, P84, P90 to P95, port B Output high voltage Output low voltage All output pins All output pins Ports 1, 2, and 5 Input leakage STBY, RES, current NMI, FWE, MD2 to MD0 Port 7 |Iin| VOH VOL VIL VIH VCC x 0.7 2.0 2.0 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V -0.3 -- 0.5 V -0.3 -- 0.8 V VCC - 0.5 3.5 -- -- -- -- -- -- -- -- -- -- 0.4 1.0 1.0 V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 10 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A 696 Item Three-state leakage current Input pull-up MOS current Input capacitance Ports 1 to 6 Ports 8 to B Ports 2, 4, and 5 FWE NMI All input pins except NMI Current dissipation * 2 Normal operation Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C -I p Cin 50 -- -- -- -- -- -- -- 300 80 50 15 A pF pF pF mA I CC* 3 -- 32 54 (5.0 V) 37 66 (5.0 V) f = 20 MHz f = 25 MHz Sleep mode -- 25 47 (5.0 V) 31 58 (5.0 V) mA f = 20 MHz f = 25 MHz Module standby mode -- 21 33 (5.0 V) 24 40 (5.0 V) mA f = 20 MHz f = 25 MHz Standby mode -- -- 1.0 -- 42 10 80 64 A A mA Ta 50C 50C < Ta f = 20 MHz Flash memory programming/ erasing * 4 -- 47 Analog power During A/D supply current conversion During A/D and D/A conversion Idle AI CC -- -- 0.6 0.6 76 1.5 1.5 mA mA f = 25 MHz -- 0.01 5 A DASTE = 0 697 Item Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage Symbol AI CC Min -- -- Typ 0.45 2.0 Max 0.8 3.0 Unit mA mA Test Conditions -- VRAM 2.0 0.01 -- 5 -- A V DASTE = 0 Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AV SS pins open. Connect AVCC and VREF to VCC, and connect AVSS to V SS . *2 Current dissipation values are for V IH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip MOS pull-up transistors in the off state. The values are for VRAM V CC < 4.5 V, VIH min = VCC x 0.9, and V IL max = 0.3 V. *3 I CC max (normal operation) = 3.0 (mA) + 0.46 (mA/(MHz x V)) x V CC x f I CC max (sleep mode) = 3.0 (mA) + 0.40 (mA/(MHz x V)) x V CC x f I CC max (sleep mode + module standby mode) = 3.0 (mA) + 0.27 (mA/(MHz x V)) x V CC x f The Typ values for power consumption are reference values. *4 Sum of current dissipation in normal operation and current dissipation in program/erase operations. 698 Table 22.23 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = -40C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, and 5 Other output pins Total of 20 pins in Ports 1, 2, and 5 Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins | -IOH | | IOH | IOL Symbol I OL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.23. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 22.7 and 22.8. H8/3064F-ZTAT B-mask version 2 k Port Darlington pair Figure 22.7 Darlington Pair Drive Circuit (Example) 699 H8/3064F-ZTAT B-mask version 600 Ports 1, 2, 5 LED Figure 22.8 Sample LED Circuit 700 22.3.3 AC Characteristics Clock timing parameters are listed in table 22.24, control signal timing parameters in table 22.25, and bus timing parameters in table 22.26. Timing parameters of the on-chip supporting modules are listed in table 22.27. Table 22.24 Clock Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Clock oscillator settling time at reset Clock oscillator settling time in software standby Symbol t cyc t CL t CH t Cr t Cf t OSC1 t OSC2 Min 50 15 15 -- -- 20 7 Max 500 -- -- 10 10 -- -- Min 40 10 10 -- -- 20 7 B Max 500 -- -- 10 10 -- -- Unit ns ns ns ns ns ms ms Figure 22.19 Test Conditions Figure 22.19 to figure 22.31 701 Table 22.25 Control Signal Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item RES setup time RES pulse width Symbol t RESS t RESW Min 150 20 200 150 10 200 Max -- -- -- -- -- -- Unit ns t cyc ns ns ns ns Figure 22.22 Test Conditions Figure 22.20 Mode programming setup time t MDS NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width (in recovery from software standby mode) t NMIS t NMIH t NMIW 702 Table 22.26 Bus Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Address delay time Address hold time Read strobe delay time Address strobe delay time Write strobe delay time Strobe delay time Write strobe pulse width 1 Write strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time 1 Precharge time 2 Wait setup time Wait hold time Symbol t AD t AH t RSD t ASD t WSD t SD t WSW1 t WSW2 t AS1 t AS2 t RDS t RDH t WDD t WDS1 t WDS2 t WDH t ACC1 t ACC2 t ACC3 t ACC4 t PCH1 t PCH2 t WTS t WTH Min -- 0.5 t cyc - 20 -- -- -- -- 1.0 t cyc - 25 1.5 t cyc - 25 0.5 t cyc - 20 1.0 t cyc - 20 25 0 -- 1.0 t cyc - 30 2.0 t cyc - 30 0.5 t cyc - 15 -- -- -- -- 1.0 t cyc - 20 0.5 t cyc - 20 25 5 Max 25 -- 25 25 25 25 -- -- -- -- -- -- 35 -- -- -- 2.0 t cyc - 45 3.0 t cyc - 45 1.5 t cyc - 45 2.5 t cyc - 45 -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 703 Figure 22.25 Test Conditions Figure 22.23, figure 22.24 Condition A and B Item Bus request setup time Symbol t BRQS Min 25 -- -- -- Max -- 30 30 30 Unit ns ns ns ns Test Conditions Figure 22.26 Bus acknowledge delay time 1 t BACD1 Bus acknowledge delay time 2 t BACD2 Bus-floating time t BZD Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. 704 Table 22.27 Timing of On-Chip Supporting Modules Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Module Item Symbol t PWD t PRS t PRH t TOCD t TICS t TCKS t TCKWH t TCKWL t TOCD t TICS t TCKS t TCKWH t TCKWL t Scyc Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 4 6 t SCKr t SCKf t SCKW t TXD t RXS t RXH 1.5 1.5 0.4 -- 100 100 0 Max 50 -- -- 50 -- -- -- -- 50 -- -- -- -- -- -- -- -- 0.6 100 -- -- -- Unit ns ns ns ns ns ns t cyc t cyc ns ns ns t cyc t cyc t cyc t cyc t cyc t cyc t Scyc ns ns ns ns Figure 22.31 Figure 22.30 Figure 22.29 Figure 22.28 Figure 22.29 Figure 22.28 Test Conditions Figure 22.27 Ports Output data delay time and TPC Input data setup time Input data hold time 16-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock Single edge pulse width Both edges 8-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock Single edge pulse width Both edges SCI Input clock cycle Asyn- chronous Syn- chronous Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) Clock input Clock output 705 RL H8/3064F-ZTAT B-mask version output pin C RH C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B R L = 2.4 k R H = 12 k Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V Figure 22.9 Output Load Circuit 706 22.3.4 A/D Conversion Characteristics Table 22.28 lists the A/D conversion characteristics. Table 22.28 A/D Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Conversion time: 134 states Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance 13 MHz > 13 MHz 4.0 V AVCC 5.5 V 3.0 V AVCC < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Conversion time: 70 states Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance 13 MHz > 13 MHz 4.0 V AVCC 5.5 V 3.0 V AVCC < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 134 20 10 5 -- -- 3.5 3.5 3.5 0.5 4.0 10 70 20 5 3 -- -- 7.5 7.5 7.5 0.5 8.0 Unit bits tcyc pF k k k k LSB LSB LSB LSB LSB bits tcyc pF k k k k LSB LSB LSB LSB LSB 707 22.3.5 D/A Conversion Characteristics Table 22.29 lists the D/A conversion characteristics. Table 22.29 D/A Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20 pF capacitive load 2 M resistive load 4 M resistive load Test Conditions 708 22.3.6 Flash Memory Characteristics Table 22.30 shows the flash memory characteristics. Table 22.30 Flash Memory Characteristics Conditions: VCC = 4.5 to 5.5 V, AVCC = 4.5 to 5.5 V, VSS = AVSS = 0 V, Ta = 0C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) (operating temperature range for programming/erasing) Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting *1 Wait time after P bit setting *1 *4 Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min -- -- -- 1 50 28 198 8 Typ 10 100 -- 1 50 30 200 10 Max 200 1200 100 -- -- 32 202 12 Unit ms/ 128 bytes ms/block Times s s s s s Programming time wait Programming time wait Additionalprogramming time wait Notes Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear *1 Wait time after SWE bit clear*1 Maximum programming count *1 *4 Erase Wait time after SWE bit setting*1 Wait time after ESU bit setting *1 Wait time after E bit setting *1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV bit clear *1 Wait time after SWE bit clear*1 Maximum erase count *1 *4 tcp tcpsu tspv tspvr tcpv tcswe N tsswe tsesu tse tce tcesu tsev tsevr tcev tcswe N 5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 12 5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 -- -- -- -- -- -- -- 1000 -- -- 100 -- -- -- -- -- -- 120 s s s s s s Times s s ms s s s s s s Times Erase time wait 709 Notes: *1 Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. *2 Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR) is set. It does not include the programming verification time) *3 Block erase time (Shows the total period for which the E-bit in FLMCR is set. It does not include the erase verification time) *4 To specify the maximum programming time (tP(max)) in the 128-byte programming flowchart, set the maximum value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6 : t sp30 = 30 s Programming counter (n) = 7 to 1000 : t sp200 = 200 s Programming counter (n) [in additional programming] = 1 to 6 : t sp10 = 10 s *5 For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (t se) and the maximum erase count (N): t E(max) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of tse and N should be set so as to satisfy the above formula. Examples: When t se = 100 [ms], N = 12 times When t se = 10 [ms], N = 120 times 710 22.4 22.4.1 Electrical Characteristics of H8/3064 Mask ROM B-Mask Version Absolute Maximum Ratings Table 22.31 lists the absolute maximum ratings. Table 22.31 Absolute Maximum Ratings Item Power supply voltage Input voltage (except for port 7)* Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature 2 Symbol VCC* Vin Vin VREF AVCC VAN Topr 1 Value -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 -0.3 to +7.0 -0.3 to AVCC +0.3 Regular specifications: -20 to +75 Wide-range specifications: -40 to +85 Unit V V V V V V C C C Storage temperature Tstg -55 to +125 Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: *1 Do not supply the power supply voltage to the V CL pin. Connect an external capacitor between this pin and GND. *2 12 V must not be applied to any pin, as this may cause permanent damage to the device. 711 22.4.2 DC Characteristics Table 22.32 lists the DC characteristics. Table 22.33 lists the permissible output currents. Table 22.32 DC Characteristics Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V - T Min 1.0 -- Typ -- -- -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions VT+ V -V + T - T 0.4 VCC - 0.7 Input high voltage RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, P83, P84, P90 to P95, port B VIH VCC x 0.7 2.0 2.0 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7, P83, P84, P90 to P95, port B VIL -0.3 -0.3 -- -- 0.5 0.8 V V Output high voltage Output low voltage All output pins VOH (except RESO) All output pins VOL (except RESO) Ports 1, 2, and 5 RESO VCC - 0.5 3.5 -- -- -- -- -- -- -- -- -- -- -- 0.4 1.0 0.4 1.0 V V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 10 mA I OL = 1.6 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V Input leakage STBY, NMI, current RES, MD2 to MD0 Port 7 |Iin| -- -- -- 1.0 A 712 Item Three-state leakage current Ports 1 to 6 Ports 8 to B RESO Input pull-up MOS current Input capacitance Ports 2, 4, and 5 NMI All input pins except NMI Normal operation Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V f = fmin, Ta = 25C f = 20 MHz f = 25 MHz f = 20 MHz f = 25 MHz f = 20 MHz f = 25 MHz Ta 50C 50C < Ta -- -I p Cin 50 -- -- I CC* 3 -- -- -- -- -- -- 10.0 300 50 15 A A pF pF mA mA mA mA mA mA A A mA mA Current dissipation * 2 32 54 (5.0 V) 37 66 (5.0 V) 25 47 (5.0 V) 31 58 (5.0 V) 21 33 (5.0 V) 24 40 (5.0 V) 1.0 -- 0.6 0.6 10 80 1.5 1.5 Sleep mode -- -- Module standby mode -- -- Standby mode -- -- Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage AI CC -- -- -- AI CC -- -- 0.01 0.45 2.0 5.0 0.8 3.0 A mA mA DASTE = 0 -- VRAM 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open. Connect AVCC and VREF to VCC, and connect AVSS to V SS . *2 Current dissipation values are for V IH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip MOS pull-up transistors in the off state. 713 The values are for VRAM V CC < 4.5 V, VIH min = VCC x 0.9, and V IL max = 0.3 V. *3 I CC max (normal operation) = 3.0 (mA) + 0.46 (mA/(MHz x V)) x V CC x f = 3.0 (mA) + 0.40 (mA/(MHz x V)) x V CC x f I CC max (sleep mode) I CC max (sleep mode + module standby mode) = 3.0 (mA) + 0.27 (mA/(MHz x V)) x V CC x f The Typ values for power consumption are reference values. Table 22.33 Permissible Output Currents Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, and 5 Other output pins Total of 20 pins in Ports 1, 2, and 5 Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins |-IOH | |-IOH | IOL Symbol I OL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.33. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 22.10 and 22.11. 714 H8/3064 mask ROM B-mask version 2 k Port Darlington pair Figure 22.10 Darlington Pair Drive Circuit (Example) H8/3064 mask ROM B-mask version 600 Ports 1, 2, 5 LED Figure 22.11 Sample LED Circuit 715 22.4.3 AC Characteristics Clock timing parameters are listed in table 22.34, control signal timing parameters in table 22.35, and bus timing parameters in table 22.36. Timing parameters of the on-chip supporting modules are listed in table 22.37. Table 22.34 Clock Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Clock oscillator settling time at reset Clock oscillator settling time in software standby Symbol t cyc t CL t CH t Cr t Cf t OSC1 t OSC2 Min 50 15 15 -- -- 20 7 Max 500 -- -- 10 10 -- -- Min 40 10 10 -- -- 20 7 B Max 500 -- -- 10 10 -- -- Unit ns ns ns ns ns ms ms Figure 22.19 Test Conditions Figure 22.19 to figure 22.31 716 Table 22.35 Control Signal Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item RES setup time RES pulse width RESO output delay time RESO output pulse width NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width Symbol t RESS t RESW Min 150 20 200 -- 132 150 10 200 Max -- -- -- 50 -- -- -- -- Unit ns t cyc ns ns t cyc ns ns ns Figure 22.22 Figure 22.21 Test Conditions Figure 22.20 Mode programming setup time t MDS t RESD t RESOW t NMIS t NMIH t NMIW 717 Table 22.36 Bus Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Address delay time Address hold time Read strobe delay time Address strobe delay time Write strobe delay time Strobe delay time Write strobe pulse width 1 Write strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time 1 Precharge time 2 Wait setup time Wait hold time 718 Symbol t AD t AH t RSD t ASD t WSD t SD t WSW1 t WSW2 t AS1 t AS2 t RDS t RDH t WDD t WDS1 t WDS2 t WDH t ACC1 t ACC2 t ACC3 t ACC4 t PCH1 t PCH2 t WTS t WTH Min -- 0.5 t cyc - 20 -- -- -- -- 1.0 t cyc - 25 1.5 t cyc - 25 0.5 t cyc - 20 1.0 t cyc - 20 25 0 -- 1.0 t cyc - 30 2.0 t cyc - 30 0.5 t cyc - 15 -- -- -- -- 1.0 t cyc - 20 0.5 t cyc - 20 25 5 Max 25 -- 25 25 25 25 -- -- -- -- -- -- 35 -- -- -- 2.0 t cyc - 45 3.0 t cyc - 45 1.5 t cyc - 45 2.5 t cyc - 45 -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Figure 22.25 Test Conditions Figure 22.23, figure 22.24 Condition A and B Item Bus request setup time Symbol t BRQS Min 25 -- -- -- Max -- 30 30 30 Unit ns ns ns ns Test Conditions Figure 22.26 Bus acknowledge delay time 1 t BACD1 Bus acknowledge delay time 2 t BACD2 Bus-floating time t BZD Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. 719 Table 22.37 Timing of On-Chip Supporting Modules Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Module Item Symbol t PWD t PRS t PRH t TOCD t TICS t TCKS t TCKWH t TCKWL t TOCD t TICS t TCKS t TCKWH t TCKWL t Scyc Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 4 6 t SCKr t SCKf t SCKW t TXD t RXS t RXH 1.5 1.5 0.4 -- 100 100 0 Max 50 -- -- 50 -- -- -- -- 50 -- -- -- -- -- -- -- -- 0.6 100 -- -- -- Unit ns ns ns ns ns ns t cyc t cyc ns ns ns t cyc t cyc t cyc t cyc t cyc t cyc t Scyc ns ns ns ns Figure 22.31 Figure 22.30 Figure 22.29 Figure 22.28 Figure 22.29 Figure 22.28 Test Conditions Figure 22.27 Ports Output data delay time and TPC Input data setup time Input data hold time 16-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock Single edge pulse width Both edges 8-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock Single edge pulse width Both edges SCI Input clock cycle Asyn- chronous Syn- chronous Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) 720 Clock input Clock output RL H8/3064 mask ROM B-mask version output pin C RH C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B, RESO R L = 2.4 k R H = 12 k Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V Figure 22.12 Output Load Circuit 721 22.4.4 A/D Conversion Characteristics Table 22.38 lists the A/D conversion characteristics. Table 22.38 A/D Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Conversion time: 134 states Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Conversion time: 70 states* Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy 13 MHz > 13 MHz 13 MHz > 13 MHz Min 10 5.36 -- -- -- -- -- -- -- -- 10 5.36 -- -- -- -- -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- Max 10 -- 20 10 5 3.5 3.5 3.5 0.5 4.0 10 -- 20 5 3 7.5 7.5 7.5 0.5 8.0 Unit bits s pF k k LSB LSB LSB LSB LSB bits s pF k k LSB LSB LSB LSB LSB Note: * When using an operating frequency f (MHz) exceeding 70/5.36 = 13 (MHz), do not select 70 states for the conversion time. 722 22.4.5 D/A Conversion Characteristics Table 22.39 lists the D/A conversion characteristics. Table 22.39 D/A Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20 pF capacitive load 2 M resistive load 4 M resistive load Test Conditions 723 22.5 22.5.1 Electrical Characteristics of H8/3062F-ZTAT B-Mask Version Absolute Maximum Ratings Table 22.40 lists the absolute maximum ratings. Table 22.40 Absolute Maximum Ratings Item Power supply voltage Input voltage (FWE)* 2 2 Symbol VCC* Vin Vin Vin VREF AVCC VAN Topr 1 Value 5 V operation model: -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 5 V operation model: -0.3 to +7.0 -0.3 to AVCC +0.3 Regular specifications: -20 to +75 Wide range specifications: -40 to 85 Unit V V V V V V V C C C Input voltage (except for port 7)* Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Storage temperature Tstg -55 to +125 Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: The operating temperature range for flash memory programming/erasing is 0C to +75C. *1 Do not apply the power supply voltage to the VCL pin in 5 V operation models. Connect an external capacitor between this pin and GND. *2 12 V must not be applied to any pin, as this may cause permanent damage to the device. 724 22.5.2 DC Characteristics Table 22.41 lists the DC characteristics. Table 22.42 lists the permissible output currents. Table 22.41 DC Characteristics Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC*1, VSS = AVSS*1 = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) [Programming/erasing conditions: T a = 0C to +75C] Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V V - T + T + T - T Min 1.0 -- 0.4 VCC - 0.7 Typ -- -- -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions V -V Input high voltage STBY, RES, NMI, MD2 to MD0, FWE EXTAL Port 7 Ports 1 to 6, P83, P84, P90 to P95, port B Input low voltage STBY, RES, FWE, MD2 to MD0 NMI, EXTAL, ports 1 to 7, P83, P84, P90 to P95, port B Output high voltage Output low voltage All output pins All output pins Ports 1, 2, and 5 Input leakage STBY, RES, current NMI, FWE, MD2 to MD0 Port 7 |Iin| VOH VOL VIL VIH VCC x 0.7 2.0 2.0 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V -0.3 -- 0.5 V -0.3 -- 0.8 V VCC - 0.5 3.5 -- -- -- -- -- -- -- -- -- -- 0.4 1.0 1.0 V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 10 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V -- -- 1.0 A 725 Item Three-state leakage current Input pull-up MOS current Input capacitance Ports 1 to 6 Ports 8 to B Ports 2, 4, and 5 FWE NMI All input pins except NMI Current dissipation * 2 Normal operation Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V f = fmin Ta = 25C -I p Cin 50 -- -- -- -- -- -- -- 300 80 50 15 A pF pF pF mA I CC* 3 -- 32 47 (5.0 V) 37 58 (5.0 V) f = 20 MHz f = 25 MHz Sleep mode -- 24 38 (5.0 V) 29 47 (5.0 V) mA f = 20 MHz f = 25 MHz Module standby mode -- 19 31 (5.0 V) 21 37 (5.0 V) mA f = 20 MHz f = 25 MHz Standby mode -- -- 1.0 -- 37 10 80 57 A A mA Ta 50C 50C < Ta f = 20 MHz Flash memory programming/ erasing * 4 -- 42 Analog power During A/D supply current conversion During A/D and D/A conversion Idle AI CC -- -- 0.6 0.6 68 1.5 1.5 mA mA f = 25 MHz -- 0.01 5 A DASTE = 0 726 Item Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage Symbol AI CC Min -- -- Typ 0.45 2.0 Max 0.8 3.0 Unit mA mA Test Conditions -- VRAM 2.0 0.01 -- 5 -- A V DASTE = 0 Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open. Connect AVCC and VREF to VCC, and connect AVSS to V SS . *2 Current dissipation values are for V IH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip MOS pull-up transistors in the off state. The values are for VRAM V CC < 4.5 V, VIH min = VCC x 0.9, and V IL max = 0.3 V. *3 I CC max (normal operation) = 3.0 (mA) + 0.40 (mA/(MHz x V)) x V CC x f I CC max (sleep mode) = 3.0 (mA) + 0.32 (mA/(MHz x V)) x V CC x f I CC max (sleep mode + module standby mode) = 3.0 (mA) + 0.25 (mA/(MHz x V)) x V CC x f The Typ values for power consumption are reference values. *4 Sum of current dissipation in normal operation and current dissipation in program/erase operations. 727 Table 22.42 Permissible Output Currents Conditions: VCC = 4.5 V to 5.5 V, AVCC = 4.5 V to 5.5 V, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = -40C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, and 5 Other output pins Total of 20 pins in Ports 1, 2, and 5 Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins | -IOH | | IOH | IOL Symbol I OL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.42. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 22.13 and 22.14. H8/3062F-ZTAT B-mask version 2 k Port Darlington pair Figure 22.13 Darlington Pair Drive Circuit (Example) 728 H8/3062F-ZTAT B-mask version 600 Ports 1, 2, 5 LED Figure 22.14 Sample LED Circuit 729 22.5.3 AC Characteristics Clock timing parameters are listed in table 22.43, control signal timing parameters in table 22.44, and bus timing parameters in table 22.45. Timing parameters of the on-chip supporting modules are listed in table 22.46. Table 22.43 Clock Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Clock oscillator settling time at reset Clock oscillator settling time in software standby Symbol Min t cyc t CL t CH t Cr t Cf t OSC1 t OSC2 50 15 15 -- -- 20 7 Max 500 -- -- 10 10 -- -- Min 40 10 10 -- -- 20 7 B Max 500 -- -- 10 10 -- -- Unit ns ns ns ns ns ms ms Figure 22.19 Test Conditions Figure 22.19 to figure 22.31 730 Table 22.44 Control Signal Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item RES setup time RES pulse width Mode programming setup time NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width Symbol t RESS t RESW t MDS t NMIS t NMIH t NMIW Min 150 20 200 150 10 200 Max -- -- -- -- -- -- Unit ns t cyc ns ns ns ns Figure 22.22 Test Conditions Figure 22.20 731 Table 22.45 Bus Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Address delay time Address hold time Read strobe delay time Address strobe delay time Write strobe delay time Strobe delay time Write strobe pulse width 1 Write strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Symbol t AD t AH t RSD t ASD t WSD t SD t WSW1 t WSW2 t AS1 t AS2 t RDS t RDH t WDD t WDS1 t WDS2 t WDH Min -- 0.5 t cyc - 20 -- -- -- -- 1.0 t cyc - 25 1.5 t cyc - 25 0.5 t cyc - 20 1.0 t cyc - 20 25 0 -- 1.0 t cyc - 30 2.0 t cyc - 30 0.5 t cyc - 15 Max 25 -- 25 25 25 25 -- -- -- -- -- -- 35 -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Test Conditions Figure 22.23, figure 22.24 732 Condition A and B Item Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time 1 Precharge time 2 Wait setup time Wait hold time Bus request setup time Symbol t ACC1 t ACC2 t ACC3 t ACC4 t PCH1 t PCH2 t WTS t WTH t BRQS Min -- -- -- -- 1.0 t cyc - 20 0.5 t cyc - 20 25 5 25 -- -- -- Max Unit Test Conditions Figure 22.23, figure 22.24 2.0 t cyc - 45 ns 3.0 t cyc - 45 ns 1.5 t cyc - 45 ns 2.5 t cyc - 45 ns -- -- -- -- -- 30 30 30 ns ns ns ns ns ns ns ns Figure 22.25 Figure 22.26 Bus acknowledge delay time 1 t BACD1 Bus acknowledge delay time 2 t BACD2 Bus-floating time t BZD Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. 733 Table 22.46 Timing of On-Chip Supporting Modules Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 Mhz Condition A and B Module Ports and TPC Item Output data delay time Input data setup time Input data hold time 16-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width 8-bit timer Single edge Both edges Symbol t PWD t PRS t PRH t TOCD t TICS t TCKS t TCKWH t TCKWL t TOCD t TICS t TCKS t TCKWH t TCKWL Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 4 6 t SCKr t SCKf t SCKW t TXD t RXS t RXH 1.5 1.5 0.4 -- 100 100 0 Max 50 -- -- 50 -- -- -- -- 50 -- -- -- -- -- -- -- -- 0.6 100 -- -- -- Unit ns ns ns ns ns ns t cyc t cyc ns ns ns t cyc t cyc t cyc t cyc t cyc t cyc t Scyc ns ns ns ns Figure 22.31 Figure 22.30 Figure 22.29 Figure 22.28 Figure 22.29 Figure 22.28 Test Conditions Figure 22.27 Timer output delay time Timer input setup time Timer clock input setup time Timer clock pulse width Single edge Both edges SCI Input clock cycle Asyn- chronous t Scyc Syn- chronous Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) 734 Clock input Clock output RL H8/3062F-ZTAT B-mask version output pin C RH C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B R L = 2.4 k R H = 12 k Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V Figure 22.15 Output Load Circuit 735 22.5.4 A/D Conversion Characteristics Table 22.47 lists the A/D conversion characteristics. Table 22.47 A/D Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Conversion time: 134 states Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance 13 MHz > 13 MHz 4.0 V AVCC 5.5 V 3.0 V AVCC < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Conversion time: 70 states Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance 13 MHz > 13 MHz 4.0 V AVCC 5.5 V 3.0 V AVCC < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 134 20 10 5 -- -- 3.5 3.5 3.5 0.5 4.0 10 70 20 5 3 -- -- 7.5 7.5 7.5 0.5 8.0 Unit bits tcyc pF k k k k LSB LSB LSB LSB LSB bits tcyc pF k k k k LSB LSB LSB LSB LSB 736 22.5.5 D/A Conversion Characteristics Table 22.48 lists the D/A conversion characteristics. Table 22.48 D/A Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20 pF capacitive load 2 M resistive load 4 M resistive load Test Conditions 737 22.5.6 Flash Memory Characteristics Table 22.49 shows the flash memory characteristics. Table 22.49 Flash Memory Characteristics Conditions: VCC = 4.5 to 5.5 V, AVCC = 4.5 to 5.5 V, VSS = AVSS = 0 V, Ta = 0C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) (operating temperature range for programming/erasing) Item Programming time*1 *2 *4 Erase time*1 *3 *5 Reprogramming count Programming Wait time after SWE bit setting*1 Wait time after PSU bit setting *1 Wait time after P bit setting *1 *4 Symbol tP tE NWEC tsswe tspsu tsp30 tsp200 tsp10 Min -- -- -- 1 50 28 198 8 Typ 10 100 -- 1 50 30 200 10 Max 200 1200 100 -- -- 32 202 12 Unit ms/ 128 bytes ms/block Times s s s s s Programming time wait Programming time wait Additionalprogramming time wait Notes Wait time after P bit clear*1 Wait time after PSU bit clear*1 Wait time after PV bit setting*1 Wait time after H'FF dummy write*1 Wait time after PV bit clear *1 Wait time after SWE bit clear*1 Maximum programming count *1 *4 Erase Wait time after SWE bit setting*1 Wait time after ESU bit setting *1 Wait time after E bit setting *1 *5 Wait time after E bit clear*1 Wait time after ESU bit clear*1 Wait time after EV bit setting*1 Wait time after H'FF dummy write*1 Wait time after EV bit clear *1 Wait time after SWE bit clear*1 Maximum erase count *1 *5 tcp tcpsu tspv tspvr tcpv tcswe N tsswe tsesu tse tce tcesu tsev tsevr tcev tcswe N 5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 12 5 5 4 2 2 100 -- 1 100 10 10 10 20 2 4 100 -- -- -- -- -- -- -- 1000 -- -- 100 -- -- -- -- -- -- 120 s s s s s s Times s s ms s s s s s s Times Erase time wait 738 Notes: *1 Make each time setting in accordance with the program/program-verify flowchart or erase/erase-verify flowchart. *2 Programming time per 128 bytes (Shows the total period for which the P-bit in the flash memory control register (FLMCR1) is set. It does not include the programming verification time) *3 Block erase time (Shows the total period for which the E-bit in FLMCR1 is set. It does not include the erase verification time) *4 To specify the maximum programming time (t P(max)) in the 128-byte programming flowchart, set the maximum value (1000) for the maximum programming count (N). The wait time after P bit setting should be changed as follows according to the value of the programming counter (n). Programming counter (n) = 1 to 6 : t sp30 = 30 s Programming counter (n) = 7 to 1000 : t sp200 = 200 s Programming counter (n) [in additional programming] = 1 to 6 : t sp10 = 10 s *5 For the maximum erase time (tE(max)), the following relationship applies between the wait time after E bit setting (t se) and the maximum erase count (N): t E(max) = Wait time after E bit setting (tse) x maximum erase count (N) To set the maximum erase time, the values of tse and N should be set so as to satisfy the above formula. Examples: When t se = 100 [ms], N = 12 times When t se = 10 [ms], N = 120 times 739 22.6 Electrical Characteristics of H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version Absolute Maximum Ratings 22.6.1 Table 22.50 lists the absolute maximum ratings. Table 22.50 Absolute Maximum Ratings Item Power supply voltage Input voltage (except for port 7)* 2 Input voltage (port 7) Reference voltage Analog power supply voltage Analog input voltage Operating temperature Symbol VCC* 1 Vin Vin VREF AVCC VAN Topr Value -0.3 to +7.0 -0.3 to VCC +0.3 -0.3 to AVCC +0.3 -0.3 to AVCC +0.3 -0.3 to +7.0 -0.3 to AVCC +0.3 Regular specifications: -20 to +75 Wide-range specifications: -40 to +85 Storage temperature Tstg -55 to +125 Unit V V V V V V C C C Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded. Notes: *1 Do not supply the power supply voltage to the V CL pin in 5 V operation models. Connect an external capacitor between this pin and GND. *2 12 V must not be applied to any pin, as this may cause permanent damage to the device. 740 22.6.2 DC Characteristics Table 22.51 lists the DC characteristics. Table 22.52 lists the permissible output currents. Table 22.51 DC Characteristics Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC*1, VSS = AVSS = 0 V*1, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Schmitt trigger Port A, input voltages P80 to P8 2 Symbol V - T Min 1.0 -- Typ -- -- -- -- Max -- VCC x 0.7 -- VCC + 0.3 Unit V V V V Test Conditions VT+ V -V + T - T 0.4 VCC - 0.7 Input high voltage RES, STBY, NMI, MD2 to MD0 EXTAL Port 7 Ports 1 to 6, P83, P84, P90 to P95, port B VIH VCC x 0.7 2.0 2.0 -- -- -- VCC + 0.3 V AVCC + 0.3 V VCC + 0.3 V Input low voltage RES, STBY, MD2 to MD0 NMI, EXTAL, ports 1 to 7, P83, P84, P90 to P95, port B VIL -0.3 -0.3 -- -- 0.5 0.8 V V Output high voltage Output low voltage All output pins VOH (except RESO) All output pins VOL (except RESO) Ports 1, 2, and 5 RESO VCC - 0.5 3.5 -- -- -- -- -- -- -- -- -- -- -- 0.4 1.0 0.4 1.0 V V V V V A I OH = -200 A I OH = -1 mA I OL = 1.6 mA I OL = 10 mA I OL = 1.6 mA Vin = 0.5 V to VCC - 0.5 V Vin = 0.5 V to AVCC - 0.5 V Input leakage STBY, NMI, current RES, MD2 to MD0 Port 7 |Iin| -- -- -- 1.0 A 741 Item Three-state leakage current Ports 1 to 6 Ports 8 to B RESO Input pull-up MOS current Input capacitance Ports 2, 4, and 5 NMI All input pins except NMI Normal operation Symbol |ITSI| Min -- Typ -- Max 1.0 Unit A Test Conditions Vin = 0.5 V to VCC - 0.5 V Vin = 0 V Vin = 0 V f = fmin, Ta = 25C f = 20 MHz f = 25 MHz f = 20 MHz f = 25 MHz f = 20 MHz f = 25 MHz Ta 50C 50C < Ta -- -I p Cin 50 -- -- I CC* 3 -- -- -- -- -- -- 10.0 300 50 15 A A pF pF mA mA mA mA mA mA A A mA mA Current dissipation * 2 32 47 (5.0 V) 37 58 (5.0 V) 24 38 (5.0 V) 29 47 (5.0 V) 19 31 (5.0 V) 21 37 (5.0 V) 1.0 -- 0.6 0.6 10 80 1.5 1.5 Sleep mode -- -- Module standby mode -- -- Standby mode -- -- Analog power During A/D supply current conversion During A/D and D/A conversion Idle Reference current During A/D conversion During A/D and D/A conversion Idle RAM standby voltage AI CC -- -- -- AI CC -- -- 0.01 0.45 2.0 5.0 0.8 3.0 A mA mA DASTE = 0 -- VRAM 2.0 0.01 -- 5.0 -- A V DASTE = 0 Notes: *1 If the A/D converter is not used, do not leave the AVCC, VREF, and AVSS pins open. Connect AVCC and VREF to VCC, and connect AVSS to V SS . *2 Current dissipation values are for V IH min = VCC - 0.5 V and VIL max = 0.5 V with all output pins unloaded and the on-chip MOS pull-up transistors in the off state. 742 The values are for VRAM V CC < 4.5 V, VIH min = VCC x 0.9, and V IL max = 0.3 V. *3 I CC max (normal operation) = 3.0 (mA) + 0.46 (mA/(MHz x V)) x V CC x f = 3.0 (mA) + 0.40 (mA/(MHz x V)) x V CC x f I CC max (sleep mode) I CC max (sleep mode + module standby mode) = 3.0 (mA) + 0.27 (mA/(MHz x V)) x V CC x f The Typ values for power consumption are reference values. Table 22.52 Permissible Output Currents Conditions: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 V to AVCC, VSS = AVSS = 0 V, Ta = -20C to +75C (regular specifications), Ta = -40C to +85C (wide-range specifications) Item Permissible output low current (per pin) Permissible output low current (total) Ports 1, 2, and 5 Other output pins Total of 20 pins in Ports 1, 2, and 5 Total of all output pins, including the above Permissible output high current (per pin) Permissible output high current (total) All output pins Total of all output pins |-IOH | |-IOH | IOL Symbol I OL Min -- -- -- -- -- -- Typ -- -- -- -- -- -- Max 10 2.0 80 120 2.0 40 Unit mA mA mA mA mA mA Notes: 1. To protect chip reliability, do not exceed the output current values in table 22.52. 2. When directly driving a darlington pair or LED, always insert a current-limiting resistor in the output line, as shown in figures 22.16 and 22.17. 743 H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, H8/3060 mask ROM B-mask version 2 k Port Darlington pair Figure 22.16 Darlington Pair Drive Circuit (Example) H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, H8/3060 mask ROM B-mask version 600 Ports 1, 2, 5 LED Figure 22.17 Sample LED Circuit 744 22.6.3 AC Characteristics Clock timing parameters are listed in table 22.53, control signal timing parameters in table 22.54, and bus timing parameters in table 22.55. Timing parameters of the on-chip supporting modules are listed in table 22.56. Table 22.53 Clock Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A Item Clock cycle time Clock pulse low width Clock pulse high width Clock rise time Clock fall time Clock oscillator settling time at reset Clock oscillator settling time in software standby Symbol t cyc t CL t CH t Cr t Cf t OSC1 t OSC2 Min 50 15 15 -- -- 20 7 Max 500 -- -- 10 10 -- -- Min 40 10 10 -- -- 20 7 B Max 500 -- -- 10 10 -- -- Unit ns ns ns ns ns ms ms Figure 22.19 Test Conditions Figure 22.19 to figure 22.31 745 Table 22.54 Control Signal Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item RES setup time RES pulse width RESO output delay time RESO output pulse width NMI, IRQ setup time NMI, IRQ hold time NMI, IRQ pulse width Symbol t RESS t RESW Min 150 20 200 -- 132 150 10 200 Max -- -- -- 50 -- -- -- -- Unit ns t cyc ns ns t cyc ns ns ns Figure 22.22 Figure 22.21 Test Conditions Figure 22.20 Mode programming setup time t MDS t RESD t RESOW t NMIS t NMIH t NMIW 746 Table 22.55 Bus Timing Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Address delay time Address hold time Read strobe delay time Address strobe delay time Write strobe delay time Strobe delay time Write strobe pulse width 1 Write strobe pulse width 2 Address setup time 1 Address setup time 2 Read data setup time Read data hold time Write data delay time Write data setup time 1 Write data setup time 2 Write data hold time Read data access time 1 Read data access time 2 Read data access time 3 Read data access time 4 Precharge time 1 Precharge time 2 Wait setup time Wait hold time Symbol t AD t AH t RSD t ASD t WSD t SD t WSW1 t WSW2 t AS1 t AS2 t RDS t RDH t WDD t WDS1 t WDS2 t WDH t ACC1 t ACC2 t ACC3 t ACC4 t PCH1 t PCH2 t WTS t WTH Min -- 0.5 t cyc - 20 -- -- -- -- 1.0 t cyc - 25 1.5 t cyc - 25 0.5 t cyc - 20 1.0 t cyc - 20 25 0 -- 1.0 t cyc - 30 2.0 t cyc - 30 0.5 t cyc - 15 -- -- -- -- 1.0 t cyc - 20 0.5 t cyc - 20 25 5 Max 25 -- 25 25 25 25 -- -- -- -- -- -- 35 -- -- -- 2.0 t cyc - 45 3.0 t cyc - 45 1.5 t cyc - 45 2.5 t cyc - 45 -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 747 Figure 22.25 Test Conditions Figure 22.23, figure 22.24 Condition A and B Item Bus request setup time Symbol t BRQS Min 25 -- -- -- Max -- 30 30 30 Unit ns ns ns ns Test Conditions Figure 22.26 Bus acknowledge delay time 1 t BACD1 Bus acknowledge delay time 2 t BACD2 Bus-floating time t BZD Note: In order to secure the address hold time relative to the rise of the RD strobe, address update mode 2 should be used. For details see section 6.3.5, Address Output Method. 748 Table 22.56 Timing of On-Chip Supporting Modules Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Module Item Symbol t PWD t PRS t PRH t TOCD t TICS t TCKS t TCKWH t TCKWL t TOCD t TICS t TCKS t TCKWH t TCKWL t Scyc Min -- 50 50 -- 50 50 1.5 2.5 -- 50 50 1.5 2.5 4 6 t SCKr t SCKf t SCKW t TXD t RXS t RXH 1.5 1.5 0.4 -- 100 100 0 Max 50 -- -- 50 -- -- -- -- 50 -- -- -- -- -- -- -- -- 0.6 100 -- -- -- Unit ns ns ns ns ns ns t cyc t cyc ns ns ns t cyc t cyc t cyc t cyc t cyc t cyc t Scyc ns ns ns ns Figure 22.31 Figure 22.30 Figure 22.29 Figure 22.28 Figure 22.29 Figure 22.28 Test Conditions Figure 22.27 Ports Output data delay time and TPC Input data setup time Input data hold time 16-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock Single edge pulse width Both edges 8-bit timer Timer output delay time Timer input setup time Timer clock input setup time Timer clock Single edge pulse width Both edges SCI Input clock Asyn- chronous cycle Syn- chronous Input clock rise time Input clock fall time Input clock pulse width Transmit data delay time Receive data setup time (synchronous) Receive data hold time (synchronous) Clock input Clock output 749 Output pin of H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, or H8/3060 mask ROM B-mask version C RH RL C = 90 pF: ports 1 to 6, 8 C = 30 pF: ports 9, A, B, RESO R L = 2.4 k R H = 12 k Input/output timing measurement levels * Low: 0.8 V * High: 2.0 V Figure 22.18 Output Load Circuit 750 22.6.4 A/D Conversion Characteristics Table 22.57 lists the A/D conversion characteristics. Table 22.57 A/D Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Conversion time: 134 states Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance 13 MHz > 13 MHz 4.0 V AVCC 5.5 V 3.0 V AVCC < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Conversion time: 70 states* Resolution Conversion time (single mode) Analog input capacitance Permissible signalsource impedance 13 MHz > 13 MHz 4.0 V AVCC 5.5 V 3.0 V AVCC < 4.0 V Nonlinearity error Offset error Full-scale error Quantization error Absolute accuracy Min 10 5.36 -- -- -- -- -- -- -- -- -- -- 10 5.36 -- -- -- -- -- -- -- -- -- -- Typ 10 -- -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- Max 10 -- 20 10 5 -- -- 3.5 3.5 3.5 0.5 4.0 10 -- 20 5 3 -- -- 7.5 7.5 7.5 0.5 8.0 Unit bits s pF k k k k LSB LSB LSB LSB LSB bits s pF k k k k LSB LSB LSB LSB LSB Note: * When using an operating frequency f (MHz) exceeding 70/5.36 = 13 (MHz), do not select 70 states for the conversion time. 751 22.6.5 D/A Conversion Characteristics Table 22.58 lists the D/A conversion characteristics. Table 22.58 D/A Conversion Characteristics Condition: Ta = -20C to +75C (regular specifications), Ta = -40C to 85C (wide-range specifications) Condition A: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 20 MHz Condition B: VCC = 5.0 V 10%, AVCC = 5.0 V 10%, VREF = 4.5 to AVCC, VSS = AVSS = 0 V, fmax = 25 MHz Condition A and B Item Resolution Conversion time (centering time) Absolute accuracy Min 8 -- -- -- Typ 8 -- 1.5 -- Max 8 10 2.0 1.5 Unit bits s LSB LSB 20 pF capacitive load 2 M resistive load 4 M resistive load Test Conditions 752 22.7 Operational Timing This section shows timing diagrams. 22.7.1 Clock Timing Clock timing is shown as follows: * Oscillator settling timing Figure 22.19 shows the oscillator settling timing. VCC STBY tOSC1 RES tOSC1 Figure 22.19 Oscillator Settling Timing 753 22.7.2 Control Signal Timing Control signal timing is shown as follows: * Reset input timing Figure 22.20 shows the reset input timing. * Reset output timing* Figure 22.21 shows the reset output timing. * Interrupt input timing Figure 22.22 shows the interrupt input timing for NMI and IRQ5 to IRQ0. tRESS RES tMDS FWE MD2 to MD0 tRESW tRESS Figure 22.20 Reset Input Timing tRESD RESO tRESOW tRESD Figure 22.21 Reset Output Timing* Note: * This function is used only in mask ROM models, and is not provided in flash memory models. 754 tNMIS NMI tNMIS IRQ E tNMIS IRQ L IRQ E : Edge-sensitive IRQ i IRQ L : Level-sensitive IRQ i (i = 0 to 5) tNMIW NMI IRQ j (j = 0 to 5) tNMIH tNMIH Figure 22.22 Interrupt Input Timing 755 22.7.3 Bus Timing Bus timing is shown as follows: * Basic bus cycle: two-state access Figure 22.23 shows the timing of the external two-state access cycle. * Basic bus cycle: three-state access Figure 22.24 shows the timing of the external three-state access cycle. * Basic bus cycle: three-state access with one wait state Figure 22.25 shows the timing of the external three-state access cycle with one wait state inserted. * Bus-release mode timing Figure 22.26 shows the bus-release mode timing. 756 T1 tcyc tCH tAD A23 to A0, CSn tCf tcyc tCr tCL T2 tPCH1 tASD AS tAS1 tASD RD (read) tAS1 tACC1 D15 to D0 (read) tPCH1 tASD HWR, LWR (write) tAS1 tWSW1 tWDS1 tSD tAH tRDS tRDH* tACC3 tRSD tPCH2 tACC3 tSD tAH tWDD D15 to D0 (write) tWDH Note: * Specification from the earliest negation timing of A23 to A0, CSn, and RD. Figure 22.23 Basic Bus Cycle: Two-State Access 757 T1 A23 to A0, CSn T2 T3 tACC4 AS tACC4 RD (read) tACC2 D15 to D0 (read) tWSD HWR, LWR (write) tAS2 tWDD D15 to D0 (write) tWDS2 tWSW2 tRDS Figure 22.24 Basic Bus Cycle: Three-State Access 758 T1 A23 to A0, CSn AS T2 TW T3 RD (read) D15 to D0 (read) HWR, LWR (write) D15 to D0 (write) tWTS WAIT tWTH tWTS tWTH Figure 22.25 Basic Bus Cycle: Three-State Access with One Wait State tBRQS BREQ tBACD2 tBACD1 BACK tBRQS A23 to A0, AS, RD, HWR, LWR tBZD tBZD Figure 22.26 Bus-Release Mode Timing 759 22.7.4 TPC and I/O Port Timing Figure 22.27 shows the TPC and I/O port input/output timing. T1 tPRS Port 1 to B (read) tPWD Port 1 to 6, 8 to B (write) tPRH T2 T3 Figure 22.27 TPC and I/O Port Input/Output Timing 22.7.5 Timer Input/Output Timing 16-bit timer and 8-bit timer timing is shown below. * Timer input/output timing Figure 22.28 shows the timer input/output timing. * Timer external clock input timing Figure 22.29 shows the timer external clock input timing. tTOCD Output compare*1 tTICS Input capture*2 Notes: *1 TIOCA0 to TIOCA2, TIOCB0 to TIOCB2, TMO0, TMO2, TMIO1, TMIO3 *2 TIOCA0 to TIOCA2, TIOCB0 to TIOCB2, TMIO1, TMIO3 Figure 22.28 Timer Input/Output Timing 760 tTCKS TCLKA to TCLKD tTCKS tTCKWL tTCKWH Figure 22.29 Timer External Clock Input Timing 22.7.6 SCI Input/Output Timing SCI timing is shown as follows: * SCI input clock timing Figure 22.30 shows the SCI input clock timing. * SCI input/output timing (synchronous mode) Figure 22.31 shows the SCI input/output timing in synchronous mode. tSCKW SCK0, SCK1 tScyc tSCKr tSCKf Figure 22.30 SCI Input Clock Timing tScyc SCK0, SCK1 tTXD TxD0, TxD1 (transmit data) RxD0, RxD1 (receive data) tRXS tRXH Figure 22.31 SCI Input/Output Timing in Synchronous Mode 761 762 Appendix A Instruction Set A.1 Instruction List Operand Notation Symbol Rd Rs Rn ERd ERs ERn (EAd) (EAs) PC SP CCR N Z V C disp + - x / ( ), < > Description General destination register General source register General register General destination register (address register or 32-bit register) General source register (address register or 32-bit register) General register (32-bit register) Destination operand Source operand Program counter Stack pointer Condition code register N (negative) flag in CCR Z (zero) flag in CCR V (overflow) flag in CCR C (carry) flag in CCR Displacement Transfer from the operand on the left to the operand on the right, or transition from the state on the left to the state on the right Addition of the operands on both sides Subtraction of the operand on the right from the operand on the left Multiplication of the operands on both sides Division of the operand on the left by the operand on the right Logical AND of the operands on both sides Logical OR of the operands on both sides Exclusive logical OR of the operands on both sides NOT (logical complement) Contents of operand Note: General registers include 8-bit registers (R0H to R7H and R0L to R7L) and 16-bit registers (R0 to R7 and E0 to E7). 763 Condition Code Notation Symbol Description Changed according to execution result * 0 1 -- Undetermined (no guaranteed value) Cleared to 0 Set to 1 Not affected by execution of the instruction Varies depending on conditions, described in notes 764 Table A.1 Instruction Set 1. Data transfer instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation #xx:8 Rd8 I HN Z V C Mnemonic MOV.B #xx:8, Rd MOV.B Rs, Rd MOV.B @ERs, Rd B B B 2 2 2 4 ---- ---- ---- ---- 0-- 0-- 0-- 0-- 2 2 4 6 Rs8 Rd8 @ERs Rd8 @(d:16, ERs) Rd8 @(d:24, ERs) Rd8 2 @ERs Rd8 ERs32+1 ERs32 2 4 6 2 4 @aa:8 Rd8 @aa:16 Rd8 @aa:24 Rd8 Rs8 @ERd Rs8 @(d:16, ERd) Rs8 @(d:24, ERd) 2 ERd32-1 ERd32 Rs8 @ERd 2 4 6 Rs8 @aa:8 Rs8 @aa:16 Rs8 @aa:24 #xx:16 Rd16 MOV.B @(d:16, ERs), B Rd MOV.B @(d:24, ERs), B Rd MOV.B @ERs+, Rd B 8 ---- 0-- 10 ---- 0-- 6 MOV.B @aa:8, Rd MOV.B @aa:16, Rd MOV.B @aa:24, Rd MOV.B Rs, @ERd MOV.B Rs, @(d:16, ERd) MOV.B Rs, @(d:24, ERd) MOV.B Rs, @-ERd B B B B B ---- ---- ---- ---- ---- 0-- 0-- 0-- 0-- 0-- 4 6 8 4 6 B 8 ---- 0-- 10 B ---- 0-- 6 MOV.B Rs, @aa:8 MOV.B Rs, @aa:16 MOV.B Rs, @aa:24 MOV.W #xx:16, Rd MOV.W Rs, Rd MOV.W @ERs, Rd B B B W4 W W 2 2 4 ---- ---- ---- ---- ---- ---- ---- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 4 6 8 4 2 4 6 Rs16 Rd16 @ERs Rd16 @(d:16, ERs) Rd16 @(d:24, ERs) Rd16 2 @ERs Rd16 ERs32+2 @ERd32 4 @aa:16 Rd16 MOV.W @(d:16, ERs), W Rd MOV.W @(d:24, ERs), W Rd MOV.W @ERs+, Rd W 8 ---- 0-- 10 ---- 0-- 6 MOV.W @aa:16, Rd W ---- 0-- 6 Advanced @(d, PC) Normal @@aa @ERn #xx Rn 765 Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation @aa:24 Rd16 Rs16 @ERd I HN Z V C Mnemonic MOV.W @aa:24, Rd MOV.W Rs, @ERd MOV.W Rs, @(d:16, ERd) MOV.W Rs, @(d:24, ERd) MOV.W Rs, @-ERd W W W 2 4 6 ---- ---- ---- 0-- 0-- 0-- 8 4 6 Rs16 @(d:16, ERd) Rs16 @(d:24, ERd) 2 ERd32-2 ERd32 Rs16 @ERd 4 6 Rs16 @aa:16 Rs16 @aa:24 #xx:32 Rd32 W 8 ---- 0-- 10 W ---- 0-- 6 MOV.W Rs, @aa:16 MOV.W Rs, @aa:24 MOV.L #xx:32, Rd MOV.L ERs, ERd MOV.L @ERs, ERd MOV.L @(d:16, ERs), ERd MOV.L @(d:24, ERs), ERd MOV.L @ERs+, ERd W W L L L L 6 2 4 6 ---- ---- ---- ---- ---- 0-- 0-- 0-- 0-- 0-- 0-- 6 8 6 2 8 10 ERs32 ERd32 @ERs ERd32 @(d:16, ERs) ERd32 -- -- @(d:24, ERs) ERd32 -- -- 4 @ERs ERd32 ERs32+4 ERs32 6 8 @aa:16 ERd32 @aa:24 ERd32 ERs32 @ERd ---- L 10 0-- 14 L 0-- 10 MOV.L @aa:16, ERd MOV.L @aa:24, ERd MOV.L ERs, @ERd MOV.L ERs, @(d:16, ERd) MOV.L ERs, @(d:24, ERd) MOV.L ERs, @-ERd L L L L 4 6 ---- ---- ---- 0-- 0-- 0-- 0-- 10 12 8 10 ERs32 @(d:16, ERd) -- -- ERs32 @(d:24, ERd) -- -- 4 ERd32-4 ERd32 ERs32 @ERd 6 8 ERs32 @aa:16 ERs32 @aa:24 2 @SP Rn16 SP+2 SP @SP ERn32 4 SP+4 SP ---- L 10 0-- 14 L 0-- 10 MOV.L ERs, @aa:16 MOV.L ERs, @aa:24 POP.W Rn L L W ---- ---- ---- 0-- 0-- 0-- 10 12 6 POP.L ERn L ---- 0-- 10 766 Advanced @(d, PC) Normal @@aa @ERn #xx Rn Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation I HN Z V C Mnemonic PUSH.W Rn W 2 SP-2 SP Rn16 @SP 4 SP-4 SP ERn32 @SP 4 Cannot be used in the H8/3062 Series Cannot be used in the H8/3062 Series ---- 0-- 6 PUSH.L ERn L -- -- 0-- 10 MOVFPE @aa:16, Rd MOVTPE Rs, @aa:16 B Cannot be used in the H8/3062 Series Cannot be used in the H8/3062 Series B 4 2. Arithmetic instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation Rd8+#xx:8 Rd8 I -- -- HN Z V C Mnemonic ADD.B #xx:8, Rd ADD.B Rs, Rd ADD.W #xx:16, Rd ADD.W Rs, Rd ADD.L #xx:32, ERd B B 2 2 2 2 4 2 6 Rd8+Rs8 Rd8 Rd16+#xx:16 Rd16 W4 W L 6 2 -- (1) -- (1) -- (2) Rd16+Rs16 Rd16 ERd32+#xx:32 ERd32 ADD.L ERs, ERd L 2 ERd32+ERs32 ERd32 Rd8+#xx:8 +C Rd8 -- (2) 2 ADDX.B #xx:8, Rd ADDX.B Rs, Rd ADDS.L #1, ERd ADDS.L #2, ERd ADDS.L #4, ERd INC.B Rd INC.W #1, Rd INC.W #2, Rd B B L L L B W W 2 2 2 2 2 2 2 2 -- -- (3) (3) 2 2 2 2 2 2 2 2 Rd8+Rs8 +C Rd8 ERd32+1 ERd32 ERd32+2 ERd32 ERd32+4 ERd32 Rd8+1 Rd8 Rd16+1 Rd16 Rd16+2 Rd16 ------------ ------------ ------------ ---- ---- ---- -- -- -- Advanced @(d, PC) Normal @@aa @ERn #xx Rn Advanced @(d, PC) Normal @@aa @ERn #xx Rn 767 Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation ERd32+1 ERd32 ERd32+2 ERd32 Rd8 decimal adjust Rd8 Rd8-Rs8 Rd8 Rd16-#xx:16 Rd16 I HN Z V C -- -- Mnemonic INC.L #1, ERd INC.L #2, ERd DAA Rd L L B 2 2 2 ---- ---- --* -- 2 2 2 *-- SUB.B Rs, Rd SUB.W #xx:16, Rd SUB.W Rs, Rd SUB.L #xx:32, ERd B W4 W L 6 2 2 4 2 6 -- (1) -- (1) -- (2) 2 Rd16-Rs16 Rd16 ERd32-#xx:32 ERd32 SUB.L ERs, ERd L 2 ERd32-ERs32 ERd32 Rd8-#xx:8-C Rd8 -- (2) 2 SUBX.B #xx:8, Rd SUBX.B Rs, Rd SUBS.L #1, ERd SUBS.L #2, ERd SUBS.L #4, ERd DEC.B Rd DEC.W #1, Rd DEC.W #2, Rd DEC.L #1, ERd DEC.L #2, ERd DAS.Rd B B L L L B W W L L B 2 2 2 2 2 2 2 2 2 2 2 -- -- (3) (3) 2 2 2 2 2 2 2 2 2 2 2 Rd8-Rs8-C Rd8 ERd32-1 ERd32 ERd32-2 ERd32 ERd32-4 ERd32 Rd8-1 Rd8 Rd16-1 Rd16 Rd16-2 Rd16 ERd32-1 ERd32 ERd32-2 ERd32 Rd8 decimal adjust Rd8 ------------ ------------ ------------ ---- ---- ---- ---- ---- --* -- -- -- -- -- MULXU. B Rs, Rd B 2 Rd8 x Rs8 Rd16 ------------ (unsigned multiplication) Rd16 x Rs16 ERd32 -- (unsigned multiplication) Rd8 x Rs8 Rd16 (signed multiplication) Rd16 x Rs16 ERd32 (signed multiplication) Rd16 / Rs8 Rd16 (RdH: remainder, RdL: quotient) (unsigned division) ---------- *-- 14 MULXU. W Rs, ERd W 2 22 MULXS. B Rs, Rd B 4 ---- ---- 16 MULXS. W Rs, ERd W 4 ---- ---- 24 DIVXU. B Rs, Rd B 2 -- -- (6) (7) -- -- 14 768 Advanced @(d, PC) Normal @@aa @ERn #xx Rn Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation I HN Z V C Mnemonic DIVXU. W Rs, ERd W 2 ERd32 / Rs16 ERd32 -- -- (6) (7) -- -- (Ed: remainder, Rd: quotient) (unsigned division) Rd16 / Rs8 Rd16 (RdH: remainder, RdL: quotient) (signed division) -- -- (8) (7) -- -- 22 DIVXS. B Rs, Rd B 4 16 DIVXS. W Rs, ERd W 4 ERd32 / Rs16 ERd32 -- -- (8) (7) -- -- (Ed: remainder, Rd: quotient) (signed division) Rd8-#xx:8 -- -- 24 CMP.B #xx:8, Rd CMP.B Rs, Rd CMP.W #xx:16, Rd CMP.W Rs, Rd CMP.L #xx:32, ERd CMP.L ERs, ERd NEG.B Rd NEG.W Rd NEG.L ERd EXTU.W Rd B B 2 2 2 2 4 2 6 2 2 2 2 2 Rd8-Rs8 Rd16-#xx:16 W4 W L L B W L W 6 2 2 2 2 2 2 -- (1) -- (1) -- (2) -- (2) -- -- -- Rd16-Rs16 ERd32-#xx:32 ERd32-ERs32 0-Rd8 Rd8 0-Rd16 Rd16 0-ERd32 ERd32 0 ( ---- 0 0-- EXTU.L ERd L 2 ---- 0 0-- 2 EXTS.W Rd W 2 ( 0-- 2 EXTS.L ERd L 2 0-- 2 Advanced @(d, PC) Normal @@aa @ERn #xx Rn 769 3. Logic instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation Rd8#xx:8 Rd8 I HN Z V C Mnemonic AND.B #xx:8, Rd AND.B Rs, Rd AND.W #xx:16, Rd AND.W Rs, Rd AND.L #xx:32, ERd AND.L ERs, ERd OR.B #xx:8, Rd OR.B Rs, Rd OR.W #xx:16, Rd OR.W Rs, Rd OR.L #xx:32, ERd OR.L ERs, ERd XOR.B #xx:8, Rd XOR.B Rs, Rd XOR.W #xx:16, Rd XOR.W Rs, Rd XOR.L #xx:32, ERd XOR.L ERs, ERd NOT.B Rd NOT.W Rd NOT.L ERd B B 2 2 ---- ---- ---- ---- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 0-- 2 2 4 2 6 4 2 2 4 2 6 4 2 2 4 2 6 4 2 2 2 Rd8Rs8 Rd8 Rd16#xx:16 Rd16 W4 W L L B B W4 W L L B B W4 W L L B W L 6 4 2 2 2 2 2 2 6 4 2 2 2 6 4 2 Rd16Rs16 Rd16 ERd32#xx:32 ERd32 -- -- ERd32ERs32 ERd32 -- -- Rd8#xx:8 Rd8 Rd8Rs8 Rd8 Rd16#xx:16 Rd16 Rd16Rs16 Rd16 ---- ---- ---- ---- ERd32#xx:32 ERd32 -- -- ERd32ERs32 ERd32 -- -- Rd8#xx:8 Rd8 Rd8Rs8 Rd8 Rd16#xx:16 Rd16 Rd16Rs16 Rd16 ---- ---- ---- ---- ERd32#xx:32 ERd32 -- -- ERd32ERs32 ERd32 -- -- Rd8 Rd8 Rd16 Rd16 Rd32 Rd32 ---- ---- ---- 770 Advanced @(d, PC) Normal @@aa @ERn #xx Rn 4. Shift instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation I HN Z V C Mnemonic SHAL.B Rd SHAL.W Rd SHAL.L ERd SHAR.B Rd SHAR.W Rd SHAR.L ERd SHLL.B Rd SHLL.W Rd SHLL.L ERd SHLR.B Rd SHLR.W Rd SHLR.L ERd ROTXL.B Rd ROTXL.W Rd ROTXL.L ERd ROTXR.B Rd ROTXR.W Rd ROTXR.L ERd ROTL.B Rd ROTL.W Rd ROTL.L ERd ROTR.B Rd ROTR.W Rd ROTR.L ERd B W L B W L B W L B W L B W L B W L B W L B W L 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 ---- 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 C MSB LSB 0 ---- ---- ---- 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 C MSB LSB ---- ---- ---- C MSB LSB 0 ---- ---- ---- 0 MSB LSB C ---- ---- ---- C MSB LSB ---- ---- ---- C MSB LSB ---- ---- ---- C MSB LSB ---- ---- ---- C MSB LSB ---- ---- Advanced @(d, PC) Normal @@aa @ERn #xx Rn 771 5. Bit manipulation instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation (#xx:3 of Rd8) 1 I HN Z V C Mnemonic BSET #xx:3, Rd BSET #xx:3, @ERd BSET #xx:3, @aa:8 BSET Rn, Rd BSET Rn, @ERd BSET Rn, @aa:8 BCLR #xx:3, Rd BCLR #xx:3, @ERd BCLR #xx:3, @aa:8 BCLR Rn, Rd BCLR Rn, @ERd BCLR Rn, @aa:8 BNOT #xx:3, Rd B B B B B B B B B B B B B 2 4 4 2 4 4 2 4 4 2 4 4 2 ------------ ------------ ------------ ------------ ------------ ------------ ------------ ------------ ------------ ------------ ------------ ------------ ------------ 2 8 8 2 8 8 2 8 8 2 8 8 2 (#xx:3 of @ERd) 1 (#xx:3 of @aa:8) 1 (Rn8 of Rd8) 1 (Rn8 of @ERd) 1 (Rn8 of @aa:8) 1 (#xx:3 of Rd8) 0 (#xx:3 of @ERd) 0 (#xx:3 of @aa:8) 0 (Rn8 of Rd8) 0 (Rn8 of @ERd) 0 (Rn8 of @aa:8) 0 (#xx:3 of Rd8) (#xx:3 of Rd8) BNOT #xx:3, @ERd B 4 (#xx:3 of @ERd) (#xx:3 of @ERd) 4 (#xx:3 of @aa:8) (#xx:3 of @aa:8) (Rn8 of Rd8) (Rn8 of Rd8) ------------ 8 BNOT #xx:3, @aa:8 B ------------ 8 BNOT Rn, Rd B 2 ------------ 2 BNOT Rn, @ERd B 4 (Rn8 of @ERd) (Rn8 of @ERd) 4 (Rn8 of @aa:8) (Rn8 of @aa:8) (#xx:3 of Rd8) Z ------------ 8 BNOT Rn, @aa:8 B ------------ 8 BTST #xx:3, Rd BTST #xx:3, @ERd BTST #xx:3, @aa:8 BTST Rn, Rd BTST Rn, @ERd BTST Rn, @aa:8 BLD #xx:3, Rd B B B B B B B 2 4 4 2 4 4 2 ------ ------ ------ ------ ------ ------ ---- ---- ---- ---- ---- ---- 2 6 6 2 6 6 2 (#xx:3 of @ERd) Z (#xx:3 of @aa:8) Z (Rn8 of @Rd8) Z (Rn8 of @ERd) Z (Rn8 of @aa:8) Z (#xx:3 of Rd8) C ---------- 772 Advanced @(d, PC) Normal @@aa @ERn #xx Rn Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation (#xx:3 of @ERd) C I HN Z V C Mnemonic BLD #xx:3, @ERd BLD #xx:3, @aa:8 BILD #xx:3, Rd BILD #xx:3, @ERd BILD #xx:3, @aa:8 BST #xx:3, Rd BST #xx:3, @ERd BST #xx:3, @aa:8 BIST #xx:3, Rd BIST #xx:3, @ERd BIST #xx:3, @aa:8 BAND #xx:3, Rd BAND #xx:3, @ERd BAND #xx:3, @aa:8 BIAND #xx:3, Rd B B B B B B B B B B B B B B B 2 2 2 2 2 4 4 ---------- ---------- ---------- ---------- ---------- 6 6 2 6 6 2 8 8 2 8 8 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6 2 6 6 (#xx:3 of @aa:8) C (#xx:3 of Rd8) C 4 4 (#xx:3 of @ERd) C (#xx:3 of @aa:8) C C (#xx:3 of Rd8) ------------ ------------ ------------ ------------ ------------ ------------ ---------- ---------- ---------- ---------- 4 4 C (#xx:3 of @ERd24) C (#xx:3 of @aa:8) C (#xx:3 of Rd8) 4 4 C (#xx:3 of @ERd24) C (#xx:3 of @aa:8) C(#xx:3 of Rd8) C 4 4 C(#xx:3 of @ERd24) C C(#xx:3 of @aa:8) C C (#xx:3 of Rd8) C BIAND #xx:3, @ERd B BIAND #xx:3, @aa:8 B BOR #xx:3, Rd BOR #xx:3, @ERd BOR #xx:3, @aa:8 BIOR #xx:3, Rd BIOR #xx:3, @ERd BIOR #xx:3, @aa:8 BXOR #xx:3, Rd BXOR #xx:3, @ERd BXOR #xx:3, @aa:8 BIXOR #xx:3, Rd B B B B B B B B B B 2 2 2 2 4 4 C (#xx:3 of @ERd24) C -- -- -- -- -- C (#xx:3 of @aa:8) C C(#xx:3 of Rd8) C ---------- ---------- ---------- ---------- ---------- 4 4 C(#xx:3 of @ERd24) C C(#xx:3 of @aa:8) C C (#xx:3 of Rd8) C 4 4 C (#xx:3 of @ERd24) C -- -- -- -- -- C (#xx:3 of @aa:8) C C(#xx:3 of Rd8) C ---------- ---------- ---------- ---------- ---------- 4 4 C(#xx:3 of @ERd24) C C(#xx:3 of @aa:8) C C (#xx:3 of Rd8) C BIXOR #xx:3, @ERd B BIXOR #xx:3, @aa:8 B 4 4 C (#xx:3 of @ERd24) C -- -- -- -- -- C (#xx:3 of @aa:8) C ---------- Advanced @(d, PC) Normal @@aa @ERn #xx Rn 773 6. Branching instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) Mnemonic BRA d:8 (BT d:8) BRA d:16 (BT d:16) BRN d:8 (BF d:8) BRN d:16 (BF d:16) BHI d:8 BHI d:16 BLS d:8 BLS d:16 BCC d:8 (BHS d:8) Branch Operation Condition If condition Always is true then PC PC+d else Never next; CZ=0 @aa Condition Code I HN Z V C -- -- -- -- -- -- -- -- -- 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 2 4 ------------ ------------ ------------ ------------ ------------ ------------ 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 4 6 CZ=1 ------------ ------------ C=0 ------------ ------------ BCC d:16 (BHS d:16) -- BCS d:8 (BLO d:8) -- C=1 ------------ ------------ BCS d:16 (BLO d:16) -- BNE d:8 BNE d:16 BEQ d:8 BEQ d:16 BVC d:8 BVC d:16 BVS d:8 BVS d:16 BPL d:8 BPL d:16 BMI d:8 BMI d:16 BGE d:8 BGE d:16 BLT d:8 BLT d:16 BGT d:8 BGT d:16 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Z=0 ------------ ------------ Z=1 ------------ ------------ V=0 ------------ ------------ V=1 ------------ ------------ N=0 ------------ ------------ N=1 ------------ ------------ NV = 0 ------------ ------------ NV = 1 ------------ ------------ Z (NV) =0 ------------ ------------ 774 Advanced @(d, PC) Normal @@aa @ERn #xx Rn -- Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) Mnemonic BLE d:8 BLE d:16 Branch Operation Condition @aa Condition Code I HN Z V C -- -- 2 4 If condition Z (NV) = 1 -- -- -- -- -- -- is true then ------------ PC PC+d else next; PC ERn 4 6 JMP @ERn JMP @aa:24 JMP @@aa:8 BSR d:8 -- -- -- -- 2 4 2 2 ------------ ------------ ------------ ------------ 8 6 4 6 10 8 PC aa:24 PC @aa:8 PC @-SP PC PC+d:8 PC @-SP PC PC+d:16 PC @-SP PC @ERn BSR d:16 -- 4 ------------ 8 10 JSR @ERn -- 2 ------------ 6 -- JSR @aa:24 -- JSR @@aa:8 -- 4 PC @-SP PC @aa:24 2 PC @-SP PC @aa:8 2 PC @SP+ ------------ 8 10 ------------ 8 12 ------------ 8 10 Advanced 8 @(d, PC) Normal @@aa @ERn #xx Rn -- 775 7. System control instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation I HN Z V C Mnemonic TRAPA #x:2 -- 2 PC @-SP CCR @-SP 1 -- -- -- -- -- 14 16 RTE -- 10 SLEEP -- Transition to powerdown -- -- -- -- -- -- state 2 2 4 6 #xx:8 CCR Rs8 CCR @ERs CCR @(d:16, ERs) CCR @(d:24, ERs) CCR 4 @ERs CCR ERs32+2 ERs32 6 8 2 4 6 @aa:16 CCR @aa:24 CCR CCR Rd8 CCR @ERd CCR @(d:16, ERd) CCR @(d:24, ERd) 4 ERd32-2 ERd32 CCR @ERd 6 8 2 2 2 CCR @aa:16 CCR @aa:24 CCR#xx:8 CCR CCR#xx:8 CCR CCR#xx:8 CCR 2 PC PC+2 2 LDC #xx:8, CCR LDC Rs, CCR LDC @ERs, CCR LDC @(d:16, ERs), CCR LDC @(d:24, ERs), CCR LDC @ERs+, CCR B B W W 2 2 6 8 W 10 12 W 8 LDC @aa:16, CCR LDC @aa:24, CCR STC CCR, Rd STC CCR, @ERd STC CCR, @(d:16, ERd) STC CCR, @(d:24, ERd) STC CCR, @-ERd W W B W W 8 10 2 6 8 ------------ ------------ ------------ W 10 ------------ 12 W ------------ 8 STC CCR, @aa:16 STC CCR, @aa:24 ANDC #xx:8, CCR ORC #xx:8, CCR XORC #xx:8, CCR NOP W W B B B -- ------------ ------------ 8 10 2 2 2 2 ------------ 776 Advanced @(d, PC) Normal @@aa @ERn #xx Rn 8. Block transfer instructions Addressing Mode and Instruction Length (bytes) @-ERn/@ERn+ Operand Size No. of States*1 @(d, ERn) @aa Condition Code -- Operation I HN Z V C Mnemonic EEPMOV. B -- 4 if R4L 0 ------------ repeat @R5 @R6 R5+1 R5 R6+1 R6 R4L-1 R4L until R4L=0 else next; if R4 0 repeat @R5 @R6 R5+1 R5 R6+1 R6 R4-1 R4 until R4L=0 else next; ------------ 8+4n*2 EEPMOV. W -- 4 8+4n*2 Notes: *1 The number of states is the number of states required for execution when the instruction and its operands are located in on-chip memory. For other cases see section A.3, Number of States Required for Execution. *2 n is the value set in register R4L or R4. (1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0. (2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0. (3) Retains its previous value when the result is zero; otherwise cleared to 0. (4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value. (5) The number of states required for execution of an instruction that transfers data in synchronization with the E clock is variable. (6) Set to 1 when the divisor is negative; otherwise cleared to 0. (7) Set to 1 when the divisor is zero; otherwise cleared to 0. (8) Set to 1 when the quotient is negative; otherwise cleared to 0. Advanced @(d, PC) Normal @@aa @ERn #xx Rn 777 778 A.2 Table A.2 Instruction code: Instruction when most significant bit of BH is 1. 4 ORC ADD SUB Table A.2 Table A.2 (2) (2) CMP MOV OR.B XOR.B AND.B Table A.2 (2) XORC ANDC LDC Table A.2 Table A.2 (2) (2) ADDX SUBX 5 6 7 8 9 A B C D E F Table A.2 (2) Table A.2 (2) 1st byte 2nd byte AH AL BH BL Instruction when most significant bit of BH is 0. 2 LDC 3 AL AH 0 1 0 NOP Table A.2 (2) STC 1 Table A.2 Table A.2 Table A.2 Table A.2 (2) (2) (2) (2) 2 MOV.B Operation Code Maps Operation Code Map (1) 3 BLS BVS JMP MOV MOV BIOR ADD ADDX CMP SUBX OR XOR AND MOV BIXOR BIAND BILD Table A.2 Table A.2 EEPMOV (2) (2) Table A.2 (3) DIVXU BST OR BTST BOR BXOR BAND BIST BLD XOR AND RTS BSR RTE TRAPA Table A.2 (2) BCC BCS BNE BNQ BVC BPL BMI BGE BSR BLT BGT JSR BLE 4 BRA BRN BHI 5 MULXU DIVXU MULXU 6 BSET BNOT BCLR 7 8 9 A B C D E F Table A.2 Instruction code: 1st byte 2nd byte AH AL BH BL 2 LDC/STC ADD INC ADDS INC INC INC SLEEP Table A.2 Table A.2 (3) (3) 3 4 5 6 7 8 9 A B C D E F Table A.2 (3) BH AH AL 0 1 01 MOV 0A INC 0B ADDS Operation Code Map (2) 0F SHLL SHAL SHAR ROTL ROTR EXTU EXTU NEG SHLR ROTXL ROTXR NOT DAA MOV SHAL SHAR ROTL ROTR NEG EXTS EXTS 10 SHLL 11 SHLR 12 ROTXL 13 ROTXR 17 NOT 1A DEC DEC DEC SUBS SUB DEC DEC 1B SUBS 1F BHI CMP CMP SUB OR SUB OR BLS BCC BCS XOR XOR DAS BNE AND AND BEQ BVC BVS BPL BMI CMP BGE BLT BGT BLE 58 BRA BRN 79 MOV ADD 7A MOV ADD 779 780 Table A.2 Instruction code: 1st byte 2nd byte 3rd byte 4th byte AH AL BH BL CH CL DH DL Instruction when most significant bit of DH is 0. Instruction when most significant bit of DH is 1. CL 2 3 4 5 6 7 8 9 A B C D E F AH ALBH BLCH LDC STC STC MULXS DIVXS OR BTST BOR BTST BIOR BCLR BIST BCLR BTST BOR BTST BIOR BCLR BIST BCLR BIXOR BIAND BILD BST BXOR BAND BLD BIXOR BIAND BILD BST BXOR BAND BLD XOR AND LDC LDC 0 1 01406 LDC STC STC 01C05 MULXS Operation Code Map (3) 01D05 DIVIXS 01F06 7Cr06 *1 7Cr07 *1 7Dr06 *1 BSET BNOT 7Dr07 *1 BSET BNOT 7Eaa6 *2 7Eaa7 *2 7Faa6 *2 BSET BNOT 7Faa7 *2 BSET BNOT Notes: *1 r is the register designation field. *2 aa is the absolute address field. A.3 Number of States Required for Execution The tables in this section can be used to calculate the number of states required for instruction execution by the H8/300H CPU. Table A.4 indicates the number of instruction fetch, data read/write, and other cycles occurring in each instruction. Table A.3 indicates the number of states required per cycle according to the bus size. The number of states required for execution of an instruction can be calculated from these two tables as follows: Number of states = I x SI + J x SJ + K x SK + L x SL+ M x SM + N x SN Examples of Calculation of Number of States Required for Execution Examples: Advanced mode, stack located in external address space, on-chip supporting modules accessed with 8-bit bus width, external devices accessed in three states with one wait state and 16-bit bus width. BSET #0, @FFFFC7:8 From table A.4, I = L = 2 and J = K = M = N = 0 From table A.3, SI = 4 and S L = 3 Number of states = 2 x 4 + 2 x 3 = 14 JSR @@30 From table A.4, I = J = K = 2 and L = M = N = 0 From table A.3, SI = SJ = SK = 4 Number of states = 2 x 4 + 2 x 4 + 2 x 4 = 24 781 Table A.3 Number of States per Cycle Access Conditions On-Chip Supporting Module External Device 8-Bit Bus 2-State Access 4 3-State Access 6 + 2m 16-Bit Bus 2-State Access 2 3-State Access 3+m Cycle Instruction fetch On-Chip 8-Bit Memory Bus SI 2 6 16-Bit Bus 3 Branch address read SJ Stack operation Byte data access Word data access Internal operation SK SL SM SN 1 3 6 2 4 3+m 6 + 2m Legend: m : Number of wait states inserted into external device access 782 Table A.4 Number of Cycles per Instruction Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 2 1 3 1 1 1 1 1 1 2 1 3 2 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 1 Instruction Mnemonic ADD ADD.B #xx:8, Rd ADD.B Rs, Rd ADD.W #xx:16, Rd ADD.W Rs, Rd ADD.L #xx:32, ERd ADD.L ERs, ERd ADDS #1/2/4, ERd ADDX #xx:8, Rd ADDX Rs, Rd AND.B #xx:8, Rd AND.B Rs, Rd AND.W #xx:16, Rd AND.W Rs, Rd AND.L #xx:32, ERd AND.L ERs, ERd ANDC #xx:8, CCR BAND #xx:3, Rd BAND #xx:3, @ERd BAND #xx:3, @aa:8 BRA d:8 (BT d:8) BRN d:8 (BF d:8) BHI d:8 BLS d:8 BCC d:8 (BHS d:8) BCS d:8 (BLO d:8) BNE d:8 BEQ d:8 BVC d:8 BVS d:8 BPL d:8 BMI d:8 BGE d:8 BLT d:8 BGT d:8 BLE d:8 ADDS ADDX AND ANDC BAND Bcc 783 Instruction Mnemonic Bcc BRA d:16 (BT d:16) BRN d:16 (BF d:16) BHI d:16 BLS d:16 BCC d:16 (BHS d:16) BCS d:16 (BLO d:16) BNE d:16 BEQ d:16 BVC d:16 BVS d:16 BPL d:16 BMI d:16 BGE d:16 BLT d:16 BGT d:16 BLE d:16 BCLR #xx:3, Rd BCLR #xx:3, @ERd BCLR #xx:3, @aa:8 BCLR Rn, Rd BCLR Rn, @ERd BCLR Rn, @aa:8 BIAND #xx:3, Rd BIAND #xx:3, @ERd BIAND #xx:3, @aa:8 BILD #xx:3, Rd BILD #xx:3, @ERd BILD #xx:3, @aa:8 BIOR #xx:8, Rd BIOR #xx:8, @ERd BIOR #xx:8, @aa:8 BIST #xx:3, Rd BIST #xx:3, @ERd BIST #xx:3, @aa:8 BIXOR #xx:3, Rd BIXOR #xx:3, @ERd BIXOR #xx:3, @aa:8 BLD #xx:3, Rd BLD #xx:3, @ERd BLD #xx:3, @aa:8 Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 2 2 2 2 1 1 1 1 1 1 2 2 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 BCLR BIAND BILD BIOR BIST BIXOR BLD 784 Instruction Mnemonic BNOT BNOT #xx:3, Rd BNOT #xx:3, @ERd BNOT #xx:3, @aa:8 BNOT Rn, Rd BNOT Rn, @ERd BNOT Rn, @aa:8 BOR #xx:3, Rd BOR #xx:3, @ERd BOR #xx:3, @aa:8 BSET #xx:3, Rd BSET #xx:3, @ERd BSET #xx:3, @aa:8 BSET Rn, Rd BSET Rn, @ERd BSET Rn, @aa:8 BSR d:8 Normal Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 2 2 1 2 2 1 2 2 1 2 2 1 2 2 2 1 2 1 2 2 2 1 1 1 1 1 1 2 2 2 2 2 2 1 1 2 2 2 2 BOR BSET BSR Advanced 2 BSR d:16 Normal 2 Advanced 2 BST BST #xx:3, Rd BST #xx:3, @ERd BST #xx:3, @aa:8 BTST #xx:3, Rd BTST #xx:3, @ERd BTST #xx:3, @aa:8 BTST Rn, Rd BTST Rn, @ERd BTST Rn, @aa:8 BXOR #xx:3, Rd BXOR #xx:3, @ERd BXOR #xx:3, @aa:8 CMP.B #xx:8, Rd CMP.B Rs, Rd CMP.W #xx:16, Rd CMP.W Rs, Rd CMP.L #xx:32, ERd CMP.L ERs, ERd DAA Rd DAS Rd 1 2 2 1 2 2 1 2 2 1 2 2 1 1 2 1 3 1 1 1 BTST BXOR CMP DAA DAS 785 Instruction Mnemonic DEC DEC.B Rd DEC.W #1/2, Rd DEC.L #1/2, ERd DIVXS.B Rs, Rd DIVXS.W Rs, ERd DIVXU.B Rs, Rd DIVXU.W Rs, ERd EEPMOV.B EEPMOV.W EXTS.W Rd EXTS.L ERd EXTU.W Rd EXTU.L ERd INC.B Rd INC.W #1/2, Rd INC.L #1/2, ERd JMP @ERn JMP @aa:24 JMP @@aa:8 Normal Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 1 2 2 1 1 2 2 1 1 1 1 1 1 1 2 2 2 1 2 1 2 1 2 1 2 1 2 2 2 2 2 2 2n + 2*1 2n + 2*1 12 20 12 20 DIVXS DIVXU EEPMOV EXTS EXTU INC JMP Advanced 2 JSR JSR @ERn Normal 2 Advanced 2 JSR @aa:24 Normal 2 Advanced 2 JSR @@aa:8 Normal 2 Advanced 2 LDC LDC #xx:8, CCR LDC Rs, CCR LDC @ERs, CCR LDC @(d:16, ERs), CCR LDC @(d:24, ERs), CCR LDC @ERs+, CCR LDC @aa:16, CCR LDC @aa:24, CCR 1 1 2 3 5 2 3 4 1 1 1 1 1 1 2 786 Instruction Mnemonic MOV MOV.B #xx:8, Rd MOV.B Rs, Rd MOV.B @ERs, Rd MOV.B @(d:16, ERs), Rd MOV.B @(d:24, ERs), Rd MOV.B @ERs+, Rd MOV.B @aa:8, Rd MOV.B @aa:16, Rd MOV.B @aa:24, Rd MOV.B Rs, @ERd MOV.B Rs, @(d:16, ERd) MOV.B Rs, @(d:24, ERd) MOV.B Rs, @-ERd MOV.B Rs, @aa:8 MOV.B Rs, @aa:16 MOV.B Rs, @aa:24 MOV.W #xx:16, Rd MOV.W Rs, Rd MOV.W @ERs, Rd MOV.W @(d:16, ERs), Rd MOV.W @(d:24, ERs), Rd MOV.W @ERs+, Rd MOV.W @aa:16, Rd MOV.W @aa:24, Rd MOV.W Rs, @ERd MOV.W Rs, @(d:16, ERd) MOV.W Rs, @(d:24, ERd) MOV.W Rs, @-ERd MOV.W Rs, @aa:16 MOV.W Rs, @aa:24 MOV.L #xx:32, ERd MOV.L ERs, ERd MOV.L @ERs, ERd M OV.L @( d:16, ERs) , ERd M OV.L @( d:24, ERs) , ERd MOV.L @ERs+, ERd MOV.L @aa:16, ERd MOV.L @aa:24, ERd MOV.L ERs, @ERd M OV.L ERs, @( d:16, ERd) M OV.L ERs, @( d:24, ERd) MOV.L ERs, @-ERd MOV.L ERs, @aa:16 MOV.L ERs, @aa:24 Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 1 1 1 2 4 1 1 2 3 1 2 4 1 1 2 3 2 1 1 2 4 1 2 3 1 2 4 1 2 3 3 1 2 3 5 2 3 4 2 3 5 2 3 4 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 787 Instruction Mnemonic MOVFPE MOVTPE MULXS MULXU NEG MOVFPE @aa:16, Rd*2 MOVTPE Rs, @aa:16*2 MULXS.B Rs, Rd MULXS.W Rs, ERd MULXU.B Rs, Rd MULXU.W Rs, ERd NEG.B Rd NEG.W Rd NEG.L ERd NOP NOT.B Rd NOT.W Rd NOT.L ERd OR.B #xx:8, Rd OR.B Rs, Rd OR.W #xx:16, Rd OR.W Rs, Rd OR.L #xx:32, ERd OR.L ERs, ERd ORC #xx:8, CCR POP.W Rn POP.L ERn PUSH.W Rn PUSH.L ERn ROTL.B Rd ROTL.W Rd ROTL.L ERd ROTR.B Rd ROTR.W Rd ROTR.L ERd ROTXL.B Rd ROTXL.W Rd ROTXL.L ERd ROTXR.B Rd ROTXR.W Rd ROTXR.L ERd RTE Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 2 1 3 2 1 1 2 1 2 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 1 2 1 2 2 2 2 2 1 1 12 20 12 20 NOP NOT OR ORC POP PUSH ROTL ROTR ROTXL ROTXR RTE 788 Instruction Mnemonic RTS RTS Normal Instruction Branch Stack Byte Data Word Data Internal Fetch Addr. Read Operation Access Access Operation I J K L M N 2 1 2 2 2 Advanced 2 SHAL SHAL.B Rd SHAL.W Rd SHAL.L ERd SHAR.B Rd SHAR.W Rd SHAR.L ERd SHLL.B Rd SHLL.W Rd SHLL.L ERd SHLR.B Rd SHLR.W Rd SHLR.L ERd SLEEP STC CCR, Rd STC CCR, @ERd STC CCR, @( d:16, ERd) STC CCR, @( d:24, ERd) STC CCR, @-ERd STC CCR, @aa:16 STC CCR, @aa:24 SUB.B Rs, Rd SUB.W #xx:16, Rd SUB.W Rs, Rd SUB.L #xx:32, ERd SUB.L ERs, ERd SUBS #1/2/4, ERd SUBX #xx:8, Rd SUBX Rs, Rd TRAPA #x:2 Normal 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 3 5 2 3 4 1 2 1 3 1 1 1 1 2 1 2 SHAR SHLL SHLR SLEEP STC 1 1 1 1 1 1 2 SUB SUBS SUBX TRAPA 2 2 4 4 Advanced 2 XOR XOR.B #xx:8, Rd XOR.B Rs, Rd XOR.W #xx:16, Rd XOR.W Rs, Rd XOR.L #xx:32, ERd XOR.L ERs, ERd XORC #xx:8, CCR 1 1 2 1 3 2 1 XORC Notes: *1 n is the value set in register R4L or R4. The source and destination are accessed n + 1 times each. *2 Not available in the H8/3062 Series. 789 Appendix B Internal I/O Registers Table B.1 Comparison of H8/3062 Series Internal I/O Register Specifications H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, H8/3060 Mask ROM B-Mask Version Module ADRCR -- -- -- -- RAMCR -- -- Bus controller Flash memory Address (Low) H'EE01E H'EE030 H'EE031 H'EE032 H'EE033 H'EE077 H'EE07D H8/3062 F-ZTAT -- FLMCR H8/3062 F-ZTAT R-Mask Version ADRCR FLMCR H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version ADRCR -- -- H8/3064 F-ZTAT B-Mask Version ADRCR FLMCR1 FLMCR2 EBR1 EBR2 RAMCR H8/3062 F-ZTAT B-Mask Version ADRCR FLMCR1 FLMCR2 EBR EBR EBR -- -- RAMCR FLMSR RAMCR FLMSR -- -- Notes: 1. A dash ("--") indicates that an access will always return 1s, and writes are invalid. 2. Shading indicates that access is prohibited. Normal operation is not guaranteed if these addresses are accessed. 790 B.1 Address List (H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version, H8/3062 Mask ROM Version, H8/3061 Mask ROM Version, H8/3060 Mask ROM Version) Data Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name Bus Width Bit 7 8 8 8 8 8 8 Address Register (Low) Name H'EE000 P1DDR H'EE001 P2DDR H'EE002 P3DDR H'EE003 P4DDR H'EE004 P5DDR H'EE005 P6DDR H'EE006 -- H'EE007 P8DDR H'EE008 P9DDR H'EE009 PADDR H'EE00A PBDDR H'EE00B -- H'EE00C -- H'EE00D -- H'EE00E -- H'EE00F -- H'EE010 -- H'EE011 MDCR H'EE012 SYSCR H'EE013 BRCR H'EE014 ISCR H'EE015 IER H'EE016 ISR H'EE017 -- H'EE018 IPRA H'EE019 IPRB H'EE01A DASTCR H'EE01B DIVCR H 'EE01C MSTCRH H'EE01D MSTCRL P1 7DDR P1 6DDR P1 5DDR P1 4DDR P1 3DDR P1 2DDR P1 1DDR P1 0DDR Port 1 P2 7DDR P2 6DDR P2 5DDR P2 4DDR P2 3DDR P2 2DDR P2 1DDR P2 0DDR Port 2 P3 7DDR P3 6DDR P3 5DDR P3 4DDR P3 3DDR P3 2DDR P3 1DDR P3 0DDR Port 3 P4 7DDR P4 6DDR P4 5DDR P4 4DDR P4 3DDR P4 2DDR P4 1DDR P4 0DDR Port 4 -- -- -- -- -- -- P5 3DDR P5 2DDR P5 1DDR P5 0DDR Port 5 P6 6DDR P6 5DDR P6 4DDR P6 3DDR P6 2DDR P6 1DDR P6 0DDR Port 6 -- -- -- -- -- -- -- -- -- -- 8 8 8 8 -- -- P8 4DDR P8 3DDR P8 2DDR P8 1DDR P8 0DDR Port 8 P9 5DDR P9 4DDR P9 3DDR P9 2DDR P9 1DDR P9 0DDR Port 9 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B -- -- -- -- -- -- -- -- -- -- -- -- -- STS2 A22E -- -- -- -- IPRA6 IPRB6 -- -- -- -- -- CS6E -- -- -- -- -- -- -- STS1 A21E -- -- -- -- -- -- -- STS0 A20E -- -- -- -- -- -- -- UE -- -- -- -- -- -- -- MDS2 NMIEG -- -- -- -- -- -- -- MDS1 SSOE -- -- -- -- -- -- -- MDS0 RAME BRLE Bus controller System control 8 8 8 8 8 8 -- SSBY A23E -- -- -- -- IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt IRQ5E IRQ5F -- IPRA5 -- -- -- -- -- -- CS5E IRQ4E IRQ4F -- IPRA4 -- -- -- -- IRQ3E IRQ3F -- IPRA3 IPRB3 -- -- -- IRQ2E IRQ2F -- IPRA2 IPRB2 -- -- -- IRQ1E IRQ1F -- IPRA1 -- -- DIV1 IRQ0E IRQ0F -- IPRA0 -- DASTE DIV0 D/A converter System control controller 8 8 8 8 8 8 IPRA7 IPRB7 -- -- PSTOP -- -- CS7E MSTPH1 MSTPH0 MSTPL0 ADRCTL Bus controller -- MSTPL4 MSTPL3 MSTPL2 -- -- CS4E -- -- -- -- -- -- H'EE01E ADRCR* 1 8 H'EE01F CSCR 8 791 Data Address Register (Low) Name H'EE020 ABWCR H'EE021 ASTCR H'EE022 WCRH H'EE023 WCRL H'EE024 BCR H'EE025 -- Bus Width Bit 7 8 8 8 8 8 ABW7 AST7 W71 W31 ICIS1 -- Bit 6 ABW6 AST6 W70 W30 ICIS0 -- Bit 5 ABW5 AST5 W61 W21 --* 2 -- Bit Names Bit 4 ABW4 AST4 W60 W20 --* 2 -- Bit 3 ABW3 AST3 W51 W11 --* 2 -- Bit 2 ABW2 AST2 W50 W10 -- -- Bit 1 ABW1 AST1 W41 W01 RDEA -- Bit 0 ABW0 AST0 W40 W00 WAITE -- Module Name Bus controller H'EE026 Reserved area (access prohibited) H'EE027 H'EE028 H'EE029 H'EE02A H'EE02B H'EE02C H'EE02D H'EE02E H'EE02F H'EE030 FLMCR* 3 8 FWE SWE ESU PSU EV PV E P Flash memory H'EE031 Reserved area (access prohibited) H'EE032 EBR*3 8 EB7 EB6 EB5 EB4 EB3 EB2 EB1 EB0 H'EE033 Reserved area (access prohibited) H'EE034 -- H'EE035 -- H'EE036 -- H'EE037 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- H'EE038 Reserved area (access prohibited) H'EE039 H'EE03A H'EE03B H'EE03C P2PCR H'EE03D -- H'EE03E P4PCR H'EE03F P5PCR H'EE040 -- H'EE041 -- H'EE042 -- H'EE043 -- 8 8 8 P2 7PCR P2 6PCR P2 5PCR P2 4PCR P2 3PCR P2 2PCR P2 1PCR P2 0PCR Port 2 -- -- -- -- -- -- -- -- P4 7PCR P4 6PCR P4 5PCR P4 4PCR P4 3PCR P4 2PCR P4 1PCR P4 0PCR Port 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- P5 3PCR P5 2PCR P5 1PCR P5 0PCR Port 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 792 Data Address Register (Low) Name H'EE044 -- H'EE045 -- H'EE046 -- H'EE047 -- H'EE048 -- H'EE049 -- H'EE04A -- H'EE04B -- H'EE04C -- H'EE04D -- H'EE04E -- H'EE04F -- H'EE050 -- H'EE051 -- H'EE052 -- H'EE053 -- H'EE054 -- H'EE055 -- H'EE056 -- H'EE057 -- H'EE058 -- H'EE059 -- H'EE05A -- H'EE05B -- H'EE05C -- H'EE05D -- H'EE05E -- H'EE05F -- H'EE060 -- H'EE061 -- H'EE062 -- H'EE063 -- H'EE064 -- H'EE065 -- H'EE066 -- H'EE067 -- Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Module Name 793 Data Address Register (Low) Name H'EE068 -- H'EE069 -- H'EE06A -- H'EE06B -- H'EE06C -- H'EE06D -- H'EE06E -- H'EE06F -- H'EE070 -- H'EE071 -- H'EE072 -- H'EE073 -- Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- Module Name H'EE074 Reserved area (access prohibited) H'EE075 H'EE076 H'EE077 RAMCR * 4 8 -- -- -- -- RAMS RAM2 RAM1 -- Flash memory H'EE078 Reserved area (access prohibited) H'EE079 H'EE07A H'EE07B H'EE07C H'EE07D FLMSR * 4 8 FLER -- -- -- -- -- -- -- H'EE07E Reserved area (access prohibited) H'EE07F H'EE080 H'EE081 H'FFF20 Reserved area (access prohibited) H'FFF21 H'FFF22 H'FFF23 H'FFF24 H'FFF25 H'FFF26 H'FFF27 H'FFF28 H'FFF29 794 Data Address Register (Low) Name Bus Width Bit 7 Bit 6 Bit 5 Bit Names Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF2A Reserved area (access prohibited) H'FFF2B H'FFF2C H'FFF2D H'FFF2E H'FFF2F H'FFF30 H'FFF31 H'FFF32 H'FFF33 H'FFF34 H'FFF35 H'FFF36 H'FFF37 H'FFF38 H'FFF39 H'FFF3A H'FFF3B H'FFF3C H'FFF3D H'FFF3E H'FFF3F H'FFF40 -- H'FFF41 -- H'FFF42 -- H'FFF43 -- H'FFF44 -- H'FFF45 -- H'FFF46 -- H'FFF47 -- H'FFF48 -- H'FFF49 -- H'FFF4A -- H'FFF4B -- H'FFF4C -- H'FFF4D -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 795 Data Address Register (Low) Name H'FFF4E -- H'FFF4F -- H'FFF50 -- H'FFF51 -- H'FFF52 -- H'FFF53 -- H'FFF54 -- H'FFF55 -- H'FFF56 -- H'FFF57 -- H'FFF58 -- H'FFF59 -- H'FFF5A -- H'FFF5B -- H'FFF5C -- H'FFF5D -- H'FFF5E -- H'FFF5F -- H'FFF60 TSTR H'FFF61 TSNC H'FFF62 TMDR H'FFF63 TOLR H'FFF64 TISRA H'FFF65 TISRB H'FFF66 TISRC H'FFF67 H'FFF68 16TCR0 H'FFF69 TIOR0 8 8 -- -- CCLR1 IOB2 CCLR0 IOB1 8 8 8 8 8 8 8 Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- MDF -- IMIEA2 IMIEB2 OVIE2 Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- FDIR TOB2 IMIEA1 IMIEB1 OVIE1 Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TOA2 IMIEA0 IMIEB0 OVIE0 Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TOB1 -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR2 SYNC2 PWM2 TOA1 IMFA2 IMFB2 OVF2 Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR1 SYNC1 PWM1 TOB0 IMFA1 IMFB1 OVF1 Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR0 SYNC0 PWM0 TOA0 IMFA0 IMFB0 OVF0 16-bit timer (all channels) Module Name CKEG1 IOB0 CKEG0 -- TPSC2 IOA2 TPSC1 IOA1 TPSC0 IOA0 16-bit timer channel 0 H'FFF6A 16TCNT0H 16 H'FFF6B 16TCNT0L H'FFF6C GRA0H H'FFF6D GRA0L H'FFF6E GRB0H H'FFF6F GRB0L 16 16 796 Data Address Register (Low) Name H'FFF70 16TCR1 H'FFF71 TIOR1 Bus Width Bit 7 8 8 -- -- Bit 6 CCLR1 IOB2 Bit 5 CCLR0 IOB1 Bit Names Bit 4 CKEG1 IOB0 Bit 3 CKEG0 -- Bit 2 TPSC2 IOA2 Bit 1 TPSC1 IOA1 Bit 0 TPSC0 IOA0 Module Name 16-bit timer channel 1 H'FFF72 16TCNT1H 16 H'FFF73 16TCNT1L H'FFF74 GRA1H H'FFF75 GRA1L H'FFF76 GRB1H H'FFF77 GRB1L H'FFF78 16TCR2 H'FFF79 TIOR2 8 8 -- -- CCLR1 IOB2 CCLR0 IOB1 CKEG1 IOB0 CKEG0 -- TPSC2 IOA2 TPSC1 IOA1 TPSC0 IOA0 16-bit timer channel 2 16 16 H'FFF7A 16TCNT2H 16 H'FFF7B 16TCNT2L H'FFF7C GRA2H H'FFF7D GRA2L H'FFF7E GRB2H H'FFF7F GRB2L H'FFF80 8TCR0 H'FFF81 8TCR1 H'FFF82 8TCSR0 H'FFF83 8TCSR1 H'FFF84 TCORA0 H'FFF85 TCORA1 H'FFF86 TCORB0 H'FFF87 TCORB1 H'FFF88 8TCNT0 H'FFF89 8TCNT1 H'FFF8A -- H'FFF8B -- H'FFF8C TCSR* 5 H'FFF8D TCNT * 5 H'FFF8E -- H'FFF8F RSTCSR * 5 8 8 8 -- WRST -- -- -- -- -- -- -- -- -- -- -- -- 8 8 8 8 8 8 8 8 8 8 -- -- OVF -- -- WT/IT -- -- TME -- -- -- -- -- -- -- -- CKS2 -- -- CKS1 -- -- CKS0 WDT CMIEB CMIEB CMFB CMFB CMIEA CMIEA CMFA CMFA OVIE OVIE OVF OVF CCLR1 CCLR1 ADTE ICE CCLR0 CCLR0 OIS3 OIS3 CKS2 CKS2 OIS2 OIS2 CKS1 CKS1 OS1 OS1 CKS0 CKS0 OS0 OS0 8-bit timer channels 0 and 1 16 16 RSTOE -- 797 Data Address Register (Low) Name H'FFF90 8TCR2 H'FFF91 8TCR3 H'FFF92 8TCSR2 H'FFF93 8TCSR3 H'FFF94 TCORA2 H'FFF95 TCORA3 H'FFF96 TCORB2 H'FFF97 TCORB3 H'FFF98 8TCNT2 H'FFF99 8TCNT3 H'FFF9A -- H'FFF9B -- H'FFF9C DADR0 H'FFF9D DADR1 H'FFF9E DACR H'FFF9F -- H'FFFA0 TPMR H'FFFA1 TPCR H'FFFA2 NDERB H'FFFA3 NDERA H'FFFA4 NDRB* 6 8 8 8 8 8 8 8 8 8 DAOE1 -- -- DAOE0 -- -- DAE -- -- -- -- -- Bus Width Bit 7 8 8 8 8 8 8 8 8 8 8 -- -- -- -- -- -- -- -- CMIEB CMIEB CMFB CMFB Bit 6 CMIEA CMIEA CMFA CMFA Bit 5 OVIE OVIE OVF OVF Bit Names Bit 4 CCLR1 CCLR1 -- ICE Bit 3 CCLR0 CCLR0 OIS3 OIS3 Bit 2 CKS2 CKS2 OIS2 OIS2 Bit 1 CKS1 CKS1 OS1 OS1 Bit 0 CKS0 CKS0 OS0 OS0 Module Name 8-bit timer channels 2 and 3 -- -- -- -- -- -- -- -- D/A converter -- -- -- -- -- -- -- -- G3NOV G2NOV G1NOV G0NOV TPC G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER7 NDR15 NDR15 NDER6 NDR14 NDR14 NDR6 NDR6 -- -- -- -- -- -- -- -- -- -- -- -- NDER5 NDR13 NDR13 NDR5 NDR5 -- -- -- -- -- -- -- -- -- -- -- -- NDER4 NDR12 NDR12 NDR4 NDR4 -- -- -- -- -- -- -- -- -- -- -- -- NDER3 NDR11 -- NDR3 -- -- NDR11 -- NDR3 -- -- -- -- -- -- -- -- NDER2 NDR10 -- NDR2 -- -- NDR10 -- NDR2 -- -- -- -- -- -- -- -- NDER1 NDR9 -- NDR1 -- -- NDR9 -- NDR1 -- -- -- -- -- -- -- -- NDER8 NDER0 NDR8 -- NDR0 -- -- NDR8 -- NDR0 -- -- -- -- -- -- -- -- H'FFFA5 NDRA* 6 8 NDR7 NDR7 H'FFFA6 NDRB* 6 8 -- -- H'FFFA7 NDRA* 6 8 -- -- H'FFFA8 -- H'FFFA9 -- H'FFFAA -- H'FFFAB -- H'FFFAC -- H'FFFAD -- H'FFFAE -- H'FFFAF -- -- -- -- -- -- -- -- -- 798 Data Address Register (Low) Name H'FFFB0 SMR H'FFFB1 BRR H'FFFB2 SCR H'FFFB3 TDR H'FFFB4 SSR Bus Width Bit 7 8 8 8 8 8 TDRE RDRF ORER TIE RIE TE RE C/A Bit 6 CHR Bit 5 PE Bit Names Bit 4 O/E Bit 3 STOP Bit 2 MP Bit 1 CKS1 Bit 0 CKS0 Module Name SCI channel 0 MPIE TEIE CKE1 CKE0 FER/ ERS PER TEND MPB MPBT H'FFFB5 RDR H'FFFB6 SCMR 8 8 -- -- -- -- SDIR SINV -- SMIF H'FFFB7 Reserved area (access prohibited) H'FFFB8 SMR H'FFFB9 BRR H'FFFBA SCR H'FFFBB TDR H'FFFBC SSR 8 8 8 8 8 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0 C/A CHR PE O/E STOP MP CKS1 CKS0 SCI channel 1 H'FFFBD RDR H'FFFBE SCMR 8 8 -- -- -- -- SDIR SINV -- SMIF H'FFFBF Reserved area (access prohibited) H'FFFC0 Reserved area (access prohibited) H'FFFC1 H'FFFC2 H'FFFC3 H'FFFC4 H'FFFC5 H'FFFC6 H'FFFC7 H'FFFC8 -- H'FFFC9 -- H'FFFCA -- H'FFFCB -- H'FFFCC -- H'FFFCD -- H'FFFCE -- H'FFFCF -- H'FFFD0 P1DR H'FFFD1 P2DR H'FFFD2 P3DR 8 8 8 -- -- -- -- -- -- -- -- P1 7 P2 7 P3 7 -- -- -- -- -- -- -- -- P1 6 P2 6 P3 6 -- -- -- -- -- -- -- -- P1 5 P2 5 P3 5 -- -- -- -- -- -- -- -- P1 4 P2 4 P3 4 -- -- -- -- -- -- -- -- P1 3 P2 3 P3 3 -- -- -- -- -- -- -- -- P1 2 P2 2 P3 2 -- -- -- -- -- -- -- -- P1 1 P2 1 P3 1 -- -- -- -- -- -- -- -- P1 0 P2 0 P3 0 Port 1 Port 2 Port 3 799 Data Address Register (Low) Name H'FFFD3 P4DR H'FFFD4 P5DR H'FFFD5 P6DR H'FFFD6 P7DR H'FFFD7 P8DR H'FFFD8 P9DR H'FFFD9 PADR H'FFFDA PBDR H'FFFDB -- H'FFFDC -- H'FFFDD -- H'FFFDE -- H'FFFDF -- H'FFFE0 ADDRAH H'FFFE1 ADDRAL H'FFFE2 ADDRBH H'FFFE3 ADDRBL H'FFFE4 ADDRCH H'FFFE5 ADDRCL H'FFFE6 ADDRDH H'FFFE7 ADDRDL H'FFFE8 ADCSR H'FFFE9 ADCR 8 8 8 8 8 8 8 8 8 8 Bus Width Bit 7 8 8 8 8 8 8 8 8 P4 7 -- P6 7 P7 7 -- -- PA7 PB7 -- -- -- -- -- AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGE Bit 6 P4 6 -- P6 6 P7 6 -- -- PA6 PB6 -- -- -- -- -- AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE -- Bit 5 P4 5 -- P6 5 P7 5 -- P9 5 PA5 PB5 -- -- -- -- -- AD7 -- AD7 -- AD7 -- AD7 -- ADST -- Bit Names Bit 4 P4 4 -- P6 4 P7 4 P8 4 P9 4 PA4 PB4 -- -- -- -- -- AD6 -- AD6 -- AD6 -- AD6 -- SCAN -- Bit 3 P4 3 P5 3 P6 3 P7 3 P8 3 P9 3 PA3 PB3 -- -- -- -- -- AD5 -- AD5 -- AD5 -- AD5 -- CKS -- Bit 2 P4 2 P5 2 P6 2 P7 2 P8 2 P9 2 PA2 PB2 -- -- -- -- -- AD4 -- AD4 -- AD4 -- AD4 -- CH2 -- Bit 1 P4 1 P5 1 P6 1 P7 1 P8 1 P9 1 PA1 PB1 -- -- -- -- -- AD3 -- AD3 -- AD3 -- AD3 -- CH1 -- Bit 0 P4 0 P5 0 P6 0 P7 0 P8 0 P9 0 PA0 PB0 -- -- -- -- -- AD2 -- AD2 -- AD2 -- AD2 -- CH0 -- A/D converter Module Name Port 4 Port 5 Port 6 Port 7 Port 8 Port 9 Port A Port B Notes: *1 ADRCR is not present in the H8/3062F-ZTAT. *2 Writing to bits 5 to 3 of BCR is prohibited. *3 The FLMCR and EBR registers are used only in the versions with on-chip flash memory. Use byte access on these registers. FLMCR and EBR are not present in the versions with on-chip mask ROM. *4 The RAMCR and FLMSR registers are used only in the versions with on-chip flash memory. Use byte access on these registers. RAMCR and FLMSR are not present in the versions with on-chip mask ROM. *5 For the procedure for writing to TCSR, TCNT, and RSTCSR, see section 11.2.4, Notes on Register Rewriting. *6 The address depends on the output trigger setting. Legend: WDT : Watchdog timer TPC : Programmable timing pattern controller SCI : Serial communication interface 800 B.2 Address List (H8/3064F-ZTAT B-Mask Version, H8/3064 Mask ROM B-Mask Version) Data Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name Bus Width Bit 7 8 8 8 8 8 8 Address Register (Low) Name H'EE000 P1DDR H'EE001 P2DDR H'EE002 P3DDR H'EE003 P4DDR H'EE004 P5DDR H'EE005 P6DDR H'EE006 -- H'EE007 P8DDR H'EE008 P9DDR H'EE009 PADDR H'EE00A PBDDR H'EE00B -- H'EE00C -- H'EE00D -- H'EE00E -- H'EE00F -- H'EE010 -- H'EE011 MDCR H'EE012 SYSCR H'EE013 BRCR H'EE014 ISCR H'EE015 IER H'EE016 ISR H'EE017 -- H'EE018 IPRA H'EE019 IPRB H'EE01A DASTCR H'EE01B DIVCR H'EE01C MSTCRH H'EE01D MSTCRL H'EE01E ADRCR H'EE01F CSCR P1 7DDR P1 6DDR P1 5DDR P1 4DDR P1 3DDR P1 2DDR P1 1DDR P1 0DDR Port 1 P2 7DDR P2 6DDR P2 5DDR P2 4DDR P2 3DDR P2 2DDR P2 1DDR P2 0DDR Port 2 P3 7DDR P3 6DDR P3 5DDR P3 4DDR P3 3DDR P3 2DDR P3 1DDR P3 0DDR Port 3 P4 7DDR P4 6DDR P4 5DDR P4 4DDR P4 3DDR P4 2DDR P4 1DDR P4 0DDR Port 4 -- -- -- -- -- -- P5 3DDR P5 2DDR P5 1DDR P5 0DDR Port 5 P6 6DDR P6 5DDR P6 4DDR P6 3DDR P6 2DDR P6 1DDR P6 0DDR Port 6 -- -- -- -- -- -- -- -- -- -- 8 8 8 8 -- -- P8 4DDR P8 3DDR P8 2DDR P8 1DDR P8 0DDR Port 8 P9 5DDR P9 4DDR P9 3DDR P9 2DDR P9 1DDR P9 0DDR Port 9 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B -- -- -- -- -- -- -- -- -- -- -- -- -- STS2 A22E -- -- -- -- IPRA6 IPRB6 -- -- -- -- -- CS6E -- -- -- -- -- -- -- STS1 A21E -- -- -- -- -- -- -- STS0 A20E -- -- -- -- -- -- -- UE -- -- -- -- -- -- -- MDS2 NMIEG -- -- -- -- -- -- -- MDS1 SSOE -- -- -- -- -- -- -- MDS0 RAME BRLE Bus controller System control 8 8 8 8 8 8 -- SSBY A23E -- -- -- -- IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt IRQ5E IRQ5F -- IPRA5 -- -- -- -- -- -- CS5E IRQ4E IRQ4F -- IPRA4 -- -- -- -- IRQ3E IRQ3F -- IPRA3 IPRB3 -- -- -- IRQ2E IRQ2F -- IPRA2 IPRB2 -- -- -- IRQ1E IRQ1F -- IPRA1 -- -- DIV1 IRQ0E IRQ0F -- IPRA0 -- DASTE DIV0 D/A converter System control controller 8 8 8 8 8 8 8 8 IPRA7 IPRB7 -- -- PSTOP -- -- CS7E MSTPH1 MSTPH0 MSTPL0 ADRCTL Bus controller -- MSTPL4 MSTPL3 MSTPL2 -- -- CS4E -- -- -- -- -- -- 801 Data Address Register (Low) Name H'EE020 ABWCR H'EE021 ASTCR H'EE022 WCRH H'EE023 WCRL H'EE024 BCR H'EE025 -- Bus Width Bit 7 8 8 8 8 8 ABW7 AST7 W71 W31 ICIS1 -- Bit 6 ABW6 AST6 W70 W30 ICIS0 -- Bit 5 ABW5 AST5 W61 W21 --* 2 -- Bit Names Bit 4 ABW4 AST4 W60 W20 --* 2 -- Bit 3 ABW3 AST3 W51 W11 --* 2 -- Bit 2 ABW2 AST2 W50 W10 -- -- Bit 1 ABW1 AST1 W41 W01 RDEA -- Bit 0 ABW0 AST0 W40 W00 WAITE -- Module Name Bus controller H'EE026 Reserved area (access prohibited) H'EE027 H'EE028 H'EE029 H'EE02A H'EE02B H'EE02C H'EE02D H'EE02E H'EE02F H'EE030 FLMCR1* 5 8 H'EE031 FLMCR2* 5 8 H'EE032 EBR1* 5 H'EE033 EBR2* 5 H'EE034 -- H'EE035 -- H'EE036 -- H'EE037 -- 8 8 FWE FLER EB7 -- -- -- -- -- SWE --* 1 EB6 -- -- -- -- -- ESU --* 1 EB5 -- -- -- -- -- PSU --* 1 EB4 -- -- -- -- -- EV --* 1 EB3 EB11 -- -- -- -- PV --* 1 EB2 EB10 -- -- -- -- E --* 1 EB1 EB9 -- -- -- -- P --* 1 EB0 EB8 -- -- -- -- Flash memory H'EE038 Reserved area (access prohibited) H'EE039 H'EE03A H'EE03B H'EE03C P2PCR H'EE03D -- H'EE03E P4PCR H'EE03F P5PCR H'EE040 -- H'EE041 -- H'EE042 -- H'EE043 -- 8 8 8 P2 7PCR P2 6PCR P2 5PCR P2 4PCR P2 3PCR P2 2PCR P2 1PCR P2 0PCR Port 2 -- -- -- -- -- -- -- -- P4 7PCR P4 6PCR P4 5PCR P4 4PCR P4 3PCR P4 2PCR P4 1PCR P4 0PCR Port 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- P5 3PCR P5 2PCR P5 1PCR P5 0PCR Port 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 802 Data Address Register (Low) Name H'EE044 -- H'EE045 -- H'EE046 -- H'EE047 -- H'EE048 -- H'EE049 -- H'EE04A -- H'EE04B -- H'EE04C -- H'EE04D -- H'EE04E -- H'EE04F -- H'EE050 -- H'EE051 -- H'EE052 -- H'EE053 -- H'EE054 -- H'EE055 -- H'EE056 -- H'EE057 -- H'EE058 -- H'EE059 -- H'EE05A -- H'EE05B -- H'EE05C -- H'EE05D -- H'EE05E -- H'EE05F -- H'EE060 -- H'EE061 -- H'EE062 -- H'EE063 -- H'EE064 -- H'EE065 -- H'EE066 -- H'EE067 -- Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Module Name 803 Data Address Register (Low) Name H'EE068 -- H'EE069 -- H'EE06A -- H'EE06B -- H'EE06C -- H'EE06D -- H'EE06E -- H'EE06F -- H'EE070 -- H'EE071 -- H'EE072 -- H'EE073 -- Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- Module Name H'EE074 Reserved area (access prohibited) H'EE075 H'EE076 H'EE077 RAMCR * 5 8 -- -- -- -- RAMS RAM2 RAM1 RAM0 Flash memory H'EE078 Reserved area (access prohibited) H'EE079 H'EE07A H'EE07B H'EE07C H'EE07D H'EE07E H'EE07F H'EE080 H'EE081 H'FFF20 H'FFF21 H'FFF22 H'FFF23 H'FFF24 H'FFF25 H'FFF26 H'FFF27 H'FFF28 H'FFF29 804 Data Address Register (Low) Name Bus Width Bit 7 Bit 6 Bit 5 Bit Names Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF2A Reserved area (access prohibited) H'FFF2B H'FFF2C H'FFF2D H'FFF2E H'FFF2F H'FFF30 H'FFF31 H'FFF32 H'FFF33 H'FFF34 H'FFF35 H'FFF36 H'FFF37 H'FFF38 H'FFF39 H'FFF3A H'FFF3B H'FFF3C H'FFF3D H'FFF3E H'FFF3F H'FFF40 -- H'FFF41 -- H'FFF42 -- H'FFF43 -- H'FFF44 -- H'FFF45 -- H'FFF46 -- H'FFF47 -- H'FFF48 -- H'FFF49 -- H'FFF4A -- H'FFF4B -- H'FFF4C -- H'FFF4D -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 805 Data Address Register (Low) Name H'FFF4E -- H'FFF4F -- H'FFF50 -- H'FFF51 -- H'FFF52 -- H'FFF53 -- H'FFF54 -- H'FFF55 -- H'FFF56 -- H'FFF57 -- H'FFF58 -- H'FFF59 -- H'FFF5A -- H'FFF5B -- H'FFF5C -- H'FFF5D -- H'FFF5E -- H'FFF5F -- H'FFF60 TSTR H'FFF61 TSNC H'FFF62 TMDR H'FFF63 TOLR H'FFF64 TISRA H'FFF65 TISRB H'FFF66 TISRC H'FFF67 H'FFF68 16TCR0 H'FFF69 TIOR0 8 8 -- -- CCLR1 IOB2 CCLR0 IOB1 8 8 8 8 8 8 8 Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- MDF -- IMIEA2 IMIEB2 OVIE2 Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- FDIR TOB2 IMIEA1 IMIEB1 OVIE1 Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TOA2 IMIEA0 IMIEB0 OVIE0 Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TOB1 -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR2 SYNC2 PWM2 TOA1 IMFA2 IMFB2 OVF2 Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR1 SYNC1 PWM1 TOB0 IMFA1 IMFB1 OVF1 Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR0 SYNC0 PWM0 TOA0 IMFA0 IMFB0 OVF0 16-bit timer (all channels) Module Name CKEG1 IOB0 CKEG0 -- TPSC2 IOA2 TPSC1 IOA1 TPSC0 IOA0 16-bit timer channel 0 H'FFF6A 16TCNT0H 16 H'FFF6B 16TCNT0L H'FFF6C GRA0H H'FFF6D GRA0L H'FFF6E GRB0H H'FFF6F GRB0L 16 16 806 Data Address Register (Low) Name H'FFF70 16TCR1 H'FFF71 TIOR1 Bus Width Bit 7 8 8 -- -- Bit 6 CCLR1 IOB2 Bit 5 CCLR0 IOB1 Bit Names Bit 4 CKEG1 IOB0 Bit 3 CKEG0 -- Bit 2 TPSC2 IOA2 Bit 1 TPSC1 IOA1 Bit 0 TPSC0 IOA0 Module Name 16-bit timer channel 1 H'FFF72 16TCNT1H 16 H'FFF73 16TCNT1L H'FFF74 GRA1H H'FFF75 GRA1L H'FFF76 GRB1H H'FFF77 GRB1L H'FFF78 16TCR2 H'FFF79 TIOR2 8 8 -- -- CCLR1 IOB2 CCLR0 IOB1 CKEG1 IOB0 CKEG0 -- TPSC2 IOA2 TPSC1 IOA1 TPSC0 IOA0 16-bit timer channel 2 16 16 H'FFF7A 16TCNT2H 16 H'FFF7B 16TCNT2L H'FFF7C GRA2H H'FFF7D GRA2L H'FFF7E GRB2H H'FFF7F GRB2L H'FFF80 8TCR0 H'FFF81 8TCR1 H'FFF82 8TCSR0 H'FFF83 8TCSR1 H'FFF84 TCORA0 H'FFF85 TCORA1 H'FFF86 TCORB0 H'FFF87 TCORB1 H'FFF88 8TCNT0 H'FFF89 8TCNT1 H'FFF8A -- H'FFF8B -- H'FFF8C TCSR* 3 H'FFF8D TCNT * 3 H'FFF8E -- H'FFF8F RSTCSR * 3 8 8 8 -- WRST -- -- -- -- -- -- -- -- -- -- -- -- -- -- 8 8 8 8 8 8 8 8 8 8 -- -- OVF -- -- WT/IT -- -- TME -- -- -- -- -- -- -- -- CKS2 -- -- CKS1 -- -- CKS0 WDT CMIEB CMIEB CMFB CMFB CMIEA CMIEA CMFA CMFA OVIE OVIE OVF OVF CCLR1 CCLR1 ADTE ICE CCLR0 CCLR0 OIS3 OIS3 CKS2 CKS2 OIS2 OIS2 CKS1 CKS1 OS1 OS1 CKS0 CKS0 OS0 OS0 8-bit timer channels 0 and 1 16 16 807 Data Address Register (Low) Name H'FFF90 8TCR2 H'FFF91 8TCR3 H'FFF92 8TCSR2 H'FFF93 8TCSR3 H'FFF94 TCORA2 H'FFF95 TCORA3 H'FFF96 TCORB2 H'FFF97 TCORB3 H'FFF98 8TCNT2 H'FFF99 8TCNT3 H'FFF9A -- H'FFF9B -- H'FFF9C DADR0 H'FFF9D DADR1 H'FFF9E DACR 8 8 8 DAOE1 DAOE0 DAE -- Bus Width Bit 7 8 8 8 8 8 8 8 8 8 8 -- -- -- -- -- -- -- -- CMIEB CMIEB CMFB CMFB Bit 6 CMIEA CMIEA CMFA CMFA Bit 5 OVIE OVIE OVF OVF Bit Names Bit 4 CCLR1 CCLR1 -- ICE Bit 3 CCLR0 CCLR0 OIS3 OIS3 Bit 2 CKS2 CKS2 OIS2 OIS2 Bit 1 CKS1 CKS1 OS1 OS1 Bit 0 CKS0 CKS0 OS0 OS0 Module Name 8-bit timer channels 2 and 3 -- -- -- -- -- -- -- -- D/A converter -- -- -- -- H'FFF9F Reserved area (access prohibited) H'FFFA0 TPMR H'FFFA1 TPCR H'FFFA2 NDERB H'FFFA3 NDERA H'FFFA4 NDRB* 4 8 8 8 8 8 -- -- -- -- G3NOV G2NOV G1NOV G0NOV TPC G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER7 NDR15 NDR15 NDER6 NDR14 NDR14 NDR6 NDR6 -- -- -- -- -- -- -- -- -- -- -- -- NDER5 NDR13 NDR13 NDR5 NDR5 -- -- -- -- -- -- -- -- -- -- -- -- NDER4 NDR12 NDR12 NDR4 NDR4 -- -- -- -- -- -- -- -- -- -- -- -- NDER3 NDR11 -- NDR3 -- -- NDR11 -- NDR3 -- -- -- -- -- -- -- -- NDER2 NDR10 -- NDR2 -- -- NDR10 -- NDR2 -- -- -- -- -- -- -- -- NDER1 NDR9 -- NDR1 -- -- NDR9 -- NDR1 -- -- -- -- -- -- -- -- NDER8 NDER0 NDR8 -- NDR0 -- -- NDR8 -- NDR0 -- -- -- -- -- -- -- -- H'FFFA5 NDRA* 4 8 NDR7 NDR7 H'FFFA6 NDRB* 4 8 -- -- H'FFFA7 NDRA* 4 8 -- -- H'FFFA8 -- H'FFFA9 -- H'FFFAA -- H'FFFAB -- H'FFFAC -- H'FFFAD -- H'FFFAE -- H'FFFAF -- -- -- -- -- -- -- -- -- 808 Data Address Register (Low) Name H'FFFB0 SMR H'FFFB1 BRR H'FFFB2 SCR H'FFFB3 TDR H'FFFB4 SSR Bus Width Bit 7 8 8 8 8 8 TDRE RDRF ORER TIE RIE TE RE C/A Bit 6 CHR Bit 5 PE Bit Names Bit 4 O/E Bit 3 STOP Bit 2 MP Bit 1 CKS1 Bit 0 CKS0 Module Name SCI channel 0 MPIE TEIE CKE1 CKE0 FER/ ERS PER TEND MPB MPBT H'FFFB5 RDR H'FFFB6 SCMR 8 8 -- -- -- -- SDIR SINV -- SMIF H'FFFB7 Reserved area (access prohibited) H'FFFB8 SMR H'FFFB9 BRR H'FFFBA SCR H'FFFBB TDR H'FFFBC SSR 8 8 8 8 8 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0 C/A CHR PE O/E STOP MP CKS1 CKS0 SCI channel 1 H'FFFBD RDR H'FFFBE SCMR 8 8 -- -- -- -- SDIR SINV -- SMIF H'FFFBF Reserved area (access prohibited) H'FFFC0 Reserved area (access prohibited) H'FFFC1 H'FFFC2 H'FFFC3 H'FFFC4 H'FFFC5 H'FFFC6 H'FFFC7 H'FFFC8 -- H'FFFC9 -- H'FFFCA -- H'FFFCB -- H'FFFCC -- H'FFFCD -- H'FFFCE -- H'FFFCF -- H'FFFD0 P1DR H'FFFD1 P2DR H'FFFD2 P3DR 8 8 8 -- -- -- -- -- -- -- -- P1 7 P2 7 P3 7 -- -- -- -- -- -- -- -- P1 6 P2 6 P3 6 -- -- -- -- -- -- -- -- P1 5 P2 5 P3 5 -- -- -- -- -- -- -- -- P1 4 P2 4 P3 4 -- -- -- -- -- -- -- -- P1 3 P2 3 P3 3 -- -- -- -- -- -- -- -- P1 2 P2 2 P3 2 -- -- -- -- -- -- -- -- P1 1 P2 1 P3 1 -- -- -- -- -- -- -- -- P1 0 P2 0 P3 0 Port 1 Port 2 Port 3 809 Data Address Register (Low) Name H'FFFD3 P4DR H'FFFD4 P5DR H'FFFD5 P6DR H'FFFD6 P7DR H'FFFD7 P8DR H'FFFD8 P9DR H'FFFD9 PADR H'FFFDA PBDR H'FFFDB -- H'FFFDC -- H'FFFDD -- H'FFFDE -- H'FFFDF -- H'FFFE0 ADDRAH H'FFFE1 ADDRAL H'FFFE2 ADDRBH H'FFFE3 ADDRBL H'FFFE4 ADDRCH H'FFFE5 ADDRCL H'FFFE6 ADDRDH H'FFFE7 ADDRDL H'FFFE8 ADCSR H'FFFE9 ADCR 8 8 8 8 8 8 8 8 8 8 Bus Width Bit 7 8 8 8 8 8 8 8 8 P4 7 -- P6 7 P7 7 -- -- PA7 PB7 -- -- -- -- -- AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGE Bit 6 P4 6 -- P6 6 P7 6 -- -- PA6 PB6 -- -- -- -- -- AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE -- Bit 5 P4 5 -- P6 5 P7 5 -- P9 5 PA5 PB5 -- -- -- -- -- AD7 -- AD7 -- AD7 -- AD7 -- ADST -- Bit Names Bit 4 P4 4 -- P6 4 P7 4 P8 4 P9 4 PA4 PB4 -- -- -- -- -- AD6 -- AD6 -- AD6 -- AD6 -- SCAN -- Bit 3 P4 3 P5 3 P6 3 P7 3 P8 3 P9 3 PA3 PB3 -- -- -- -- -- AD5 -- AD5 -- AD5 -- AD5 -- CKS -- Bit 2 P4 2 P5 2 P6 2 P7 2 P8 2 P9 2 PA2 PB2 -- -- -- -- -- AD4 -- AD4 -- AD4 -- AD4 -- CH2 -- Bit 1 P4 1 P5 1 P6 1 P7 1 P8 1 P9 1 PA1 PB1 -- -- -- -- -- AD3 -- AD3 -- AD3 -- AD3 -- CH1 -- Bit 0 P4 0 P5 0 P6 0 P7 0 P8 0 P9 0 PA0 PB0 -- -- -- -- -- AD2 -- AD2 -- AD2 -- AD2 -- CH0 -- A/D converter Module Name Port 4 Port 5 Port 6 Port 7 Port 8 Port 9 Port A Port B Notes: *1 Writing to bits 6 to 0 of FLMCR2 is prohibited. *2 Writing to bits 5 to 3 of BCR is prohibited. *3 For the procedure for writing to TCSR, TCNT, and RSTCSR, see section 11.2.4, Notes on Register Rewriting. *4 The address depends on the output trigger setting. *5 Use byte access on FLMCR1, FLMCR2, EBR1, EBR2, and RAMCR. Legend: WDT : Watchdog timer TPC : Programmable timing pattern controller SCI : Serial communication interface 810 B.3 Address List (H8/3062F-ZTAT B-Mask Version, H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version) Data Bit Names Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name Bus Width Bit 7 8 8 8 8 8 8 Address Register (Low) Name H'EE000 P1DDR H'EE001 P2DDR H'EE002 P3DDR H'EE003 P4DDR H'EE004 P5DDR H'EE005 P6DDR H'EE006 -- H'EE007 P8DDR H'EE008 P9DDR H'EE009 PADDR H'EE00A PBDDR H'EE00B -- H'EE00C -- H'EE00D -- H'EE00E -- H'EE00F -- H'EE010 -- H'EE011 MDCR H'EE012 SYSCR H'EE013 BRCR H'EE014 ISCR H'EE015 IER H'EE016 ISR H'EE017 -- H'EE018 IPRA H'EE019 IPRB H'EE01A DASTCR H'EE01B DIVCR H'EE01C MSTCRH H'EE01D MSTCRL H'EE01E ADRCR H'EE01F CSCR P1 7DDR P1 6DDR P1 5DDR P1 4DDR P1 3DDR P1 2DDR P1 1DDR P1 0DDR Port 1 P2 7DDR P2 6DDR P2 5DDR P2 4DDR P2 3DDR P2 2DDR P2 1DDR P2 0DDR Port 2 P3 7DDR P3 6DDR P3 5DDR P3 4DDR P3 3DDR P3 2DDR P3 1DDR P3 0DDR Port 3 P4 7DDR P4 6DDR P4 5DDR P4 4DDR P4 3DDR P4 2DDR P4 1DDR P4 0DDR Port 4 -- -- -- -- -- -- P5 3DDR P5 2DDR P5 1DDR P5 0DDR Port 5 P6 6DDR P6 5DDR P6 4DDR P6 3DDR P6 2DDR P6 1DDR P6 0DDR Port 6 -- -- -- -- -- -- -- -- -- -- 8 8 8 8 -- -- P8 4DDR P8 3DDR P8 2DDR P8 1DDR P8 0DDR Port 8 P9 5DDR P9 4DDR P9 3DDR P9 2DDR P9 1DDR P9 0DDR Port 9 PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Port A PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Port B -- -- -- -- -- -- -- -- -- -- -- -- -- STS2 A22E -- -- -- -- IPRA6 IPRB6 -- -- -- -- -- CS6E -- -- -- -- -- -- -- STS1 A21E -- -- -- -- -- -- -- STS0 A20E -- -- -- -- -- -- -- UE -- -- -- -- -- -- -- MDS2 NMIEG -- -- -- -- -- -- -- MDS1 SSOE -- -- -- -- -- -- -- MDS0 RAME BRLE Bus controller System control 8 8 8 8 8 8 -- SSBY A23E -- -- -- -- IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Interrupt IRQ5E IRQ5F -- IPRA5 -- -- -- -- -- -- CS5E IRQ4E IRQ4F -- IPRA4 -- -- -- -- IRQ3E IRQ3F -- IPRA3 IPRB3 -- -- -- IRQ2E IRQ2F -- IPRA2 IPRB2 -- -- -- IRQ1E IRQ1F -- IPRA1 -- -- DIV1 IRQ0E IRQ0F -- IPRA0 -- DASTE DIV0 D/A converter System control controller 8 8 8 8 8 8 8 8 IPRA7 IPRB7 -- -- PSTOP -- -- CS7E MSTPH1 MSTPH0 MSTPL0 ADRCTL Bus controller -- MSTPL4 MSTPL3 MSTPL2 -- -- CS4E -- -- -- -- -- -- 811 Data Address Register (Low) Name H'EE020 ABWCR H'EE021 ASTCR H'EE022 WCRH H'EE023 WCRL H'EE024 BCR H'EE025 -- Bus Width Bit 7 8 8 8 8 8 ABW7 AST7 W71 W31 ICIS1 -- Bit 6 ABW6 AST6 W70 W30 ICIS0 -- Bit 5 ABW5 AST5 W61 W21 --* 2 -- Bit Names Bit 4 ABW4 AST4 W60 W20 --* 2 -- Bit 3 ABW3 AST3 W51 W11 --* 2 -- Bit 2 ABW2 AST2 W50 W10 -- -- Bit 1 ABW1 AST1 W41 W01 RDEA -- Bit 0 ABW0 AST0 W40 W00 WAITE -- Module Name Bus controller H'EE026 Reserved area (access prohibited) H'EE027 H'EE028 H'EE029 H'EE02A H'EE02B H'EE02C H'EE02D H'EE02E H'EE02F H'EE030 FLMCR1* 5 8 H'EE031 FLMCR2* 5 8 H'EE032 EBR*5 8 FWE FLER EB7 SWE --* 1 EB6 ESU --* 1 EB5 PSU --* 1 EB4 EV --* 1 EB3 PV --* 1 EB2 E --* 1 EB1 P --* 1 EB0 Flash memory H'EE033 Reserved area (access prohibited) H'EE034 -- H'EE035 -- H'EE036 -- H'EE037 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- H'EE038 Reserved area (access prohibited) H'EE039 H'EE03A H'EE03B H'EE03C P2PCR H'EE03D -- H'EE03E P4PCR H'EE03F P5PCR H'EE040 -- H'EE041 -- H'EE042 -- H'EE043 -- 8 8 8 P2 7PCR P2 6PCR P2 5PCR P2 4PCR P2 3PCR P2 2PCR P2 1PCR P2 0PCR Port 2 -- -- -- -- -- -- -- -- P4 7PCR P4 6PCR P4 5PCR P4 4PCR P4 3PCR P4 2PCR P4 1PCR P4 0PCR Port 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- P5 3PCR P5 2PCR P5 1PCR P5 0PCR Port 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 812 Data Address Register (Low) Name H'EE044 -- H'EE045 -- H'EE046 -- H'EE047 -- H'EE048 -- H'EE049 -- H'EE04A -- H'EE04B -- H'EE04C -- H'EE04D -- H'EE04E -- H'EE04F -- H'EE050 -- H'EE051 -- H'EE052 -- H'EE053 -- H'EE054 -- H'EE055 -- H'EE056 -- H'EE057 -- H'EE058 -- H'EE059 -- H'EE05A -- H'EE05B -- H'EE05C -- H'EE05D -- H'EE05E -- H'EE05F -- H'EE060 -- H'EE061 -- H'EE062 -- H'EE063 -- H'EE064 -- H'EE065 -- H'EE066 -- H'EE067 -- Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Module Name 813 Data Address Register (Low) Name H'EE068 -- H'EE069 -- H'EE06A -- H'EE06B -- H'EE06C -- H'EE06D -- H'EE06E -- H'EE06F -- H'EE070 -- H'EE071 -- H'EE072 -- H'EE073 -- Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- Module Name H'EE074 Reserved area (access prohibited) H'EE075 H'EE076 H'EE077 RAMCR * 5 8 -- -- -- -- RAMS RAM2 RAM1 RAM0 Flash memory H'EE078 Reserved area (access prohibited) H'EE079 H'EE07A H'EE07B H'EE07C H'EE07D H'EE07E H'EE07F H'EE080 H'EE081 H'FFF20 H'FFF21 H'FFF22 H'FFF23 H'FFF24 H'FFF25 H'FFF26 H'FFF27 H'FFF28 H'FFF29 814 Data Address Register (Low) Name Bus Width Bit 7 Bit 6 Bit 5 Bit Names Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Module Name H'FFF2A Reserved area (access prohibited) H'FFF2B H'FFF2C H'FFF2D H'FFF2E H'FFF2F H'FFF30 H'FFF31 H'FFF32 H'FFF33 H'FFF34 H'FFF35 H'FFF36 H'FFF37 H'FFF38 H'FFF39 H'FFF3A H'FFF3B H'FFF3C H'FFF3D H'FFF3E H'FFF3F H'FFF40 -- H'FFF41 -- H'FFF42 -- H'FFF43 -- H'FFF44 -- H'FFF45 -- H'FFF46 -- H'FFF47 -- H'FFF48 -- H'FFF49 -- H'FFF4A -- H'FFF4B -- H'FFF4C -- H'FFF4D -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 815 Data Address Register (Low) Name H'FFF4E -- H'FFF4F -- H'FFF50 -- H'FFF51 -- H'FFF52 -- H'FFF53 -- H'FFF54 -- H'FFF55 -- H'FFF56 -- H'FFF57 -- H'FFF58 -- H'FFF59 -- H'FFF5A -- H'FFF5B -- H'FFF5C -- H'FFF5D -- H'FFF5E -- H'FFF5F -- H'FFF60 TSTR H'FFF61 TSNC H'FFF62 TMDR H'FFF63 TOLR H'FFF64 TISRA H'FFF65 TISRB H'FFF66 TISRC H'FFF67 H'FFF68 16TCR0 H'FFF69 TIOR0 8 8 -- -- CCLR1 IOB2 CCLR0 IOB1 8 8 8 8 8 8 8 Bus Width Bit 7 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Bit 6 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- MDF -- IMIEA2 IMIEB2 OVIE2 Bit 5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- FDIR TOB2 IMIEA1 IMIEB1 OVIE1 Bit Names Bit 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TOA2 IMIEA0 IMIEB0 OVIE0 Bit 3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- TOB1 -- -- -- Bit 2 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR2 SYNC2 PWM2 TOA1 IMFA2 IMFB2 OVF2 Bit 1 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR1 SYNC1 PWM1 TOB0 IMFA1 IMFB1 OVF1 Bit 0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- STR0 SYNC0 PWM0 TOA0 IMFA0 IMFB0 OVF0 16-bit timer (all channels) Module Name CKEG1 IOB0 CKEG0 -- TPSC2 IOA2 TPSC1 IOA1 TPSC0 IOA0 16-bit timer channel 0 H'FFF6A 16TCNT0H 16 H'FFF6B 16TCNT0L H'FFF6C GRA0H H'FFF6D GRA0L H'FFF6E GRB0H H'FFF6F GRB0L 16 16 816 Data Address Register (Low) Name H'FFF70 16TCR1 H'FFF71 TIOR1 Bus Width Bit 7 8 8 -- -- Bit 6 CCLR1 IOB2 Bit 5 CCLR0 IOB1 Bit Names Bit 4 CKEG1 IOB0 Bit 3 CKEG0 -- Bit 2 TPSC2 IOA2 Bit 1 TPSC1 IOA1 Bit 0 TPSC0 IOA0 Module Name 16-bit timer channel 1 H'FFF72 16TCNT1H 16 H'FFF73 16TCNT1L H'FFF74 GRA1H H'FFF75 GRA1L H'FFF76 GRB1H H'FFF77 GRB1L H'FFF78 16TCR2 H'FFF79 TIOR2 8 8 -- -- CCLR1 IOB2 CCLR0 IOB1 CKEG1 IOB0 CKEG0 -- TPSC2 IOA2 TPSC1 IOA1 TPSC0 IOA0 16-bit timer channel 2 16 16 H'FFF7A 16TCNT2H 16 H'FFF7B 16TCNT2L H'FFF7C GRA2H H'FFF7D GRA2L H'FFF7E GRB2H H'FFF7F GRB2L H'FFF80 8TCR0 H'FFF81 8TCR1 H'FFF82 8TCSR0 H'FFF83 8TCSR1 H'FFF84 TCORA0 H'FFF85 TCORA1 H'FFF86 TCORB0 H'FFF87 TCORB1 H'FFF88 8TCNT0 H'FFF89 8TCNT1 H'FFF8A -- H'FFF8B -- H'FFF8C TCSR* 3 H'FFF8D TCNT * 3 H'FFF8E -- H'FFF8F RSTCSR * 3 8 8 8 -- WRST -- -- -- -- -- -- -- -- -- -- -- -- -- -- 8 8 8 8 8 8 8 8 8 8 -- -- OVF -- -- WT/IT -- -- TME -- -- -- -- -- -- -- -- CKS2 -- -- CKS1 -- -- CKS0 WDT CMIEB CMIEB CMFB CMFB CMIEA CMIEA CMFA CMFA OVIE OVIE OVF OVF CCLR1 CCLR1 ADTE ICE CCLR0 CCLR0 OIS3 OIS3 CKS2 CKS2 OIS2 OIS2 CKS1 CKS1 OS1 OS1 CKS0 CKS0 OS0 OS0 8-bit timer channels 0 and 1 16 16 817 Data Address Register (Low) Name H'FFF90 8TCR2 H'FFF91 8TCR3 H'FFF92 8TCSR2 H'FFF93 8TCSR3 H'FFF94 TCORA2 H'FFF95 TCORA3 H'FFF96 TCORB2 H'FFF97 TCORB3 H'FFF98 8TCNT2 H'FFF99 8TCNT3 H'FFF9A -- H'FFF9B -- H'FFF9C DADR0 H'FFF9D DADR1 H'FFF9E DACR 8 8 8 DAOE1 DAOE0 DAE -- Bus Width Bit 7 8 8 8 8 8 8 8 8 8 8 -- -- -- -- -- -- -- -- CMIEB CMIEB CMFB CMFB Bit 6 CMIEA CMIEA CMFA CMFA Bit 5 OVIE OVIE OVF OVF Bit Names Bit 4 CCLR1 CCLR1 -- ICE Bit 3 CCLR0 CCLR0 OIS3 OIS3 Bit 2 CKS2 CKS2 OIS2 OIS2 Bit 1 CKS1 CKS1 OS1 OS1 Bit 0 CKS0 CKS0 OS0 OS0 Module Name 8-bit timer channels 2 and 3 -- -- -- -- -- -- -- -- D/A converter -- -- -- -- H'FFF9F Reserved area (access prohibited) H'FFFA0 TPMR H'FFFA1 TPCR H'FFFA2 NDERB H'FFFA3 NDERA H'FFFA4 NDRB* 4 8 8 8 8 8 -- -- -- -- G3NOV G2NOV G1NOV G0NOV TPC G3CMS1 G3CMS0 G2CMS1 G2CMS0 G1CMS1 G1CMS0 G0CMS1 G0CMS0 NDER15 NDER14 NDER13 NDER12 NDER11 NDER10 NDER9 NDER7 NDR15 NDR15 NDER6 NDR14 NDR14 NDR6 NDR6 -- -- -- -- -- -- -- -- -- -- -- -- NDER5 NDR13 NDR13 NDR5 NDR5 -- -- -- -- -- -- -- -- -- -- -- -- NDER4 NDR12 NDR12 NDR4 NDR4 -- -- -- -- -- -- -- -- -- -- -- -- NDER3 NDR11 -- NDR3 -- -- NDR11 -- NDR3 -- -- -- -- -- -- -- -- NDER2 NDR10 -- NDR2 -- -- NDR10 -- NDR2 -- -- -- -- -- -- -- -- NDER1 NDR9 -- NDR1 -- -- NDR9 -- NDR1 -- -- -- -- -- -- -- -- NDER8 NDER0 NDR8 -- NDR0 -- -- NDR8 -- NDR0 -- -- -- -- -- -- -- -- H'FFFA5 NDRA* 4 8 NDR7 NDR7 H'FFFA6 NDRB* 4 8 -- -- H'FFFA7 NDRA* 4 8 -- -- H'FFFA8 -- H'FFFA9 -- H'FFFAA -- H'FFFAB -- H'FFFAC -- H'FFFAD -- H'FFFAE -- H'FFFAF -- -- -- -- -- -- -- -- -- 818 Data Address Register (Low) Name H'FFFB0 SMR H'FFFB1 BRR H'FFFB2 SCR H'FFFB3 TDR H'FFFB4 SSR Bus Width Bit 7 8 8 8 8 8 TDRE RDRF ORER TIE RIE TE RE C/A Bit 6 CHR Bit 5 PE Bit Names Bit 4 O/E Bit 3 STOP Bit 2 MP Bit 1 CKS1 Bit 0 CKS0 Module Name SCI channel 0 MPIE TEIE CKE1 CKE0 FER/ ERS PER TEND MPB MPBT H'FFFB5 RDR H'FFFB6 SCMR 8 8 -- -- -- -- SDIR SINV -- SMIF H'FFFB7 Reserved area (access prohibited) H'FFFB8 SMR H'FFFB9 BRR H'FFFBA SCR H'FFFBB TDR H'FFFBC SSR 8 8 8 8 8 TDRE RDRF ORER FER/ ERS PER TEND MPB MPBT TIE RIE TE RE MPIE TEIE CKE1 CKE0 C/A CHR PE O/E STOP MP CKS1 CKS0 SCI channel 1 H'FFFBD RDR H'FFFBE SCMR 8 8 -- -- -- -- SDIR SINV -- SMIF H'FFFBF Reserved area (access prohibited) H'FFFC0 Reserved area (access prohibited) H'FFFC1 H'FFFC2 H'FFFC3 H'FFFC4 H'FFFC5 H'FFFC6 H'FFFC7 H'FFFC8 -- H'FFFC9 -- H'FFFCA -- H'FFFCB -- H'FFFCC -- H'FFFCD -- H'FFFCE -- H'FFFCF -- H'FFFD0 P1DR H'FFFD1 P2DR H'FFFD2 P3DR 8 8 8 -- -- -- -- -- -- -- -- P1 7 P2 7 P3 7 -- -- -- -- -- -- -- -- P1 6 P2 6 P3 6 -- -- -- -- -- -- -- -- P1 5 P2 5 P3 5 -- -- -- -- -- -- -- -- P1 4 P2 4 P3 4 -- -- -- -- -- -- -- -- P1 3 P2 3 P3 3 -- -- -- -- -- -- -- -- P1 2 P2 2 P3 2 -- -- -- -- -- -- -- -- P1 1 P2 1 P3 1 -- -- -- -- -- -- -- -- P1 0 P2 0 P3 0 Port 1 Port 2 Port 3 819 Data Address Register (Low) Name H'FFFD3 P4DR H'FFFD4 P5DR H'FFFD5 P6DR H'FFFD6 P7DR H'FFFD7 P8DR H'FFFD8 P9DR H'FFFD9 PADR H'FFFDA PBDR H'FFFDB -- H'FFFDC -- H'FFFDD -- H'FFFDE -- H'FFFDF -- H'FFFE0 ADDRAH H'FFFE1 ADDRAL H'FFFE2 ADDRBH H'FFFE3 ADDRBL H'FFFE4 ADDRCH H'FFFE5 ADDRCL H'FFFE6 ADDRDH H'FFFE7 ADDRDL H'FFFE8 ADCSR H'FFFE9 ADCR 8 8 8 8 8 8 8 8 8 8 Bus Width Bit 7 8 8 8 8 8 8 8 8 P4 7 -- P6 7 P7 7 -- -- PA7 PB7 -- -- -- -- -- AD9 AD1 AD9 AD1 AD9 AD1 AD9 AD1 ADF TRGE Bit 6 P4 6 -- P6 6 P7 6 -- -- PA6 PB6 -- -- -- -- -- AD8 AD0 AD8 AD0 AD8 AD0 AD8 AD0 ADIE -- Bit 5 P4 5 -- P6 5 P7 5 -- P9 5 PA5 PB5 -- -- -- -- -- AD7 -- AD7 -- AD7 -- AD7 -- ADST -- Bit Names Bit 4 P4 4 -- P6 4 P7 4 P8 4 P9 4 PA4 PB4 -- -- -- -- -- AD6 -- AD6 -- AD6 -- AD6 -- SCAN -- Bit 3 P4 3 P5 3 P6 3 P7 3 P8 3 P9 3 PA3 PB3 -- -- -- -- -- AD5 -- AD5 -- AD5 -- AD5 -- CKS -- Bit 2 P4 2 P5 2 P6 2 P7 2 P8 2 P9 2 PA2 PB2 -- -- -- -- -- AD4 -- AD4 -- AD4 -- AD4 -- CH2 -- Bit 1 P4 1 P5 1 P6 1 P7 1 P8 1 P9 1 PA1 PB1 -- -- -- -- -- AD3 -- AD3 -- AD3 -- AD3 -- CH1 -- Bit 0 P4 0 P5 0 P6 0 P7 0 P8 0 P9 0 PA0 PB0 -- -- -- -- -- AD2 -- AD2 -- AD2 -- AD2 -- CH0 -- A/D converter Module Name Port 4 Port 5 Port 6 Port 7 Port 8 Port 9 Port A Port B Notes: *1 Writing to bits 6 to 0 of FLMCR2 is prohibited. *2 Writing to bits 5 to 3 of BCR is prohibited. *3 For the procedure for writing to TCSR, TCNT, and RSTCSR, see section 11.2.4, Notes on Register Rewriting. *4 The address depends on the output trigger setting. *5 Use byte access on FLMCR1, FLMCR2, EBR, and RAMCR. Legend: WDT : Watchdog timer TPC : Programmable timing pattern controller SCI : Serial communication interface 820 B.4 Functions Register abbreviation Register name TIER--Timer Interrupt Enable Register H' 90 Address to which register is mapped Name of on-chip supporting module FRT Bit numbers Bit 7 ICIAE Initial value 6 ICIBE 0 R/W 5 ICICE 0 R/W 4 3 2 1 OVIE 1 R/W 0 Names of the bits. Dashes (--) indicate reserved bits. Initial bit values R/W: OCIDE OCIAE OCIBE 0 R/W 0 R/W 1 R/W 0 R/W 1 Possible types of access R W Read only Write only Timer overflow interrupt enable 0 1 Interrupt requested by OVF flag is disabled Interrupt requested by OVF flag is enabled R/W Read and write Output compare interrupt B enable 0 1 Interrupt requested by OCFB flag is disabled Interrupt requested by OCFB flag is enabled Full name of bit Output compare interrupt A enable 0 1 Interrupt requested by OCFA flag is disabled Interrupt requested by OCFA flag is enabled Descriptions of bit settings Input capture interrupt D enable 0 1 Interrupt requested by ICFD flag is disabled Interrupt requested by ICFD flag is enabled 821 P1DDR--Port 1 Data Direction Register 7 6 5 4 H'EE000 3 2 1 Port 1 0 Bit P17DDR P16DDR P15DDR P14DDR P13DDR P12DDR P11DDR P10DDR Initial value Read/Write Initial value Read/Write 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W Modes 1 to 4 Modes 5 to 7 Port 1 input/output select 0 1 Generic input Generic output P2DDR--Port 2 Data Direction Register H'EE001 Port 2 Bit 7 6 5 4 3 2 1 0 P27DDR P26DDR P25DDR P24DDR P23DDR P22DDR P21DDR P20DDR Initial value Read/Write Initial value Read/Write 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W 1 0 W Modes 1 to 4 Modes 5 to 7 Port 2 input/output select 0 1 Generic input Generic output 822 P3DDR--Port 3 Data Direction Register 7 6 5 4 3 H'EE002 2 1 Port 3 0 Bit P37DDR P36DDR P35DDR P34DDR P33DDR P32DDR P31DDR P30DDR Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 3 input/output select 0 1 Generic input Generic output P4DDR--Port 4 Data Direction Register 7 6 5 4 3 H'EE003 2 1 Port 4 0 Bit P47DDR P46DDR P45DDR P44DDR P43DDR P42DDR P41DDR P40DDR Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 4 input/output select 0 1 Generic input Generic output 823 P5DDR--Port 5 Data Direction Register 7 6 5 4 3 H'EE004 2 1 Port 5 0 Bit P53DDR P52DDR P51DDR P50DDR Initial value Read/Write Initial value Read/Write 1 1 1 1 1 1 1 1 1 0 W 1 0 W 1 0 W 1 0 W Modes 1 to 4 Modes 5 to 7 Port 5 input/output select 0 1 Generic input pin Generic output pin P6DDR--Port 6 Data Direction Register 7 6 5 4 3 H'EE005 2 1 Port 6 0 Bit P66DDR P65DDR P64DDR P63DDR P62DDR P61DDR P60DDR Initial value Read/Write 1 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port 6 input/output select 0 1 Generic input Generic output 824 P8DDR--Port 8 Data Direction Register 7 6 5 4 H'EE007 3 2 1 Port 8 0 Bit P84DDR P83DDR P82DDR P81DDR P80DDR Initial value Read/Write Initial value Read/Write 1 1 1 1 1 1 1 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Modes 1 to 4 Modes 5 to 7 Port 8 input/output select 0 1 Generic input Generic output 825 P9DDR--Port 9 Data Direction Register 7 6 5 4 3 H'EE008 2 1 Port 9 0 Bit P95DDR P94DDR P93DDR P92DDR P91DDR P90DDR Initial value Read/Write 1 1 0 W 0 W 0 W 0 W 0 W 0 W Port 9 input/output select 0 1 Generic input Generic output PADDR--Port A Data Direction Register 7 6 5 4 3 H'EE009 2 1 Port A 0 Bit PA7DDR PA6DDR PA5DDR PA4DDR PA3DDR PA2DDR PA1DDR PA0DDR Initial value Read/Write Initial value Read/Write 1 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Modes 3, 4 Modes 1, 2, 5, 6, 7 Port A input/output select 0 1 Generic input Generic output PBDDR--Port B Data Direction Register 7 6 5 4 3 H'EE00A 2 1 Port B 0 Bit PB7DDR PB6DDR PB5DDR PB4DDR PB3DDR PB2DDR PB1DDR PB0DDR Initial value Read/Write 0 W 0 W 0 W 0 W 0 W 0 W 0 W 0 W Port B input/output select 0 1 Generic input Generic output 826 MDCR--Mode Control Register H'EE011 System control Bit 7 6 5 4 3 2 MDS2 1 MDS1 * * R 0 MDS0 * R Initial value Read/Write 1 1 0 0 0 R Mode select 2 to 0 Bit 2 MD2 Bit 1 MD1 0 0 1 Bit 0 MD0 0 1 0 1 0 1 1 0 1 0 1 Note: * Determined by the state of the mode pins (MD2 to MD0). Mode 1 Mode 2 Mode 3 Mode 4 Mode 5 Mode 6 Mode 7 Operating Mode 827 SYSCR--System Control Register H'EE012 System control Bit 7 SSBY 6 STS2 0 R/W 5 STS1 0 R/W 4 STS0 0 R/W 3 UE 1 R/W 2 NMIEG 0 R/W 1 SSOE 0 R/W 0 RAME 1 R/W Initial value Read/Write 0 R/W RAM enable 0 1 On-chip RAM is disabled On-chip RAM is enabled Software standby output port enable In software standby mode, all address bus and bus control signals are highimpedance In software standby mode, address bus retains output state and bus control signals are fixed high 0 1 NMI edge select 0 1 User bit enable 0 1 Standby timer select 2 to 0 Bit 6 STS2 0 1 0 1 1 Bit 5 STS1 0 Bit 4 STS0 0 1 0 1 0 1 0 1 Standby Timer Waiting Time = 8,192 states Waiting Time = 16,384 states Waiting Time = 32,768 states Waiting Time = 65,536 states Waiting Time = 131,072 states Waiting Time = 26,2144 states Waiting Time = 1,024 states Illegal setting CCR bit 6 (UI) is used as an interrupt mask bit CCR bit 6 (UI) is used as a user bit An interrupt is requested at the falling edge of NMI An interrupt is requested at the rising edge of NMI Software standby SLEEP instruction causes transition to sleep mode 0 SLEEP instruction causes transition to software standby mode 1 828 BRCR--Bus Release Control Register H'EE013 Bus controller Bit 7 A23E 6 A22E 1 1 R/W 1 R/W 5 A21E 1 1 R/W 1 R/W 4 A20E 1 0 1 R/W 3 2 1 0 BRLE Modes 1, 2, 6, 7 Modes 3, 4 Mode 5 Initial value Read/Write Initial value Read/Write Initial value Read/Write 1 1 R/W 1 R/W 1 1 1 1 1 1 1 1 1 0 R/W 0 R/W 0 R/W Address 23 to 20 enable 0 1 Address output Other input/output Bus release enable 0 The bus cannot be released to an external device The bus can be released to an external device 1 ISCR--IRQ Sense Control Register 7 6 5 4 3 H'EE014 2 1 Interrupt Controller 0 Bit IRQ5SC IRQ4SC IRQ3SC IRQ2SC IRQ1SC IRQ0SC Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W IRQ5 to IRQ0 sense control 0 1 Interrupts are requested when IRQ5 to IRQ0 are low Interrupts are requested by falling-edge input at IRQ5 to IRQ0 829 IER--IRQ Enable Register H'EE015 Interrupt Controller Bit 7 6 5 IRQ5E 4 IRQ4E 0 R/W 3 IRQ3E 0 R/W 2 IRQ2E 0 R/W 1 IRQ1E 0 R/W 0 IRQ0E 0 R/W Initial value Read/Write 0 R/W 0 R/W 0 R/W IRQ5 to IRQ0 enable 0 1 IRQ5 to IRQ0 interrupts are disabled IRQ5 to IRQ0 interrupts are enabled ISR--IRQ Status Register H'EE016 Interrupt Controller Bit 7 6 5 IRQ5F 4 IRQ4F 0 R/(W)* 3 IRQ3F 0 R/(W)* 2 IRQ2F 0 R/(W)* 1 IRQ1F 0 R/(W)* 0 IRQ0F 0 R/(W)* Initial value Read/Write 0 0 0 R/(W)* IRQ5 to IRQ0 flags Bits 5 to 0 IRQ5F to IRQ0F Setting and Clearing Conditions [Clearing conditions] * Read IRQnF when IRQnF = 1, then write 0 in IRQnF. 0 * IRQnSC = 0, IRQn input is high, and interrupt exception handling is being carried out. * IRQnSC = 1 and IRQn interrupt exception handling is being carried out. [Setting conditions] 1 * IRQnSC = 0 and IRQn input is low. * IRQnSC = 1 and IRQn input changes from high to low. (n = 5 to 0) 830 IPRA--Interrupt Priority Register A 7 IPRA7 Initial value Read/Write 0 R/W 6 IPRA6 0 R/W 5 IPRA5 0 R/W 4 IPRA4 0 R/W H'EE018 3 IPRA3 0 R/W 2 IPRA2 0 R/W 1 IPRA1 0 R/W Interrupt Controller 0 IPRA0 0 R/W Bit Priority level A7 to A0 0 1 Priority level 0 (low priority) Priority level 1 (high priority) * Interrupt sources controlled by each bit Bit IPRA Bit 7 IPRA7 IRQ0 Interrupt source Bit 6 IPRA6 IRQ1 Bit 5 IPRA5 IRQ2, IRQ3 Bit 4 IPRA4 IRQ4, IRQ5 Bit 3 IPRA3 WDT, A/D converter Bit 2 IPRA2 16-bit timer Bit 1 IPRA1 16-bit timer Bit 0 IPRA0 16-bit timer channel 0 channel 1 channel 2 IPRB--Interrupt Priority Register B 7 IPRB7 Initial value Read/Write 0 R/W 6 IPRB6 0 R/W 0 R/W 0 R/W 5 4 3 IPRB3 0 R/W H'EE019 2 IPRB2 0 R/W 0 R/W 1 Interrupt Controller 0 Bit 0 R/W Priority level B7, B6, B3, and B2 0 1 Priority level 0 (low priority) Priority level 1 (high priority) * Interrupt sources controlled by each bit Bit IPRB Bit 7 IPRB7 Bit 6 IPRB6 Bit 5 Bit 4 Bit 3 IPRB3 SCI Bit 2 IPRB2 SCI Bit 1 Bit 0 8-bit timer 8-bit timer Interrupt channels channels source 0 and 1 2 and 3 channel 0 channel 1 831 DASTCR--D/A Standby Control Register H'EE01A D/A Bit 7 6 5 4 3 2 1 0 DASTE Initial value Read/Write 1 1 1 1 1 1 1 0 R/W D/A standby enable 0 1 D/A output is disabled in software standby mode D/A output is enabled in software standby mode (Initial value) 832 DIVCR--Division Control Register H'EE01B System control Bit 7 6 5 4 3 2 1 DIV1 0 DIV0 0 R/W Initial value Read/Write 1 1 1 1 1 1 0 R/W Division ratio bits 1 and 0 Bit 1 DIV1 0 Bit 0 DIV0 0 1 1 0 1 1/1 1/2 1/4 1/8 (Initial value) Frequency Division Ratio 833 MSTCRH--Module Standby Control Register H H'EE01C System control Bit 7 PSTOP 6 5 4 3 2 1 0 MSTPH1 MSTPH0 1 1 1 1 0 R/W 0 R/W 0 R/W Initial value Read/Write 0 R/W Module standby H1 to H0 Selection bits for placing modules in standby state. Reserved bits clock stop Enables or disables o clock output. MSTCRL--Module Standby Control Register L H'EE01D System control Bit 7 6 5 4 3 2 1 0 MSTPL0 MSTPL4 MSTPL3 MSTPL2 Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Module standby L4 to L2, L0 Selection bits for placing modules in standby state. Reserved bits 834 ADRCR--Address Control Register H'EE01E Bus controller Bit 7 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- Reserved bits 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 ADRCTL 1 R/W Address control Initial value Read/Write 1 -- Selects address update mode 1 or address update mode 2. ADRCTL 0 1 Description Address update mode 2 is selected Address update mode 1 is selected (Initial value) Note: H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register not provided This register provided 835 CSCR--Chip Select Control Register H'EE01F Bus controller Bit 7 CS7E 6 CS6E 0 R/W 5 CS5E 0 R/W 4 CS4E 0 R/W 3 2 1 0 Initial value Read/Write 0 R/W 1 1 1 1 Chip select 7 to 4 enable Bit n CSnE 0 1 (n = 7 to 4) Output of chip select signal CSn is disabled (Initial value) Output of chip select signal CSn is enabled Description 836 ABWCR--Bus Width Control Register H'EE020 Bus controller Bit 7 ABW7 6 ABW6 1 0 R/W 5 ABW5 1 0 R/W 4 ABW4 1 0 R/W 3 ABW3 1 0 R/W 2 ABW2 1 0 R/W 1 ABW1 1 0 R/W 0 ABW0 1 0 R/W Modes 1, 3, 5, 6, and 7 Modes 2 and 4 Initial value Initial value Read/Write 1 0 R/W Area 7 to 0 bus width control Bits 7 to 0 ABW7 to ABW0 0 1 Areas 7 to 0 are 16-bit access areas Areas 7 to 0 are 8-bit access areas Bus Width of Access Area ASTCR--Access State Control Register H'EE021 Bus controller Bit 7 AST7 6 AST6 1 R/W 5 AST5 1 R/W 4 AST4 1 R/W 3 AST3 1 R/W 2 AST2 1 R/W 1 AST1 1 R/W 0 AST0 1 R/W Initial value Read/Write 1 R/W Area 7 to 0 access state control Bits 7 to 0 AST7 to AST0 0 1 Areas 7 to 0 are two-state access areas Areas 7 to 0 are three-state access areas Number of States in Access Area 837 WCRH--Wait Control Register H 7 W71 Initial value Read/Write 1 R/W 6 W70 1 R/W 5 W61 1 R/W 4 W60 1 R/W 3 W51 1 R/W 2 W50 1 R/W H'EE022 1 W41 1 R/W 0 W40 1 R/W Bus controller Bit Area 4 wait control 1 and 0 0 No program wait is inserted 0 1 1 program wait state is inserted 1 0 1 2 program wait states are inserted 3 program wait states are inserted Area 5 wait control 1 and 0 0 No program wait is inserted 0 1 1 program wait state is inserted 1 0 1 2 program wait states are inserted 3 program wait states are inserted Area 6 wait control 1 and 0 0 No program wait is inserted 0 1 1 program wait state is inserted 1 0 1 2 program wait states are inserted 3 program wait states are inserted Area 7 wait control 1 and 0 0 No program wait is inserted 0 1 1 program wait state is inserted 1 0 1 2 program wait states are inserted 3 program wait states are inserted 838 WCRL--Wait Control Register L H'EE023 Bus controller Bit 7 W31 6 W30 1 R/W 5 W21 1 R/W 4 W20 1 R/W 3 W11 1 R/W 2 W10 1 R/W 1 W01 1 R/W 0 W00 1 R/W Initial value Read/Write 1 R/W Area 0 wait control 1 and 0 0 0 1 0 1 1 No program wait is inserted 1 program wait state is inserted 2 program wait states are inserted 3 program wait states are inserted Area 1 wait control 1 and 0 0 0 1 0 1 1 No program wait is inserted 1 program wait state is inserted 2 program wait states are inserted 3 program wait states are inserted Area 2 wait control 1 and 0 0 0 1 0 1 1 No program wait is inserted 1 program wait state is inserted 2 program wait states are inserted 3 program wait states are inserted Area 3 wait control 1 and 0 0 0 1 0 1 1 No program wait is inserted 1 program wait state is inserted 2 program wait states are inserted 3 program wait states are inserted 839 BCR--Bus Control Register H'EE024 Bus controller Bit 7 ICIS1 6 ICIS0 1 R/W 5 -- 0* -- 4 -- 0* -- 3 -- 0* -- 2 -- 1 -- 1 RDEA 1 R/W 0 WAITE 0 R/W Initial value Read/Write 1 R/W Wait pin enable 0 1 WAIT pin wait input is disabled WAIT pin wait input is enabled Area division unit select 0 Area divisions are as follows: Area 0: 2 MB Area 1: 2 MB Area 2: 8 MB Area 3: 2 MB 1 Area 4: 1.93 MB Area 5: 4 kB Area 6: 23.75 kB Area 7: 22 B Areas 0 to 7 are the same size (2 MB) Idle cycle insertion 0 0 1 No idle cycle is inserted in case of consecutive external read and write cycles Idle cycle is inserted in case of consecutive external read and write cycles Idle cycle insertion 1 0 1 No idle cycle is inserted in case of consecutive external read cycles for different areas Idle cycle is inserted in case of consecutive external read cycles for different areas Note: * These bits can be read and written, but must not be set to 1. Normal operation cannot be guaranteed if 1 is written in these bits. 840 FLMCR (FLMCR1)--Flash Memory Control Register Bit 7 FWE Modes 1 to 4, and 6 Modes 5 and 7 Initial value Read/Write Initial value Read/Write 0 R 1/0 R 6 SWE 0 R 0 R/W 5 ESU 0 R 0 R/W 4 PSU 0 R 0 R/W 3 EV 0 R 0 R/W H'EE030 2 PV 0 R 0 R/W 1 E 0 R 0 R/W 0 P 0 R 0 R/W Flash Memory Program mode 0 1 Program mode cleared (Initial value) Transition to program mode [Setting condition] When FWE = 1, SWE = 1, and PSU = 1 Erase mode 0 1 Erase mode cleared (Initial value) Transition to erase mode [Setting condition] When FWE = 1, SWE = 1, and ESU = 1 Program-verify mode 0 1 Program-verify mode cleared (Initial value) Transition to program-verify mode [Setting condition] When FWE = 1 and SWE = 1 Erase-verify mode 0 1 Erase-verify mode cleared (Initial value) Transition to erase-verify mode [Setting condition] When FWE = 1 and SWE = 1 Program setup 0 1 Program setup cleared (Initial value) Program setup [Setting condition] When FWE = 1 and SWE = 1 Erase setup 0 1 Erase setup cleared (Initial value) Erase setup [Setting condition] When FWE = 1 and SWE = 1 Software write enable bit 0 1 Write/erase disabled (Initial value) Write/erase enabled [Setting condition] When FWE = 1 Flash write enable bit 0 1 When a low level is input to the FWE pin (hardware protection state)* When a high level is input to the FWE pin Note: * Fix the FWE pin low in mode 6. H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register provided (FLMCR1) This register not provided This register provided 841 FLMCR (FLMCR2)--Flash Memory Control Register 2 H'EE031 Flash Memory Bit 7 FLER 6 -- 0 -- 5 -- 0 -- 4 -- 0 -- 3 -- 0 -- 2 -- 0 -- 1 -- 0 -- 0 -- 0 -- Initial value Read/Write 0 R Reserved bits Flash memory error H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register not provided This register provided This register not provided Note: Writes to FLMCR2 are prohibited. 842 EBR (EBR1)--Erase Block Register H'EE032 Flash Memory Bit 7 EB7 6 EB6 0 R 0 R/W 5 EB5 0 R 0 R/W 4 EB4 0 R 0 R/W 3 EB3 0 R 0 R/W 2 EB2 0 R 0 R/W 1 EB1 0 R 0 R/W 0 EB0 0 R 0 R/W Modes 1 to 4, and 6 Modes 5 and 7 Initial value Read/Write Initial value Read/Write 0 R 0 R Block 7 to 0 0 1 Block EB7 to EB0 is not selected (Initial value) Block EB7 to EB0 is selected Note: When not erasing, clear EBR to H'00. Writes are invalid. A value of 1 cannot be set in this register in mode 6. H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register provided (EBR1) This register not provided This register provided 843 EBR (EBR2)--Erase Block Register 2 H'EE033 Flash Memory Bit 7 -- 6 -- 0 R 0 R/W 5 -- 0 R 0 R/W 4 -- 0 R 0 R/W 3 EB11 0 R 0 R/W 2 EB10 0 R 0 R/W 1 EB9 0 R 0 R/W 0 EB8 0 R 0 R/W Modes 1 to 4, and 6 Modes 5 and 7 Initial value Read/Write Initial value Read/Write 0 R 0 R/W Block 11 to 8 0 1 Block EB11 to EB8 is not selected (Initial value) Block EB11 to EB8 is selected Note: When not erasing, clear EBR to H'00. A value of 1 cannot be set in this register in mode 6. H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register provided This register not provided This register not provided 844 P4PCR--Port 4 Input Pull-Up Control Register H'EE03E Port 4 Bit 7 6 5 4 3 2 1 0 P47PCR P46PCR P45PCR P44PCR P43PCR P42PCR P41PCR P40PCR Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Port 4 input pull-up control 7 to 0 0 1 Input pull-up transistor is off Input pull-up transistor is on Note: Valid when the corresponding P4DDR bit is cleared to 0 (designating generic input). P5PCR--Port 5 Input Pull-Up Control Register 7 6 5 4 3 H'EE03F 2 1 Port 5 0 Bit P53PCR P52PCR P51PCR P50PCR Initial value Read/Write 1 1 1 1 0 R/W 0 R/W 0 R/W 0 R/W Port 5 input pull-up control 3 to 0 0 1 Input pull-up transistor is off Input pull-up transistor is on Note: Valid when the corresponding P5DDR bit is cleared to 0 (designating generic input). 845 RAMCR--RAM Control Register H'EE077 Flash Memory Bit 7 -- 6 -- 1 -- 1 -- 5 -- 1 -- 1 -- 4 -- 1 -- 1 -- 3 RAMS 0 R 0 R/W* 2 RAM2 0 R 0 R/W* 1 RAM1 0 R 0 R/W* 0 -- 1 -- 1 -- Modes 1 to 4 Modes 5 to 7 Initial value R/W Initial value R/W 1 -- 1 -- Reserved bits RAM select, RAM2, RAM1 Bit 3 Bit 2 Bit 1 RAM Area H'FFF000 to H'FFF3FF H'000000 to H'0003FF H'000400 to H'0007FF H'000800 to H'000BFF H'000C00 to H'000FFF RAM Emulation Status No emulation Mapping RAM RAMS RAM2 RAM1 0 1 0/1 0 0/1 0 1 1 0 1 Note: * In mode 6 (single-chip normal mode), flash memory emulation by RAM is not supported; these bits can be modified, but must not be set to 1. H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register provided (bit specification below) This register not provided This register provided 846 RAMCR (H8/3064F-ZTAT)--RAM Control Register H'EE077 Flash Memory Bit 7 -- 6 -- 1 -- 1 -- 5 -- 1 -- 1 -- 4 -- 1 -- 1 -- 3 RAMS 0 R 0 R/W 2 RAM2 0 R 0 R/W 1 RAM1 0 R 0 R/W 0 RAM0 0 R 0 R/W Modes 1 to 4 Modes 5 to 7 Initial value R/W Initial value R/W 1 -- 1 -- Reserved bits 847 FLMSR-Flash Memory Status Register H'EE07D Flash Memory Bit 7 FLER 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 -- 1 -- 1 -- 1 -- 0 -- 1 -- Initial value R/W 0 R Reserved bits Flash memory error Bit 7 FLER 0 Flash memory program/erase protection (error protection*1) is disabled (Initial value) [Clearing condition] WDT reset, reset via the RES pin, or hardware standby mode An error has occurred during flash memory programming/erasing, and error protection*1 is enabled [Setting conditions] * When flash memory is read*2 during programming/erasing (including a vector read or instruction fetch, but excluding reads in a RAM area overlapping flash memory space) * Immediately after the start of exception handling during programming/erasing (but excluding reset, illegal instruction, trap instruction, and division-by-zero exception handling)*3 * When a SLEEP instruction (including software standby) is executed during programming/erasing * When the bus is released during programming/erasing Description 1 Notes: *1 See 18.7.3, Error Protection, for details. *2 The read value in this case is undefined. *3 Before the exception handling stack or vector read is performed. H8/3062F-ZTAT H8/3062F-ZTAT R-mask version H8/3062F-ZTAT B-mask version H8/3064F-ZTAT B-mask version H8/3062 mask ROM version H8/3061 mask ROM version H8/3060 mask ROM version H8/3064 mask ROM B-mask version H8/3062 mask ROM B-mask version H8/3061 mask ROM B-mask version H8/3060 mask ROM B-mask version This register not provided (FLER bit in FLMCR2) This register not provided This register provided 848 TSTR--Timer Start Register H'FFF60 16-bit timer (all channels) Bit 7 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 STR2 0 R/W 1 STR1 0 R/W 0 STR0 0 R/W Initial value Read/Write 1 -- Reserved bits Counter start 0 0 1 Counter start 1 0 1 Counter start 2 0 1 16TCNT2 is halted 16TCNT2 is counting (Initial value) 16TCNT1 is halted 16TCNT1 is counting (Initial value) 16TCNT0 is halted 16TCNT0 is counting (Initial value) 849 TSNC--Timer Synchro Register H'FFF61 16-bit timer (all channels) Bit 7 -- 6 -- 1 -- 5 -- 1 -- 4 -- 1 -- 3 -- 1 -- 2 1 0 SYNC2 SYNC1 SYNC0 0 R/W 0 R/W 0 R/W Initial value Read/Write 1 -- Reserved bits Timer sync 0 0 Channel 0 timer counter (16TCNT0) operates independently (16TCNT0 presetting/clearing is independent of other channels) (Initial value) Channel 0 operates synchronously Synchronous presetting/synchronous clearing of 16TCNT0 is possible 1 Timer sync 1 0 Channel 1 timer counter (16TCNT1) operates independently (16TCNT1 presetting/clearing is independent of other channels) (Initial value) Channel 1 operates synchronously Synchronous presetting/synchronous clearing of 16TCNT1 is possible 1 Timer sync 2 0 Channel 2 timer counter (16TCNT2) operates independently (16TCNT2 presetting/clearing is independent of other channels) (Initial value) Channel 2 operates synchronously Synchronous presetting/synchronous clearing of 16TCNT2 is possible 1 850 TMDR--Timer Mode Register H'FFF62 16-bit timer (all channels) Bit 7 -- 6 MDF 0 R/W 5 FDIR 0 R/W 4 -- 1 -- 3 -- 1 -- 2 PWM2 0 R/W 1 PWM1 0 R/W 0 PWM0 0 R/W Initial value Read/Write 1 -- PWM mode 0 0 1 Channel 0 operates normally (Initial value) Channel 0 operates in PWM mode PWM mode 1 0 1 Channel 1 operates normally (Initial value) Channel 1 operates in PWM mode PWM mode 2 0 1 Channel 2 operates normally (Initial value) Channel 2 operates in PWM mode Flag direction 0 1 OVF is set to 1 in TISRC when 16TCNT2 overflows or underflows (Initial value) OVF is set to 1 in TISRC when 16TCNT2 overflows Phase counting mode 0 1 Channel 2 operates normally (Initial value) Channel 2 operates in phase counting mode 851 TOLR--Timer Output Level Setting Register H'FFF63 16-bit timer (all channels) Bit 7 -- 6 -- 1 -- 5 TOB2 0 W 4 TOA2 0 W 3 TOB1 0 W 2 TOA1 0 W 1 TOB0 0 W 0 TOA0 0 W Initial value Read/Write 1 -- Output level setting A0 0 1 TIOCA0 is 0 TIOCA0 is 1 (Initial value) Output level setting B0 0 1 TIOCB0 is 0 TIOCB0 is 1 (Initial value) Output level setting A1 0 1 TIOCA1 is 0 TIOCA1 is 1 (Initial value) Output level setting B1 0 1 TIOCB1 is 0 TIOCB1 is 1 (Initial value) Output level setting A2 0 1 TIOCA2 is 0 TIOCA2 is 1 (Initial value) Output level setting B2 0 1 TIOCB2 is 0 TIOCB2 is 1 (Initial value) 852 TISRA--Timer Interrupt Status Register A H'FFF64 16-bit timer (all channels) Bit: 7 -- 6 5 4 3 -- 1 -- 2 1 0 IMIEA2 IMIEA1 IMIEA0 0 R/W 0 R/W 0 R/W IMFA2 IMFA1 IMFA0 0 0 0 R/(W)* R/(W)* R/(W)* Initial value: Read/Write: 1 -- Input capture/compare match flag A0 0 [Clearing conditions] Read IMFA0 when IMFA0=1, then write 0 in IMFA0 [Setting conditions] * 16TCNT0=GRA0 when GRA0 functions as an output compare register. 1 * 16TCNT0 value is transferred to GRA0 by an input capture signal when GRA0 functions as an input capture register. Input capture/compare match flag A1 0 [Clearing conditions] Read IMFA1 when IMFA1=1, then write 0 in IMFA1 [Setting conditions] * 16TCNT1=GRA1 when GRA1 functions as an output compare register. 1 * 16TCNT1 value is transferred to GRA1 by an input capture signal when GRA1 functions as an input capture register. Input capture/compare match flag A2 0 [Clearing conditions] Read IMFA2 when IMFA2=1, then write 0 in IMFA2 [Setting conditions] * 16TCNT2=GRA2 when GRA2 functions as an output compare register. 1 * 16TCNT2 value is transferred to GRA2 by an input capture signal when GRA2 functions as an input capture register. Input capture/compare match interrupt enable A0 0 IMIA0 interrupt requested by IMFA0 flag is disabled 1 IMIA0 interrupt requested by IMFA0 is enabled (Initial value) (Initial value) (Initial value) (Initial value) (Initial value) Input capture/compare match interrupt enable A1 0 IMIA1 interrupt requested by IMFA1 flag is disabled 1 IMIA1 interrupt requested by IMFA1 is enabled Input capture/compare match interrupt enable A2 0 IMIA2 interrupt requested by IMFA2 flag is disabled 1 IMIA2 interrupt requested by IMFA2 is enabled (Initial value) Note: * Only 0 can be written to clear the flag. 853 TISRB--Timer Interrupt Status Register B H'FFF65 16-bit timer (all channels) Bit: 7 -- 6 5 4 3 -- 1 -- 2 1 0 IMIEB2 IMIEB1 IMIEB0 0 R/W 0 R/W 0 R/W IMFB2 IMFB1 IMFB0 0 0 0 R/(W)* R/(W)* R/(W)* Initial value: Read/Write: 1 -- Input capture/compare match flag B0 [Clearing condition] Read IMFB0 when IMFB0=1, then write 0 in IMFB0. (Initial value) 0 [Setting conditions] 16TCNT0=GRB0 when GRB0 functions as an output compare register. 1 16TCNT0 value is transferred to GRB0 by an input capture signal when GRB0 functions as an input capture register. Input capture/compare match flag B1 [Clearing condition] Read IMFB1 when IMFB1=1, then write 0 in IMFB1. [Setting conditions] * 16TCNT1=GRB1 when GRB1 functions as an output compare register. 1 * 16TCNT1 value is transferred to GRB1 by an input capture signal when GRB1 functions as an input capture register. Input capture/compare match flag B2 [Clearing condition] Read IMFB2 when IMFB2=1, then write 0 in IMFB2. [Setting conditions] * 16TCNT2=GRB2 when GRB2 functions as an output compare register. 1 * 16TCNT2 value is transferred to GRB2 by an input capture signal when GRB2 functions as an input capture register. Input capture/compare match interrupt enable B0 0 IMIB0 interrupt requested by IMFB0 flag is disabled 1 IMIB0 interrupt requested by IMFB0 is enabled (Initial value) (Initial value) (Initial value) 0 0 (Initial value) Input capture/compare match interrupt enable B1 0 IMIB1 interrupt requested by IMFB1 flag is disabled 1 IMIB1 interrupt requested by IMFB1 is enabled Input capture/compare match interrupt enable B2 0 IMIB2 interrupt requested by IMFB2 flag is disabled 1 IMIB2 interrupt requested by IMFB2 is enabled (Initial value) Note: * Only 0 can be written to clear the flag. 854 TISRC--Timer Interrupt Status Register C H'FFF66 16-bit timer (all channels) Bit: 7 -- 6 5 4 3 -- 1 -- 2 1 0 OVIE2 OVIE1 OVIE0 0 R/W 0 R/W 0 R/W OVF2 OVF1 OVF0 0 0 0 R/(W)* R/(W)* R/(W)* Initial value: Read/Write: 1 -- Overflow flag 0 0 1 [Clearing condition] Read OVF0 when OVF0 = 1, then write 0 in OVF0. [Setting condition] 16TCNT0 overflowed from H'FFFF to H'0000. (Initial value) Overflow flag 1 0 1 [Clearing condition] Read OVF1 when OVF1 = 1, then write 0 in OVF1. [Setting condition] 16TCNT1 overflowed from H'FFFF to H'0000. (Initial value) Overflow flag 2 0 [Clearing condition] Read OVF2 when OVF2 = 1, then write 0 in OVF2. [Setting condition] 1 16TCNT2 overflowed from H'FFFF to H'0000, or underflowed from H'0000 to H'FFFF. (Initial value) Overflow interrupt enable 0 OVI0 interrupt requested by OVF0 flag is disabled 0 1 OVI0 interrupt requested by OVF0 flag is enabled (Initial value) Overflow interrupt enable 1 OVI1 interrupt requested by OVF1 flag is disabled 0 1 OVI1 interrupt requested by OVF1 flag is enabled (Initial value) Overflow interrupt enable 2 OVI2 interrupt requested by OVF2 flag is disabled 0 1 OVI2 interrupt requested by OVF2 flag is enabled (Initial value) Note: * Only 0 can be written to clear the flag. 855 16TCR0--Timer Control Register 0 H'FFF68 16-bit timer channel 0 Bit 7 -- 1 -- 6 CCLR1 0 R/W 5 CCLR0 0 R/W 4 CKEG1 0 R/W 3 CKEG0 0 R/W 2 TPSC2 0 R/W 1 TPSC1 0 R/W 0 TPSC0 0 R/W Initial value Read/Write Timer prescaler 2 to 0 Bit 1 Bit 0 Bit 2 TPSC2 TPSC1 TPSC0 Description Internal clock : o Internal clock : o / 2 Internal clock : o / 4 Internal clock : o / 8 External clock A : TCLKA input External clock B : TCLKB input External clock C : TCLKC input External clock D : TCLKD input (Initial value) 0 0 1 0 1 1 0 1 0 1 0 1 0 1 Clock edge 1 and 0 Bit 4 Bit 3 CKEG CKEG0 Description Rising edges counted Falling edges counted Both edges counted (Initial value) 0 0 1 0 1 -- Counter clear 1 and 0 Bit 5 Bit 6 CCLR1 CCLR0 Description (Initial value) 16TCNT is not cleared 16TCNT is cleared by GRA compare match or input capture 16TCNT is cleared by GRB compare match or input capture Synchronous clear : 16TCNT is cleared in synchronization with other synchronized timers 0 1 0 1 0 1 856 TIOR0--Timer I/O Control Register 0 H'FFF69 16-bit timer channel 0 Bit: 7 -- 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 -- 1 -- 2 IOA2 0 R/W 1 IOA1 0 R/W 0 IOA0 0 R/W Initial value: Read/Write: 1 -- I / O control A2 to A0 Bit 2 Bit 1 Bit 0 IOA2 IOA1 IOA0 Description GRA is an output compare register No output at compare match (Initial value) 0 output at GRA compare match 1 output at GRA compare match Output toggles at GRA compare match (1 output on channel 2) GRA captures rising edges of input GRA captures falling edges of input GRB captures both edges of input 0 0 1 0 1 1 0 1 0 1 0 1 0 1 GRA is an input capture register I / O control B2 to B0 Bit 6 Bit 5 Bit 4 IOB2 IOB1 IOB0 Description GRB is an output compare register No output at compare match (Initial value) 0 output at GRB compare match 1 output at GRB compare match Output toggles at GRB compare match (1 output on channel 2) GRB captures rising edges of input GRB captures falling edges of input GRB captures both edges of input 0 0 1 0 1 1 0 1 0 1 0 1 0 1 GRB is an input capture register 857 16TCNT0 H/L--Timer Counter 0 H/L H'FFF6A, H'FFF6B 16-bit timer channel 0 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Up - counter GRA0 H/L--General Register A0 H/L H'FFF6C, H'FFF6D 16-bit timer channel 0 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register GRB0 H/L--General Register B0 H/L H'FFF6E, H'FFF6F 16-bit timer channel 0 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Output compare or input capture register 858 16TCR1 Timer Control Register 1 H'FFF70 16-bit timer channel 1 Bit 7 -- 6 5 4 3 2 1 0 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Initial value Read/Write 1 -- *Bit functions are the same as for 16-bit timer channel 0. TIOR1--Timer I/O Control Register 1 H'FFF71 16-bit timer channel 1 Bit 7 -- 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 -- 1 -- 2 IOA2 0 R/W 1 IOA1 0 R/W 0 IOA0 0 R/W Initial value Read/Write 1 -- *Bit functions are the same as for 16-bit timer channel 0. 16TCNT1 H/L--Timer Counter 1 H/L H'FFF72, H'FFF73 16-bit timer channel 1 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *Bit functions are the same as for 16-bit timer channel 0. 859 GRA1 H/L--General Register A1 H/L H'FFF74, H'FFF75 16-bit timer channel 1 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *Bit functions are the same as for 16-bit timer channel 0. GRB1 H/L--General Register B1 H/L H'FFF76, H'FFF77 16-bit timer channel 1 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *Bit functions are the same as for 16-bit timer channel 0. 16TCR2 Timer Control Register 2 H'FFF78 16-bit timer channel 2 Bit 7 -- 6 5 4 3 2 1 0 CCLR1 CCLR0 CKEG1 CKEG0 TPSC2 TPSC1 TPSC0 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Initial value Read/Write 1 -- *Bit functions are the same as for 16-bit timer channel 0. Note : When phase counting mode is selected in channel 2, the settings of bits CKEG1 and CKEG0 and TPSC2 to TPSC0 in 16TCR2 are ignored. 860 TIOR2--Timer I/O Control Register 2 H'FFF79 16-bit timer channel 2 Bit 7 -- 6 IOB2 0 R/W 5 IOB1 0 R/W 4 IOB0 0 R/W 3 -- 1 -- 2 IOA2 0 R/W 1 IOA1 0 R/W 0 IOA0 0 R/W Initial value Read/Write 1 -- *Bit functions are the same as for 16-bit timer channel 0. 16TCNT2 H/L--Timer Counter 2 H/L H'FFF7A, H'FFF7B 16-bit timer channel 2 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W Phase counting mode : up / down counter Other mode : up - counter GRA2 H/L--General Register A2 H/L H'FFF7C, H'FFF7D 16-bit timer channel 2 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *Bit functions are the same as for 16-bit timer channel 0. 861 GRB2 H/L--General Register B2 H/L H'FFF7E, H'FFF7F 16-bit timer channel 2 Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W *Bit functions are the same as for 16-bit timer channel 0. 862 8TCR0--Timer Control Register 0 8TCR1--Timer Control Register 1 Bit 7 CMIEB Initial value Read/Write 0 R/W 6 CMIEA 0 R/W 5 OVIE 0 R/W 4 CCLR1 0 R/W 3 H'FFF80 H'FFF81 2 CKS2 0 R/W 1 CKS1 0 R/W 8-bit timer channel 0 8-bit timer channel 1 0 CKS0 0 R/W CCLR0 0 R/W Clock select 2 to 0 0 0 0 1 1 1 0 Clock input is disabled Internal clock: counted on rising edge of /8 Internal clock: counted on rising edge of /64 Internal clock: counted on rising edge of /8192 Channel 0: Count on 8TCNT1 overflow signal* Channel 1: Count on 8TCNT0 compare match A* External clock: counted on falling edge External clock: counted on rising edge External clock: counted on both rising and falling edges 0 1 0 1 0 1 1 Notes: * If the clock input of channel 0 is the 8TCNT1 overflow signal and that of channel 1 is the 8TCNT0 compare match signal, no incrementing clock is generated. Do not use this setting. Counter clear 1 and 0 0 0 1 1 0 1 Clearing is disabled Cleared by compare match A Cleared by compare match B/input capture B Cleared by input capture B Timer overflow interrupt enable 0 1 OVI interrupt requested by OVF is disabled OVI interrupt requested by OVF is enabled Compare match interrupt enable A 0 1 CMIA interrupt requested by CMFA is disabled CMIA interrupt requested by CMFA is enabled Compare match interrupt enable B 0 1 CMIB interrupt requested by CMFB is disabled CMIB interrupt requested by CMFB is enabled 863 8TCSR0--Timer Control/Status Register 0 Bit 7 CMFB Initial value Read/Write 0 R/(W)*1 6 CMFA 0 R/(W)*1 5 OVF 0 R/(W)*1 4 ADTE 0 R/W 3 OIS3 0 R/W 2 H'FFF82 1 OS1 0 R/W 0 OS0 0 R/W OIS2 0 R/W 8-bit timer channel 0 Output select A1 and A0 Bit 1 Bit 0 Description OS1 OS0 0 0 1 0 No change at compare match A 0 output at compare match A 1 output at compare match A Output toggles at compare match A 1 1 Output/input capture edge select B3 and B2 ICE in Bit 3 8TCSR1 OIS3 0 0 1 1 0 0 1 1 A/D trigger enable Bit 4 TRGE*2 ADTE 0 0 1 0 1 1 Timer overflow flag 0 1 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF. [Setting condition] 8TCNT overflows from H'FF to H'00. Description A/D converter start requests by compare match A or an external trigger are disabled A/D converter start requests by compare match A or an external trigger are disabled A/D converter start requests by an external trigger are enabled, and A/D converter start requests by compare match A are disabled A/D converter start requests by compare match A are enabled, and A/D converter start requests by an external trigger are disabled 1 0 1 Bit 2 OIS2 Description No change at compare match B 0 output at compare match B 1 output at compare match B Output toggles at compare match B TCORB input capture on rising edge TCORB input capture on falling edge TCORB input capture on both rising and falling edges 0 1 0 Compare match flag A 0 1 [Clearing condition] Read CMFA when CMFA = 1, then write 0 in CMFA. [Setting condition] 8TCNT = TCORA Compare match/input capture flag B 0 [Clearing condition] Read CMFB when CMFB = 1, then write 0 in CMFB. [Setting conditions] * 8TCNT = TCORB * The 8TCNT value is transferred to TCORB by an input capture signal when TCORB functions as an input capture register. 1 Notes: *1 Only 0 can be written to bits 7 to 5 to clear these flags. *2 TRGE is bit 7 of the A/D control register (ADCR). 864 8TCSR1--Timer Control/Status Register 1 Bit 7 CMFB Initial value Read/Write 0 R/(W)* 6 CMFA 0 R/(W)* 5 OVF 0 R/(W)* 4 ICE 0 R/W 3 OIS3 0 R/W H'FFF83 2 OIS2 0 R/W 1 OS1 0 R/W 0 8-bit timer channel 1 OS0 0 R/W Output select A1 and A0 Bit 1 Bit 0 Description OS1 OS0 0 0 1 0 No change at compare match A 0 output at compare match A 1 output at compare match A Output toggles at compare match A 1 1 Output/input capture edge select B3 and B2 Bit 3 ICE in 8TCSR1 OIS3 0 0 1 1 0 0 1 1 Input capture enable 0 1 TCORB is a compare match register TCORB is an input capture register 1 0 1 Bit 2 OIS2 Description No change at compare match B 0 output at compare match B 1 output at compare match B Output toggles at compare match B TCORB input capture on rising edge TCORB input capture on falling edge TCORB input capture on both rising and falling edges 0 1 0 Timer overflow flag 0 1 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF. [Setting condition] 8TCNT overflows from H'FF to H'00. Compare match/input capture flag A 0 1 [Clearing condition] Read CMFA when CMFA = 1, then write 0 in CMFA. [Setting condition] 8TCNT = TCORA Compare match/input capture flag B 0 [Clearing condition] Read CMFB when CMFB = 1, then write 0 in CMFB. [Setting conditions] 8TCNT = TCORB * The 8TCNT value is transferred to TCORB by an input capture signal when * TCORB functions as an input capture register. 1 Note: * Only 0 can be written to bits 7 to 5 to clear these flags. 865 TCORA0--Time Constant Register A0 TCORA1--Time Constant Register A1 H'FFF84 H'FFF85 8-bit timer channel 0 8-bit timer channel 1 TCORA0 Bit 15 14 13 12 11 10 9 8 7 6 5 TCORA1 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB0--Time Constant Register B0 TCORB1--Time Constant Register B1 H'FFF86 H'FFF87 8-bit timer channel 0 8-bit timer channel 1 TCORB0 Bit 15 14 13 12 11 10 9 8 7 6 5 TCORB1 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 8TCNT0--Timer Counter 0 8TCNT1--Timer Counter 1 H'FFF88 H'FFF89 8-bit timer channel 0 8-bit timer channel 1 8TCNT0 Bit 15 14 13 12 11 10 9 8 7 6 5 8TCNT1 4 3 2 1 0 Initial value Read/Write 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 866 TCSR--Timer Control/Status Register H'FFF8C WDT Bit 7 OVF 6 WT/IT 0 R/W 5 TME 0 R/W 4 3 2 CKS2 1 CKS1 0 R/W 0 CKS0 0 R/W Initial value Read/Write 0 R/(W)* 1 1 0 R/W Clock select 2 to 0 CKS2 CKS1 CKS0 0 0 0 1 1 0 1 0 0 1 1 Timer enable Timer disabled 0 * TCNT is initialized to H'00 and halted Timer enabled 1 * TCNT starts counting up 1 0 1 Description /2 /32 /64 /128 /256 /512 /2048 /4096 Timer mode select 0 Interval timer: requests interval timer interrupts Watchdog timer: generates a reset signal 1 Overflow flag 0 1 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF [Setting condition] TCNT changes from H'FF to H'00 Note: * Only 0 can be written to clear the flag. 867 TCNT--Timer Counter H'FFF8D (read), H'FFF8C (write) WDT Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W Count value RSTCSR--Reset Control/Status Register H'FFF8F (read), H'FFF8E (write) WDT Bit 7 WRST 6 RSTOE 0 R/W 5 4 3 2 1 0 Initial value Read/Write 0 R/(W)* 1 1 1 1 1 1 Reset output enable 0 1 External output of reset signal is disabled External output of reset signal is enabled Watchdog timer reset 0 [Clearing conditions] * Reset signal at RES pin * Read WRST when WRST = 1, then write 0 in WRST [Setting condition] 1 TCNT overflow generates a reset signal during watchdog timer operation Note: * Only 0 can be written in bit 7 to clear the flag. 868 8TCR2--Timer Control Register 2 8TCR3--Timer Control Register 3 Bit 7 CMIEB Initial value Read/Write 0 R/W 6 CMIEA 0 R/W 5 OVIE 0 R/W 4 CCLR1 0 R/W 3 CCLR0 0 R/W 2 H'FFF90 H'FFF91 1 CKS1 0 R/W 0 8-bit timer channel 2 8-bit timer channel 3 CKS2 0 R/W CKS0 0 R/W Clock select 2 to 0 CSK2 CSK1 CSK0 0 0 1 0 0 1 1 Description Clock input is disabled Internal clock: counted on rising edge of /8 Internal clock: counted on rising edge of /64 Internal clock: counted on rising edge of /8192 Channel 2: Count on 8TCNT3 overflow signal* Channel 3: Count on 8TCNT2 compare match A* External clock: counted on falling edge External clock: counted on rising edge External clock: counted on both rising and falling edges 0 1 1 0 1 0 1 Note: * If the clock input of channel 2 is the 8TCNT3 overflow signal and that of channel 3 is the 8TCNT2 compare match signal, no incrementing clock is generated. Do not use this setting. Counter clear 1 and 0 0 0 1 0 1 Clearing is disabled Cleared by compare match A Cleared by compare match B/input capture B Cleared by input capture B 1 Timer overflow interrupt enable 0 1 OVI interrupt requested by OVF is disabled OVI interrupt requested by OVF is enabled Compare match interrupt enable A 0 1 CMIA interrupt requested by CMFA is disabled CMIA interrupt requested by CMFA is enabled Compare match interrupt enable B 0 1 CMIB interrupt requested by CMFB is disabled CMIB interrupt requested by CMFB is enabled 869 8TCSR2--Timer Control/Status Register 2 8TCSR3--Timer Control/Status Register 3 8TCSR2 Bit 7 CMFB Initial value Read/Write 8TCSR3 Bit 0 R/(W)* 7 CMFB Initial value Read/Write 0 R/(W)* 6 CMFA 0 R/(W)* 6 CMFA 0 R/(W)* 5 OVF 0 R/(W)* 5 OVF 0 R/(W)* 1 -- 4 ICE 0 R/W 4 3 OIS3 0 R/W 3 OIS3 0 R/W H'FFF92 H'FFF93 2 OIS2 0 R/W 2 OIS2 0 R/W 1 OS1 0 R/W 1 OS1 0 R/W 8-bit timer channel 2 8-bit timer channel 3 0 OS0 0 R/W 0 OS0 0 R/W Output select A1 and A0 Bit 1 Bit 0 Description OS1 OS0 0 0 1 0 No change at compare match A 0 output at compare match A 1 output at compare match A Output toggles at compare match A 1 1 Output/input capture edge select B3 and B2 ICE in Bit 3 8TCSR3 OIS3 0 0 1 1 0 0 1 1 1 0 Bit 3 OIS2 Description No change at compare match B 0 output at compare match B 1 output at compare match B Output toggles at compare match B TCORB input capture on rising edge TCORB input capture on falling edge TCORB input capture on both rising and falling edges 0 1 0 Input capture enable 0 1 TCORB is a compare match register TCORB is an input capture register Timer overflow flag 0 1 [Clearing condition] Read OVF when OVF = 1, then write 0 in OVF. [Setting condition] 8TCNT overflows from H'FF to H'00. Compare match/input capture flag A 0 1 [Clearing condition] Read CMFA when CMFA = 1, then write 0 in CMFA. [Setting condition] 8TCNT = TCORA Compare match/input capture flag B 0 [Clearing condition] Read CMFB when CMFB = 1, then write 0 in CMFB. [Setting conditions] * 8TCNT = TCORB * The 8TCNT value is transferred to TCORB by an input capture signal when TCORB functions as an input capture register. 1 Note: * Only 0 can be written to bits 7 to 5 to clear these flags. 870 TCORA2--Time Constant Register A2 TCORA3--Time Constant Register A3 H'FFF94 H'FFF95 8-bit timer channel 2 8-bit timer channel 3 TCORA2 Bit 15 14 13 12 11 10 9 8 7 6 5 TCORA3 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W TCORB2--Time Constant Register B2 TCORB3--Time Constant Register B3 H'FFF96 H'FFF97 8-bit timer channel 2 8-bit timer channel 3 TCORB2 Bit 15 14 13 12 11 10 9 8 7 6 5 TCORB3 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 8TCNT2--Timer Counter 2 8TCNT3--Timer Counter 3 8TCNT2 Bit 15 14 13 12 11 10 9 8 7 H'FFF98 H'FFF99 8-bit timer channel 2 8-bit timer channel 3 8TCNT3 6 5 4 3 2 1 0 Initial value Read/Write 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W 871 DADR0--D/A Data Register 0 7 6 5 4 3 H'FFF9C 2 1 D/A 0 Bit Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W D/A conversion data DADR1--D/A Data Register 1 7 6 5 4 3 H'FFF9D 2 1 D/A 0 Bit Initial value Read/Write 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W 0 R/W D/A conversion data 872 DACR--D/A Control Register H'FFF9E D/A Bit 7 DAOE1 6 DAOE0 0 R/W 5 DAE 0 R/W 4 3 2 1 0 Initial value Read/Write 0 R/W 1 1 1 1 1 D/A enable Bit 7 DAOE1 0 Bit 6 DAOE0 0 Bit 5 Description DAE D/A conversion is disabled in channels 0 and 1 D/A conversion is enabled in channel 0 0 1 0 D/A conversion is disabled in channel 1 0 1 1 D/A conversion is enabled in channels 0 and 1 D/A conversion is disabled in channel 0 D/A conversion is enabled in channel 1 1 0 1 D/A conversion is enabled in channels 0 and 1 D/A conversion is enabled in channels 0 and 1 1 0 0 1 1 D/A output enable 0 0 1 DA0 analog output is disabled Channel-0 D/A conversion and DA0 analog output are enabled D/A output enable 1 0 1 DA1 analog output is disabled Channel-1 D/A conversion and DA1 analog output are enabled 873 TPMR--TPC Output Mode Register 7 6 5 4 3 G3NOV Initial value Read/Write 1 1 1 1 0 R/W 2 G2NOV 0 R/W 1 G1NOV 0 R/W H'FFFA0 0 G0NOV 0 R/W TPC Bit Group 0 non-overlap 0 Normal TPC output in group 0. Output values change at compare match A in the selected 16-bit timer channel Non-overlapping TPC output in group 0, controlled by compare match A and B in the selected 16-bit timer channel 1 Group 1 non-overlap 0 1 Normal TPC output in group 1. Output values change at compare match A in the selected 16-bit timer channel Non-overlapping TPC output in group 1, controlled by compare match A and B in the selected 16-bit timer channel Group 2 non-overlap 0 1 Normal TPC output in group 2. Output values change at compare match A in the selected 16-bit timer channel Non-overlapping TPC output in group 2, controlled by compare match A and B in the selected 16-bit timer channel Group 3 non-overlap 0 1 Normal TPC output in group 3. Output values change at compare match A in the selected 16-bit timer channel Non-overlapping TPC output in group 3, controlled by compare match A and B in the selected 16-bit timer channel 874 TPCR--TPC Output Control Register H'FFFA1 TPC Bit 7 G3CMS1 6 G3CMS0 1 R/W 5 G2CMS1 1 R/W 4 G2CMS0 1 R/W 3 G1CMS1 1 R/W 2 G1CMS0 1 R/W 1 G0CMS1 1 R/W 0 G0CMS0 1 R/W Initial value Read/Write 1 R/W Group 0 compare match select 1 and 0 Bit 1 Bit 0 G0CMS1 G0CMS0 0 0 1 1 0 1 16-Bit Timer Channel Selected as Output Trigger TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 0 TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 1 TPC output group 0 (TP3 to TP0) is triggered by compare match in 16-bit timer channel 2 Group 1 compare match select 1 and 0 Bit 3 Bit 2 G1CMS1 G1CMS0 0 0 1 1 0 1 Group 2 compare match select 1 and 0 Bit 5 Bit 4 0 1 0 1 G2CMS1 G2CMS0 0 1 16-Bit Timer Channel Selected as Output Trigger TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 0 TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 1 TPC output group 2 (TP11 to TP8) is triggered by compare match in 16-bit timer channel 2 16-Bit Timer Channel Selected as Output Trigger TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 0 TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 1 TPC output group 1 (TP7 to TP4) is triggered by compare match in 16-bit timer channel 2 Group 3 compare match select 1 and 0 Bit 7 Bit 6 0 1 0 1 G3CMS1 G3CMS0 0 1 16-Bit Timer Channel Selected as Output Trigger TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 0 TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 1 TPC output group 3 (TP15 to TP12) is triggered by compare match in 16-bit timer channel 2 875 NDERB--Next Data Enable Register B H'FFFA2 TPC Bit 7 NDER15 6 NDER14 0 R/W 5 NDER13 0 R/W 4 NDER12 0 R/W 3 NDER11 0 R/W 2 NDER10 0 R/W 1 NDER9 0 R/W 0 NDER8 0 R/W Initial value Read/Write 0 R/W Next data enable 15 to 8 TPC outputs TP15 to TP8 are disabled 0 (NDR15 to NDR8 are not transferred to PB7 to PB0) TPC outputs TP15 to TP8 are enabled (NDR15 to NDR8 are transferred to PB7 to PB0) 1 NDERA--Next Data Enable Register A H'FFFA3 TPC Bit 7 NDER7 6 NDER6 0 R/W 5 NDER5 0 R/W 4 NDER4 0 R/W 3 NDER3 0 R/W 2 NDER2 0 R/W 1 NDER1 0 R/W 0 NDER0 0 R/W Initial value Read/Write 0 R/W Next data enable 7 to 0 0 TPC outputs TP7 to TP0 are disabled (NDR7 to NDR0 are not transferred to PA7 to PA0) TPC outputs TP7 to TP0 are enabled (NDR7 to NDR0 are transferred to PA7 to PA0) 1 876 NDRB--Next Data Register B * Same trigger for TPC output groups 2 and 3 Address H'FFFA4 Bit 7 NDR15 Initial value Read/Write 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 3 NDR11 0 R/W H'FFFA4/H'FFFA6 TPC 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W Store the next output data for TPC output group 3 Store the next output data for TPC output group 2 Address H'FFFA6 Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 * Different triggers for TPC output groups 2 and 3 Address H'FFFA4 Bit 7 NDR15 Initial value Read/Write 0 R/W 6 NDR14 0 R/W 5 NDR13 0 R/W 4 NDR12 0 R/W 1 1 1 1 3 2 1 0 Store the next output data for TPC output group 3 Address H'FFFA6 Bit 7 6 5 4 3 NDR11 Initial value Read/Write 1 1 1 1 0 R/W 2 NDR10 0 R/W 1 NDR9 0 R/W 0 NDR8 0 R/W Store the next output data for TPC output group 2 877 NDRA--Next Data Register A * Same trigger for TPC output groups 0 and 1 Address H'FFFA5 Bit 7 NDR7 Initial value Read/Write 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 3 NDR3 0 R/W H'FFFA5/H'FFFA7 TPC 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W Store the next output data for TPC output group 1 Store the next output data for TPC output group 0 Address H'FFFA7 Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 1 1 1 1 1 1 1 * Different triggers for TPC output groups 0 and 1 Address H'FFFA5 Bit 7 NDR7 Initial value Read/Write 0 R/W 6 NDR6 0 R/W 5 NDR5 0 R/W 4 NDR4 0 R/W 1 1 1 1 3 2 1 0 Store the next output data for TPC output group 1 Address H'FFFA7 Bit 7 6 5 4 3 NDR3 Initial value Read/Write 1 1 1 1 0 R/W 2 NDR2 0 R/W 1 NDR1 0 R/W 0 NDR0 0 R/W Store the next output data for TPC output group 0 878 SMR--Serial Mode Register H'FFFB0 SCI0 Bit 7 C/A 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Initial value Read/Write 0 R/W Clock select 1 and 0 Bit 1 Bit 0 CKS1 CKS0 Clock Source clock /4 clock /16 clock /64 clock 0 0 1 0 1 1 Multiprocessor mode 0 1 Multiprocessor function disabled Multiprocessor format selected Stop bit length 0 1 Parity mode 0 1 Parity enable 0 1 Character length 0 1 8-bit data 7-bit data Parity bit is not added or checked Parity bit is added and checked Even parity Odd parity One stop bit Two stop bits Communication mode (for serial communication interface) 0 1 Asynchronous mode Synchronous mode GSM mode (for smart card interface) 0 1 TEND flag is set 12.5 etu* after start bit TEND flag is set 11.0 etu* after start bit Note: * etu: Elementary time unit (time required to transmit one bit) 879 BRR--Bit Rate Register H'FFFB1 SCI0 Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Serial communication bit rate setting 880 SCR--Serial Control Register 7 TIE Initial value Read/Write 0 R/W 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W H'FFFB2 0 CKE0 0 R/W SCI0 Bit Receive enable 0 1 Receiving is disabled Receiving is enabled Transmit enable 0 1 Transmitting is disabled Transmitting is enabled Clock enable 1 and 0 (for serial communication interface) Bit 1 Bit 0 Description CKE1 CKE0 Internal clock: SCK pin Asynchronous mode available for generic I/O 0 Internal clock: SCK pin Synchronous mode used for serial clock output 0 Internal clock: SCK pin Asynchronous mode used for clock output 1 Internal clock: SCK pin Synchronous mode used for serial clock output External clock: SCK pin Asynchronous mode used for clock input 0 External clock: SCK pin Synchronous mode used for serial clock input 1 External clock: SCK pin Asynchronous mode used for clock input 1 External clock: SCK pin Synchronous mode used for serial clock input Clock enable 1 and 0 (for smart card interface) SMR Bit 1 Bit 0 Description GM CKE1 CKE0 SCK pin available for generic I/O 0 0 0 SCK pin used for clock output 1 SCK pin output fixed low 0 0 SCK pin used for clock output 1 1 SCK pin output fixed high 0 1 SCK pin used for clock output 1 Transmit-end interrupt enable 0 1 Transmit-end interrupt requests (TEI) are disabled Transmit-end interrupt requests (TEI) are enabled Multiprocessor interrupt enable 0 1 Receive interrupt enable 0 1 Receive-data-full (RXI) and receive-error (ERI) interrupt requests are disabled Receive-data-full (RXI) and receive-error (ERI) interrupt requests are enabled Multiprocessor interrupts are disabled (normal receive operation) Multiprocessor interrupts are enabled Transmit interrupt enable 0 1 Transmit-data-empty interrupt request (TXI) is disabled Transmit-data-empty interrupt request (TXI) is enabled 881 TDR--Transmit Data Register 7 6 5 4 3 H'FFFB3 2 1 SCI0 0 Bit Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Store serial transmit data 882 SSR--Serial Status Register H'FFFB4 SCI0 Bit 7 TDRE 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 FER/ERS 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R 1 MPB 0 R 0 MPBT 0 R/W Multiprocessor bit transfer Initial value Read/Write 1 R/(W)* 0 Multiprocessor bit value in transmit data is 0 1 Multiprocessor bit value in transmit data is 1 Multiprocessor bit Multiprocessor bit value in receive data is 1 Transmit end (for serial communication interface) 0 [Clearing conditions] Read TDRE when TDRE = 1, then write 0 in TDRE. [Setting conditions] * Reset or transition to standby mode * TE is cleared to 0 in SCR. * TDRE is 1 when last bit of 1-byte serial character is transmitted. 0 1 Multiprocessor bit value in receive data is 0 1 Transmit end (for smart card interface) 0 [Clearing conditions] Read TDRE when TDRE = 1, then write 0 in TDRE. [Setting conditions] * Reset or transition to standby mode * TE is cleared to 0 in SCR and FER/ERS is cleared to 0. * TDRE is 1 and FER/ERS is 0 (normal transmission) 2.5 etu* (when GM = 0) or 1.0 etu (when GM = 1) after 1-byte serial character is transmitted. 1 Note: * etu: Elementary time unit (time required to transmit one bit) Parity error 0 1 [Clearing conditions] * Reset or transition to standby mode * Read PER when PER = 1, then write 0 in PER. [Setting condition] Parity error (parity of receive data does not match parity setting of O/E bit in SMR) Framing error (for serial communication interface) 0 1 [Clearing conditions] * Reset or transition to standby mode * Read FER when FER = 1, then write 0 in FER. [Setting condition] Framing error (stop bit is 0) [Clearing conditions] * Reset or transition to standby mode * Read ERS when ERS = 1, then write 0 in ERS. [Setting condition] A low error signal is received. Error signal status (for smart card interface) 0 1 Overrun error 0 1 [Clearing conditions] * Reset or transition to standby mode * Read ORER when ORER = 1, then write 0 in ORER. [Setting condition] Overrun error (reception of the next serial data ends when RDRF = 1) Receive data register full 0 1 0 1 [Clearing conditions] * Reset or transition to standby mode * Read RDRF when RDRF = 1, then write 0 in RDRF. [Setting condition] Serial data is received normally and transferred from RSR to RDR. Transmit data register empty [Clearing conditions] * Read TDRE when TDRE = 1, then write 0 in TDRE. [Setting conditions] * Reset or transition to standby mode * TE is 0 in SCR. * Data is transferred from TDR to TSR, enabling new data to be written in TDR Note: * Only 0 can be written, to clear the flag. 883 RDR--Receive Data Register 7 6 5 4 3 H'FFFB5 2 1 SCI0 0 Bit Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R Store serial receive data 884 SCMR--Smart Card Mode Register H'FFFB6 SCI0 Bit 7 6 5 4 3 SDIR 2 SINV 0 R/W 1 0 SMIF Initial value Read/Write 1 1 1 1 0 R/W 1 0 R/W Smart card interface mode select 0 1 Smart card interface function is disabled Smart card interface function is enabled (Initial value) Smart card data invert Unmodified TDR contents are transmitted 0 Receive data is stored unmodified in RDR Inverted 1/0 logic levels of TDR contents are transmitted 1/0 logic levels of received data are inverted before storage in RDR (Initial value) 1 Smart card data transfer direction TDR contents are transmitted LSB-first 0 Receive data is stored LSB-first in RDR TDR contents are transmitted MSB-first Receive data is stored MSB-first in RDR (Initial value) 1 885 SMR--Serial Mode Register H'FFFB8 SCI1 Bit 7 C/A 6 CHR 0 R/W 5 PE 0 R/W 4 O/E 0 R/W 3 STOP 0 R/W 2 MP 0 R/W 1 CKS1 0 R/W 0 CKS0 0 R/W Initial value Read/Write 0 R/W Note: Bit functions are the same as for SCI0. BRR--Bit Rate Register H'FFFB9 SCI1 Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Note: Bit functions are the same as for SCI0. SCR--Serial Control Register H'FFFBA SCI1 Bit 7 TIE 6 RIE 0 R/W 5 TE 0 R/W 4 RE 0 R/W 3 MPIE 0 R/W 2 TEIE 0 R/W 1 CKE1 0 R/W 0 CKE0 0 R/W Initial value Read/Write 0 R/W Note: Bit functions are the same as for SCI0. 886 TDR--Transmit Data Register H'FFFBB SCI1 Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W 1 R/W Note: Bit functions are the same as for SCI0. SSR--Serial Status Register H'FFFBC SCI1 Bit 7 TDRE 6 RDRF 0 R/(W)* 5 ORER 0 R/(W)* 4 FER/ERS 0 R/(W)* 3 PER 0 R/(W)* 2 TEND 1 R 1 MPB 0 R 0 MPBT 0 R/W Initial value Read/Write 0 R/(W)* Note: Bit functions are the same as for SCI0. * Only 0 can be written to clear the flag. RDR--Receive Data Register H'FFFBD SCI1 Bit 7 6 5 4 3 2 1 0 Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R Note: Bit functions are the same as for SCI0. 887 SCMR--Smart Card Mode Register H'FFFBE SCI1 Bit 7 6 5 4 3 SDIR 2 SINV 0 R/W 1 0 SMIF Initial value Read/Write 1 1 1 1 0 R/W 1 0 R/W Note: Bit functions are the same as for SCI0. 888 P1DR--Port 1 Data Register 7 P17 Initial value Read/Write 0 R/W 6 P16 0 R/W 5 P15 0 R/W 4 P14 0 R/W 3 P13 0 R/W H'FFFD0 2 P12 0 R/W 1 P11 0 R/W Port 1 0 P10 0 R/W Bit Store data for port 1 pins P2DR--Port 2 Data Register 7 P27 Initial value Read/Write 0 R/W 6 P26 0 R/W 5 P25 0 R/W 4 P24 0 R/W 3 P23 0 R/W H'FFFD1 2 P22 0 R/W 1 P21 0 R/W Port 2 0 P20 0 R/W Bit Store data for port 2 pins P3DR--Port 3 Data Register 7 P37 Initial value Read/Write 0 R/W 6 P36 0 R/W 5 P35 0 R/W 4 P34 0 R/W 3 P33 0 R/W H'FFFD2 2 P32 0 R/W 1 P31 0 R/W Port 3 0 P30 0 R/W Bit Store data for port 3 pins 889 P4DR--Port 4 Data Register 7 P47 Initial value Read/Write 0 R/W 6 P46 0 R/W 5 P45 0 R/W 4 P44 0 R/W 3 P43 0 R/W H'FFFD3 2 P42 0 R/W 1 P41 0 R/W Port 4 0 P40 0 R/W Bit Store data for port 4 pins P5DR--Port 5 Data Register 7 6 5 4 3 P53 Initial value Read/Write 1 1 1 1 0 R/W H'FFFD4 2 P52 0 R/W 1 P51 0 R/W Port 5 0 P50 0 R/W Bit Store data for port 5 pins P6DR--Port 6 Data Register 7 P67 Initial value Read/Write 1 R 6 P66 0 R/W 5 P65 0 R/W 4 P64 0 R/W 3 P63 0 R/W H'FFFD5 2 P62 0 R/W 1 P61 0 R/W Port 6 0 P60 0 R/W Bit Store data for port 6 pins 890 P7DR--Port 7 Data Register 7 P77 Initial value Read/Write * R R 6 P76 * R 5 P75 * R 4 P74 * R 3 P73 H'FFFD6 2 P72 * R * R 1 P71 Port 7 0 P70 * R * Bit Read data for port 7 pins Note: * Determined by pins P77 to P70. P8DR--Port 8 Data Register 7 6 5 4 P84 Initial value Read/Write 1 1 1 0 R/W 3 P83 0 R/W H'FFFD7 2 P82 0 R/W 1 P81 0 R/W Port 8 0 P80 0 R/W Bit Store data for port 8 pins 891 P9DR--Port 9 Data Register 7 6 5 P95 Initial value Read/Write 1 1 0 R/W 4 P94 0 R/W 3 P93 0 R/W H'FFFD8 2 P92 0 R/W 1 P91 0 R/W Port 9 0 P90 0 R/W Bit Store data for port 9 pins PADR--Port A Data Register 7 PA7 Initial value Read/Write 0 R/W 6 PA6 0 R/W 5 PA5 0 R/W 4 PA4 0 R/W 3 PA3 0 R/W H'FFFD9 2 PA2 0 R/W 1 PA1 0 R/W Port A 0 PA0 0 R/W Bit Store data for port A pins PBDR--Port B Data Register 7 PB7 Initial value Read/Write 0 R/W 6 PB6 0 R/W 5 PB5 0 R/W 4 PB4 0 R/W 3 PB3 0 R/W H'FFFDA 2 PB2 0 R/W 1 PB1 0 R/W Port B 0 PB0 0 R/W Bit Store data for port B pins 892 ADDRA H/L--A/D Data Register A H/L H'FFFE0, H'FFFE1 A/D Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R ADDRAH ADDRAL A/D conversion data Store 10-bit data giving an A/D conversion result ADDRB H/L--A/D Data Register B H/L H'FFFE2, H'FFFE3 A/D Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R ADDRBH ADDRBL A/D conversion data Store 10-bit data giving an A/D conversion result 893 ADDRC H/L--A/D Data Register C H/L H'FFFE4, H'FFFE5 A/D Bit 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R ADDRCH ADDRCL A/D conversion data Store 10-bit data giving an A/D conversion result ADDRD H/L--A/D Data Register D H/L 15 14 13 12 11 10 9 8 7 6 H'FFFE6, H'FFFE7 5 4 3 2 1 0 A/D Bit AD9 AD8 AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0 Initial value Read/Write 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R 0 R ADDRDH ADDRDL A/D conversion data Store 10-bit data giving an A/D conversion result ADCR--A/D Control Register 7 TRGE Initial value Read/Write 0 R/W 1 1 1 1 6 5 4 3 H'FFFE9 2 1 0 A/D Bit 1 1 0 R/W Trigger Enable 0 1 A/D conversion start by external trigger or 8-bit timer compare match is disabled A/D conversion is started by falling edge of external trigger signal (ADTRG) or 8-bit timer compare match 894 ADCSR--A/D Control/Status Register 7 ADF Initial value Read/Write 0 R/(W)* 6 ADIE 0 R/W 5 ADST 0 R/W 4 SCAN 0 R/W 3 CKS 0 R/W 2 CH2 0 R/W 1 CH1 0 R/W 0 CH0 0 R/W H'FFFE8 A/D Bit Channel select 2 to 0 Clock select Conversion time = Description Group Selection Channel Selection 0 134 states (maximum) Scan Mode CH2 CH1 CH0 Single Mode AN0 0 AN0 Conversion time = 1 0 AN1 AN0, AN1 1 70 states (maximum) 0 AN2 AN0 to AN2 0 1 AN3 AN0 to AN3 1 0 AN4 AN4 0 Scan mode 1 AN5 AN4, AN5 1 Single mode 0 0 AN6 AN4 to AN6 1 1 Scan mode 1 AN7 AN4 to AN7 A/D start 0 1 A/D conversion is stopped * Single mode: A/D conversion starts; ADST is automatically cleared to 0 when conversion ends * Scan mode: A/D conversion starts and continues, cycling among the selected channels ADST is cleared to 0 by software, by a reset, or by a transition to standby mode A/D interrupt enable 0 1 A/D end flag 0 1 [Clearing condition] Read ADF when ADF = 1, then write 0 in ADF [Setting conditions] * Single mode: A/D conversion ends * Scan mode: A/D conversion ends in all selected channels A/D end interrupt request is disabled A/D end interrupt request is enabled Note: * Only 0 can be written to clear the flag. 895 Appendix C I/O Port Block Diagrams C.1 Port 1 Block Diagram Software standby SSOE Internal data bus (upper) Mode 1 to 4 Reset R Q P1 n DDR C WP1D Reset D Mode 6/7 R P1n Q P1 nDR C WP1 D Mode 1 to 5 RP1 WP1D : Write to P1DDR WP1 : Write to port 1 RP1 : Read port 1 SSOE : Software standby output port enable n = 0 to 7 Figure C.1 Port 1 Block Diagram 896 Internal address bus Hardware standby External bus released Mode 6/7 C.2 Port 2 Block Diagram Software standby SSOE Reset Internal data bus (upper) R Q P2 n PCR C RP2P WP2P Reset Mode 1 to 4 R Q P2n DDR C WP2D Reset D D Mode 6/7 Hardware standby External bus released Mode 6/7 R Q P2 nDR C WP2 D P2n Mode 1 to 5 RP2 WP2P : Write to P2PCR RP2P : Read P2PCR WP2D : Write to P2DDR WP2 : Write to port 2 RP2 : Read port 2 SSOE : Software standby output port enable n = 0 to 7 Figure C.2 Port 2 Block Diagram 897 Internal address bus C.3 Port 3 Block Diagram Internal data bus (upper) Reset Hardware standby External bus released R Mode 6/7 Q Write to external address P3 n DDR C WP3D Reset R Mode 6/7 P3n Q P3 nDR C WP3 D D Mode 1 to 5 RP3 Read external address WP3D : Write to P3DDR WP3 : Write to port 3 RP3 : Read port 3 n = 0 to 7 Figure C.3 Port 3 Block Diagram 898 Internal data bus (lower) C.4 Port 4 Block Diagram 8-bit bus 16-bit bus mode mode Mode 6/7 Mode 1 to 5 Reset Internal data bus (upper) Internal data bus (lower) R Q P4 n PCR RP4P Hardware standby Q P4 n DDR C WP4D Reset R P4n Q P4n DR C WP4 D C WP4P Reset R Write to external address External bus released D D RP4 Read external address WP4P : Write to P4PCR RP4P : Read P4PCR WP4D : Write to P4DDR WP4 : Write to port 4 RP4 : Read port 4 n = 0 to 7 Figure C.4 Port 4 Block Diagram 899 C.5 Port 5 Block Diagram Software standby SSOE Reset Q P5 n PCR RP5P C WP5P Mode 1 to 4 D Internal data bus (upper) R Hardware standby External bus released Mode 6/7 Reset R Q P5 n DDR C WP5D Reset R Q P5n DR C D D Mode 6/7 P5n Mode 1 to 5 WP5 RP5 WP5P : Write to P5PCR RP5P : Read P5PCR WP5D : Write to P5DDR WP5 : Write to port 5 RP5 : Read port 5 SSOE : Software standby output port enable n = 0 to 3 Figure C.5 Port 5 Block Diagram 900 Internal address bus C.6 Port 6 Block Diagrams Reset Internal data bus R Hardware Standby Q P60 DDR C Mode 6/7 WP6D Reset R P60 Q P60 DR C WP6 D D Bus controller WAIT input enable RP6 Bus controller WAIT input WP6D : Write to P6DDR WP6 : Write to port 6 RP6 : Read port 6 Figure C.6 (a) Port 6 Block Diagram (Pin P60) 901 Reset Internal data bus R Hardware Standby Q P6 1 DDR C Mode 6/7 WP6D Reset R P61 Q P61 DR C WP6 D D Bus controller Bus release enable RP6 BREQ input WP6D : Write to P6DDR WP6 : Write to port 6 RP6 : Read port 6 Figure C.6 (b) Port 6 Block Diagram (Pin P61) 902 Reset Hardware standby Q P6 2 DDR C WP6D Reset R P62 Q P62 DR C Mode 6/7 WP6 D Bus controller Bus release enable BACK output R D Internal data bus RP6 WP6D : Write to P6DDR WP6 : Write to port 6 RP6 : Read port 6 Figure C.6 (c) Port 6 Block Diagram (Pin P62) 903 SSOE Software standby Mode 6/7 Hardware standby External bus released Reset R Q Mode 6/7 P6 n DDR C WP6D Reset R Mode 6/7 D P6n Q Mode 1 to 5 P6 nDR C WP6 D Bus controller AS output RD output HWR output LWR output RP6 WP6D : Write to P6DDR WP6 : Write to port 6 RP6 : Read port 6 SSOE : Software standby output port enable n = 3 to 6 Figure C.6 (d) Port 6 Block Diagram (Pins P63 to P66) 904 Internal data bus Hardware standby output enable Internal data bus P67 output RP6 RP6 : Read port 6 Figure C.6 (e) Port 6 Block Diagram (Pin P67) 905 C.7 Port 7 Block Diagrams RP7 P7 n Internal data bus A/D converter Analog input RP7 : Read port 7 n = 0 to 5 Input enable Channel select signal Figure C.7 (a) Port 7 Block Diagram (Pins P7 0 to P75) RP7 P7 n Internal data bus A/D converter Analog input Input enable Channel select signal D/A converter Output enable Analog output RP7 : Read port 7 n = 6 and 7 Figure C.7 (b) Port 7 Block Diagram (Pins P76 and P77) 906 C.8 Port 8 Block Diagrams Reset R Q P8 0 DDR C WP8D Reset R P80 Q P80 DR C WP8 D D Internal data bus Interrupt controller WP8D : Write to P8DDR WP8 : Write to port 8 RP8 : Read port 8 IRQ 0 input RP8 Figure C.8 (a) Port 8 Block Diagram (Pin P80) 907 Mode 6/7 SSOE Software standby External bus released Reset R Q P8 n DDR C WP8D Reset R Q D P8n DR C WP8 D Internal data bus Hardware standby Bus controller CS 2 CS 3 output Mode 6/7 P8 n Mode 1 to 5 RP8 Interrupt controller IRQ 1 IRQ 2 input WP8D : WP8 : RP8 : SSOE : n = 1, 2 Write to P8DDR Write to port 8 Read port 8 Software standby output port enable Figure C.8 (b) Port 8 Block Diagram (Pins P81 and P82) 908 Mode 6/7 Reset R Q D P83DDR C WP8D Hardware standby Internal data bus Software standby SSOE External bus released Bus controller CS1 output Reset Mode 6/7 P83 Mode 1 to 5 R Q D P83DR C WP8 RP8 Interrupt controller IRQ3 input A/D converter ADTRG input WP8D WP8 RP8 SSOE : : : : Write to P8DDR Write to port 8 Read port 8 Software standby output port enable Figure C.8 (c) Port 8 Block Diagram (Pin P83) 909 Mode 6/7 Software standby SSOE External bus released Reset Mode 1 to 4 S Q Hardware standby R D Internal data bus P8 4 DDR C WP8D Reset R Bus controller CS 0 output Mode 6/7 P84 Mode 1 to 5 Q P84 DR C WP8 D RP8 WP8D WP8 RP8 SSOE : : : : Write to P8DDR Write to port 8 Read port 8 Software standby output port enable Figure C.8 (d) Port 8 Block Diagram (Pin P84) 910 C.9 Port 9 Block Diagrams Reset Internal data bus SCI Output enable Serial transmit data Guard time RP9 Hardware standby Q P9 0 DDR C WP9D Reset R P90 Q P90 DR C WP9 D R D WP9D : Write to P9DDR WP9 : Write to port 9 RP9 : Read port 9 Figure C.9 (a) Port 9 Block Diagram (Pin P90) 911 Reset Internal data bus SCI Output enable Serial transmit data Guard time Hardware standby Q P9 1 DDR C WP9D Reset R P91 Q P91 DR C WP9 D R D RP9 WP9D : Write to P9DDR WP9 : Write to port 9 RP9 : Read port 9 Figure C.9 (b) Port 9 Block Diagram (Pin P91) 912 Reset R Hardware standby Q P9 2 DDR C WP9D Reset R P9 2 Q P9 2 DR C WP9 D D Internal data bus SCI Input enable RP9 Serial receive data WP9D : Write to P9DDR WP9 : Write to port 9 RP9 : Read port 9 Figure C.9 (c) Port 9 Block Diagram (Pin P92) 913 Reset R Q D P93DDR C WP9D Reset P93 R Q D P93DR C WP9 Hardware standby Internal data bus SCI Input enable Serial receive data RP9 WP9D : Write to P9DDR WP9 : Write to port 9 RP9 : Read port 9 Figure C.9 (d) Port 9 Block Diagram (Pin P93) 914 Reset R Hardware standby Q P9 4DDR C WP9D Reset R P94 Q P9 4 DR C WP9 Clock output enable Clock output D D Internal data bus SCI Clock input enable RP9 Clock input WP9D : Write to P9DDR WP9 : Write to port 9 RP9 : Read port 9 Interrupt controller IRQ 4 input Figure C.9 (e) Port 9 Block Diagram (Pin P94) 915 Reset Hardware standby R Q D P95DDR C WP9D Reset P95 R Q D P95DR C WP9 Internal data bus SCI Clock input enable Clock output enable Clock output Clock input Interrupt controller IRQ5 input RP9 WP9D : Write to P9DDR WP9 : Write to port 9 RP9 : Read port 9 Figure C.9 (f) Port 9 Block Diagram (Pin P95) 916 C.10 Port A Block Diagrams Reset R Hardware standby Q PA n DDR C WPAD Reset R PA n Q PA n DR C D D Internal data bus WPA Output trigger TPC TPC output enable Next data 16-bit timer RPA Counter clock input 8-bit timer WPAD : Write to PADDR WPA : Write to port A RPA : Read port A n = 0 and 1 Counter clock input Figure C.10 (a) Port A Block Diagram (Pins PA0 and PA1) 917 Reset R Q PA n DDR C WPAD Reset R PA n Q PA n DR C D D Internal data bus WPA Output trigger 16-bit timer Output enable Compare match output Hardware standby TPC TPC output enable Next data RPA Input capture Counter clock input WPAD : Write to PADDR WPA : Write to port A RPA : Read port A n = 2 and 3 8-bit timer Counter clock input Figure C.10 (b) Port A Block Diagram (Pins PA 2 and PA3) 918 Software standby Bus released SSOE Hardware standby Q R D PAnDDR C WPAD Reset R Internal address bus Internal data bus Address output enable Mode 3/4 Reset TPC PA n TPC output enable D Next data Q PAnDR C WPA Output trigger 16-bit timer Output enable Compare match output RPA Input capture WPAD : Write to PADDR WPA : Write to port A RPA : Read port A SSOE : Software standby output port enable n = 4 to 7 Note: The PA7 address output enable setting is fixed at 1 in modes 3 and 4. Figure C.10 (c) Port A Block Diagram (Pins PA4 to PA7) 919 C.11 Port B Block Diagrams Software standby Hardware standby SSOE Internal data bus Reset R Q PB n DDR C Bus released WPBD D Bus controller CS7 CS5 output CS output enable TPC TPC output enable Reset PBn Mode 1 to 5 Q PB n DR C R D Next data WPB Output trigger 8-bit timer Output enable Compare match output RPB WPBD : WPB : RPB : SSOE : n=0,2 Write to PBDDR Write to port B Read port B Software standby output port enable Figure C.11 (a) Port B Block Diagram (Pins PB0 and PB2) 920 Software standby Internal data bus SSOE Hardware standby Reset R Q D PBnDDR C Bus released Mode 1 to 5 WPBD Reset R Q D PBnDR C WPB Output trigger 8-bit timer Output enable Compare match output Bus controller CS6 CS4 output PBn CS output enable TPC TPC output enable Next data RPB TMO2 TMO3 input WPBD : WPB : RPB : SSOE : n = 1, 3 Write to PBDDR Write to port B Read port B Software standby output port enable Figure C.11 (b) Port B Block Diagram (Pins PB1 and PB3) 921 R Hardware standby Q PB 4 DDR C WPBD Reset R PB4 Q PB 4 DR C D D Internal data bus WPB Reset TPC TPC output enable Next data Output trigger RPB WPBD : Write to PBDDR WPB : Write to port B RPB : Read port B Figure C.11 (c) Port B Block Diagram (Pin PB4) 922 Reset Hardware standby R Q D PB5DDR C WPBD Reset R PB5 Q D PB5DR C WPB Internal data bus TPC TPC output enable Next data Output trigger RPB WPBD : Write to PBDDR WPB : Write to port B RPB : Read port B Figure C.11 (d) Port B Block Diagram (Pin PB 5) 923 R Q Hardware standby PB 6 DDR C WPBD Reset R PB6 Q PB6 DR C D D Internal data bus WPB Reset TPC TPC output enable Next data Output trigger RPB WPBD : Write to PBDDR WPB : Write to port B RPB : Read port B Figure C.11 (e) Port B Block Diagram (Pin PB6) 924 R Hardware standby Q PB 7 DDR C WPBD Reset R PB7 Q PB7 DR C D D Internal data bus TPC TPC output enable Next data WPB Output trigger Reset RPB WPBD : Write to PBDDR WPB : Write to port B RPB : Read port B Figure C.11 (f) Port B Block Diagram (Pin PB7) 925 Appendix D Pin States D.1 Port States in Each Mode Port States Hardware Standby Software Reset Mode Standby Mode T*1 L T T T (SSOE = 0) T (SSOE = 1) Keep (DDR = 0) T (DDR=1,SSOE=0) T (DDR=1,SSOE=1) Keep Keep (SSOE = 0) T (SSOE = 1) Keep (DDR = 0) Keep (DDR=1,SSOE=0) T (DDR=1,SSOE=1) Keep Keep T Keep Keep T Keep BusReleased Mode T*1 T Program Execution Mode T*1 A7 to A 0 Table D.1 Pin Name RESO * 1 Mode -- P17 to P1 0 1 to 4 5 T T T (DDR = 0) Input port (DDR = 1) A7 to A 0 6, 7 P27 to P2 0 1 to 4 T L T T -- T I/O port A15 to A 8 5 T T T (DDR = 0) Input port (DDR = 1) A15 to A 8 6, 7 P37 to P3 0 1 to 5 6, 7 P47 to P4 0 1, 3, 5 2, 4 6, 7 T T T T T T T T T T T T -- T -- Keep T -- I/O port D15 to D8 I/O port I/O port D7 to D0 I/O port 926 Pin Name Mode Hardware Standby Software Reset Mode Standby Mode L T (SSOE = 0) T (SSOE = 1) Keep (DDR = 0) Keep (DDR=1,SSOE=0) T (DDR=1,SSOE=1) Keep Keep Keep Keep (BRLE = 0) Keep (BRLE = 1) T Keep (BRLE = 0) Keep (BRLE = 1) H Keep (SSOE = 0) T (SSOE = 1) H Keep (PSTOP = 0) H (PSTOP = 1) Keep T Keep (DDR=0) T (DDR=1, SSOE=0) T (DDR=1, SSOE=1) H Keep BusReleased Mode T Program Execution, Mode A19 to A 16 P53 to P5 0 1 to 4 5 T T T (DDR = 0) Input port (DDR = 1) A19 to A 16 6, 7 P60 1 to 5 6, 7 P61 1 to 5 T T T T T T T T -- Keep -- T I/O port I/O port WAIT I/O port I/O port BREQ 6, 7 P62 1 to 5 T T T T -- L I/O port (BRLE = 0) I/O port (BRLE = 1) BACK I/O port AS, RD, HWR, LWR I/O port (PSTOP = 0) (PSTOP = 1) Input port Input port I/O port (DDR=0) Input port (DDR=1) CS 3 6, 7 P66 to P6 3 1 to 5 6, 7 P67 1 to 7 T H T T T T -- T -- (PSTOP = 0) (PSTOP = 1) Keep T -- (DDR=0) Keep (DDR=1) T Clock T output P77 to P7 0 1 to 7 P80 P81 1 to 7 1 to 5 T T T T T T 6, 7 T T -- I/O port 927 Pin Name P82 Mode 1 to 5 Hardware Standby Software Reset Mode Standby Mode T T (DDR=0) T (DDR=1, SSOE=0) T (DDR=1, SSOE=1) H Keep (DDR=0) T (DDR=1, SSOE=0) T (DDR=1, SSOE=1) H Keep (DDR=0) T (DDR=1, SSOE=0) T (DDR=1, SSOE=1) H (DDR=0) T (DDR=1, SSOE=0) T (DDR=1, SSOE=1) H Keep Keep Keep Keep (Address output) * 2 (SSOE = 0) T (SSOE = 1) Keep (Otherwise)*3 Keep Keep BusReleased Mode (DDR=0) Keep (DDR=1) T Program Execution Mode (DDR=0) Input port (DDR=1) CS 2 6, 7 P83 1 to 5 T T T T -- (DDR=0) Keep (DDR=1) T I/O port (DDR=0) Input port (DDR=1) CS 1 6, 7 P84 1 to 4 T H T T -- (DDR=0) Keep (DDR=1) T I/O port (DDR=0) Input port (DDR=1) CS 0 5 T T (DDR=0) Keep (DDR=1) T (DDR=0) Input port (DDR=1) CS 0 6, 7 P95 to P9 0 1 to 7 PA3 to PA 0 1 to 7 PA6 to PA 4 1, 2 3 to 5 T T T T T T T T T T -- Keep Keep Keep I/O port I/O port I/O port I/O port (Address output) * 2(Address output) * 2 T A23 to A 21 (Otherwise)*3 (Otherwise)*3 Keep I/O port 6, 7 T T -- I/O port 928 Pin Name PA7 Mode 1, 2 3, 4 Hardware Standby Software Reset Mode Standby Mode T L T T Keep (SSOE = 0) T (SSOE = 1) Keep (Address output) * 4 (SSOE = 0) T (SSOE = 1) Keep (Otherwise)*5 Keep Keep (CS output)* 6 (SSOE = 0) T (SSOE = 1) H (Otherwise)*7 Keep Keep Keep BusReleased Mode Keep T Program Execution Mode I/O port A20 5 T T (Address output) * 4(Address output) * 4 T A20 (Otherwise)*5 (Otherwise)*5 Keep I/O port 6, 7 PB3 to PB 0 1 to 5 T T T T -- (CS output)* 6 T (Otherwise)*7 Keep I/O port (CS output)* 6 CS 7 to CS 4 (Otherwise)*7 I/O port 6, 7 PB7 to PB 4 1 to 7 T T T T -- Keep I/O port I/O port Legend: H : High L : Low T : High-impedance state keep : Input pins are in the high-impedance state; output pins maintain their previous state. DDR : Data direction register Notes: *1 Low output only when WDT overflow causes a reset. This RESO output function is provided only in the mask ROM version. *2 When A23E, A22E, A21E = 0 in BRCR (bus release control register) *3 When A23E, A22E, A21E = 1 in BRCR (bus release control register) *4 When A20E = 0 in BRCR (bus release control register) *5 When A20E = 1 in BRCR (bus release control register) *6 When CS7E, CS6E, CS5E, CS4E = 1 in CSCR (chip select control register) *7 When CS7E, CS6E, CS5E, CS4E = 0 in CSCR (chip select control register) The bus cannot be released in modes 6 and 7. 929 D.2 Pin States at Reset Modes 1 and 2: Figure D.1 is a timing diagram for the case in which RES goes low during an external memory access in mode 1 or 2. As soon as RES goes low, all ports are initialized to the input state. AS, RD, HWR, LWR, and CS0 go high, and D15 to D0 go to the high-impedance state. The address bus is initialized to the low output level 2.5 clock cycles after the low level of RES is sampled. Clock pin P67/ goes to the output state at the next rise of after RES goes low. Access to external memory T1 P67/ RES Internal reset signal A19 to A0 CS0 AS, RD (read) HWR, LWR (write) D15 to D0 (write) I/O port, CS7 to CS1 High impedance High impedance H'00000 T2 T3 Figure D.1 Reset during Memory Access (Modes 1 and 2) 930 Modes 3 and 4: Figure D.2 is a timing diagram for the case in which RES goes low during an external memory access in mode 3 or 4. As soon as RES goes low, all ports are initialized to the input state. AS, RD, HWR, LWR, and CS0 go high, and D15 to D0 go to the high-impedance state. The address bus is initialized to the low output level 2.5 clock cycles after the low level of RES is sampled. However, when PA4 to PA 6 are used as address bus pins, or when P83 to P81 and PB0 to PB 3 are used as CS output pins, they go to the high-impedance state at the same time as RES goes low. Clock pin P67/ goes to the output state at the next rise of after RES goes low. Access to external memory T1 P67/ RES Internal reset signal A20 to A0 CS0 AS, RD (read) HWR, LWR (write) D15 to D0 (write) I/O port, PA4/A23 to PA6/A21, CS7 to CS1 High impedance H'00000 T2 T3 High impedance Figure D.2 Reset during Memory Access (Modes 3 and 4) Mode 5: Figure D.3 is a timing diagram for the case in which RES goes low during an external memory access in mode 5. As soon as RES goes low, all ports are initialized to the input state. AS, RD, HWR, and LWR go high, and the address bus and D15 to D0 go to the high-impedance state. Clock pin P67/ goes to the output state at the next rise of after RES goes low. 931 Access to external memory T1 P67/ RES Internal reset signal A23 to A0 AS, RD (read) HWR, LWR (write) D15 to D0 (write) I/O port, CS7 to CS1 High impedance High impedance High impedance T2 T3 Figure D.3 Reset during Memory Access (Mode 5) Modes 6 and 7: Figure D.4 is a timing diagram for the case in which RES goes low during an operation mode 6 or 7. As soon as RES goes low, all ports are initialized to the input state. Clock pin P67/ goes to the output state at the next rise of after RES goes low. P67/ RES Internal reset signal I/O port High impedance Figure D.4 Reset during Operation (Modes 6 and 7) 932 Appendix E Timing of Transition to and Recovery from Hardware Standby Mode Timing of Transition to Hardware Standby Mode 1. To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10 system clock cycles before the STBY signal goes low, as shown below. RES must remain low until STBY goes low (minimum delay from STBY low to RES high: 0 ns). STBY t1 10tcyc RES t2 0 ns 2. To retain RAM contents with the RAME bit cleared to 0 in SYSCR, RES does not have to be driven low as in (1). Timing of Recovery from Hardware Standby Mode: Drive the RES signal low approximately 100 ns before STBY goes high. STBY t 100 ns RES tOSC 933 Appendix F Product Code Lineup Table F.1 H8/3062 Series Product Code HD64F3062F HD64F3062TE HD64F3062FP H8/3062 On-chip 5 V F-ZTAT flash R-mask memory version 3V HD64F3062RF HD64F3062RTE HD64F3062RFP HD64F3062RVF Mark Code HD64F3062F HD64F3062TE HD64F3062FP HD64F3062RF HD64F3062RTE HD64F3062RFP HD64F3062RVF Package (Hitachi Package Code) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) Product Type H8/3062 On-chip 5 V F-ZTAT flash memory HD64F3062RVTE HD64F3062RVTE HD64F3062RVFP HD64F3062RVFP H8/3062 On-chip 5 V mask mask ROM ROM version 3V HD6433062F HD6433062TE HD6433062FP HD6433062VF HD6433062VTE HD6433062VFP H8/3061 On-chip 5 V mask mask ROM ROM version 3V HD6433061F HD6433061TE HD6433061FP HD6433061VF HD6433061VTE HD6433061VFP H8/3060 On-chip 5 V mask mask ROM ROM version 3V HD6433060F HD6433060TE HD6433060FP HD6433060VF HD6433060VTE HD6433060VFP HD6433062(***)F HD6433062(***)TE HD6433062(***)FP HD6433062(***)VF HD6433062(***)VTE 100-pin TQFP (TFP-100B) HD6433062(***)VFP 100-pin QFP (FP-100A) HD6433061(***)F HD6433061(***)TE HD6433061(***)FP HD6433061(***)VF 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) HD6433061(***)VTE 100-pin TQFP (TFP-100B) HD6433061(***)VFP 100-pin QFP (FP-100A) HD6433060(***)F HD6433060(***)TE HD6433060(***)FP HD6433060(***)VF 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) HD6433060(***)VTE 100-pin TQFP (TFP-100B) HD6433060(***)VFP 100-pin QFP (FP-100A) 934 Product Type H8/3064 On-chip 5 V F-ZTAT flash B-mask memory version H8/3064 On-chip 5 V mask mask ROM ROM B-mask version H8/3062 On-chip 5 V F-ZTAT flash B-mask memory version H8/3062 On-chip 5 V mask mask ROM ROM B-mask version H8/3061 On-chip 5 V mask mask ROM ROM B-mask version H8/3060 On-chip 5 V mask mask ROM ROM B-mask version Product Code HD64F3064BF HD64F3064BTE HD64F3064BFP HD6433064BF HD6433064BTE HD6433064BFP HD64F3062BF HD64F3062BTE HD64F3062BFP HD6433062BF HD6433062BTE HD6433062BFP HD6433061BF HD6433061BTE HD6433061BFP HD6433060BF HD6433060BTE HD6433060BFP Mark Code HD64F3064BF HD64F3064BTE HD64F3064BFP HD6433064B(***)F Package (Hitachi Package Code) 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) HD6433064B(***)TE 100-pin TQFP (TFP-100B) HD6433064B(***)FP 100-pin QFP (FP-100A) HD64F3062BF HD64F3062BTE HD64F3062BFP HD6433062B(***)F 100-pin QFP (FP-100B) 100-pin TQFP (TFP-100B) 100-pin QFP (FP-100A) 100-pin QFP (FP-100B) HD6433062B(***)TE 100-pin TQFP (TFP-100B) HD6433062B(***)FP 100-pin QFP (FP-100A) HD6433061B(***)F 100-pin QFP (FP-100B) HD6433061B(***)TE 100-pin TQFP (TFP-100B) HD6433061B(***)FP 100-pin QFP (FP-100A) HD6433060B(***)F 100-pin QFP (FP-100B) HD6433060B(***)TE 100-pin TQFP (TFP-100B) HD6433060B(***)FP 100-pin QFP (FP-100A) Note: For mask ROM versions, (***) is the ROM code. 935 Appendix G Package Dimensions Figure G.1 shows the FP-100B package dimensions of the H8/3062 Series. Figure G.2 shows the TFP-100B package dimensions. Figure G.3 shows the FP-100A package dimensions. Unit: mm 16.0 0.3 14 75 76 51 50 16.0 0.3 100 1 *0.22 0.05 0.20 0.04 25 26 0.5 3.05 Max 2.70 0.08 M 1.0 *0.17 0.05 0.15 0.04 1.0 0 - 8 0.5 0.2 0.10 0.12 +0.13 -0.12 *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC JEITA Mass (reference value) FP-100B -- Conforms 1.2 g Figure G.1 Package Dimensions (FP-100B) 936 Unit: mm 16.0 0.2 14 75 76 51 50 16.0 0.2 100 1 *0.22 0.05 0.20 0.04 25 0.08 M 1.0 26 0.5 *0.17 0.05 0.15 0.04 1.00 1.20 Max 1.0 0 - 8 0.5 0.1 0.10 0.10 0.10 *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC JEITA Mass (reference value) TFP-100B -- Conforms 0.5 g Figure G.2 Package Dimensions (TFP-100B) 937 24.8 0.4 20 80 81 51 50 Unit: mm 18.8 0.4 100 1 *0.32 0.08 0.30 0.06 30 0.13 M 31 3.10 Max 0.65 *0.17 0.05 0.15 0.04 14 2.4 0.83 0 - 10 0.58 0.20 +0.10 -0.20 2.70 1.2 0.2 Hitachi Code JEDEC JEITA Mass (reference value) FP-100A -- -- 1.7 g 0.15 *Dimension including the plating thickness Base material dimension Figure G.3 Package Dimensions (FP-100A) 938 Appendix H Comparison of H8/300H Series Product Specifications H.1 Differences between H8/3067 and H8/3062 Series, H8/3048 Series, H8/3007 and H8/3006, and H8/3002 Item 1 Operating Mode 5 mode H8/3067, H8/3062 Series H8/3048 Series H8/3006, H8/3007 H8/3002 16 Mbyte ROM enabled 1 Mbyte expanded mode ROM enabled expanded mode 64 kbyte single-chip mode 16 Mbyte ROM enabled expanded mode 30 36 30 Mode 6 2 Interrupt controller 3 Bus controller Internal interrupt 36 (H8/3067) sources 27 (H8/3062 Series) Burst ROM interface Yes (H8/3067) No (H8/3062 Series) No Yes No Idle cycle Yes insertion function Wait mode Wait state number setting Address output method 2 modes Per area Choice of address update mode (fixed in H8/3067F-ZTAT and H8/3062F-ZTAT) Area 2/3/4/5 (H8/3067 only) No 4 modes Yes 2 modes No 4 modes Common to all areas Fixed Common Per area to all areas Fixed Fixed 4 DRAM interface Connectable areas Area 3 No No 8 bit/9 bit Area 2/3/4/5 Yes Yes 8 bit/9 bit/10 bit Area 3 No No 8 bit/9 bit Precharge cycle Yes (H8/3067 only) insertion function Fast page mode Yes (H8/3067 only) Address shift amount 8 bit/9 bit/10 bit (H8/3067 only) 939 Item 5 Timer functions Number of channels Pulse output Input capture External clock Internal clock Complementary PWM function Resetsynchronous PWM function Buffer operation Output initialization function PWM output H8/3067, H8/3062 Series 16-bit timers 16 bits x 3 6 pins 6 8-bit timers H8/3048 Series ITU H8/3006, H8/3007 16-bit timers 16 bits x 3 6 pins 6 8-bit timers H8/3002 ITU 8 bits x 4 16 bits x 5 (16 bits x 2) 4 pins (2 pins) 2 12 pins 10 8 bits x 4 16 bits x 5 (16 bits x 2) 4 pins (2 pins) 2 12 pins 10 4 systems (selectable) , /2, /4, /8 Yes Yes 4 systems 4 systems (selectable) (fixed) , /2, /4, /8 No No /8, /64, /8192 No No 4 systems 4 systems 4 systems (selectable) (selectable) (fixed) , /2, /4, /8 Yes Yes , /2, /4, /8 No No /8, /64, /8192 No No No Yes No No Yes No No Yes No No Yes No 3 4 (2) 5 3 4 (2) 5 4 channels DMAC activation 3 channels No (H8/3067 only) A/D conversion activation No Yes 8 sources 4 channels 3 channels No No 3 sources x5 4 kinds, ITU base Yes No 3 sources x3 Yes 8 sources No 3 sources x5 4 kinds, ITU base Yes Interrupt sources 3 sources x3 6 TPC 7 WDT Time base Reset signal external output function Number of channels 3 kinds, 16-bit timer base Yes (except products with on-chip flash memory) 3 channels (H8/3067) 2 channels (H8/3062 Series) Supported on all channels 3 kinds, 16-bit timer base Yes 8 SCI 2 channels 3 channels 2 channels Smart card interface Supported on SCI0 only Supported on all channels No 940 Item H8/3067, H8/3062 Series H8/3048 Series External trigger 134/266 H8/3006, H8/3007 External trigger/8-bit timer compare match 70/134 H8/3002 External trigger 134/266 9 A/D Conversion start External trigger/8-bit converter trigger input timer compare match Conversion states 10 Pin control pin 70/134 /input port multiplexing output only /input port multiplexing output only A20 in 16 MB A20 / I/O port multiplexing A20 output ROM enabled expanded mode Address bus, High-level output/highAS, RD, HWR, impedance selectable LWR, CS7-CS0, (RFSH: H8/3067 only) RFSH in software standby state High-level output (except CS0) Low-level output (CS0) High-level output 12 V application from offchip 16 blocks High-impedance High-level output/highimpedance selectable High-level output (except CS0) Low-level output (CS0) High-level output CS7-CS0 in bus- High-impedance released state 11 Flash memory functions Program/erase voltage 12 V application unnecessary. Single-power-supply programming. 8 blocks (12 blocks in H8/3064F-ZTAT) Block divisions 941 H.2 Comparison of Pin Functions of 100-Pin Package Products (FP-100B, TFP-100B) Pin Arrangement of Each Product (FP-100B, TFP-100B) On-chip-ROM Products ROMless Products H8/3006, H8/3007 VCC H8/3002 VCC Table H.1 Pin No. 1 2 3 4 5 H8/3067 Series H8/3062 Series H8/3048 Series H8/3042 Series VCC VCC/VCL* 2 VCC VCC PB 0/TP8/ TIOCA3 PB 1/TP9/ TIOCB3 PB 2/TP10/ TIOCA4 PB 3/TP11/ TIOCB4 PB 4/TP12/ TOCXA 4 PB 5/TP13/ TOCXB 4 PB 6/TP14/ DREQ0 PB 0/TP8/TMO0/ PB 0/TP8/TMO0/ PB 0/TP8/ CS7 CS7 TIOCA3 PB 1/TP9/TMIO1/ PB 1/TP9/TMIO1/ PB 1/TP9/ DREQ0/CS6 CS6 TIOCB3 PB 2/TP10/TMO2/ PB 2/TP10/TMO2/ PB 2/TP10/ CS5 CS5 TIOCA4 PB 3/TP11/ TMIO3/DREQ1/ CS4 PB 4/TP12/ UCAS PB 5/TP13/ LCAS/SCK 2 PB 6/TP14/TxD2 PB 7/TP15/RxD2 RESO/FWE*1 Vss P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94/SCK 0/IRQ4 P95/SCK 1/IRQ5 P40/D0 P41/D1 P42/D2 P43/D3 Vss P44/D4 P45/D5 PB 3/TP11/ TMIO3/CS4 PB 4/TP12 PB 5/TP13 PB 6/TP14 PB 7/TP15 RESO/FWE*1 Vss P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94/SCK 0/IRQ4 P95/SCK 1/IRQ5 P40/D0 P41/D1 P42/D2 P43/D3 Vss P44/D4 P45/D5 PB 3/TP11/ TIOCB4 PB 4/TP12/ TOCXA 4 PB 5/TP13/ TOCXB 4 PB 6/TP14/ DREQ0/CS7 PB 0/TP8/TMO0/ PB 0/TP8/ CS7 TIOCA3 PB 1/TP9/TMIO1/ PB 1/TP9/ DREQ0/CS6 TIOCB3 PB 2/TP10/TMO2/ PB 2/TP10/ CS5 TIOCA4 PB 3/TP11/ TMIO3/DREQ1/ CS4 PB 4/TP12/ UCAS PB 5/TP13/ LCAS/SCK 2 PB 6/TP14/TxD2 PB 7/TP15/RxD2 RESO Vss P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94/SCK 0/IRQ4 P95/SCK 1/IRQ5 P40/D0 P41/D1 P42/D2 P43/D3 Vss P44/D4 P45/D5 PB 3/TP11/ TIOCB4 PB 4/TP12/ TOCXA 4 PB 5/TP13/ TOCXB 4 PB 6/TP14/ DREQ0 PB 7/TP15/ DREQ1/ADTRG RESO Vss P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94/SCK 0/IRQ4 P95/SCK 1/IRQ5 P40/D0 P41/D1 P42/D2 P43/D3 Vss P44/D4 P45/D5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 PB 7/TP15/ PB 7/TP15/ DREQ1/ADTRG DREQ1/ADTRG RESO/V PP Vss P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94/SCK 0/IRQ4 P95/SCK 1/IRQ5 P40/D0 P41/D1 P42/D2 P43/D3 Vss P44/D4 P45/D5 RESO Vss P90/TxD0 P91/TxD1 P92/RxD0 P93/RxD1 P94/SCK 0/IRQ4 P95/SCK 1/IRQ5 P40/D0 P41/D1 P42/D2 P43/D3 Vss P44/D4 P45/D5 942 On-chip-ROM Products Pin No. 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 H8/3067 Series H8/3062 Series H8/3048 Series H8/3042 Series P46/D6 P47/D7 P30/D8 P31/D9 P32/D10 P33/D11 P34/D12 P35/D13 P36/D14 P37/D15 Vcc P10/A 0 P11/A 1 P12/A 2 P13/A 3 P14/A 4 P15/A 5 P16/A 6 P17/A 7 Vss P20/A 8 P21/A 9 P22/A 10 P23/A 11 P24/A 12 P25/A 13 P26/A 14 P27/A 15 P50/A 16 P51/A 17 P52/A 18 P53/A 19 Vss P60/WAIT P46/D6 P47/D7 P30/D8 P31/D9 P32/D10 P33/D11 P34/D12 P35/D13 P36/D14 P37/D15 Vcc P10/A 0 P11/A 1 P12/A 2 P13/A 3 P14/A 4 P15/A 5 P16/A 6 P17/A 7 Vss P20/A 8 P21/A 9 P22/A 10 P23/A 11 P24/A 12 P25/A 13 P26/A 14 P27/A 15 P50/A 16 P51/A 17 P52/A 18 P53/A 19 Vss P60/WAIT P46/D6 P47/D7 P30/D8 P31/D9 P32/D10 P33/D11 P34/D12 P35/D13 P36/D14 P37/D15 Vcc P10/A 0 P11/A 1 P12/A 2 P13/A 3 P14/A 4 P15/A 5 P16/A 6 P17/A 7 Vss P20/A 8 P21/A 9 P22/A 10 P23/A 11 P24/A 12 P25/A 13 P26/A 14 P27/A 15 P50/A 16 P51/A 17 P52/A 18 P53/A 19 Vss P60/WAIT P46/D6 P47/D7 P30/D8 P31/D9 P32/D10 P33/D11 P34/D12 P35/D13 P36/D14 P37/D15 Vcc P10/A 0 P11/A 1 P12/A 2 P13/A 3 P14/A 4 P15/A 5 P16/A 6 P17/A 7 Vss P20/A 8 P21/A 9 P22/A 10 P23/A 11 P24/A 12 P25/A 13 P26/A 14 P27/A 15 P50/A 16 P51/A 17 P52/A 18 P53/A 19 Vss P60/WAIT ROMless Products H8/3006, H8/3007 P46/D6 P47/D7 D8 D9 D10 D11 D12 D13 D14 D15 Vcc A0 A1 A2 A3 A4 A5 A6 A7 Vss A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 Vss P60/WAIT H8/3002 P46/D6 P47/D7 D8 D9 D10 D11 D12 D13 D14 D15 Vcc A0 A1 A2 A3 A4 A5 A6 A7 Vss A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 Vss P60/WAIT 943 On-chip-ROM Products Pin No. 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 H8/3067 Series H8/3062 Series H8/3048 Series H8/3042 Series P61/BREQ P62/BACK P67/ STBY RES NMI Vss EXTAL XTAL Vcc P63/AS P64/RD P65/HWR P66/LWR MD0 MD1 MD2 AVcc VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVss P61/BREQ P62/BACK P67/ STBY RES NMI Vss EXTAL XTAL Vcc P63/AS P64/RD P65/HWR P66/LWR MD0 MD1 MD2 AVcc VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVss P61/BREQ P62/BACK STBY RES NMI Vss EXTAL XTAL Vcc P63/AS P64/RD P65/HWR P66/LWR MD0 MD1 MD2 AVcc VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVss P61/BREQ P62/BACK STBY RES NMI Vss EXTAL XTAL Vcc P63/AS P64/RD P65/HWR P66/LWR MD0 MD1 MD2 AVcc VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVss ROMless Products H8/3006, H8/3007 P61/BREQ P62/BACK P67/ STBY RES NMI Vss EXTAL XTAL Vcc AS RD HWR LWR MD0 MD1 MD2 AVcc VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6/DA0 P77/AN7/DA1 AVss H8/3002 P61/BREQ P62/BACK STBY RES NMI Vss EXTAL XTAL Vcc AS RD HWR LWR MD0 MD1 MD2 AVcc VREF P70/AN0 P71/AN1 P72/AN2 P73/AN3 P74/AN4 P75/AN5 P76/AN6 P77/AN7 AVss P80/RFSH/IRQ0 P80/IRQ0 P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3/ ADTRG P84/CS0 Vss P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3/ ADTRG P84/CS0 Vss P80/RFSH/IRQ0 P80/RFSH/IRQ0 P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3 P84/CS0 Vss P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3 P84/CS0 Vss P80/RFSH/IRQ0 P80/RFSH/IRQ0 P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3/ ADTRG P84/CS0 Vss P81/CS3/IRQ1 P82/CS2/IRQ2 P83/CS1/IRQ3 P84/CS0 Vss 944 On-chip-ROM Products Pin No. 93 94 95 96 97 98 99 100 H8/3067 Series H8/3062 Series H8/3048 Series H8/3042 Series PA 0/TP0/ TEND 0/TCLKA PA 1/TP1/ TEND 1/TCLKB PA 0/TP0/TCLKA PA 0/TP0/ TEND 0/TCLKA PA 1/TP1/TCLKB PA 1/TP1/ TEND 1/TCLKB PA 0/TP0/ TEND 0/TCLKA PA 1/TP1/ TEND 1/TCLKB ROMless Products H8/3006, H8/3007 PA 0/TP0/ TEND 0/TCLKA PA 1/TP1/ TEND 1/TCLKB H8/3002 PA 0/TP0/ TEND 0/TCLKA PA 1/TP1/ TEND 1/TCLKB PA 2/TP2/ PA 2/TP2/ PA 2/TP2/ PA 2/TP2/ TIOCA0/TCLKC TIOCA0/TCLKC TIOCA0/TCLKC TIOCA0/TCLKC PA 3/TP3/ PA 3/TP3/ PA 3/TP3/ PA 3/TP3/ TIOCB0/TCLKD TIOCB0/TCLKD TIOCB0/TCLKD TIOCB0/TCLKD PA 4/TP4/ TIOCA1/A 23 PA 5/TP5/ TIOCB1/A 22 PA 6/TP6/ TIOCA2/A 21 PA 7/TP7/ TIOCB2/A 20 PA 4/TP4/ TIOCA1/A 23 PA 5/TP5/ TIOCB1/A 22 PA 6/TP6/ TIOCA2/A 21 PA 7/TP7/ TIOCB2/A 20 PA 4/TP4/ PA 4/TP4/ TIOCA1/CS6/A 23 TIOCA1/A 23 PA 5/TP5/ PA 5/TP5/ TIOCB1/CS5/A 22 TIOCB1/A 22 PA 6/TP6/ PA 6/TP6/ TIOCA2/CS4/A 21 TIOCA2/A 21 PA 7/TP7/ TIOCB2/A 20 PA 7/TP7/ TIOCB2/A 20 PA 2/TP2/ PA 2/TP2/ TIOCA0/TCLKC TIOCA0/TCLKC PA 3/TP3/ PA 3/TP3/ TIOCB0/TCLKD TIOCB0/TCLKD PA 4/TP4/ TIOCA1/A 23 PA 5/TP5/ TIOCB1/A 22 PA 6/TP6/ TIOCA2/A 21 PA 7/TP7/ TIOCB2/A 20 PA 4/TP4/ TIOCA1/A 23 PA 5/TP5/ TIOCB1/A 22 PA 6/TP6/ TIOCA2/A 21 PA 7/TP7/ TIOCB2/A 20 Notes: *1 Functions as RESO in the mask ROM versions, and as FWE in the on-chip flash memory versions. *2 The H8/3064F-ZTAT B-mask version, H8/3064 mask ROM B-mask version, H8/3062F-ZTAT B-mask version, H8/3062 mask ROM B-mask version, H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version have a VCL pin, and require an external capacitor (0.1 F). 945 946 H8/3062 Series, H8/3062B Series, H8/3062F-ZTATTM, H8/3064F-ZTATTM Hardware Manual Publication Date: 1st Edition, December 1997 5th Edition, March 2002 Published by: Business Planning Division Semiconductor & Integrated Circuits Hitachi, Ltd. Edited by: Technical Documentation Group Hitachi Kodaira Semiconductor Co., Ltd. Copyright (c) Hitachi, Ltd., 1997. All rights reserved. Printed in Japan. note Postfach 201 * D-85619 Feldkirchen bei Munchen * Germany Dornacher Strae 3 * D-85622 Feldkirchen bei Munchen * Germany Tel: +49-89-991 80 297 * Fax: +49-89-991 80 272 Subject: H8/300H / Technical Bulletin H8/306x Date: 25-Apr-02 Dear Customer, Thank you for using Hitachi's H8 products. The actual hardware manuals for H8/306x mention 3V and 5V versions. Please note that currently only the 5V versions of H8/306x (i.e. H8/3067 series, H8/3064 series, including B-versions, and H8/3068F) are available in Europe. Please consider that FP-100A package is not supported in Europe. If you intend to use QFP package, please use FP-100B only. Best Regards, Peter Kliegelhofer, Microcontroller Product Marketing |
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